JP6098688B1 - Electromagnetic shielding sheet and printed wiring board - Google Patents

Abstract

An object of the present invention is to provide an electromagnetic wave shielding sheet having an insulating layer excellent in print visibility, adhesion of printing ink and ink resistance, and having low repulsion even when bonded to an FPC. And A black resin composition comprising an insulating layer and a conductive adhesive layer (I), wherein the insulating layer contains a thermosetting resin (A1), a curing agent (A2), and a black colorant. And the surface of the insulating layer is solved by an electromagnetic wave shielding sheet having a contact angle with water of 60 to 110 °. [Selection] Figure 2

Description

  The present invention relates to an electromagnetic wave shielding sheet that shields electromagnetic waves generated from electronic components such as printed wiring boards.

  A flexible printed wiring board (hereinafter referred to as FPC) has flexibility, and its narrow and complex structure is required to meet the demand for higher performance and miniaturization of recent office automation equipment, communication equipment, mobile phones and the like. It is often used to incorporate an electronic circuit inside a casing made of With such downsizing and high frequency of electronic circuits, countermeasures against unnecessary electromagnetic noise generated therefrom are becoming more and more important. Thus, conventionally, an electromagnetic wave shielding sheet for shielding electromagnetic noise generated from an electronic circuit is laminated on the FPC. In addition to the electromagnetic wave shielding property, the electromagnetic wave shielding sheet is required to have thinness and excellent bending resistance so as not to impair the bending resistance of the bonded FPC as a whole. Therefore, the electromagnetic shielding sheet is widely known to have a configuration in which a conductive adhesive layer and an insulating layer are provided on a thin base film.

  For example, Patent Document 1 discloses an electromagnetic wave shield sheet in which an adhesive layer, a cover film, a metal thin film layer, and a conductive adhesive layer are sequentially laminated. Patent Document 2 discloses an electromagnetic wave shielding sheet in which a base film, a metal thin film layer, and a conductive adhesive layer are sequentially laminated. Patent Document 3 discloses an electromagnetic wave shielding sheet in which a cover film, a metal thin film layer, and a conductive adhesive layer are sequentially laminated.

  Usually, after affixing an electromagnetic wave shielding sheet to a large-sized wiring board, it is cut into a predetermined shape to produce a printed wiring board having a size that can be mounted on an electronic device. At this time, in order to grasp the manufacturer and production lot, the product name and lot number are often printed in white on the insulating layer of the electromagnetic wave shielding sheet on the printed wiring board by screen printing or the like. Since the printing area is small, the size of characters is usually small.

JP 2003-298285 A JP 2004-273577 A JP 2004-95566 A

  The FPC is printed with the product number and lot number on the insulating layer of the laminated electromagnetic shielding sheet. However, in the conventional electromagnetic shielding sheet, the printing ink that is usually used is blurred. When small characters are printed, there is a problem of printing visibility that it is difficult for an operator to visually recognize the printing. In addition, due to the low adhesion of the printing ink, if the printing peels off due to contact with other members, or the resistance to the solvent contained in the printing ink is low, the hardness of the coating film decreases, Ink resistance problems, such as reduced printability and reduced film strength, sometimes occurred. Further, when the thickness of the insulating layer is increased in order to improve printing visibility and ink resistance, the repulsive force of the FPC to which the electromagnetic wave shielding sheet is attached becomes strong, and there is a problem that handling properties deteriorate when mounting.

  An object of the present invention is to provide an electromagnetic wave shielding sheet having an insulating layer excellent in printing visibility, adhesion of printing ink, and ink resistance, and having a low repulsive force even when bonded to an FPC.

  As a result of intensive studies, the present inventors have found that an insulating layer formed of a black resin composition containing a thermosetting resin (A1), a curing agent (A2), and a black colorant, and conductive adhesion It has been found that the above-described problems can be solved by an electromagnetic wave shielding sheet comprising an agent layer (I) and having a contact angle with water on the surface of the insulating layer within a specific range, and has reached the present invention.

  That is, the present invention includes an insulating layer and a conductive adhesive layer (I), and the insulating layer contains a thermosetting resin (A1), a curing agent (A2), and a black colorant. The surface of the said insulating layer formed with a composition is related with the electromagnetic wave shield sheet characterized by the contact angle with water being 60-110 degrees.

  In the present invention, the conductive adhesive layer (I) is formed of a conductive adhesive (i) containing a thermosetting resin (B1), a curing agent (B2), and a conductive filler. It is related with the said electromagnetic wave shielding sheet characterized by these.

  In addition, the present invention relates to the electromagnetic wave shielding sheet, wherein the conductive adhesive layer (I) is anisotropically conductive and further includes a conductive layer that is isotropically conductive.

  In addition, the present invention includes the electromagnetic wave shielding sheet, a cover coat layer, and a wiring board having a signal wiring and an insulating reliability base material, and the printing is performed on the insulating layer of the electromagnetic wave shielding sheet The present invention relates to a wiring board.

  The present invention also relates to the printed wiring board, wherein the printing is white.

  According to the present invention, it is possible to provide an electromagnetic wave shielding sheet having an insulating layer excellent in printing visibility, printing ink adhesion and ink resistance, and having a low repulsive force even when bonded to an FPC. .

Cross section of electromagnetic shielding sheet Cross section of printed wiring board

  According to the present invention, it is possible to provide an electromagnetic wave shielding sheet having an insulating layer excellent in printing visibility, adhesion of printing ink, and ink resistance.

<Electromagnetic wave shield sheet>
The electromagnetic wave shielding sheet of the present invention comprises an insulating layer and a conductive adhesive layer (I), at least an insulating layer, and a conductive adhesive layer (I). The insulating layer is a thermosetting resin (A1), cured. The surface of the insulating layer is formed of a black resin composition containing the agent (A2) and a black colorant, and has a contact angle with water of 60 to 110 °.
Further, the conductive adhesive layer (I) may be either isotropic conductive or anisotropic conductive, and anisotropic conductive is preferable because the cost can be reduced.

Specifically, as such an electromagnetic wave shielding sheet, for example, the first embodiment including an insulating layer and a conductive adhesive layer (I) having isotropic conductivity, or an insulating layer, having isotropic conductivity The 2nd embodiment provided with the electroconductive layer and the electroconductive adhesive layer (I) which has anisotropic electroconductivity is mentioned.
In applications where particularly high electromagnetic shielding properties are required, the second embodiment is preferred.

<< Method for producing electromagnetic wave shielding sheet >>
The electromagnetic wave shielding sheet of the present invention can be produced by a known method and is not particularly limited.
In the case of the first embodiment, for example, the conductive adhesive layer (I) prepared in advance on the peelable sheet and an insulating layer prepared separately are bonded together.
In the case of the second embodiment, for example, a metal layer, which is a conductive layer having isotropic conductivity, is formed on a peelable sheet, and an anisotropic conductive conductive adhesive layer (I ) Is bonded to the metal layer surface, and then the separately prepared insulating layer is peeled off and peeled off from the metal layer surface.

In addition to the above layer configuration, the electromagnetic wave shielding sheet of the present invention can be laminated with other functional layers other than conductivity and insulation reliability.
The other functional layer is a layer having functions such as hard coat property, water vapor barrier property, oxygen barrier property, low dielectric constant, high dielectric constant property, and heat resistance.

  Moreover, it is preferable that the electromagnetic wave shielding sheet of this invention exists in the state (B stage) in which the crosslinkable functional group of the thermosetting resin and the functional group of the hardening | curing agent reacted partially. And when using an electromagnetic wave shield sheet, for example, it piles up on FPC, or after affixing, it is often hardened | cured by a thermocompression-bonding process (C stage), and desired adhesive strength is obtained in many cases.

  The peelable sheet preferably uses a paper or plastic substrate, and a sheet having a known release treatment on one side of the substrate or a pressure sensitive adhesive layer instead of the release treatment is used. It is a formed sheet.

  Note that the electromagnetic wave shielding sheet is often stored in a state where a peelable sheet is adhered until just before use, in order to facilitate protection and handling of the conductive adhesive layer (I) or the insulating layer.

  The electromagnetic wave shielding sheet of the present invention can be used for various applications where electromagnetic waves need to be shielded. For example, rigid printed wiring boards can be used for flexible printed wiring boards, COFs, TABs, flexible connectors, liquid crystal displays, touch panels, and the like. Moreover, it can also be used as a member for shielding electromagnetic waves from a case of a personal computer, a building material such as a wall of a building material and a window glass, a vehicle, a ship, and an aircraft.

<Insulating layer>
The insulating layer of the present invention is formed of a black resin composition containing a thermosetting resin (A1), a curing agent (A2), and a black colorant, and has a contact angle with water on the surface of the insulating layer. It is 60-110 degrees. Thereby, the wettability of the ink is improved, and the characters printed on the insulating layer are not blurred and can adhere to the surface of the insulating layer.
The contact angle with water on the surface of the insulating layer can be controlled by the composition of the black resin composition described later, the surface roughness of the insulating layer (surface roughness Ra), and the like.

  Although the thickness of an insulating layer can be designed suitably according to a use, 3-20 micrometers is preferable and 5-15 micrometers is more preferable. By setting the thickness of the insulating layer to 3 to 20 μm, print visibility and ink resistance can be improved, and the repulsive force of the FPC to which the electromagnetic wave shield sheet is attached can be reduced.

[Water contact angle of insulation layer]
The insulating layer of the electromagnetic wave shielding sheet of the present invention has a water contact angle of 60 to 110 °, and more preferably 70 to 100 °. When the water contact angle is 60 to 110 °, the wettability of the ink is improved, and the characters printed on the insulating layer have no blur and adhere to the surface of the insulating layer.
When the water contact angle is 60 or more, the wettability of the ink is improved and printing with good visibility without bleeding is possible. Further, when the glossiness is 110 or less, the adhesion of the ink coating to the insulating layer surface is further improved. In addition, a water contact angle is a value after the thermosetting of an electromagnetic wave shield sheet, and a measuring method is mentioned later.

[Martens hardness of insulating layer]
The insulating layer of the electromagnetic wave shielding sheet of the present invention preferably has a Martens hardness of 20 to 300, and more preferably 50 to 200. When the Martens hardness is 20 to 300, ink resistance and repulsive force are improved.

[Dynamic friction coefficient of insulating layer]
The insulating layer of the electromagnetic wave shielding sheet of the present invention preferably has a dynamic friction coefficient of 0.01 to 0.5, and more preferably 0.05 to 0.4. When the coefficient of dynamic friction is 0.01 to 0.5, the wettability of the ink is improved, and the characters printed on the insulating layer do not bleed and adhere to the surface of the insulating layer, so that the printing visibility is improved.

[Gloss of insulation layer]
In the electromagnetic wave shielding sheet of the present invention, the 85 ° glossiness of the insulating layer surface is preferably 15 to 50. When the glossiness is 15 to 50, light is appropriately scattered on the surface of the insulating layer, and glossiness is moderately suppressed. Therefore, the characters printed on the insulating layer are easy to see from various angles, so the visibility is improved.
When the glossiness is 15 or more, peeling between the peelable sheet and the insulating layer becomes easy. Further, when the glossiness is 50 or less, the visibility of printing is further improved. A method for measuring the gloss level will be described later.

In order to give a predetermined gloss value to the surface of the insulating layer, for example, the following method can be used.
Unevenness is formed in advance on the release surface of the release sheet by sandblasting or the like. By applying the black resin composition on the surface, the unevenness of the peelable sheet is transferred to the insulating layer, and an appropriate glossiness can be imparted.
As another method, the glossiness can be adjusted by applying a black resin composition to the conductive adhesive layer (I) formed on the peelable sheet and performing a process such as mechanical polishing.
Alternatively, it is possible to form irregularities on the surface of the insulating layer by adding an additive such as a suitable matting agent to the black resin composition, regardless of these methods.

[L * value of insulating layer]
The electromagnetic shielding sheet of the present invention preferably has an L * value of 20 to 30 in the L * a * b * color system on the surface of the insulating layer. When the L * value is set to 20 to 30, light is absorbed on the surface of the insulating layer, and for example, characters printed in white can be visually recognized more clearly.
In addition, by setting the L * value in the above range, when a part of the surface is rubbed and worn, the blackness of the appearance does not change greatly, and appearance defects are less likely to occur. That is, wear resistance can be improved. Incidentally, L * a * b * values Ru axes der representing the color space. a * and b * mean complementary color dimensions. When the L * value is high, the jetness is low . Conversely, when the L * value is low, the jetness is high, so that the print visibility is good.

  In order to obtain such an L * value, for example, it is preferable to add 1 to 50% by weight, and more preferably 2 to 40% by weight, of the black colorant in the insulating layer to be formed. Needless to say, the means for adjusting the L * value to 20-30 is not limited to black colorants. When secondary aggregation occurs in the black colorant, the L value can be adjusted to 20 to 30 by performing a crushing treatment with a sand mill or the like as necessary.

  When the L value is 20 or more, the insulation reliability can be further improved. Further, when the L value is 30 or less, the print visibility is further improved.

[Insulation layer reflectivity]
The electromagnetic wave shielding sheet of the present invention preferably has a reflectance of 10% or less at 400 to 780 nm on the surface of the insulating layer. When the reflectance at 400 to 780 nm is in the above range, reflection of light at each wavelength on the surface of the insulating layer is suppressed, and for example, characters printed in white can be more clearly recognized.

[Insulation layer surface resistance]
In the electromagnetic wave shielding sheet of the present invention, the surface resistance value of the insulating layer is preferably 1 × 10 ⁵ or more. The insulation reliability is further improved when the surface resistance value of the insulating layer is 1 × 10 ⁵ Ω / □ or more.

"Black resin composition"
Subsequently, the thermosetting resin (A1), the curing agent (A2), the black colorant and the like constituting the black resin composition for forming the insulating layer will be described.

(Thermosetting resin (A1))
The thermosetting resin (A1) is a resin having a plurality of functional groups that can be used for a crosslinking reaction by heating.
Examples of the functional group include a hydroxyl group, a phenolic hydroxyl group, a carboxyl group, an amino group, an epoxy group, an oxetanyl group, an oxazoline group, an oxazine group, an aziridine group, a thiol group, an isocyanate group, a blocked isocyanate group, and a silanol group. .
The thermosetting resin (A1) having the above functional group is, for example, an acrylic resin, a maleic acid resin, a polybutadiene resin, a polyester resin, a condensation type polyester resin, an addition type polyester resin, a melamine resin, a polyurethane resin, or a polyurethane urea resin. , Epoxy resin, oxetane resin, phenoxy resin, polyimide resin, polyamide resin, polyamideimide resin, phenolic resin, alkyd resin, amino resin, polylactic acid resin, oxazoline resin, benzoxazine resin, silicone resin, fluorine resin, etc. . Among these, polyurethane resin, polyurethane urea resin, addition-type polyester resin, polyamide resin, polyimide resin, and polyamideimide resin are preferable from the viewpoint of surface resistance and ink resistance.

In the present invention, a thermoplastic resin can be used in combination with the thermosetting resin (A1).
As thermoplastic resins, polyolefin resins, vinyl resins, styrene / acrylic resins, diene resins, terpene resins, petroleum resins, cellulose resins, polyamide resins, polyurethane resins, polyester resins that do not have the above curable functional groups. , Polycarbonate resin, polyimide resin, fluorine resin and the like.
The polyolefin resin is preferably a homopolymer or copolymer such as ethylene, propylene, and α-olefin compound. Specific examples include polyethylene propylene rubber, olefinic thermoplastic elastomer, α-olefin polymer, and the like.
The vinyl resin is preferably a polymer obtained by polymerization of vinyl ester such as vinyl acetate or a copolymer of vinyl ester and olefin compound such as ethylene. Specific examples include ethylene-vinyl acetate copolymer and partially saponified polyvinyl alcohol.
The styrene / acrylic resin is preferably a homopolymer or copolymer composed of styrene, (meth) acrylonitrile, acrylamides, (meth) acrylic acid esters, maleimides and the like. Specific examples include syndiotactic polystyrene, polyacrylonitrile, acrylic copolymer, ethylene-methyl methacrylate copolymer, and the like.
The diene resin is preferably a homopolymer or copolymer of a conjugated diene compound such as butadiene or isoprene and a hydrogenated product thereof. Specific examples include styrene-butadiene rubber and styrene-isoprene block copolymer. The terpene resin is preferably a polymer composed of terpenes or a hydrogenated product thereof. Specific examples include aromatic modified terpene resins, terpene phenol resins, and hydrogenated terpene resins.
The petroleum resin is preferably a dicyclopentadiene type petroleum resin or a hydrogenated petroleum resin. The cellulose resin is preferably a cellulose acetate butyrate resin. The polycarbonate resin is preferably bisphenol A polycarbonate. The polyimide resin is preferably a thermoplastic polyimide, a polyamideimide resin, or a polyamic acid type polyimide resin.

(Curing agent (A2))
The curing agent (A2) has a plurality of functional groups that can react with the functional groups in the thermosetting resin (A1). The curing agent is preferably an epoxy compound, an acid anhydride group-containing compound, an isocyanate compound, an aziridine compound, an amine compound such as dicyandiamide, an aromatic diamine, or a phenol compound such as a phenol novolac resin.

  The curing agent (A2) is preferably contained in an amount of 1 to 50 parts by weight, more preferably 3 to 30 parts by weight, and even more preferably 3 to 20 parts by weight with respect to 100 parts by weight of the thermosetting resin (A1).

(Black colorant)
The insulating layer can improve the visibility of the printed character by including a black colorant. The black colorant is preferably a black color pigment and a mixed colorant containing a plurality of pigments such as red, green, blue, yellow, purple, cyan and magenta. The mixed colorant can obtain black color by subtractive color mixing of a plurality of pigments.
Examples of the black pigment include carbon black, ketjen black, carbon nanotube (CNT), perylene black, titanium black, iron black, and aniline black.

  The black colorant preferably has an average primary particle size of 10 to 200 nm, more preferably 20 to 100 nm. By using the black colorant having the average primary particle size, the insulating layer can be colored in clear black without color unevenness, and the visibility of characters is further improved. By setting the average primary particle diameter to 10 nm or more, the viscosity of the black resin composition can be easily maintained at a level suitable for coating. Moreover, jet blackness of an insulating layer improves by making an average primary particle diameter 200 nm or less, and printing visibility improves more. In addition, when the particle shape of the black colorant has an average aspect ratio (major axis length / minor axis length) of 1.5 or more, the average primary particle diameter is obtained by averaging the major axis lengths.

  The average primary particle diameter of the black colorant can be determined from an average value of about 20 primary particles that can be observed from an image magnified 10,000 to 1,000,000 times with a transmission electron microscope (TEM).

  The following pigments can be used as the mixed colorant. “CI” means a color index (CI).

  Examples of red pigments and magenta pigments include C.I. I. Pigment Red 7, 14, 41, 48: 1, 48: 2, 48: 3, 48: 4, 57: 1, 81, 81: 1, 81: 2, 81: 3, 81: 4, 122, 146, 168, 176, 177, 178, 184, 185, 187, 200, 202, 208, 210, 242, 246, 254, 255, 264, 270, 272, and 279.

  Examples of the green pigment include C.I. I. Pigment green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 45, 48, 50, 51, 54, 55 and 58.

  Blue pigments and cyan pigments are exemplified by C.I. I. Pigment Blue 1, 1: 2, 9, 14, 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56: 1, 60, 61, 61: 1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, 79 and the like.

  Examples of yellow pigments include C.I. I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 126, 127, 128, 129, 138, 139, 147, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 82,184,185,187,188,193,194,198,199,213 and 214, and the like.

  Examples of purple pigments include C.I. I. Pigment Violet 1, 1: 1, 2, 2: 2, 3, 3: 1, 3: 3, 5, 5: 1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, 50 and the like.

  The black colorant is preferably contained in an amount of 2 to 25% by weight in 100% by weight of the insulating layer, and more preferably 4 to 15% by weight. By including 2 to 25% by weight of the black colorant, the insulating layer can easily achieve both good print visibility and insulation reliability.

(Surface conditioner)
In order to adjust the wettability of the surface of the black resin composition, it is preferable to add a surface conditioner. Examples of the surface conditioner include waxes, leveling agents, surfactants, silane coupling agents, and inorganic fillers. Waxes, leveling agents, silane coupling agents, and inorganic fillers are preferable, and waxes, leveling agents, and inorganic fillers are preferable. More preferred. Although the said surface treating agent may be used independently, it is preferable to use 2 or more types together. Specifically, a combination of a wax and an inorganic filler or a leveling agent and an inorganic filler is preferable. The black resin composition of the present invention can easily adjust the contact angle with water on the surface of the insulating layer to 60 to 110 ° C. by adding a surface conditioner, and print visibility and ink coating film adhesion are improved. .

As the wax, for example, natural wax such as candelilla wax, carnauba wax, rice wax, wax wax, jojoba oil and other animal waxes, beeswax, lanolin, whale wax and other animal waxes, montan wax, ozokerite, cecilen, etc. Petroleum waxes such as mineral wax, paraffin wax, microcrystalline wax, petrolatum, synthetic waxes such as Fischer-Tropish wax, synthetic hydrocarbons such as polyethylene wax, montan wax derivatives, paraffin wax derivatives, microcrystalline wax derivatives, etc. Hydrogenated wax such as modified wax, hydrogenated castor oil, hydrogenated castor oil derivative, fatty acid such as lanolinic acid, palmitic acid, myristic acid, stearic acid, 12-hydroxystearic acid There is.
These waxes have a melting point of 30 to 140 ° C., preferably 60 to 120 ° C. When the melting point of the wax is less than 30 ° C., contamination is likely to occur due to the bleed out of the wax. Moreover, when the melting point of the wax exceeds 140 ° C., high wear resistance is difficult to be exhibited.

  The blending ratio of the thermosetting resin (A1) and the wax used in the present invention is preferably 0.5 to 40 parts by weight of wax with respect to 100 parts by weight of the thermosetting resin (A1). More preferably, it is 20 parts by weight. When the wax is less than 0.5 parts by weight with respect to 100 parts by weight of the thermosetting resin (A1), the effect on the wear resistance cannot be expected so much. On the other hand, when the wax is more than 40 parts by weight, the bleed out May occur and may cause other physical properties to deteriorate.

  As the leveling agent used in the present invention, a polyether structure, a polyester structure, an aralkyl structure, a polysiloxane having an acrylic group, and an acrylic copolymer can be used in the main chain. Specific examples of dimethylsiloxane having a polyether structure in the main chain include FZ-2110, 2122, 2130, 2166, 2191, 2032, 2207, manufactured by Toray Dow Corning, BYK-330, BYK-323, BYK manufactured by BYK Chemie. -348 and the like. Specific examples of dimethylsiloxane having a polyester structure in the main chain include BYK-310 and BYK-370 manufactured by BYK Chemie. Specific examples of polymethylsiloxane having an aralkyl structure in the main chain include BYK-322 and BYK-323 manufactured by BYK Chemie. Specific examples of polydimethylsiloxane having an alkyl group in the main chain include BYK-3500, BYK-3505, BYK-3530, BYK-3570 and the like manufactured by BYK Chemie. Specific examples of the acrylic copolymer system include BYK-350, BYK-354, BYK-355, BYK-358, BYK-381, BYK-392, BYK-394, and BYK-3441 manufactured by BYK Chemie.

In general, anionic, nonionic, zwitterionic, and cationic surfactants are known as the surfactant used in the present invention, but any of them can be used.
Examples of the anionic surfactant include alpha sulfo fatty acid methyl ester salts, alkylbenzene sulfonates, alkyl sulfate esters, alkyl ether sulfate esters, monoalkyl phosphate esters, alpha olein sulfonates, alkane sulfonates. Etc.
Nonionic surfactants include, for example, glycerin fatty acid ester, sucrose fatty acid ester, sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene fatty acid ester, fatty acid alkanolamide, polyoxyethylene alkyl ether, alkyl glucoside, polyoxy Examples include ethylene alkyl phenyl ether.

Examples of zwitterionic surfactants include alkylamino fatty acid salts, alkylbetaines, and alkylamine oxides.
Examples of the cationic surfactant include alkyltrimethylammonium salt, dialkyldimethylammonium salt, alkyldimethylbenzylammonium salt, N-methylbishydroxyethylamine fatty acid ester hydrochloride, and the like.
In addition, reactive surfactants such as fluorine-based surfactants and allyl-based reactive surfactants, and polymer surfactants such as cationic cellulose derivatives, polycarboxylic acids, and polystyrene sulfonic acids can also be used. These are also commercially available as wetting and dispersing agents. 101, Disperbyk-108, Disperbyk-130 (above, manufactured by Big Chemie Japan Co., Ltd.) and the like.
One of these surfactants may be used alone, or two or more thereof may be used in combination, or a surfactant and a compound other than the surfactant may be used in combination.

  Examples of the silane coupling agent include vinyl silane coupling agents, epoxy silane coupling agents, amino silane coupling agents, vinyl silane coupling agents, methacrylic coupling agents, thiol coupling agents, and isocyanates. A silane coupling agent or the like can be used.

  Examples of the vinyl silane coupling agent include vinyltrimethoxysilane and vinyltriethoxysilane.

  Examples of the epoxy silane coupling agent include 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3- Examples thereof include glycidoxypropylmethyldiethoxysilane and 3-glycidoxypropyltriethoxysilane.

  Examples of amino silane coupling agents include N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, and 3-aminopropyltrimethoxysilane. Examples include methoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, and N-phenyl-3-aminopropyltrimethoxysilane.

  Examples of the vinyl silane coupling agent include vinyltrimethoxysilane and vinyltriethoxysilane.

  Examples of the methacrylic silane coupling agent include 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, and 3-methacryloxypropyltriethoxysilane.

  Examples of the thiol-based silane coupling agent include 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane.

  Examples of the isocyanate-based silane coupling agent include 3-isocyanatopropyltriethoxysilane.

  It is preferable that the compounding quantity of the silane coupling agent to a black resin composition is 0.1-25 weight part with respect to 100 weight part of thermosetting resins (A1), and is 0.5-15 weight part. More preferably.

  Examples of the inorganic filler include inorganic substances such as silica, alumina, aluminum hydroxide, magnesium hydroxide, barium sulfate, calcium carbonate, titanium oxide, zinc oxide, antimony trioxide, magnesium oxide, talc, montmorolinite, kaolin, and bentonite. Compounds.

  The ratio of the added weight of the black colorant and the surface conditioner in the black resin composition is preferably 100: 0.01 to 100: 10, and preferably 100: 0.05 to 100: 5. More preferred. By setting the ratio to the above value, unevenness in drying can be suppressed after the black colorant is applied to the peelable sheet, and the insulating layer can be applied more uniformly, so that the printing visibility is improved. Moreover, it is preferable because ink resistance is improved.

  The black resin composition may contain pigments and dyes other than black colorants, as well as antioxidants, tackifier resins, plasticizers, ultraviolet absorbers, antifoaming agents, fillers, flame retardants, and the like as necessary. it can.

  The black resin composition can be obtained by mixing the thermosetting resin (A1) solution obtained by dispersing the black colorant with the other thermosetting resin (A1), the curing agent (A2), and the like and stirring them. it can. For the stirring, a known stirring device can be used, and a disperse mat or a homogenizer is preferable.

  The insulating layer can be formed, for example, by coating a black resin composition on a peelable sheet. Alternatively, the black resin composition can be formed by extruding it into a sheet shape by an extruder such as a T-die.

  Coating, for example, gravure coating method, kiss coating method, die coating method, lip coating method, comma coating method, blade method, roll coating method, knife coating method, spray coating method, bar coating method, spin coating method, dip coating method A known coating method such as can be used. When applying, a drying step may be provided as necessary. For the drying, a known drying device such as a hot air dryer or an infrared heater can be used.

<< Conductive adhesive layer (I) >>
The conductive adhesive layer (I) is formed by a conductive adhesive (i) containing a thermosetting resin (B1), a curing agent (B2), and a conductive filler. The conductive adhesive layer (I) has adhesiveness because it is affixed to a cover film, an insulating substrate or the like formed on the printed wiring board.

  The conductive adhesive layer (I) can be appropriately selected from an isotropic conductive adhesive layer or an anisotropic conductive adhesive layer. The isotropic conductive adhesive layer has conductivity in the vertical direction and the horizontal direction with the electromagnetic wave shielding sheet placed horizontally. The anisotropic conductive adhesive layer has conductivity only in the vertical direction with the electromagnetic wave shielding sheet placed horizontally.

  The conductive adhesive layer (I) can be produced in the same manner as described for the insulating layer using the conductive adhesive (i).

  The thickness of the conductive adhesive layer (I) is preferably 1 to 100 μm, more preferably 3 to 50 μm, and still more preferably 4 to 15 μm. It becomes easy to make electroconductivity and other physical properties compatible because thickness exists in the range of 1-100 micrometers.

"Conductive adhesive (i)"
Next, the conductive adhesive (i) for forming the conductive adhesive layer (I) will be described. A conventionally well-known thing can be used for conductive adhesive (i), for example, thermosetting resin (B1), hardening | curing agent (B2), a conductive filler, and other additives as needed, etc. It is a conductive adhesive contained.

  Here, the thermosetting resin (B1) and the curing agent (B2) can be appropriately selected from the thermosetting resin (A1) and the curing agent (A2) described in the insulating layer.

(Conductive filler)
The conductive fine particles which are conductive fillers are preferably conductive metals such as gold, platinum, silver, copper and nickel, alloys thereof, and conductive polymer particles. In addition, composite fine particles in which a metal or a resin is used as a nucleus instead of fine particles having a single composition and a coating layer covering the surface of the nucleus is formed of a highly conductive material is preferable from the viewpoint of cost reduction.
The nucleus is preferably selected from nickel, silica, copper and resin, and more preferably a conductive metal and an alloy thereof.
The covering layer may be a material having excellent conductivity, and is preferably a conductive metal or a conductive polymer. Examples of the conductive metal include gold, platinum, silver, tin, manganese, indium, and the like, and alloys thereof. Examples of the conductive polymer include polyaniline and polyacetylene. Among these, silver is preferable from the viewpoint of conductivity.
The conductive fine particles can be used alone or in combination of two or more.

  The composite fine particles preferably have a coating layer at a ratio of 1 to 40 parts by weight, and more preferably 5 to 30 parts by weight with respect to 100 parts by weight of the nucleus. Covering with 1 to 40 parts by weight can further reduce the cost while maintaining conductivity. In the composite fine particles, it is preferable that the coating layer completely covers the core. However, in practice, a part of the nucleus may be exposed. Even in such a case, if the conductive material covers 70% or more of the surface area of the nucleus, it is easy to maintain conductivity.

  The shape of the conductive fine particles is not limited as long as desired conductivity is obtained. Specifically, for example, a spherical shape, a flake shape, a leaf shape, a dendritic shape, a plate shape, a needle shape, a rod shape, and a grape shape are preferable. The conductive fine particles generally have isotropic conductivity when flaky fine particles are used, and anisotropic conductivity is obtained when spherical or dendritic fine particles are used.

The average particle diameter of the conductive fine particles is D50 average particle diameter, preferably 1 to 100 μm, more preferably 3 to 50 μm.
The D50 average particle size is a numerical value obtained by measuring conductive fine particles with a tornado dry powder sample module using a laser diffraction / scattering particle size distribution measuring device LS13320 (manufactured by Beckman Coulter, Inc.). The cumulative value in the cumulative particle size distribution is a particle size of 50%. The refractive index was set to 1.6.

  When forming the isotropic conductive adhesive layer, the conductive fine particles are preferably blended in an amount of 100 to 1500 parts by weight, more preferably 200 to 1000 parts by weight, with respect to 100 parts by weight of the thermosetting resin (B1). preferable. When forming an anisotropic conductive adhesive layer, it is preferable to mix | blend 10-200 weight part with respect to 100 weight part of thermosetting resins (B1), and 20-150 weight part is more preferable.

  The conductive adhesive (i) further includes a silane coupling agent, a rust inhibitor, a reducing agent, an antioxidant, a pigment, a dye, a tackifier resin, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling regulator, and a filling. An agent, a flame retardant, etc. can be mix | blended.

  The conductive adhesive (i) can be obtained by mixing and stirring the conductive filler and the thermosetting resin (B1). For the stirring, a known stirring device can be used, and a disperse mat or a homogenizer is preferable.

<< Conductive layer >>
As a second embodiment, when the insulating layer and the conductive adhesive layer (I) further have a conductive layer, the conductive adhesive layer (I) has anisotropic conductivity, and the conductive layer is isotropically conductive. The case is sex.
This second embodiment is preferred for applications that require particularly high electromagnetic shielding properties.
In addition, examples of the isotropic conductive layer (isotropic conductive layer) include a metal layer or a conductive adhesive layer (II). A metal layer is preferable in terms of improving electromagnetic shielding properties and transmission characteristics against high frequency signals of 100 MHz to 20 GHz. On the other hand, the conductive adhesive layer (II) is preferable from the viewpoint of heat resistance such as solder reflow.

The metal layer can be selected from a metal foil, a vapor deposition film, a sputtering film, and a metal plating film. The metal foil is preferably a conductive metal foil such as aluminum, copper, silver, or gold, more preferably copper, silver, or aluminum, and even more preferably copper in terms of shielding properties and cost.
For example, rolled copper foil or electrolytic copper foil is preferably used as the copper, and when the thickness of the metal layer is pursued, a rolled copper foil or an electrolytic copper foil is more preferable. In the case of a metal foil, the thickness is preferably 0.1 to 10 μm, and more preferably 0.5 to 5 μm.
The vapor deposition film, the sputtering film, and the metal plating film are preferably formed of a conductive metal material such as aluminum, copper, silver, or gold, and more preferably copper, silver, or aluminum. The thickness of the deposited film is preferably 0.1 to 3 μm. The thickness of the sputtering film is preferably 10 to 1000 nm. As for the thickness of a metal plating film, 0.5-5 micrometers is preferable normally.

As the thermosetting resin or the like constituting the conductive adhesive layer (II), the same one as that having isotropic conductivity in the description of the conductive adhesive layer (I) can be used.
In addition, the conductive adhesive layer (II) can be formed of a conductive adhesive (ii), and the conductive adhesive (ii) is a conventionally known one as well as the conductive adhesive (i). For example, it is a conductive adhesive containing a thermosetting resin, a curing agent, a conductive filler, and other additives as required.

The conductive fine particles in the conductive adhesive layer (II) are preferably blended in an amount of 300 to 2000 parts by weight and more preferably 500 to 1500 parts by weight with respect to 100 parts by weight of the thermosetting resin.
The thickness of the conductive adhesive layer (II) at this time is preferably 2 to 15 μm, more preferably 3 to 10 μm.
The shape of the conductive filler used for the conductive adhesive layer (II) is preferably flake-like or dendritic. By using a flaky or dendritic conductive filler, high conductivity can be expressed with a thinner film thickness, and the repulsive force can be reduced.

<Printed wiring board>
The printed wiring board of the present invention comprises the electromagnetic shielding sheet of the present invention, a wiring board including a cover coat layer, signal wiring, and an insulating reliability base material, and the insulating layer of the electromagnetic shielding sheet is printed. Features.
With such a printed wiring board, even when printing ink that is normally used is used, when small characters are printed without blurring, it is easy for the operator to visually recognize the print and has excellent print visibility. Can be.
In particular, when the printing is white, it is preferable because the printing visibility can be improved.

The printed wiring board of the present invention will be described with reference to FIG. 2 by taking the second embodiment as an example.
The electromagnetic wave shielding sheet 4 includes an insulating layer 1, a conductive layer 3 having isotropic conductivity, and a conductive adhesive layer (I) 2 having anisotropic conductivity.
In addition, although not shown in figure, the structure of the 1st embodiment in which the electromagnetic wave shield sheet contains the insulating layer 1 and conductive adhesive layer (I) 2 is also preferable. The conductive adhesive layer (I) at this time is preferably isotropic conductive.

  The cover coat layer 6 is an insulating material that covers the signal wiring of the wiring board and protects it from the external environment. The cover coat layer 6 is preferably a polyimide cover lay with an adhesive, a thermosetting or ultraviolet curable solder resist, or a photosensitive cover lay film, and more preferably a photosensitive cover lay film for fine processing.

The signal wiring includes a ground wiring 8 for grounding and a wiring circuit 9 for sending an electric signal to the electronic component. Both are generally formed by etching a copper foil.
When the wiring board is a flexible printed wiring board (FPC), the insulating reliability substrate 7 is preferably a bendable plastic such as polyester, polycarbonate, polyimide, polyphenylene sulfide, and more preferably polyimide. When the wiring board is a rigid wiring board, the constituent material of the insulating reliability base material 7 is preferably glass epoxy. By providing the insulating reliability base material 7 as described above, the wiring board can have high heat resistance.

  Generally, the thermocompression bonding between the electromagnetic wave shielding sheet 4 and the wiring board is performed under conditions of a temperature of about 150 to 190 ° C., a pressure of about 1 to 3 MPa, and a time of about 1 to 60 minutes. The conductive adhesive layer (I) 2 and the cover coat layer 6 are brought into close contact with each other by thermocompression bonding, and the conductive adhesive layer (I) 2 flows and fills the hole 10, thereby conducting electrical continuity with the ground wiring 8. I can take it. Further, the thermosetting resin and the curing agent react by thermocompression bonding. In order to accelerate curing, post-curing may be performed at 150 to 190 ° C. for 30 to 90 minutes after thermocompression bonding. In addition, an electromagnetic wave shield sheet may be called an electromagnetic wave shield layer after thermocompression bonding.

"Printing ink"
Examples of the printing ink include silk screen ink or inkjet ink, and are composed of a colorant, a binder resin, an additive, and a solvent. The solvent is an organic solvent having a boiling point of 40 to 140 ° C. from the viewpoint of printability. It is selected appropriately.
Moreover, it is preferable that it is white printing ink from the appraisal of printing visibility.

  After the thermocompression bonding, the lot number or product number can be printed on the surface of the insulating layer 1 of the electromagnetic wave shielding sheet with printing ink by silk screen printing, ink jet printing or the like. The size of characters to be printed is usually 1 to 10 points. After printing, the print is cured and adhered to the insulating layer 1 by drying in an oven at 100 to 170 ° C. Where the insulating layer 1 is black, the color of printing is white in order to improve visibility.

  The printed wiring board of the present invention is preferably provided in an electronic device such as a notebook PC, a mobile phone, a smartphone, and a tablet terminal in addition to a liquid crystal display and a touch panel.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, the examples do not limit the scope of rights of the present invention. In the examples, “part” represents “part by weight” and “%” represents “% by weight”.

The conductive fine particles, thermosetting resins (A1, B1), and curing agents (A2, B2) used in the examples are shown below.
[Conductive filler]
Conductive fine particles: composite fine particles (nucleus: copper, coating layer: silver) average particle diameter D50: 11.0 μm, manufactured by Fukuda Metal Foil Powder Co., Ltd.)
[Thermosetting resin (A1, B1)]
Thermosetting resin 1: Thermosetting polyurethane resin (acid value = 5 mg KOH / g, Tg = 0 ° C.) Thermosetting resin manufactured by Toyochem 2: Thermosetting polyamide resin (acid value = 20 mg KOH / g, Tg = 20 ° C.) ) Thermosetting resin 3 manufactured by Toyochem Co., Ltd .: Thermosetting addition type ester resin (acid value = 10 mg KOH / g, Tg = 10 ° C.) Thermosetting resin 4: Thermosetting polyester resin manufactured by Toyochem Co., Ltd. (acid value = 10 mg KOH / g, Tg = −10 ° C.) manufactured by Toyochem [curing agents (A2, B2)]
Curing agent 1: Bisphenol A type epoxy resin “JER828” (epoxy equivalent = 189 g / eq), made by Mitsubishi Chemical Co., Ltd. 2: Aziridine compound “Chemite PZ-33”, manufactured by Nippon Shokubai Co., Ltd.

Surface modifier 1: Acrylic polymer leveling agent “BYK350” Surface modifier made by Big Chemie 2: Polyether-modified polydimethylsiloxane leveling agent “BYK300” Surface modifier made by Big Chemie 3: Amide wax “CERAFLOUR 994 (average particle size) D50: 5 μm, melting point: 145 ° C. ”“ Surface conditioner 4 manufactured by Big Chemie ”: Modified polyethylene wax“ CERAFLOUR961 (average particle size D50: 3.5 μm, melting point: 140) ”Surface conditioner 5 manufactured by BYK Chemie: polypropylene wax“ CERAFLOUR970 (Average particle diameter D50: 9 μm, melting point: 160 ° C.) “Surface conditioner 6 manufactured by Big Chemie”: PTFE “CERAFLOUR 981 (average particle diameter D50: 3 μm)” Surface conditioner 7 manufactured by BYK Chemie: Hydrophobic silica “AEROSI” RY200S "EVONIK Co. surface conditioner 8: hydrophilic silica" AEROSIL 130 "EVONIK Co.

  Table 1 shows the black colorants.

[Example 1 (3-layer structure; insulating layer / metal layer (metal foil) / conductive adhesive layer (I))]
100 parts of thermosetting resin 2, 30 parts of conductive fine particles, 30 parts of curing agent 1 and 2 parts of curing agent 2 are charged into a container, and toluene: isopropyl alcohol (weight ratio) so that the nonvolatile content concentration becomes 40% by weight. The mixed solvent of 2: 1) was added and stirred with a disper for 10 minutes to obtain a conductive adhesive. Next, the conductive adhesive was coated on the peelable sheet using a bar coater so that the dry thickness was 10 μm, and further dried in an electric oven at 100 ° C. for 2 minutes to thereby form a conductive adhesive layer ( I) was obtained.

Separately, 100 parts of the thermosetting resin 2, 10 parts of the black colorant 1 as the black colorant, 2 parts of the inorganic filler 2 and 1 part of the surface conditioner 1 are added with methyl ethyl ketone to a non-volatile concentration of 30. Prepared to 0.0 wt%. The mixture was stirred with a disper and then dispersed with an Eiger mill (manufactured by Eiger Japan) using zirconia beads to obtain a dispersion. Black resin composition by adding 30 parts of curing agent 1 and 2 parts of curing agent 2 as a curing agent to 100 parts of thermosetting resin (A1) in the obtained dispersion and stirring with a disper for 10 minutes. Got. This black resin composition was applied to the surface of the electrolytic copper foil with carrier on the side of the electrolytic copper foil using a bar coater so as to have a dry thickness of 10 μm, and further dried in an electric oven at 100 ° C. for 3 minutes. Thereafter, a slightly adhesive peelable sheet was bonded to the insulating layer side to prevent foreign matter adhesion.
The carrier copper foil is peeled off, and the conductive adhesive (I) is bonded to the exposed electrolytic copper foil surface, thereby “fine adhesion release sheet / insulating layer / electrolytic copper foil / conductive adhesive layer (I) / peelability”. An electromagnetic wave shielding sheet comprising “sheet” was obtained.

[Examples 2 to 25, Comparative Examples 1 to 4]
An electromagnetic wave shielding sheet was obtained in the same manner as in Example 1 except that the type and blending amount (parts by weight) of the raw material in Example 1 were changed as shown in Table 2.
However, Examples 1, 5, 13 , 14 , 19 , 20, 24, and 25 are reference examples.

[Example 26 (3-layer structure; insulating layer / metal layer (metal vapor deposition layer) / conductive adhesive layer (I)])
100 parts of thermosetting resin 2, 30 parts of conductive fine particles, 30 parts of curing agent 1 and 2 parts of curing agent 2 are charged into a container, and toluene: isopropyl alcohol (weight ratio) so that the nonvolatile content concentration becomes 40% by weight. The mixed solvent of 2: 1) was added and stirred with a disper for 10 minutes to obtain a conductive adhesive. Next, the conductive adhesive was coated on the peelable sheet using a bar coater so that the dry thickness was 10 μm, and further dried in an electric oven at 100 ° C. for 2 minutes to thereby form a conductive adhesive layer ( I) was obtained.

Separately, 100 parts of thermosetting resin 2, 10 parts of black colorant 1 as a black colorant, 1 part of inorganic filler 1 and 1 part of surface conditioner 1 are added with methyl ethyl ketone to a non-volatile content concentration of 30. Prepared to 0.0 wt%. The mixture was stirred with a disper and then dispersed with an Eiger mill (manufactured by Eiger Japan) using zirconia beads to obtain a dispersion. Black resin composition by adding 30 parts of curing agent 1 and 2 parts of curing agent 2 as a curing agent to 100 parts of thermosetting resin (A1) in the obtained dispersion and stirring with a disper for 10 minutes. Got. This black resin composition was applied to a 0.1 μm thick copper vapor-deposited surface formed on the release-treated surface of a PET film using a bar coater so that the dry thickness would be 10 μm, and further in an electric oven at 100 ° C. Dry for 3 minutes. Thereafter, a slightly adhesive peelable sheet was bonded to the insulating layer side to prevent foreign matter adhesion.
The PET film is peeled off and the conductive adhesive (I) is bonded to the exposed copper vapor-deposited surface to create a “fine-adhesive peelable sheet / insulating layer / copper vapor-deposited layer / conductive adhesive layer (I) / peelable sheet” An electromagnetic wave shielding sheet consisting of

[Examples 27 to 29]
An electromagnetic wave shielding sheet was obtained in the same manner as in Example 1 except that the type and blending amount (parts by weight) of the raw material in Example 1 were changed as shown in Table 2.

[Example 30 (3-layer structure; insulating layer / conductive adhesive layer (II) / conductive adhesive layer (I)]
100 parts of thermosetting resin 2, 30 parts of conductive fine particles, 30 parts of curing agent 1 and 2 parts of curing agent 2 are charged into a container, and toluene: isopropyl alcohol (weight ratio) so that the nonvolatile content concentration becomes 40% by weight. The mixed solvent of 2: 1) was added and stirred with a disper for 10 minutes to obtain a conductive adhesive. Next, the conductive adhesive is coated on the peelable sheet using a bar coater so that the dry thickness is 10 μm, and further dried in an electric oven at 100 ° C. for 2 minutes to have anisotropic conductivity. A conductive adhesive layer (I) was obtained.

  Separately, 100 parts of thermosetting resin 2, 850 parts of conductive fine particles, 30 parts of curing agent 1 and 2 parts of curing agent 2 are charged into a container, and toluene: isopropyl alcohol (40% by weight) so that the nonvolatile content concentration becomes 40% by weight. A mixed solvent having a weight ratio of 2: 1) was added and stirred with a disper for 10 minutes to obtain a conductive adhesive. Next, the conductive adhesive is coated on the peelable sheet using a bar coater so as to have a dry thickness of 3 μm, and further dried in an electric oven at 100 ° C. for 2 minutes to have isotropic conductivity. A conductive adhesive layer (II) was obtained.

  100 parts of thermosetting resin 2, 10 parts of black colorant 1 as a black colorant, 1 part of inorganic filler 1 and 1 part of surface conditioner 1 are added with methyl ethyl ketone to give a non-volatile concentration of 30.0. Prepared to% by weight. The mixture was stirred with a disper and then dispersed with an Eiger mill (manufactured by Eiger Japan) using zirconia beads to obtain a dispersion. Black resin composition by adding 30 parts of curing agent 1 and 2 parts of curing agent 2 as a curing agent to 100 parts of thermosetting resin (A1) in the obtained dispersion and stirring with a disper for 10 minutes. Got. This black resin composition is coated on a peelable sheet having a surface roughness Ra of 0.7 μm using a bar coater so as to have a dry thickness of 10 μm, and further dried in an electric oven at 100 ° C. for 2 minutes. Thus, an insulating layer (I) was obtained.

  Thereafter, the conductive adhesive layer (II) is bonded to the insulating layer side, the peelable sheet of the conductive adhesive layer (II) is peeled off, and further, the conductive adhesive layer (I) is bonded to the “peelable sheet / An electromagnetic wave shielding sheet comprising “insulating layer / conductive adhesive layer (II) / conductive adhesive layer (I) / peelable sheet” was obtained.

[Example 31 (two-layer structure; insulating layer / conductive adhesive layer (I))]
100 parts of thermosetting resin 2, 450 parts of conductive fine particles, 30 parts of curing agent 1 and 2.0 parts of curing agent 2 are charged into a container, and toluene: isopropyl alcohol (so that the non-volatile content concentration becomes 40% by weight. Conductive adhesive (I) was obtained by adding a mixed solvent with a weight ratio of 2: 1) and stirring with a disper for 10 minutes. Next, the conductive adhesive is coated on the peelable sheet using a bar coater so that the dry thickness is 10 μm, and further dried in an electric oven at 100 ° C. for 2 minutes to form the conductive adhesive layer. Obtained.

  Separately, 100 parts of binder resin, 7 parts of “RCF / SB200” manufactured by Asahi Carbon Co., Ltd. as a black colorant, 1 part of inorganic filler 1 and methyl ethyl ketone are added to surface conditioning agent 1 to give a nonvolatile content concentration of 30.0% by weight. Prepared. The mixture was stirred with a disper and then dispersed with an Eiger mill (manufactured by Eiger Japan) using zirconia beads to obtain a dispersion. 30 parts of curing agent 1 and 2 parts of curing agent 2 were added to 100 parts of binder resin in the obtained dispersion to obtain a black resin composition. The black resin composition was applied to a peelable sheet having a surface roughness Ra of 0.7 μm using a bar coater so that the dry thickness was 10 μm, and further dried in an electric oven at 100 ° C. for 3 minutes. The electromagnetic wave shielding sheet which consists of "peelable sheet / insulating layer / conductive adhesive layer (I) / peelable sheet" was obtained by pasting together with conductive adhesive layer (I).

  The surface roughness Ra specified in the present invention is defined by JIS-B0601, and was measured with a surface roughness meter Surfcom 590A (manufactured by Tokyo Seimitsu Co., Ltd.).

  Physical properties were measured and evaluated according to the following evaluation items. The results are shown in Tables 2-4.

<Test piece production>
The obtained electromagnetic wave shielding sheet was prepared to have a width of 60 mm and a length of 60 mm, and then the conductive adhesive layer (I) exposed by peeling off the peelable sheet on the conductive adhesive layer (I) side, A 125 μm thick polyimide film (“Kapton 500H” manufactured by Toray DuPont) was thermocompression bonded under the conditions of 150 ° C., 2 MPa, and 30 min. Next, the peelable sheet on the insulating layer side was peeled off, and this was used as a test piece.

<Water contact angle of insulating layer>
The water contact angle of the insulating layer was measured with respect to the insulating layer surface of the test piece using “Automatic Contact Angle Meter DM-501 / Analysis Software FAMAS” manufactured by Kyowa Interface Science Co., Ltd. The liquid method was used as the measurement method.

<85 ° glossiness>
The 85 ° glossiness of the insulating layer surface of the test piece is set to BYK. The measurement was performed at a measurement angle of 85 ° using a micro-TRI-gloss surface gloss meter manufactured by GARDNER.

<L * value measurement>
The L * a * b * value of the insulating layer surface of the test piece was measured using a “color / color difference meter CR-400” manufactured by KONICA MINOLTA.
<Measurement of reflectance>
The reflectance of the insulating layer surface of the test piece was measured using a “UV-visible spectrophotometer (V-570)” manufactured by Jasco.

<Visibility of printing>
Printing was performed by screen printing on the insulating layer surface of the test piece using white ink (manufactured by Toyo Ink Co., Ltd.). The printing size was 5 points. A 60 W LED light was applied to the printing unit in the dark room, and a distance of 50 cm from the printing was opened at an angle of 20 °, 45 °, and 90 ° with respect to the horizontal plane, and it was confirmed whether the printing was visible. The evaluation criteria are as follows.
A: 20 °, 45 °, and 90 ° are all visible. Very good results.
○: Visible at 45 ° and 90 ° Good results.
Δ: Visible at 90 ° No problem in practical use.
×: Not visible at all angles Not practical

<Martens hardness>
The hardness of the insulating layer of the test piece was measured with a Fisherscope H100C (Fischer Instruments) type hardness tester. The measurement was performed using a Vickers indenter (opening angle 136 ° diamond square pyramid) in a constant temperature room at 25 ° C. with an entry depth of 1 μm and an entry time of 30 seconds. The values obtained by repeatedly measuring the same cured film surface at 10 random locations were averaged to obtain the Martens hardness value.

<Dynamic friction coefficient>
The dynamic friction coefficient of the insulating layer of the test piece was measured by HEIDON (manufactured by Shinto Kagaku Co.). In the measurement, a weight of 100 g supported by three steel balls was attached to the insulating layer of the test piece, the surface was pulled on the insulating layer at a speed of 60 cm / min, and the dynamic friction coefficient of the coating film surface was measured. The average value of the measured values at five different locations was taken as the dynamic friction coefficient.

<Insulation reliability>
The surface resistance value of the insulating layer of the test piece was measured using a ring probe URS of “HIRESTA UP” manufactured by Mitsubishi Chemical Analytech. The evaluation criteria are as follows.
A: 1 × 10 ⁹ Ω / □ or more Very good result.
○: 1 × 10 ⁷ Ω / □ or more and less than 1 × 10 ⁹ Ω / □ Good results.
Δ: 1 × 10 ⁵ Ω / □ or more and less than 1 × 10 ⁷ Ω / □ No problem in practical use.
×: Less than 1 × 10 ⁵ Ω / □ Not practical.

<Ink adhesion>
After white silk screen ink “SS16 611 (manufactured by Toyo Ink)”, cyclohexanone and curing agent “SSUR110B (manufactured by Toyo Ink)” were mixed at a ratio of 10: 11: 1, and solid-printed on the insulating layer surface of the test piece, It dried for 10 minutes in 130 degreeC oven. A cross-cut test was performed on the printed surface according to JIS K 5600 to confirm the adhesion of the ink coating to the insulating layer. The evaluation criteria are as follows.
◎: No lattice separation is observed, which is a very good result.
○: Small peeling of the coating film at the intersection of cuts. Clearly not exceed 5%. It is a good result.
(Triangle | delta): The coating film has peeled partially and entirely along the cut line. 5% or more and less than 35% No problem in practical use.
×: Large peeling occurred on the entire surface. Not practical.

<Ink resistance>
The test piece was immersed in cyclohexanone for 10 minutes in an environment of 25 ° C. and 50%. The test piece was taken out, the solvent was removed with air, and the pencil hardness of the surface of the insulating layer was measured according to JIS K 5600. The evaluation criteria are as follows.
A: H Very good result.
○: F Good results.
Δ: HB No problem in practical use.
×: HB or less Not practical.

<Repulsive force>
An electromagnetic wave shielding sheet was prepared with a width of 1 cm and a length of 6 cm as a sample. The peelable sheet on the side of the conductive adhesive layer (I) was peeled off, and the exposed conductive adhesive layer (I) was prepared to have a width of 1 cm and a length of 6 cm. (Made by DuPont) and 150 ° C., 2 MPa, 30 minutes, and then the peelable sheet on the insulating layer side is peeled off, and the stiffness value is measured under the test conditions described in JPCA-TMJ002 8.4.1 It was measured. The results were evaluated according to the following criteria. If the repulsive force is too high, for example, when the FPC is bent and stored inside the electronic device, there is a demerit that the signal wiring of the FPC is burdened and may be disconnected.

A: Repulsive force is less than 50 mN / mm. Very good result.
○: Repulsive force is 50 mN / mm or more and less than 100 mN / mm. It is a good result.
(Triangle | delta): Repulsive force is 100 mN / mm or more and less than 150 mN / mm. There is no problem in practical use.
X: Repulsive force exceeds 150 mN / mm. Not practical.

  From the results of Tables 2 to 4, the insulating layers of the examples have good ink coating adhesion and ink resistance, excellent print visibility, and low repulsive force, so that the production yield is good and the production cost can be reduced. It was confirmed that a shield sheet could be provided.

1 Insulating layer 2 Conductive adhesive layer (I)
3 Isotropic Conductive Layer 4 Electromagnetic Shielding Sheet 5 Printed Wiring Board 6 Cover Coat Layer 7 Insulation Reliability Base Material 8 Ground Wiring 9 Signal Circuit 10 Hole

Claims (6)

An insulating layer, and a conductive adhesive layer (I),
An electromagnetic wave shielding sheet printed on the insulating layer,
The insulating layer is formed of a black resin composition containing a thermosetting resin (A1), a curing agent (A2), and a black colorant,
In the insulating layer, the content of the black colorant is 2 to 15% by weight,
The thermosetting resin (A1) is any one selected from the group consisting of polyurethane resin, polyurethane urea resin, addition type polyester resin, polyamide resin, polyimide resin, and polyamideimide resin,
The surface of the insulating layer has a contact angle with water of 70 to 100 ° and an 85 ° gloss of 15 to 50,
The electromagnetic shielding sheet, wherein the insulating layer has a thickness of 3 to 20 μm.   The conductive adhesive layer (I) is formed by a conductive adhesive (i) containing a thermosetting resin (B1), a curing agent (B2), and a conductive filler. The electromagnetic wave shielding sheet according to 1.   The electromagnetic wave shielding sheet according to claim 1, wherein the conductive adhesive layer (I) is anisotropically conductive and further includes a conductive layer that is isotropically conductive.   The electromagnetic wave shielding sheet according to any one of claims 1 to 3, wherein the black resin composition further contains a surface conditioner.   An electromagnetic wave shielding sheet according to any one of claims 1 to 4, a cover coat layer, and a wiring board having a signal wiring and an insulating reliability base material, wherein the insulating layer of the electromagnetic wave shielding sheet is printed. Characteristic printed wiring board.   6. The printed wiring board according to claim 5, wherein the printing is white.