WO2017138638A1 - Electromagnetic-wave shield film - Google Patents
Electromagnetic-wave shield film Download PDFInfo
- Publication number
- WO2017138638A1 WO2017138638A1 PCT/JP2017/004941 JP2017004941W WO2017138638A1 WO 2017138638 A1 WO2017138638 A1 WO 2017138638A1 JP 2017004941 W JP2017004941 W JP 2017004941W WO 2017138638 A1 WO2017138638 A1 WO 2017138638A1
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- WIPO (PCT)
- Prior art keywords
- insulating protective
- protective layer
- layer
- fine particles
- shielding film
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Definitions
- the present invention relates to an electromagnetic wave shielding film.
- an electromagnetic wave shielding film in which the insulating protective layer is colored black has been studied (for example, see Patent Document 2).
- the conventional electromagnetic wave shielding film has a drawback that printing with white ink tends to spread and the productivity of the printing process using white ink is low.
- information terminals that use electromagnetic shielding films are required to be lighter and smaller, and accordingly, the size of the electromagnetic shielding film is reduced, and characters printed on the electromagnetic shielding film are also reduced.
- the problem of the present disclosure is to realize an electromagnetic wave shielding film that makes it easy to recognize small-size characters and the like and that can be printed with high accuracy.
- An aspect of the electromagnetic wave shielding film includes an insulating protective layer and a shielding layer, and the insulating protective layer has an arithmetic average inclination on the surface of 30 ° or more.
- the electromagnetic wave shielding film of the present disclosure it is possible to easily recognize small-sized characters and the like and to print with high accuracy.
- FIG. 1 is a schematic cross-sectional view schematically showing the electromagnetic wave shielding film of the present embodiment.
- the electromagnetic wave shielding film has an insulating protective layer 110 and a shield layer 120.
- An adhesive layer 130 can be provided on the surface of the shield layer 120 opposite to the insulating protective layer 110 as necessary. By providing the adhesive layer, the electromagnetic wave shielding film can be easily attached to the printed wiring board.
- the insulating protective layer 110 is provided to protect the shield layer.
- the insulating protective layer 110 has an arithmetic average inclination of 30 ° or more.
- the surface area of the insulating protective layer 110 is increased, the ink absorbability is improved, and screen printing is performed. In this case, ink bleeding can be suppressed. Thereby, the efficiency of printing work can be improved.
- the value of the arithmetic average slope is large, but from the viewpoint of productivity of the insulating protective layer 110, the arithmetic average slope is preferably 80 ° or less, more preferably 70 ° or less.
- the arithmetic mean slope in this indication can be measured based on JIS B 0601 (2001).
- the insulating protective layer may have a root mean square slope of 35 ° or more, more preferably 40 ° or more, and further preferably 45 ° or more.
- the root mean square slope is 35 ° or more, the surface area of the insulating protective layer 110 is increased, the ink absorbability is improved, and ink bleeding can be suppressed during screen printing. Thereby, the efficiency of printing work can be improved.
- root mean square slope in this indication can be measured based on JIS B 0601 (2001).
- a method for obtaining an insulating protective layer having an arithmetic mean slope and a root mean square slope within a predetermined range is not particularly limited, and a known method can be used.
- corrugated shape of a peeling film is transcribe
- a method of applying a linear curable composition and then pressing a mold having an uneven shape to cure the curable composition layer and peeling the mold are known methods such as a method of applying a linear curable composition and then pressing a mold having an uneven shape to cure the curable composition layer and peeling the mold.
- the fine particles added to the insulating protective layer 110 are not particularly limited.
- resin fine particles or inorganic fine particles can be used.
- the resin fine particles can be acrylic resin fine particles, polyacrylonitrile fine particles, polyurethane fine particles, polyamide fine particles, polyimide fine particles, and the like.
- the inorganic fine particles are calcium carbonate fine particles, calcium silicate fine particles, clay, kaolin, talc, silica fine particles, glass fine particles, diatomaceous earth, mica powder, alumina fine particles, magnesium oxide fine particles, zinc oxide fine particles, barium sulfate fine particles, aluminum sulfate fine particles, Calcium sulfate fine particles and magnesium carbonate fine particles can be used. These resin fine particles and inorganic fine particles can be used alone or in combination. From the viewpoint of improving the scratch resistance of the insulating protective layer, inorganic fine particles are preferable.
- the fine particles preferably have a 50% mean particle diameter of 2 ⁇ m or more, and preferably 4 ⁇ m or more. More preferably, it is 10 ⁇ m or more.
- the 50% average particle size is preferably 30 ⁇ m or less, and more preferably 20 ⁇ m or less.
- the amount of fine particles added to the insulating protective layer 110 is preferably 3% by mass or more, and more preferably 5% or more, from the viewpoint of increasing the arithmetic mean slope and the root mean square slope. Moreover, it is preferable that it is 30 mass% or less from a viewpoint of suppressing whitening of an insulating protective layer, it is more preferable that it is 20 mass% or less, and it is further more preferable that it is 17 mass% or less.
- a black colorant can be added to the insulating protective layer 110.
- the L * value of the insulating protective layer 110 can be reduced and the visibility of characters can be further improved.
- the L * value is preferably 20 or less, and more preferably 18 or less.
- the L * value in the present disclosure can be measured according to JIS Z 8781-4 (2013).
- the black colorant can be a black pigment or a mixed pigment obtained by blackening a mixture of a plurality of pigments.
- the black pigment may be any one of carbon black, ketjen black, carbon nanotube (CNT), perylene black, titanium black, iron black, aniline black, or a combination thereof.
- the mixed pigment can be used by mixing pigments such as red, green, blue, yellow, purple, cyan and magenta.
- the black colorant may have any particle size as long as the required L * value can be realized, but the average primary particle size is preferably 20 nm or more, and 100 nm or less from the viewpoints of dispersibility and reduction of the L * value. It is preferable.
- the average primary particle diameter of the black colorant can be determined from an average value of about 20 primary particles that can be observed from an image enlarged to about 50,000 to 1,000,000 times by a transmission electron microscope (TEM).
- the amount of the black colorant added to the insulating protective layer 110 is preferably 0.5% by mass or more, and more preferably 1% by mass or more. However, the black colorant may be added if necessary, and may not be added.
- the 60 ° glossiness of the insulating protective layer 110 By setting the 60 ° glossiness of the insulating protective layer 110 to 3% or less, preferably 2% or less, more preferably 1% or less, moderate light scattering occurs on the surface of the insulating protective layer 110, and the glossiness is moderate. To be suppressed. Thereby, the visibility of printing can be improved. Further, the 85 ° glossiness of the insulating protective layer 110 is preferably 10% or less, more preferably 3% or less, and further preferably 1% or less.
- 60 degree glossiness and 85 degree glossiness in this indication can be measured by the method shown in an Example.
- the insulating protective layer 110 has required insulation, and preferably satisfies predetermined mechanical strength, chemical resistance and heat resistance.
- the resin material constituting the insulating protective layer is not particularly limited as long as it has sufficient insulating properties.
- a thermoplastic resin composition, a thermosetting resin composition, an active energy ray curable composition, or the like is used. be able to.
- thermoplastic resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, An acrylic resin composition or the like can be used.
- a thermosetting resin composition A phenol-type resin composition, an epoxy-type resin composition, a urethane-type resin composition, a melamine-type resin composition, an alkyd-type resin composition, etc. can be used.
- an active energy ray curable composition For example, the polymeric compound etc. which have at least 2 (meth) acryloyloxy group in a molecule
- the insulating protective layer 110 may include a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, and an antifoam as necessary. Agents, leveling agents, fillers, flame retardants, viscosity modifiers, anti-blocking agents, and the like may be included.
- the thickness of the insulating protective layer 110 is not particularly limited and can be appropriately set as necessary. From the viewpoint of sufficiently protecting the shield layer, the thickness is preferably 1 ⁇ m or more, and is 4 ⁇ m or more. More preferred. Moreover, it is preferable that it is 10 micrometers or less from a viewpoint of ensuring the flexibility of an electromagnetic wave shielding film, and it is more preferable that it is 5 micrometers or less.
- the shield layer 120 of the present embodiment can be a metal layer.
- a metal layer made of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, an alloy containing two or more of these, or the like can be used.
- the material and thickness of the metal layer may be appropriately selected according to the required electromagnetic shielding effect and repeated bending / sliding resistance. From the viewpoint of obtaining a sufficient electromagnetic shielding effect, the thickness of the metal layer is preferably 0.1 ⁇ m or more. Moreover, it is preferable to set it as 8 micrometers or less from viewpoints of productivity, a flexibility, etc.
- the metal layer can be formed by an electrolytic plating method, an electroless plating method, a sputtering method, an electron beam evaporation method, a vacuum evaporation method, a CVD method, a metal organic, or the like.
- the metal layer can also be formed of metal foil, metal nanoparticles, scale-like metal particles, and the like.
- the electromagnetic wave shielding film of this embodiment may include an adhesive layer 130 on the side of the shield layer 120 opposite to the insulating protective layer 110.
- the adhesive layer 130 can be formed of an adhesive resin composition.
- Adhesive resin composition is not particularly limited, but styrene resin composition, vinyl acetate resin composition, polyester resin composition, polyethylene resin composition, polypropylene resin composition, imide resin composition, amide resin Thermoplastic resin compositions such as resin compositions and acrylic resin compositions, phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resin compositions, etc.
- a thermosetting resin composition or the like can be used. These may be used alone or in combination of two or more.
- the adhesive layer 130 can be a layer having isotropic conductivity or anisotropic conductivity as required.
- conductive fine particles may be added to the adhesive resin composition.
- the conductive fine particles are not particularly limited, and metal fine particles, carbon nanotubes, carbon fibers, metal fibers, and the like can be used.
- fine metal particles such as silver powder, copper powder, nickel powder, solder powder, and aluminum powder can be used.
- covered the polymer fine particle, the glass bead, etc. with the metal etc. can also be used.
- copper powder or silver-coated copper powder that can be obtained at low cost is preferable.
- the 50% average particle diameter of the conductive particles is not particularly limited, but is preferably 0.5 ⁇ m or more from the viewpoint of obtaining good conductivity. Moreover, it is preferable to set it as 15 micrometers or less from a viewpoint of making a conductive adhesive layer thin.
- the shape of the conductive particles is not particularly limited, but can be appropriately selected from a spherical shape, a flat shape, a flake shape, a dendrite shape, and the like.
- the thickness of the adhesive layer 130 can be adjusted as necessary, but is preferably 0.5 ⁇ m or more from the viewpoint of obtaining good adhesiveness. Moreover, it is preferable to set it as 20 micrometers or less from a viewpoint of making an electromagnetic wave shielding film thin.
- the electromagnetic wave shielding film has the insulating protective layer 110, the shield layer 120, and the adhesive layer 130 has been described.
- the insulating protective layer 110 and the isotropic conductive adhesive layer 140 are provided. It can also be set as the structure which has these.
- the insulating protective layer 110 can have the same configuration as the electromagnetic wave shielding film shown in FIG.
- the isotropic conductive adhesive layer 140 can be formed of the same adhesive resin composition and conductive fine particles as the adhesive layer 130.
- the isotropic conductive adhesive layer 140 functions as a shield layer.
- the electromagnetic wave shielding film can be manufactured by a known manufacturing method. An example is shown below.
- a conductive adhesive layer 130 is formed on a support film whose surface has been release-treated.
- the adhesive layer 130 is formed by applying and drying a solution of an adhesive layer composition containing a material constituting the adhesive layer 130 on the surface of the support film.
- the shield layer 120 is formed on the surface of the adhesive layer 130.
- a method of sticking a metal foil having a predetermined thickness to the adhesive layer 130 or a method of forming a metal layer on the surface of the adhesive layer 130 by vapor deposition or plating can be used.
- the insulating protective layer 110 is formed on the surface of the shield layer 120. Specifically, a method of applying and drying a solution of an insulating protective layer composition containing a material constituting the insulating protective layer 110 on the surface of the shield layer 120 can be used.
- an electromagnetic wave shielding film can be obtained by peeling off the support film.
- the adhesive layer 130 may be the isotropic conductive adhesive layer 140, and the insulating protective layer 110 may be formed on the surface of the isotropic conductive adhesive layer 140.
- the surface of the insulating protective layer 110 can be subjected to processing such as sandblasting.
- the adhesive layer 130 side can also be formed sequentially from the insulating protective layer 110 side.
- the arithmetic average slope and the root mean square slope on the surface of the adhesive layer 130 can be adjusted.
- the visibility was performed by a method of observing 45 ° regular reflection.
- the LED light (SUPRABEAM) irradiation port is installed at a height of 10 cm from the desk so that the irradiation port is approximately 45 ° from the vertical direction.
- An electromagnetic wave shielding film was placed.
- three alphanumeric characters (0.5 mm in length, 0 in width) printed on the surface of the insulating protective layer with white ink. .2 mm, 0.1 mm interval) was observed and the visibility was evaluated.
- the mark was “ ⁇ ”
- when the print was not visible the mark was “x”.
- the L * value was measured using an integrating sphere spectrocolorimeter (X-Rite, Ci64, tungsten light source).
- Example 1 Provide of conductive adhesive layer- 100 parts by mass of bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., jER1256) and 0.1% of curing agent (manufactured by Mitsubishi Chemical Co., Ltd., ST14) so that the solid content is 20% by mass. 47 parts by mass of spherical silver-coated copper powder having an average particle size of 10 ⁇ m was added and mixed by stirring to prepare a conductive adhesive layer composition. The obtained adhesive layer composition was applied to a PET film whose surface was subjected to mold release treatment, and dried by heating to form an adhesive layer on the surface of the support film.
- bisphenol A type epoxy resin manufactured by Mitsubishi Chemical Co., Ltd., jER1256
- curing agent manufactured by Mitsubishi Chemical Co., Ltd., ST14
- insulating protective layer 100 parts by mass of bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., jER1256) and 0.1% of a curing agent (manufactured by Mitsubishi Chemical Co., Ltd., ST14) so that the solid content is 20% by mass. 1 part by mass, 15 parts by mass of carbon particles (manufactured by Tokai Carbon Co., Ltd., Talker Black # 8300 / F) as a black colorant, and 10 parts by mass of urethane resin particles having an average particle size of 6 ⁇ m as fine particles
- a layer composition was prepared. This composition was applied to the obtained shield layer and dried by heating to obtain an electromagnetic wave shielding film of Example 1.
- the arithmetic average slope on the surface of the obtained insulating protective layer is 43 °, the root mean square slope is 50 °, the L * value is 18, the 60 ° gloss is 0.2%, and the 85 ° gloss is 0.3%. Met. When the presence or absence of bleeding was evaluated, no ink repelling or the like was observed, and no bleeding was observed. Moreover, the visibility of printing was also good.
- Example 2 The same procedure as in Example 1 was conducted, except that the fine particles added to the insulating protective layer composition were changed to 10 parts by mass of urethane resin particles having an average particle diameter of 2 ⁇ m.
- the arithmetic average slope on the surface of the obtained insulating protective layer is 32 °
- the root mean square slope is 39 °
- the L * value is 20
- the 60 ° glossiness is 1.1%
- the 85 ° glossiness is 2.3%.
- Met When the presence or absence of bleeding was evaluated, no ink repelling or the like was observed, and no bleeding was observed. Moreover, the visibility of printing was also good.
- Example 3 The same procedure as in Example 1 was conducted, except that the fine particles added to the insulating protective layer composition were changed to 10 parts by mass of urethane resin particles having an average particle diameter of 5 ⁇ m.
- the arithmetic average slope on the surface of the obtained insulating protective layer is 46 °
- the root mean square slope is 52 °
- the L * value is 21,
- the 60 ° gloss is 0.3%
- the 85 ° gloss is 2.6%.
- Met When the presence or absence of bleeding was evaluated, no ink repelling or the like was observed, and no bleeding was observed. Moreover, the visibility of printing was also good.
- Example 4 The same procedure as in Example 1 was performed except that the fine particles added to the insulating protective layer composition were 13 parts by mass of acrylic styrene resin particles having an average particle size of 5 ⁇ m.
- the arithmetic average slope on the surface of the obtained insulating protective layer is 35 °
- the root mean square slope is 43 °
- the L * value is 18, the 60 ° gloss is 0.8%
- the 85 ° gloss is 2.1%. Met. When the presence or absence of bleeding was evaluated, the print visibility was good.
- the black colorant added to the insulating protective layer composition was 5 parts by mass, and no fine particles were added.
- the insulating protective layer composition is applied to the surface of the support film having a concavo-convex shape on the surface that has been subjected to the mold release treatment, dried, and bonded to the shield layer, and then the support film is applied from the surface of the insulating protective layer. By peeling off, an insulating protective layer to which the irregularities were transferred was formed.
- Other conditions were the same as in Example 1.
- the arithmetic average slope on the surface of the obtained insulating protective layer is 22 °, the root mean square slope is 31 °, the L * value is 28, the 60 ° gloss is 2.0%, and the 85 ° gloss is 43.4%. Met. When the presence or absence of bleeding was evaluated, ink repelling was observed. Also, the print could not be visually recognized by the reflected light.
- Example 2 The same procedure as in Example 1 was conducted except that the black colorant added to the insulating protective layer composition was 5 parts by mass and no fine particles were added.
- the arithmetic average slope on the surface of the obtained insulating protective layer is 16 °
- the root mean square slope is 25 °
- the L * value is 27,
- the 60 ° glossiness is 11.1%
- the 85 ° glossiness is 36.7%. Met.
- ink repelling was observed. Also, the print could not be visually recognized by the reflected light.
- Example 3 The same procedure as in Example 1 was conducted except that the black colorant added to the insulating protective layer composition was 5 parts by mass and no fine particles were added.
- the arithmetic average slope on the surface of the obtained insulating protective layer is 23 °
- the root mean square slope is 30 °
- the L * value is 25
- the 60 ° glossiness is 4.2%
- the 85 ° glossiness is 33.1%. Met.
- ink repelling was observed. Also, the print could not be visually recognized by the reflected light.
- Comparative Example 4 The same procedure as in Comparative Example 1 was conducted except that a support film having a surface roughness of 0.6 ⁇ m was used.
- the arithmetic average slope on the surface of the obtained insulating protective layer is 13 °
- the root mean square slope is 19 °
- the L * value is 28
- the 60 ° gloss is 8.0%
- the 85 ° gloss is 43.1%. there were. The print could not be seen under the reflected light.
- Example 5 The same procedure as in Example 1 was performed except that the fine particles added to the insulating protective layer composition were changed to 3 parts by mass of urethane resin particles having an average particle diameter of 7 ⁇ m.
- the arithmetic average slope on the surface of the obtained insulating protective layer is 14 °
- the root mean square slope is 20 °
- the L * value is 26
- the 60 ° glossiness is 6.1%
- the 85 ° glossiness is 36.9%. there were.
- the print could not be seen under the reflected light.
- Table 1 summarizes the composition and characteristics of the insulating protective layer for each example and comparative example.
- the insulating protective layers of Examples 1 to 3 having an arithmetic average inclination on the surface of 30 ° or more did not show ink repellency and had good printability. Further, the insulating protective layers of Examples 1 to 3 were excellent in bleeding and visibility as compared with the insulating protective layer of the comparative example.
- the electromagnetic shielding film of the present disclosure can print small-size characters and the like with high accuracy, and is useful as an electromagnetic shielding film used for electronic devices and the like.
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Abstract
This electromagnetic-wave shield film is provided with an insulation protection layer 110 and a shield layer 120. A surface of the insulation protection layer 110 has an arithmetic average inclination of 30° or greater.
Description
本発明は、電磁波シールドフィルムに関する。
The present invention relates to an electromagnetic wave shielding film.
近年、スマートフォン及びタブレット型情報端末等において、大容量のデータを高速に伝送する性能が求められている。大容量のデータを高速伝送するためには高周波信号を用いる必要がある。しかし、高周波信号を用いると、プリント配線板に設けられた信号回路から電磁波ノイズが発生し、周辺機器が誤動作しやすくなる。このような誤動作を防止するために、プリント配線板を電磁波からシールドすることが重要となる。
In recent years, smartphones and tablet-type information terminals have been required to have a capability of transmitting a large amount of data at high speed. In order to transmit a large amount of data at high speed, it is necessary to use a high-frequency signal. However, when a high-frequency signal is used, electromagnetic noise is generated from the signal circuit provided on the printed wiring board, and peripheral devices are liable to malfunction. In order to prevent such a malfunction, it is important to shield the printed wiring board from electromagnetic waves.
プリント配線板をシールドするために、絶縁層と、シールド層とを有する電磁波シールドフィルムを、プリント配線板に貼り付ける方法が検討されている(例えば、特許文献1を参照。)。
In order to shield a printed wiring board, a method of attaching an electromagnetic wave shielding film having an insulating layer and a shielding layer to the printed wiring board has been studied (for example, see Patent Document 1).
また、回路パターンを隠ぺいすることを目的として、絶縁保護層を黒色に着色した電磁波シールドフィルムが検討されている(例えば、特許文献2を参照。)。
Also, for the purpose of concealing the circuit pattern, an electromagnetic wave shielding film in which the insulating protective layer is colored black has been studied (for example, see Patent Document 2).
さらに、電磁波シールドフィルムの表面に印字された白色印字の認識性を向上させることを目的として、電磁波シールドフィルムの絶縁保護層の色調を整えることが検討されている(例えば、特許文献3を参照。)。
Furthermore, for the purpose of improving the recognizability of white printing printed on the surface of the electromagnetic wave shielding film, it has been studied to adjust the color tone of the insulating protective layer of the electromagnetic wave shielding film (see, for example, Patent Document 3). ).
プリント配線板に貼り付けられた電磁波シールドフィルムの表面には、電子機器の組み立て工程において当該プリント配線板を管理することを目的として、白色のインキで記号等が印字される。しかしながら、従来の電磁波シールドフィルムでは白色のインキによる印字が滲みやすく、白色インキを用いて印字する工程の生産性が低いという欠点がある。
On the surface of the electromagnetic wave shielding film affixed to the printed wiring board, symbols and the like are printed with white ink for the purpose of managing the printed wiring board in the assembly process of the electronic device. However, the conventional electromagnetic wave shielding film has a drawback that printing with white ink tends to spread and the productivity of the printing process using white ink is low.
また、電磁波シールドフィルムが用いられる情報端末等は、軽量小型化の要望があり、それに伴って電磁波シールドフィルムのサイズが小さくなり、電磁波シールドフィルムに印字される文字等も小さくなっている。
In addition, information terminals that use electromagnetic shielding films are required to be lighter and smaller, and accordingly, the size of the electromagnetic shielding film is reduced, and characters printed on the electromagnetic shielding film are also reduced.
印字のサイズが小さくなることにより、従来の電磁波シールドフィルムに印字された文字を認識することが困難になる。特に照度の高い室内において、この影響は大きくなる。
¡Reducing the size of printing makes it difficult to recognize characters printed on a conventional electromagnetic shielding film. This effect is particularly significant in a room with high illuminance.
さらに、従来の電磁波シールドフィルムはスクリーン印刷により文字や記号を印刷すると、スクリーン版と電磁波シールドフィルムとの間にインクが滲み出して印刷精度が低下し、小サイズの文字等の認識が困難になるという問題がある。絶縁保護層の色調を整え、コントラストを向上させたとしても、滲みによる視認性の低下の根本的な改善にはならない。
Furthermore, when characters and symbols are printed by screen printing on the conventional electromagnetic wave shielding film, ink oozes out between the screen plate and the electromagnetic wave shielding film, resulting in a decrease in printing accuracy and difficulty in recognizing small size characters. There is a problem. Even if the color of the insulating protective layer is adjusted and the contrast is improved, it does not fundamentally improve the reduction in visibility due to bleeding.
本開示の課題は、小サイズの文字等を認識しやすくすると共に、精度良く印刷することができる電磁波シールドフィルムを実現することである。
The problem of the present disclosure is to realize an electromagnetic wave shielding film that makes it easy to recognize small-size characters and the like and that can be printed with high accuracy.
電磁波シールドフィルムの一態様は、絶縁保護層と、シールド層とを備え、絶縁保護層は、表面における算術平均傾斜が30°以上である。
An aspect of the electromagnetic wave shielding film includes an insulating protective layer and a shielding layer, and the insulating protective layer has an arithmetic average inclination on the surface of 30 ° or more.
本開示の電磁波シールドフィルムによれば、小サイズの文字等を認識しやすくすると共に、精度良く印刷することができる。
According to the electromagnetic wave shielding film of the present disclosure, it is possible to easily recognize small-sized characters and the like and to print with high accuracy.
以下、本発明の電磁波シールドフィルムについて具体的に説明する。しかしながら、本発明は、以下の実施形態に限定されるものではなく、本発明の要旨を変更しない範囲において適宜変更して適用することができる。
Hereinafter, the electromagnetic wave shielding film of the present invention will be specifically described. However, the present invention is not limited to the following embodiments, and can be applied with appropriate modifications without departing from the scope of the present invention.
(電磁波シールドフィルム)
図1は、本実施形態の電磁波シールドフィルムを模式的に示す概略断面図である。図1に示すように、電磁波シールドフィルムは、絶縁保護層110とシールド層120とを有する。シールド層120における絶縁保護層110と反対側の面には、必要に応じて接着剤層130を設けることができる。接着剤層を設けることで、電磁波シールドフィルムを容易にプリント配線板に貼り合わせることができる。 (Electromagnetic wave shielding film)
FIG. 1 is a schematic cross-sectional view schematically showing the electromagnetic wave shielding film of the present embodiment. As shown in FIG. 1, the electromagnetic wave shielding film has an insulatingprotective layer 110 and a shield layer 120. An adhesive layer 130 can be provided on the surface of the shield layer 120 opposite to the insulating protective layer 110 as necessary. By providing the adhesive layer, the electromagnetic wave shielding film can be easily attached to the printed wiring board.
図1は、本実施形態の電磁波シールドフィルムを模式的に示す概略断面図である。図1に示すように、電磁波シールドフィルムは、絶縁保護層110とシールド層120とを有する。シールド層120における絶縁保護層110と反対側の面には、必要に応じて接着剤層130を設けることができる。接着剤層を設けることで、電磁波シールドフィルムを容易にプリント配線板に貼り合わせることができる。 (Electromagnetic wave shielding film)
FIG. 1 is a schematic cross-sectional view schematically showing the electromagnetic wave shielding film of the present embodiment. As shown in FIG. 1, the electromagnetic wave shielding film has an insulating
(絶縁保護層)
絶縁保護層110は、シールド層を保護するために設けられる。本実施形態の電磁シールドフィルムにおいて絶縁保護層110は、算術平均傾斜が30°以上である。 (Insulation protective layer)
The insulatingprotective layer 110 is provided to protect the shield layer. In the electromagnetic shielding film of the present embodiment, the insulating protective layer 110 has an arithmetic average inclination of 30 ° or more.
絶縁保護層110は、シールド層を保護するために設けられる。本実施形態の電磁シールドフィルムにおいて絶縁保護層110は、算術平均傾斜が30°以上である。 (Insulation protective layer)
The insulating
絶縁保護層110の算術平均傾斜を30°以上、好ましくは35°以上、より好ましくは40°以上とすることにより、絶縁保護層110の表面積が大きくなり、インクの吸収性が向上し、スクリーン印刷の際にインキの滲み出しを抑えることができる。これにより、印字作業の効率を向上させることができる。
By setting the arithmetic average inclination of the insulating protective layer 110 to 30 ° or more, preferably 35 ° or more, more preferably 40 ° or more, the surface area of the insulating protective layer 110 is increased, the ink absorbability is improved, and screen printing is performed. In this case, ink bleeding can be suppressed. Thereby, the efficiency of printing work can be improved.
滲み出しを低減する観点から、算術平均傾斜の値は大きい方が好ましいが、絶縁保護層110の生産性の観点から、算術平均傾斜は好ましくは80°以下、より好ましくは70°以下である。
From the viewpoint of reducing bleeding, it is preferable that the value of the arithmetic average slope is large, but from the viewpoint of productivity of the insulating protective layer 110, the arithmetic average slope is preferably 80 ° or less, more preferably 70 ° or less.
なお、本開示における算術平均傾斜は、JIS B 0601(2001)に準拠して計測することができる。
In addition, the arithmetic mean slope in this indication can be measured based on JIS B 0601 (2001).
また、絶縁保護層は、二乗平均平方根傾斜が35°以上であってもよく、40°以上であることがより好ましく、45°以上であることがさらに好ましい。二乗平均平方根傾斜が35°以上であることにより、絶縁保護層110の表面積が大きくなり、インクの吸収性が向上し、スクリーン印刷の際にインキの滲み出しを抑えることができる。これにより、印字作業の効率を向上させることができる。
The insulating protective layer may have a root mean square slope of 35 ° or more, more preferably 40 ° or more, and further preferably 45 ° or more. When the root mean square slope is 35 ° or more, the surface area of the insulating protective layer 110 is increased, the ink absorbability is improved, and ink bleeding can be suppressed during screen printing. Thereby, the efficiency of printing work can be improved.
なお、本開示における二乗平均平方根傾斜は、JIS B 0601(2001)に準拠して計測することができる。
In addition, the root mean square slope in this indication can be measured based on JIS B 0601 (2001).
所定の範囲の算術平均傾斜及び二乗平均平方根傾斜を有する絶縁保護層を得る方法は特に限定されず、公知の方法を用いることができる。このような方法としては、エンボス加工によって凹凸形状を付与させた剥離フィルムの表面に絶縁保護層を形成する樹脂組成物を塗布、乾燥させることで、剥離フィルムの凹凸形状を絶縁保護層に転写する方法、シールド層の表面に微粒子を含む樹脂組成物を塗布、乾燥して凹凸形状を有する絶縁保護層を形成する方法、絶縁保護層の表面にドライアイス等を吹き付ける方法、シールド層表面に活性エネルギー線硬化性組成物を塗付した後に凹凸形状を有する鋳型を押し付けて該硬化性組成物層を硬化させ、鋳型を剥離する方法等、公知の方法が挙げられる。
A method for obtaining an insulating protective layer having an arithmetic mean slope and a root mean square slope within a predetermined range is not particularly limited, and a known method can be used. As such a method, the uneven | corrugated shape of a peeling film is transcribe | transferred to an insulating protective layer by apply | coating and drying the resin composition which forms an insulating protective layer on the surface of the peeling film which gave the uneven | corrugated shape by embossing. A method of applying a resin composition containing fine particles on the surface of the shield layer and drying to form an insulating protective layer having an uneven shape, a method of spraying dry ice or the like on the surface of the insulating protective layer, an active energy on the surface of the shield layer There are known methods such as a method of applying a linear curable composition and then pressing a mold having an uneven shape to cure the curable composition layer and peeling the mold.
これらの中でも、生産性の観点から、微粒子を含む樹脂組成物を塗布、乾燥して凹凸形状を有する絶縁保護層を得る方法が好ましい。この場合、絶縁保護層110に添加する微粒子は特に限定されないが、例えば、樹脂微粒子又は無機微粒子を使用することができる。樹脂微粒子は、アクリル樹脂微粒子、ポリアクリロニトリル微粒子、ポリウレタン微粒子、ポリアミド微粒子、及びポリイミド微粒子等とすることができる。また、無機微粒子は、炭酸カルシウム微粒子、珪酸カルシウム微粒子、クレー、カオリン、タルク、シリカ微粒子、ガラス微粒子、珪藻土、雲母粉、アルミナ微粒子、酸化マグネシウム微粒子、酸化亜鉛微粒子、硫酸バリウム微粒子、硫酸アルミニウム微粒子、硫酸カルシウム微粒子、及び炭酸マグネシウム微粒子等とすることができる。これらの、樹脂微粒子及び無機微粒子は単独で使用することも、複数を組み合わせて使用することもできる。絶縁保護層の耐擦傷性を高める観点からは、無機微粒子が好ましい。
Among these, from the viewpoint of productivity, a method of obtaining an insulating protective layer having an uneven shape by applying and drying a resin composition containing fine particles is preferable. In this case, the fine particles added to the insulating protective layer 110 are not particularly limited. For example, resin fine particles or inorganic fine particles can be used. The resin fine particles can be acrylic resin fine particles, polyacrylonitrile fine particles, polyurethane fine particles, polyamide fine particles, polyimide fine particles, and the like. The inorganic fine particles are calcium carbonate fine particles, calcium silicate fine particles, clay, kaolin, talc, silica fine particles, glass fine particles, diatomaceous earth, mica powder, alumina fine particles, magnesium oxide fine particles, zinc oxide fine particles, barium sulfate fine particles, aluminum sulfate fine particles, Calcium sulfate fine particles and magnesium carbonate fine particles can be used. These resin fine particles and inorganic fine particles can be used alone or in combination. From the viewpoint of improving the scratch resistance of the insulating protective layer, inorganic fine particles are preferable.
微粒子は、絶縁保護層の表面に適度な凹凸を生じさせ、算術平均傾斜及び二乗平均平方根傾斜を大きくする観点から、50%平均粒子径が2μm以上であることが好ましく、4μm以上であることがより好ましく、10μm以上であることがさらに好ましい。また、絶縁保護層の白色化を抑えるために、50%平均粒子径が30μm以下であることが好ましく、20μm以下であることがより好ましい。
From the viewpoint of causing moderate unevenness on the surface of the insulating protective layer and increasing the arithmetic mean slope and the root mean square slope, the fine particles preferably have a 50% mean particle diameter of 2 μm or more, and preferably 4 μm or more. More preferably, it is 10 μm or more. In order to suppress whitening of the insulating protective layer, the 50% average particle size is preferably 30 μm or less, and more preferably 20 μm or less.
絶縁保護層110への微粒子の添加量は、算術平均傾斜及び二乗平均平方根傾斜を大きくする観点から3質量%以上とすることが好ましく、5%以上とすることがより好ましい。また、絶縁保護層の白色化を抑える観点から30質量%以下であることが好ましく、20質量%以下であることがより好ましく、17質量%以下であることがさらに好ましい。
The amount of fine particles added to the insulating protective layer 110 is preferably 3% by mass or more, and more preferably 5% or more, from the viewpoint of increasing the arithmetic mean slope and the root mean square slope. Moreover, it is preferable that it is 30 mass% or less from a viewpoint of suppressing whitening of an insulating protective layer, it is more preferable that it is 20 mass% or less, and it is further more preferable that it is 17 mass% or less.
絶縁保護層110には、黒色系着色剤を添加することができる。黒色系着色剤を添加することにより、絶縁保護層110のL*値を小さくし、文字の視認性をさらに向上させることができる。絶縁保護層110に印字する文字が白色の場合には、L*値を20以下とすることが好ましく、18以下とすることがより好ましい。なお、本開示におけるL*値はJIS Z 8781-4(2013)に準拠して測定することができる。
A black colorant can be added to the insulating protective layer 110. By adding a black colorant, the L * value of the insulating protective layer 110 can be reduced and the visibility of characters can be further improved. When the characters printed on the insulating protective layer 110 are white, the L * value is preferably 20 or less, and more preferably 18 or less. The L * value in the present disclosure can be measured according to JIS Z 8781-4 (2013).
黒色系着色剤は、黒色顔料又は、複数の顔料を減色混合して黒色化した混合顔料等とすることができる。黒色顔料は、例えばカーボンブラック、ケッチェンブラック、カーボンナノチューブ(CNT)、ペリレンブラック、チタンブラック、鉄黒、及びアニリンブラック等のいずれか又はこれらの組み合わせとすることができる。混合顔料は、例えば赤色、緑色、青色、黄色、紫色、シアン及びマゼンタ等の顔料を混合して用いることができる。
The black colorant can be a black pigment or a mixed pigment obtained by blackening a mixture of a plurality of pigments. The black pigment may be any one of carbon black, ketjen black, carbon nanotube (CNT), perylene black, titanium black, iron black, aniline black, or a combination thereof. The mixed pigment can be used by mixing pigments such as red, green, blue, yellow, purple, cyan and magenta.
黒色系着色剤の粒径は、必要とするL*値を実現できればよいが、分散性及びL*値の低減等の観点から平均一次粒子径が20nm以上であることが好ましく、100nm以下であることが好ましい。黒色系着色剤の平均一次粒子径は、透過型電子顕微鏡(TEM)により5万倍~100万倍程度に拡大した画像から観察できる20個程度の一次粒子の平均値から求めることができる。
The black colorant may have any particle size as long as the required L * value can be realized, but the average primary particle size is preferably 20 nm or more, and 100 nm or less from the viewpoints of dispersibility and reduction of the L * value. It is preferable. The average primary particle diameter of the black colorant can be determined from an average value of about 20 primary particles that can be observed from an image enlarged to about 50,000 to 1,000,000 times by a transmission electron microscope (TEM).
L*値を小さくする観点から、絶縁保護層110への黒色系着色剤の添加量は、0.5質量%以上とすることが好ましく、1質量%以上とすることがより好ましい。但し、黒色系着色剤は必要に応じて添加すればよく、添加しなくてもよい。
From the viewpoint of reducing the L * value, the amount of the black colorant added to the insulating protective layer 110 is preferably 0.5% by mass or more, and more preferably 1% by mass or more. However, the black colorant may be added if necessary, and may not be added.
絶縁保護層110の60°光沢度を3%以下、好ましくは2%以下、より好ましくは1%以下とすることにより、絶縁保護層110の表面において適度の光の散乱が生じ、光沢感が適度に抑制される。これにより、印字の視認性を向上させることができる。また、絶縁保護層110の85°光沢度は、好ましくは10%以下であり、より好ましくは3%以下であり、さらに好ましくは1%以下である。
By setting the 60 ° glossiness of the insulating protective layer 110 to 3% or less, preferably 2% or less, more preferably 1% or less, moderate light scattering occurs on the surface of the insulating protective layer 110, and the glossiness is moderate. To be suppressed. Thereby, the visibility of printing can be improved. Further, the 85 ° glossiness of the insulating protective layer 110 is preferably 10% or less, more preferably 3% or less, and further preferably 1% or less.
なお、本開示における60°光沢度及び85°光沢度は、実施例において示す方法により測定することができる。
In addition, 60 degree glossiness and 85 degree glossiness in this indication can be measured by the method shown in an Example.
絶縁保護層110は、必要とされる絶縁性を有しており、所定の機械的強度、耐薬品性及び耐熱性を満たすことが好ましい。
The insulating protective layer 110 has required insulation, and preferably satisfies predetermined mechanical strength, chemical resistance and heat resistance.
絶縁保護層を構成する樹脂材料は、十分な絶縁性を有していれば特に限定されないが、例えば熱可塑性樹脂組成物、熱硬化性樹脂組成物、及び活性エネルギー線硬化性組成物等を用いることができる。
The resin material constituting the insulating protective layer is not particularly limited as long as it has sufficient insulating properties. For example, a thermoplastic resin composition, a thermosetting resin composition, an active energy ray curable composition, or the like is used. be able to.
熱可塑性樹脂組成物としては、特に限定されないが、スチレン系樹脂組成物、酢酸ビニル系樹脂組成物、ポリエステル系樹脂組成物、ポリエチレン系樹脂組成物、ポリプロピレン系樹脂組成物、イミド系樹脂組成物、及びアクリル系樹脂組成物等を用いることができる。熱硬化性樹脂組成物としては、特に限定されないが、フェノール系樹脂組成物、エポキシ系樹脂組成物、ウレタン系樹脂組成物、メラミン系樹脂組成物、及びアルキッド系樹脂組成物等を用いることができる。活性エネルギー線硬化性組成物としては、特に限定されないが、例えば、分子中に少なくとも2個の(メタ)アクリロイルオキシ基を有する重合性化合物等を用いることができる。これらの組成物は、1種単独で用いてもよく、2種以上を併用してもよい。
The thermoplastic resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, an imide resin composition, An acrylic resin composition or the like can be used. Although it does not specifically limit as a thermosetting resin composition, A phenol-type resin composition, an epoxy-type resin composition, a urethane-type resin composition, a melamine-type resin composition, an alkyd-type resin composition, etc. can be used. . Although it does not specifically limit as an active energy ray curable composition, For example, the polymeric compound etc. which have at least 2 (meth) acryloyloxy group in a molecule | numerator can be used. These compositions may be used individually by 1 type, and may use 2 or more types together.
また、絶縁保護層110には、上記の微粒子及び着色剤の他に、必要に応じて、硬化促進剤、粘着性付与剤、酸化防止剤、顔料、染料、可塑剤、紫外線吸収剤、消泡剤、レベリング剤、充填剤、難燃剤、粘度調節剤、及びブロッキング防止剤等が含まれていてもよい。
In addition to the fine particles and the colorant, the insulating protective layer 110 may include a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, and an antifoam as necessary. Agents, leveling agents, fillers, flame retardants, viscosity modifiers, anti-blocking agents, and the like may be included.
絶縁保護層110の厚さは、特に限定されず、必要に応じて適宜設定することができるが、シールド層を十分に保護する観点から、1μm以上であることが好ましく、4μm以上であることがより好ましい。また、電磁波シールドフィルムの屈曲性を確保する観点から、10μm以下であることが好ましく、5μm以下であることがより好ましい。
The thickness of the insulating protective layer 110 is not particularly limited and can be appropriately set as necessary. From the viewpoint of sufficiently protecting the shield layer, the thickness is preferably 1 μm or more, and is 4 μm or more. More preferred. Moreover, it is preferable that it is 10 micrometers or less from a viewpoint of ensuring the flexibility of an electromagnetic wave shielding film, and it is more preferable that it is 5 micrometers or less.
(シールド層)
本実施形態のシールド層120は、金属層とすることができる。シールド層120は、ニッケル、銅、銀、錫、金、パラジウム、アルミニウム、クロム、チタン、及び亜鉛のいずれか、又はこれらを2つ以上含む合金等からなる金属層を用いることができる。また、金属層の材質及び厚さは、必要とする電磁シールド効果及び繰り返し屈曲・摺動耐性に応じて適宜選択すればよい。十分な電磁シールド効果を得る観点から、金属層の厚さは0.1μm以上とすることが好ましい。また、生産性及び屈曲性等の観点から8μm以下とすることが好ましい。なお、金属層は、電解メッキ法、無電解メッキ法、スパッタリング法、電子ビーム蒸着法、真空蒸着法、CVD法、及びメタルオーガニック等により形成することができる。また、金属層は、金属箔、金属ナノ粒子、及び鱗片状金属粒子等により形成することもできる。 (Shield layer)
Theshield layer 120 of the present embodiment can be a metal layer. As the shield layer 120, a metal layer made of nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, an alloy containing two or more of these, or the like can be used. The material and thickness of the metal layer may be appropriately selected according to the required electromagnetic shielding effect and repeated bending / sliding resistance. From the viewpoint of obtaining a sufficient electromagnetic shielding effect, the thickness of the metal layer is preferably 0.1 μm or more. Moreover, it is preferable to set it as 8 micrometers or less from viewpoints of productivity, a flexibility, etc. Note that the metal layer can be formed by an electrolytic plating method, an electroless plating method, a sputtering method, an electron beam evaporation method, a vacuum evaporation method, a CVD method, a metal organic, or the like. The metal layer can also be formed of metal foil, metal nanoparticles, scale-like metal particles, and the like.
本実施形態のシールド層120は、金属層とすることができる。シールド層120は、ニッケル、銅、銀、錫、金、パラジウム、アルミニウム、クロム、チタン、及び亜鉛のいずれか、又はこれらを2つ以上含む合金等からなる金属層を用いることができる。また、金属層の材質及び厚さは、必要とする電磁シールド効果及び繰り返し屈曲・摺動耐性に応じて適宜選択すればよい。十分な電磁シールド効果を得る観点から、金属層の厚さは0.1μm以上とすることが好ましい。また、生産性及び屈曲性等の観点から8μm以下とすることが好ましい。なお、金属層は、電解メッキ法、無電解メッキ法、スパッタリング法、電子ビーム蒸着法、真空蒸着法、CVD法、及びメタルオーガニック等により形成することができる。また、金属層は、金属箔、金属ナノ粒子、及び鱗片状金属粒子等により形成することもできる。 (Shield layer)
The
(接着剤層)
本実施形態の電磁波シールドフィルムは、シールド層120の絶縁保護層110と反対側に接着剤層130を備えていてもよい。接着剤層130は、接着性の樹脂組成物により形成することができる。接着性樹脂組成物は特に限定されないが、スチレン系樹脂組成物、酢酸ビニル系樹脂組成物、ポリエステル系樹脂組成物、ポリエチレン系樹脂組成物、ポリプロピレン系樹脂組成物、イミド系樹脂組成物、アミド系樹脂組成物、及びアクリル系樹脂組成物等の熱可塑性樹脂組成物、並びにフェノール系樹脂組成物、エポキシ系樹脂組成物、ウレタン系樹脂組成物、メラミン系樹脂組成物、アルキッド系樹脂組成物等の熱硬化性樹脂組成物等を用いることができる。これらは1種単独で用いてもよく、2種以上を併用してもよい。 (Adhesive layer)
The electromagnetic wave shielding film of this embodiment may include anadhesive layer 130 on the side of the shield layer 120 opposite to the insulating protective layer 110. The adhesive layer 130 can be formed of an adhesive resin composition. Adhesive resin composition is not particularly limited, but styrene resin composition, vinyl acetate resin composition, polyester resin composition, polyethylene resin composition, polypropylene resin composition, imide resin composition, amide resin Thermoplastic resin compositions such as resin compositions and acrylic resin compositions, phenolic resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resin compositions, etc. A thermosetting resin composition or the like can be used. These may be used alone or in combination of two or more.
本実施形態の電磁波シールドフィルムは、シールド層120の絶縁保護層110と反対側に接着剤層130を備えていてもよい。接着剤層130は、接着性の樹脂組成物により形成することができる。接着性樹脂組成物は特に限定されないが、スチレン系樹脂組成物、酢酸ビニル系樹脂組成物、ポリエステル系樹脂組成物、ポリエチレン系樹脂組成物、ポリプロピレン系樹脂組成物、イミド系樹脂組成物、アミド系樹脂組成物、及びアクリル系樹脂組成物等の熱可塑性樹脂組成物、並びにフェノール系樹脂組成物、エポキシ系樹脂組成物、ウレタン系樹脂組成物、メラミン系樹脂組成物、アルキッド系樹脂組成物等の熱硬化性樹脂組成物等を用いることができる。これらは1種単独で用いてもよく、2種以上を併用してもよい。 (Adhesive layer)
The electromagnetic wave shielding film of this embodiment may include an
接着剤層130は、必要に応じて等方導電性又は異方導電性を有する層とすることができる。接着剤層130を導電性を有する層とする場合には、接着性の樹脂組成物に導電性の微粒子を添加すればよい。
The adhesive layer 130 can be a layer having isotropic conductivity or anisotropic conductivity as required. When the adhesive layer 130 is a layer having conductivity, conductive fine particles may be added to the adhesive resin composition.
導電性の微粒子は、特に限定されないが、金属微粒子、カーボンナノチューブ、炭素繊維、金属繊維等を使用することができる。例えば、銀粉、銅粉、ニッケル粉、ハンダ粉、及びアルミニウム粉等の金属微粒子を用いることができる。また、銅粉に銀メッキを施した銀コート銅粉、及び高分子微粒子やガラスビーズ等を金属で被覆した金属被覆微粒子等を用いることもできる。中でも、経済性の観点から、安価に入手できる銅粉又は銀コート銅粉が好ましい。
The conductive fine particles are not particularly limited, and metal fine particles, carbon nanotubes, carbon fibers, metal fibers, and the like can be used. For example, fine metal particles such as silver powder, copper powder, nickel powder, solder powder, and aluminum powder can be used. Moreover, the silver coat copper powder which gave silver plating to copper powder, the metal coating fine particle which coat | covered the polymer fine particle, the glass bead, etc. with the metal etc. can also be used. Among these, from the economical viewpoint, copper powder or silver-coated copper powder that can be obtained at low cost is preferable.
導電性粒子の50%平均粒子径は、特に限定されないが、良好な導電性を得る観点から0.5μm以上が好ましい。また、導電性接着剤層を薄くする観点から15μm以下とすることが好ましい。
The 50% average particle diameter of the conductive particles is not particularly limited, but is preferably 0.5 μm or more from the viewpoint of obtaining good conductivity. Moreover, it is preferable to set it as 15 micrometers or less from a viewpoint of making a conductive adhesive layer thin.
導電性粒子の形状は、特に限定されないが、球状、扁平状、リン片状、及びデンドライト状等から適宜選択することができる。
The shape of the conductive particles is not particularly limited, but can be appropriately selected from a spherical shape, a flat shape, a flake shape, a dendrite shape, and the like.
接着剤層130の厚さは、必要に応じて調整することができるが、良好な接着性を得る観点から0.5μm以上とすることが好ましい。また、電磁波シールドフィルムを薄くする観点から20μm以下とすることが好ましい。
The thickness of the adhesive layer 130 can be adjusted as necessary, but is preferably 0.5 μm or more from the viewpoint of obtaining good adhesiveness. Moreover, it is preferable to set it as 20 micrometers or less from a viewpoint of making an electromagnetic wave shielding film thin.
電磁波シールドフィルムが、絶縁保護層110と、シールド層120と接着剤層130と有している構成について説明したが、図2に示すように、絶縁保護層110と等方導電性接着剤層140とを有する構成とすることもできる。
The configuration in which the electromagnetic wave shielding film has the insulating protective layer 110, the shield layer 120, and the adhesive layer 130 has been described. However, as shown in FIG. 2, the insulating protective layer 110 and the isotropic conductive adhesive layer 140 are provided. It can also be set as the structure which has these.
絶縁保護層110は、図1に示す電磁波シールドフィルムと同様の構成とすることができる。等方導電性接着剤層140は、接着剤層130と同様の接着性の樹脂組成物及び導電性微粒子により形成することができる。等方導電性接着剤層140はシールド層として機能する。
The insulating protective layer 110 can have the same configuration as the electromagnetic wave shielding film shown in FIG. The isotropic conductive adhesive layer 140 can be formed of the same adhesive resin composition and conductive fine particles as the adhesive layer 130. The isotropic conductive adhesive layer 140 functions as a shield layer.
(シールドフィルムの製造方法)
電磁波シールドフィルムは、公知の製造方法により製造することができる。以下にその一例を示す。 (Manufacturing method of shield film)
The electromagnetic wave shielding film can be manufactured by a known manufacturing method. An example is shown below.
電磁波シールドフィルムは、公知の製造方法により製造することができる。以下にその一例を示す。 (Manufacturing method of shield film)
The electromagnetic wave shielding film can be manufactured by a known manufacturing method. An example is shown below.
先ず、表面を離型処理した支持体フィルムの上に、導電性を有する接着剤層130を形成する。具体的には、接着剤層130を構成する材料を含む接着剤層組成物の溶液を支持体フィルムの表面に塗布乾燥して接着剤層130を形成する。
First, a conductive adhesive layer 130 is formed on a support film whose surface has been release-treated. Specifically, the adhesive layer 130 is formed by applying and drying a solution of an adhesive layer composition containing a material constituting the adhesive layer 130 on the surface of the support film.
次に、接着剤層130の表面にシールド層120を形成する。具体的には、予め所定の厚さに形成した金属箔を接着剤層130に貼り合わせる方法や、接着剤層130の表面に蒸着又はめっき等により金属層を形成する方法を用いることができる。
Next, the shield layer 120 is formed on the surface of the adhesive layer 130. Specifically, a method of sticking a metal foil having a predetermined thickness to the adhesive layer 130 or a method of forming a metal layer on the surface of the adhesive layer 130 by vapor deposition or plating can be used.
次に、シールド層120の表面に絶縁保護層110を形成する。具体的には、絶縁保護層110を構成する材料を含む絶縁保護層組成物の溶液をシールド層120の表面に塗布乾燥する方法を用いることができる。
Next, the insulating protective layer 110 is formed on the surface of the shield layer 120. Specifically, a method of applying and drying a solution of an insulating protective layer composition containing a material constituting the insulating protective layer 110 on the surface of the shield layer 120 can be used.
この後、支持体フィルムを剥離することにより、電磁波シールドフィルムを得ることができる。
Thereafter, an electromagnetic wave shielding film can be obtained by peeling off the support film.
なお、接着剤層130を等方導電性接着剤層140とし、等方導電性接着剤層140の表面に絶縁保護層110を形成することもできる。
Note that the adhesive layer 130 may be the isotropic conductive adhesive layer 140, and the insulating protective layer 110 may be formed on the surface of the isotropic conductive adhesive layer 140.
絶縁保護層110の表面における算術平均傾斜及び二乗平均平方根傾斜の調整を行うために、絶縁保護層110の表面にサンドブラスト等の処理を行うこともできる。
In order to adjust the arithmetic mean slope and the root mean square slope on the surface of the insulating protective layer 110, the surface of the insulating protective layer 110 can be subjected to processing such as sandblasting.
接着剤層130側から形成する例を示したが、絶縁保護層110側から順次形成することもできる。この場合、微細パターンを有する支持体フィルムを用い、接着剤層130の表面に微細パターンを転写することにより、接着剤層130の表面における算術平均傾斜及び二乗平均平方根傾斜を調整することもできる。
Although an example of forming from the adhesive layer 130 side is shown, it can also be formed sequentially from the insulating protective layer 110 side. In this case, by using a support film having a fine pattern and transferring the fine pattern to the surface of the adhesive layer 130, the arithmetic average slope and the root mean square slope on the surface of the adhesive layer 130 can be adjusted.
以下、実施例によって本発明を詳細に説明する。なお、以下の実施例は例示であり、本発明を何ら限定しない。
Hereinafter, the present invention will be described in detail by way of examples. In addition, the following Examples are illustrations and do not limit this invention at all.
<特性評価>
[滲み出しの評価]
電磁波シールドフィルムの絶縁保護層の表面に、スクリーン印刷版を用いて1mm×2mmの英数字を印刷し、英数字の形状を顕微鏡により観察することで、滲み出しの有無を評価した。滲み出しが認められない場合は○、滲み出しが生じ、輪郭に変形やインクのはじきが認められた場合は×とした。 <Characteristic evaluation>
[Evaluation of bleeding]
On the surface of the insulating protective layer of the electromagnetic wave shielding film, 1 mm × 2 mm alphanumeric characters were printed using a screen printing plate, and the presence or absence of bleeding was evaluated by observing the alphanumeric shape with a microscope. The case where no oozing was observed was evaluated as ◯, and the case where oozing occurred and the contour was deformed or ink was repelled was evaluated as x.
[滲み出しの評価]
電磁波シールドフィルムの絶縁保護層の表面に、スクリーン印刷版を用いて1mm×2mmの英数字を印刷し、英数字の形状を顕微鏡により観察することで、滲み出しの有無を評価した。滲み出しが認められない場合は○、滲み出しが生じ、輪郭に変形やインクのはじきが認められた場合は×とした。 <Characteristic evaluation>
[Evaluation of bleeding]
On the surface of the insulating protective layer of the electromagnetic wave shielding film, 1 mm × 2 mm alphanumeric characters were printed using a screen printing plate, and the presence or absence of bleeding was evaluated by observing the alphanumeric shape with a microscope. The case where no oozing was observed was evaluated as ◯, and the case where oozing occurred and the contour was deformed or ink was repelled was evaluated as x.
[視認性の評価]
視認性は、45°正反射を観察する方法により行った。暗室中にて机上から10cmの高さにLEDライト(SUPRABEAM製)の照射口が鉛直方向から略45°となるように設置し、照射口の真下から水平方向に10cm離れた位置に、上記の電磁波シールドフィルムを載置した。次いで、電磁波シールドフィルムを載置した位置から水平方向に10cm、垂直方向に10cm離れた位置から、絶縁保護層の表面に白色インキで印刷された3文字の英数字(縦0.5mm、横0.2mm、0.1mm間隔)を観察し、見えやすさを評価した。印字の全ての輪郭が明確に視認できる場合は○、印字が視認できない場合は×とした。 [Evaluation of visibility]
The visibility was performed by a method of observing 45 ° regular reflection. In the dark room, the LED light (SUPRABEAM) irradiation port is installed at a height of 10 cm from the desk so that the irradiation port is approximately 45 ° from the vertical direction. An electromagnetic wave shielding film was placed. Next, from the position 10 cm in the horizontal direction and 10 cm in the vertical direction from the position on which the electromagnetic wave shielding film was placed, three alphanumeric characters (0.5 mm in length, 0 in width) printed on the surface of the insulating protective layer with white ink. .2 mm, 0.1 mm interval) was observed and the visibility was evaluated. When all the outlines of the print were clearly visible, the mark was “◯”, and when the print was not visible, the mark was “x”.
視認性は、45°正反射を観察する方法により行った。暗室中にて机上から10cmの高さにLEDライト(SUPRABEAM製)の照射口が鉛直方向から略45°となるように設置し、照射口の真下から水平方向に10cm離れた位置に、上記の電磁波シールドフィルムを載置した。次いで、電磁波シールドフィルムを載置した位置から水平方向に10cm、垂直方向に10cm離れた位置から、絶縁保護層の表面に白色インキで印刷された3文字の英数字(縦0.5mm、横0.2mm、0.1mm間隔)を観察し、見えやすさを評価した。印字の全ての輪郭が明確に視認できる場合は○、印字が視認できない場合は×とした。 [Evaluation of visibility]
The visibility was performed by a method of observing 45 ° regular reflection. In the dark room, the LED light (SUPRABEAM) irradiation port is installed at a height of 10 cm from the desk so that the irradiation port is approximately 45 ° from the vertical direction. An electromagnetic wave shielding film was placed. Next, from the position 10 cm in the horizontal direction and 10 cm in the vertical direction from the position on which the electromagnetic wave shielding film was placed, three alphanumeric characters (0.5 mm in length, 0 in width) printed on the surface of the insulating protective layer with white ink. .2 mm, 0.1 mm interval) was observed and the visibility was evaluated. When all the outlines of the print were clearly visible, the mark was “◯”, and when the print was not visible, the mark was “x”.
[算術平均傾斜及び二乗平均平方根傾斜の測定]
レーザーマイクロスコープ(株式会社キーエンス製、VK-X200、対物レンズ50倍)を用いて絶縁保護層表面の任意の5視野を観察し、JIS B 0601(2001)に準拠して算術平均傾斜及び二乗平均平方根傾斜の平均値を測定した。なお、基準長さは280μmとした。 [Measurement of arithmetic mean slope and root mean square slope]
Using a laser microscope (Keyence Co., Ltd., VK-X200, objective lens 50 times), arbitrary 5 visual fields on the surface of the insulating protective layer are observed, and arithmetic mean inclination and square mean according to JIS B 0601 (2001) The average value of the square root slope was measured. The reference length was 280 μm.
レーザーマイクロスコープ(株式会社キーエンス製、VK-X200、対物レンズ50倍)を用いて絶縁保護層表面の任意の5視野を観察し、JIS B 0601(2001)に準拠して算術平均傾斜及び二乗平均平方根傾斜の平均値を測定した。なお、基準長さは280μmとした。 [Measurement of arithmetic mean slope and root mean square slope]
Using a laser microscope (Keyence Co., Ltd., VK-X200, objective lens 50 times), arbitrary 5 visual fields on the surface of the insulating protective layer are observed, and arithmetic mean inclination and square mean according to JIS B 0601 (2001) The average value of the square root slope was measured. The reference length was 280 μm.
[L*値の測定]
積分球分光測色計(X-Rite社製、Ci64、タングステン光源)を用いてL*値を測定した。 [Measurement of L * value]
The L * value was measured using an integrating sphere spectrocolorimeter (X-Rite, Ci64, tungsten light source).
積分球分光測色計(X-Rite社製、Ci64、タングステン光源)を用いてL*値を測定した。 [Measurement of L * value]
The L * value was measured using an integrating sphere spectrocolorimeter (X-Rite, Ci64, tungsten light source).
[光沢度の測定]
60°光沢度及び85°光沢度は、BYKガードナー・マイクロ-グロス(携帯型光沢計)により測定した。 [Glossiness measurement]
The 60 ° gloss and 85 ° gloss were measured with a BYK Gardner Micro-Gloss (portable gloss meter).
60°光沢度及び85°光沢度は、BYKガードナー・マイクロ-グロス(携帯型光沢計)により測定した。 [Glossiness measurement]
The 60 ° gloss and 85 ° gloss were measured with a BYK Gardner Micro-Gloss (portable gloss meter).
(実施例1)
-導電性接着剤層の作製-
固形分量が20質量%となるように、トルエンにビスフェノールA型エポキシ系樹脂(三菱化学(株)製、jER1256)を100質量部、硬化剤(三菱化学(株)製、ST14)を0.1質量部、平均粒子径10μmで球状の銀被覆銅粉を47質量部添加し、撹拌混合して導電性の接着剤層組成物を調製した。得られた接着剤層組成物を、表面を離型処理したPETフィルムに塗布し、加熱乾燥することで、支持フィルム表面に接着剤層を形成した。 Example 1
-Production of conductive adhesive layer-
100 parts by mass of bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., jER1256) and 0.1% of curing agent (manufactured by Mitsubishi Chemical Co., Ltd., ST14) so that the solid content is 20% by mass. 47 parts by mass of spherical silver-coated copper powder having an average particle size of 10 μm was added and mixed by stirring to prepare a conductive adhesive layer composition. The obtained adhesive layer composition was applied to a PET film whose surface was subjected to mold release treatment, and dried by heating to form an adhesive layer on the surface of the support film.
-導電性接着剤層の作製-
固形分量が20質量%となるように、トルエンにビスフェノールA型エポキシ系樹脂(三菱化学(株)製、jER1256)を100質量部、硬化剤(三菱化学(株)製、ST14)を0.1質量部、平均粒子径10μmで球状の銀被覆銅粉を47質量部添加し、撹拌混合して導電性の接着剤層組成物を調製した。得られた接着剤層組成物を、表面を離型処理したPETフィルムに塗布し、加熱乾燥することで、支持フィルム表面に接着剤層を形成した。 Example 1
-Production of conductive adhesive layer-
100 parts by mass of bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., jER1256) and 0.1% of curing agent (manufactured by Mitsubishi Chemical Co., Ltd., ST14) so that the solid content is 20% by mass. 47 parts by mass of spherical silver-coated copper powder having an average particle size of 10 μm was added and mixed by stirring to prepare a conductive adhesive layer composition. The obtained adhesive layer composition was applied to a PET film whose surface was subjected to mold release treatment, and dried by heating to form an adhesive layer on the surface of the support film.
-シールド層の作製-
得られた接着剤層の表面に、蒸着法により厚さ0.1μmの銀層を形成した。 -Production of shield layer-
A silver layer having a thickness of 0.1 μm was formed on the surface of the obtained adhesive layer by vapor deposition.
得られた接着剤層の表面に、蒸着法により厚さ0.1μmの銀層を形成した。 -Production of shield layer-
A silver layer having a thickness of 0.1 μm was formed on the surface of the obtained adhesive layer by vapor deposition.
-絶縁保護層の作製-
固形分量が20質量%となるように、トルエンにビスフェノールA型エポキシ系樹脂(三菱化学(株)製、jER1256)を100質量部、硬化剤として(三菱化学(株)製、ST14)を0.1質量部、黒色系着色剤としてカーボン粒子(東海カーボン(株)製、トーカブラック#8300/F)を15質量部、微粒子として平均粒径6μmのウレタン樹脂粒子を10質量部配合し、絶縁保護層組成物を調製した。この組成物を、得られたシールド層に塗布し、加熱乾燥して実施例1の電磁波シールドフィルムを得た。 -Production of insulating protective layer-
100 parts by mass of bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., jER1256) and 0.1% of a curing agent (manufactured by Mitsubishi Chemical Co., Ltd., ST14) so that the solid content is 20% by mass. 1 part by mass, 15 parts by mass of carbon particles (manufactured by Tokai Carbon Co., Ltd., Talker Black # 8300 / F) as a black colorant, and 10 parts by mass of urethane resin particles having an average particle size of 6 μm as fine particles A layer composition was prepared. This composition was applied to the obtained shield layer and dried by heating to obtain an electromagnetic wave shielding film of Example 1.
固形分量が20質量%となるように、トルエンにビスフェノールA型エポキシ系樹脂(三菱化学(株)製、jER1256)を100質量部、硬化剤として(三菱化学(株)製、ST14)を0.1質量部、黒色系着色剤としてカーボン粒子(東海カーボン(株)製、トーカブラック#8300/F)を15質量部、微粒子として平均粒径6μmのウレタン樹脂粒子を10質量部配合し、絶縁保護層組成物を調製した。この組成物を、得られたシールド層に塗布し、加熱乾燥して実施例1の電磁波シールドフィルムを得た。 -Production of insulating protective layer-
100 parts by mass of bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd., jER1256) and 0.1% of a curing agent (manufactured by Mitsubishi Chemical Co., Ltd., ST14) so that the solid content is 20% by mass. 1 part by mass, 15 parts by mass of carbon particles (manufactured by Tokai Carbon Co., Ltd., Talker Black # 8300 / F) as a black colorant, and 10 parts by mass of urethane resin particles having an average particle size of 6 μm as fine particles A layer composition was prepared. This composition was applied to the obtained shield layer and dried by heating to obtain an electromagnetic wave shielding film of Example 1.
得られた絶縁保護層の表面における算術平均傾斜は、43°、二乗平均平方根傾斜は50°、L*値は18、60°光沢度は0.2%、85°光沢度は0.3%であった。滲み出しの有無を評価したところ、インクのはじき等は見られず、滲み出しは認められなかった。また、印字の視認性も良好であった。
The arithmetic average slope on the surface of the obtained insulating protective layer is 43 °, the root mean square slope is 50 °, the L * value is 18, the 60 ° gloss is 0.2%, and the 85 ° gloss is 0.3%. Met. When the presence or absence of bleeding was evaluated, no ink repelling or the like was observed, and no bleeding was observed. Moreover, the visibility of printing was also good.
(実施例2)
絶縁保護層組成物に加える微粒子を平均粒径2μmのウレタン樹脂粒子10質量部とした以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、32°、二乗平均平方根傾斜は39°、L*値は20、60°光沢度は1.1%、85°光沢度は2.3%であった。滲み出しの有無を評価したところ、インクのはじき等は見られず、滲み出しは認められなかった。また、印字の視認性も良好であった。 (Example 2)
The same procedure as in Example 1 was conducted, except that the fine particles added to the insulating protective layer composition were changed to 10 parts by mass of urethane resin particles having an average particle diameter of 2 μm. The arithmetic average slope on the surface of the obtained insulating protective layer is 32 °, the root mean square slope is 39 °, the L * value is 20, the 60 ° glossiness is 1.1%, and the 85 ° glossiness is 2.3%. Met. When the presence or absence of bleeding was evaluated, no ink repelling or the like was observed, and no bleeding was observed. Moreover, the visibility of printing was also good.
絶縁保護層組成物に加える微粒子を平均粒径2μmのウレタン樹脂粒子10質量部とした以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、32°、二乗平均平方根傾斜は39°、L*値は20、60°光沢度は1.1%、85°光沢度は2.3%であった。滲み出しの有無を評価したところ、インクのはじき等は見られず、滲み出しは認められなかった。また、印字の視認性も良好であった。 (Example 2)
The same procedure as in Example 1 was conducted, except that the fine particles added to the insulating protective layer composition were changed to 10 parts by mass of urethane resin particles having an average particle diameter of 2 μm. The arithmetic average slope on the surface of the obtained insulating protective layer is 32 °, the root mean square slope is 39 °, the L * value is 20, the 60 ° glossiness is 1.1%, and the 85 ° glossiness is 2.3%. Met. When the presence or absence of bleeding was evaluated, no ink repelling or the like was observed, and no bleeding was observed. Moreover, the visibility of printing was also good.
(実施例3)
絶縁保護層組成物に加える微粒子を平均粒径5μmのウレタン樹脂粒子10質量部とした以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、46°、二乗平均平方根傾斜は52°、L*値は21、60°光沢度は0.3%、85°光沢度は2.6%であった。滲み出しの有無を評価したところ、インクのはじき等は見られず、滲み出しは認められなかった。また、印字の視認性も良好であった。 (Example 3)
The same procedure as in Example 1 was conducted, except that the fine particles added to the insulating protective layer composition were changed to 10 parts by mass of urethane resin particles having an average particle diameter of 5 μm. The arithmetic average slope on the surface of the obtained insulating protective layer is 46 °, the root mean square slope is 52 °, the L * value is 21, the 60 ° gloss is 0.3%, and the 85 ° gloss is 2.6%. Met. When the presence or absence of bleeding was evaluated, no ink repelling or the like was observed, and no bleeding was observed. Moreover, the visibility of printing was also good.
絶縁保護層組成物に加える微粒子を平均粒径5μmのウレタン樹脂粒子10質量部とした以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、46°、二乗平均平方根傾斜は52°、L*値は21、60°光沢度は0.3%、85°光沢度は2.6%であった。滲み出しの有無を評価したところ、インクのはじき等は見られず、滲み出しは認められなかった。また、印字の視認性も良好であった。 (Example 3)
The same procedure as in Example 1 was conducted, except that the fine particles added to the insulating protective layer composition were changed to 10 parts by mass of urethane resin particles having an average particle diameter of 5 μm. The arithmetic average slope on the surface of the obtained insulating protective layer is 46 °, the root mean square slope is 52 °, the L * value is 21, the 60 ° gloss is 0.3%, and the 85 ° gloss is 2.6%. Met. When the presence or absence of bleeding was evaluated, no ink repelling or the like was observed, and no bleeding was observed. Moreover, the visibility of printing was also good.
(実施例4)
絶縁保護層組成物に加える微粒子を平均粒径5μmのアクリルスチレン樹脂粒子13質量部とした以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、35°、二乗平均平方根傾斜は43°、L*値は18、60°光沢度は0.8%、85°光沢度は2.1%であった。滲み出しの有無を評価したところ、印字の視認性は良好であった。 Example 4
The same procedure as in Example 1 was performed except that the fine particles added to the insulating protective layer composition were 13 parts by mass of acrylic styrene resin particles having an average particle size of 5 μm. The arithmetic average slope on the surface of the obtained insulating protective layer is 35 °, the root mean square slope is 43 °, the L * value is 18, the 60 ° gloss is 0.8%, and the 85 ° gloss is 2.1%. Met. When the presence or absence of bleeding was evaluated, the print visibility was good.
絶縁保護層組成物に加える微粒子を平均粒径5μmのアクリルスチレン樹脂粒子13質量部とした以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、35°、二乗平均平方根傾斜は43°、L*値は18、60°光沢度は0.8%、85°光沢度は2.1%であった。滲み出しの有無を評価したところ、印字の視認性は良好であった。 Example 4
The same procedure as in Example 1 was performed except that the fine particles added to the insulating protective layer composition were 13 parts by mass of acrylic styrene resin particles having an average particle size of 5 μm. The arithmetic average slope on the surface of the obtained insulating protective layer is 35 °, the root mean square slope is 43 °, the L * value is 18, the 60 ° gloss is 0.8%, and the 85 ° gloss is 2.1%. Met. When the presence or absence of bleeding was evaluated, the print visibility was good.
(比較例1)
絶縁保護層組成物に加える黒色系着色剤を5質量部とし、微粒子を加えなかった。離型処理を施した面に凹凸形状を有する支持体フィルムの表面に絶縁保護層組成物を塗布して乾燥し、これをシールド層と貼り合わせた後、絶縁保護層の表面から支持体フィルムを剥離することにより、凹凸が転写された絶縁保護層を形成した。その他の条件は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、22°、二乗平均平方根傾斜は31°、L*値は28、60°光沢度は2.0%、85°光沢度は43.4%であった。滲み出しの有無を評価したところ、インクのはじきが認められた。また、印字は、反射光にまぎれて視認できなかった。 (Comparative Example 1)
The black colorant added to the insulating protective layer composition was 5 parts by mass, and no fine particles were added. The insulating protective layer composition is applied to the surface of the support film having a concavo-convex shape on the surface that has been subjected to the mold release treatment, dried, and bonded to the shield layer, and then the support film is applied from the surface of the insulating protective layer. By peeling off, an insulating protective layer to which the irregularities were transferred was formed. Other conditions were the same as in Example 1. The arithmetic average slope on the surface of the obtained insulating protective layer is 22 °, the root mean square slope is 31 °, the L * value is 28, the 60 ° gloss is 2.0%, and the 85 ° gloss is 43.4%. Met. When the presence or absence of bleeding was evaluated, ink repelling was observed. Also, the print could not be visually recognized by the reflected light.
絶縁保護層組成物に加える黒色系着色剤を5質量部とし、微粒子を加えなかった。離型処理を施した面に凹凸形状を有する支持体フィルムの表面に絶縁保護層組成物を塗布して乾燥し、これをシールド層と貼り合わせた後、絶縁保護層の表面から支持体フィルムを剥離することにより、凹凸が転写された絶縁保護層を形成した。その他の条件は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、22°、二乗平均平方根傾斜は31°、L*値は28、60°光沢度は2.0%、85°光沢度は43.4%であった。滲み出しの有無を評価したところ、インクのはじきが認められた。また、印字は、反射光にまぎれて視認できなかった。 (Comparative Example 1)
The black colorant added to the insulating protective layer composition was 5 parts by mass, and no fine particles were added. The insulating protective layer composition is applied to the surface of the support film having a concavo-convex shape on the surface that has been subjected to the mold release treatment, dried, and bonded to the shield layer, and then the support film is applied from the surface of the insulating protective layer. By peeling off, an insulating protective layer to which the irregularities were transferred was formed. Other conditions were the same as in Example 1. The arithmetic average slope on the surface of the obtained insulating protective layer is 22 °, the root mean square slope is 31 °, the L * value is 28, the 60 ° gloss is 2.0%, and the 85 ° gloss is 43.4%. Met. When the presence or absence of bleeding was evaluated, ink repelling was observed. Also, the print could not be visually recognized by the reflected light.
(比較例2)
絶縁保護層組成物に加える黒色系着色剤を5質量部とし、微粒子を加えなかった以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、16°、二乗平均平方根傾斜は25°、L*値は27、60°光沢度は11.1%、85°光沢度は36.7%であった。滲み出しの有無を評価したところ、インクのはじきが認められた。また、印字は、反射光にまぎれて視認できなかった。 (Comparative Example 2)
The same procedure as in Example 1 was conducted except that the black colorant added to the insulating protective layer composition was 5 parts by mass and no fine particles were added. The arithmetic average slope on the surface of the obtained insulating protective layer is 16 °, the root mean square slope is 25 °, the L * value is 27, the 60 ° glossiness is 11.1%, and the 85 ° glossiness is 36.7%. Met. When the presence or absence of bleeding was evaluated, ink repelling was observed. Also, the print could not be visually recognized by the reflected light.
絶縁保護層組成物に加える黒色系着色剤を5質量部とし、微粒子を加えなかった以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、16°、二乗平均平方根傾斜は25°、L*値は27、60°光沢度は11.1%、85°光沢度は36.7%であった。滲み出しの有無を評価したところ、インクのはじきが認められた。また、印字は、反射光にまぎれて視認できなかった。 (Comparative Example 2)
The same procedure as in Example 1 was conducted except that the black colorant added to the insulating protective layer composition was 5 parts by mass and no fine particles were added. The arithmetic average slope on the surface of the obtained insulating protective layer is 16 °, the root mean square slope is 25 °, the L * value is 27, the 60 ° glossiness is 11.1%, and the 85 ° glossiness is 36.7%. Met. When the presence or absence of bleeding was evaluated, ink repelling was observed. Also, the print could not be visually recognized by the reflected light.
(比較例3)
絶縁保護層組成物に加える黒色系着色剤を5質量部とし、微粒子を加えなかった以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、23°、二乗平均平方根傾斜は30°、L*値は25、60°光沢度は4.2%、85°光沢度は33.1%であった。滲み出しの有無を評価したところ、インクのはじきが認められた。また、印字は、反射光にまぎれて視認できなかった。 (Comparative Example 3)
The same procedure as in Example 1 was conducted except that the black colorant added to the insulating protective layer composition was 5 parts by mass and no fine particles were added. The arithmetic average slope on the surface of the obtained insulating protective layer is 23 °, the root mean square slope is 30 °, the L * value is 25, the 60 ° glossiness is 4.2%, and the 85 ° glossiness is 33.1%. Met. When the presence or absence of bleeding was evaluated, ink repelling was observed. Also, the print could not be visually recognized by the reflected light.
絶縁保護層組成物に加える黒色系着色剤を5質量部とし、微粒子を加えなかった以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は、23°、二乗平均平方根傾斜は30°、L*値は25、60°光沢度は4.2%、85°光沢度は33.1%であった。滲み出しの有無を評価したところ、インクのはじきが認められた。また、印字は、反射光にまぎれて視認できなかった。 (Comparative Example 3)
The same procedure as in Example 1 was conducted except that the black colorant added to the insulating protective layer composition was 5 parts by mass and no fine particles were added. The arithmetic average slope on the surface of the obtained insulating protective layer is 23 °, the root mean square slope is 30 °, the L * value is 25, the 60 ° glossiness is 4.2%, and the 85 ° glossiness is 33.1%. Met. When the presence or absence of bleeding was evaluated, ink repelling was observed. Also, the print could not be visually recognized by the reflected light.
(比較例4)
支持体フィルムとして、表面粗さが0.6μmのものを用いたこと以外は、比較例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は13°、二乗平均平方根傾斜は19°、L*値は28、60°光沢度は8.0%、85°光沢度は43.1%であった。印字は、反射光にまぎれて視認できなかった。 (Comparative Example 4)
The same procedure as in Comparative Example 1 was conducted except that a support film having a surface roughness of 0.6 μm was used. The arithmetic average slope on the surface of the obtained insulating protective layer is 13 °, the root mean square slope is 19 °, the L * value is 28, the 60 ° gloss is 8.0%, and the 85 ° gloss is 43.1%. there were. The print could not be seen under the reflected light.
支持体フィルムとして、表面粗さが0.6μmのものを用いたこと以外は、比較例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は13°、二乗平均平方根傾斜は19°、L*値は28、60°光沢度は8.0%、85°光沢度は43.1%であった。印字は、反射光にまぎれて視認できなかった。 (Comparative Example 4)
The same procedure as in Comparative Example 1 was conducted except that a support film having a surface roughness of 0.6 μm was used. The arithmetic average slope on the surface of the obtained insulating protective layer is 13 °, the root mean square slope is 19 °, the L * value is 28, the 60 ° gloss is 8.0%, and the 85 ° gloss is 43.1%. there were. The print could not be seen under the reflected light.
(比較例5)
絶縁保護層組成物に加える微粒子を平均粒径7μmのウレタン樹脂粒子3質量部とした以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は14°、二乗平均平方根傾斜は20°、L*値は26、60°光沢度は6.1%、85°光沢度は36.9%であった。印字は、反射光にまぎれて視認できなかった。 (Comparative Example 5)
The same procedure as in Example 1 was performed except that the fine particles added to the insulating protective layer composition were changed to 3 parts by mass of urethane resin particles having an average particle diameter of 7 μm. The arithmetic average slope on the surface of the obtained insulating protective layer is 14 °, the root mean square slope is 20 °, the L * value is 26, the 60 ° glossiness is 6.1%, and the 85 ° glossiness is 36.9%. there were. The print could not be seen under the reflected light.
絶縁保護層組成物に加える微粒子を平均粒径7μmのウレタン樹脂粒子3質量部とした以外は、実施例1と同様にした。得られた絶縁保護層の表面における算術平均傾斜は14°、二乗平均平方根傾斜は20°、L*値は26、60°光沢度は6.1%、85°光沢度は36.9%であった。印字は、反射光にまぎれて視認できなかった。 (Comparative Example 5)
The same procedure as in Example 1 was performed except that the fine particles added to the insulating protective layer composition were changed to 3 parts by mass of urethane resin particles having an average particle diameter of 7 μm. The arithmetic average slope on the surface of the obtained insulating protective layer is 14 °, the root mean square slope is 20 °, the L * value is 26, the 60 ° glossiness is 6.1%, and the 85 ° glossiness is 36.9%. there were. The print could not be seen under the reflected light.
表1に、各実施例及び比較例について絶縁保護層の組成及び特性をまとめて示す。
Table 1 summarizes the composition and characteristics of the insulating protective layer for each example and comparative example.
表面における算術平均傾斜が30°以上である実施例1~3の絶縁保護層は、いずれもインクのはじきが認められず印刷性が良好であった。また、実施例1~3の絶縁保護層は、比較例の絶縁保護層と比べて滲み出し及び視認性が優れていた。
The insulating protective layers of Examples 1 to 3 having an arithmetic average inclination on the surface of 30 ° or more did not show ink repellency and had good printability. Further, the insulating protective layers of Examples 1 to 3 were excellent in bleeding and visibility as compared with the insulating protective layer of the comparative example.
本開示の電磁波シールドフィルムは、小サイズの文字等を精度良く印刷することができ、電子機器等に用いる電磁波シールドフィルムとして有用である。
The electromagnetic shielding film of the present disclosure can print small-size characters and the like with high accuracy, and is useful as an electromagnetic shielding film used for electronic devices and the like.
110 絶縁保護層
120 シールド層
130 接着剤層
140 等方導電性接着剤層 110 Insulatingprotective layer 120 Shield layer 130 Adhesive layer 140 Isotropic conductive adhesive layer
120 シールド層
130 接着剤層
140 等方導電性接着剤層 110 Insulating
Claims (1)
- 絶縁保護層と、シールド層とを備え、
前記絶縁保護層は、表面における算術平均傾斜が30°以上である、
電磁波シールドフィルム。
Insulating protective layer and shield layer,
The insulating protective layer has an arithmetic average slope on the surface of 30 ° or more.
Electromagnetic shielding film.
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CN201780010708.7A CN108605425B (en) | 2016-02-12 | 2017-02-10 | Electromagnetic wave shielding film |
KR1020187018127A KR102432750B1 (en) | 2016-02-12 | 2017-02-10 | electromagnetic shielding film |
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KR (1) | KR102432750B1 (en) |
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JP2018041962A (en) * | 2016-09-06 | 2018-03-15 | タツタ電線株式会社 | Electromagnetic wave shield film |
WO2019073737A1 (en) * | 2017-10-10 | 2019-04-18 | 東レ株式会社 | Film |
CN110027268A (en) * | 2018-01-12 | 2019-07-19 | 拓自达电线株式会社 | Electromagnetic shielding film |
WO2019188983A1 (en) * | 2018-03-29 | 2019-10-03 | タツタ電線株式会社 | Resin composition for protective layer of electromagnetic wave-shielding film, electromagnetic wave-shielding film, and method for producing electromagnetic wave-shielding film |
WO2024004991A1 (en) * | 2022-06-28 | 2024-01-04 | タツタ電線株式会社 | Electromagnetic shielding film |
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JP6597927B1 (en) * | 2019-06-18 | 2019-10-30 | 東洋インキScホールディングス株式会社 | Electromagnetic shielding sheet and electromagnetic shielding wiring circuit board |
TWI764350B (en) * | 2020-10-30 | 2022-05-11 | 臻鼎科技股份有限公司 | Electromagnetic shielding film and manufacturing method |
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JP2003298285A (en) * | 2002-03-29 | 2003-10-17 | Tatsuta Electric Wire & Cable Co Ltd | Reinforcing shield film and shield flexible printed wiring board |
JP2012512543A (en) * | 2008-12-17 | 2012-05-31 | スリーエム イノベイティブ プロパティズ カンパニー | Electromagnetic shielding article |
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JP4201548B2 (en) | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | SHIELD FILM, SHIELD FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR PRODUCING THEM |
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- 2017-02-10 JP JP2017567011A patent/JP6621487B2/en active Active
- 2017-02-10 WO PCT/JP2017/004941 patent/WO2017138638A1/en active Application Filing
- 2017-02-10 KR KR1020187018127A patent/KR102432750B1/en active IP Right Grant
- 2017-02-10 CN CN201780010708.7A patent/CN108605425B/en active Active
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JPWO2019073737A1 (en) * | 2017-10-10 | 2020-09-24 | 東レ株式会社 | the film |
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CN110027268B (en) * | 2018-01-12 | 2022-02-01 | 拓自达电线株式会社 | Electromagnetic wave shielding film |
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CN110027268A (en) * | 2018-01-12 | 2019-07-19 | 拓自达电线株式会社 | Electromagnetic shielding film |
JPWO2019188983A1 (en) * | 2018-03-29 | 2021-04-15 | タツタ電線株式会社 | A resin composition for a protective layer of an electromagnetic wave shielding film, an electromagnetic wave shielding film, and a method for manufacturing an electromagnetic wave shielding film. |
JP7113888B2 (en) | 2018-03-29 | 2022-08-05 | タツタ電線株式会社 | Resin composition for protective layer of electromagnetic wave shielding film, electromagnetic wave shielding film, and method for producing electromagnetic wave shielding film |
WO2019188983A1 (en) * | 2018-03-29 | 2019-10-03 | タツタ電線株式会社 | Resin composition for protective layer of electromagnetic wave-shielding film, electromagnetic wave-shielding film, and method for producing electromagnetic wave-shielding film |
WO2024004991A1 (en) * | 2022-06-28 | 2024-01-04 | タツタ電線株式会社 | Electromagnetic shielding film |
Also Published As
Publication number | Publication date |
---|---|
JPWO2017138638A1 (en) | 2018-12-06 |
KR20180113500A (en) | 2018-10-16 |
CN108605425B (en) | 2020-04-07 |
JP6621487B2 (en) | 2019-12-18 |
KR102432750B1 (en) | 2022-08-12 |
TWI700982B (en) | 2020-08-01 |
TW201803434A (en) | 2018-01-16 |
CN108605425A (en) | 2018-09-28 |
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