KR101637892B1 - Multi-layer heater using heating paste composition - Google Patents

Abstract

The present invention relates to a multilayer heater using a heating paste composition, which can emit a large amount of heat in a limited area or space. According to an embodiment of the present invention, a multilayer heater includes a plurality of unit heaters three-dimensionally stacked. Each of the unit heaters includes an insulating substrate, a sheet heater, and a plurality of electrode terminals. The sheet heater is formed by printing a heating paste composition on the upper surface of the insulating substrate. The plurality of electrode terminals are formed on the sheet heater at regular intervals, and each have an end portion protruding to the outside of the sheet heater to receive a voltage. Electrode terminals positioned on the unit heaters to correspond to each other are electrically connected to each other.

Description

[0001] The present invention relates to a multi-layer heater using a heating paste composition,

The present invention relates to a heating element, and more particularly, to a multi-layer heating element in which unit heating elements are laminated using an exothermic paste composition in which carbon nanotubes and graphite particles are mixed and mixed.

Unlike linear heating elements, plane heating elements generate uniform heat on the surface, which is 20 ~ 40% more energy efficient than linear heating elements. The surface heating element is a relatively safe heating element because there is no electromagnetic wave emission during DC driving.

Typically, the surface heating element may be formed by uniformly spraying or printing a metal heating element such as iron, nickel, chromium, or platinum having a high thermal conductivity on a film-type resin or the like, or by forming a conductive inorganic particle heating element such as carbon, graphite, or carbon black Is mixed with a polymer resin. In recent years, many carbon-based surface heating elements having heat and durability, good thermal conductivity and low thermal expansion coefficient and light characteristics have been researched.

The surface heating element using a carbonaceous material is made of a paste formed by mixing a conductive carbonaceous powder such as carbon, graphite, carbon black or carbon nanotube with a binder, and the amount of the conductive material and the binder used is Accordingly, conductivity, workability, adhesion, scratch resistance and the like are determined.

However, the heating paste based on carbon black is difficult to be developed as a heating element having a high heat resistance of 200 ° C or more due to a PCT (positive coefficient temperature) characteristic unique to carbon black.

It is difficult to have high heat resistance in the case of a heating paste based on carbon nanotubes. In particular, a heat-generating paste having high heat resistance at a temperature of about 200 ° C to 300 ° C, which is capable of screen printing, gravure printing, or comma coating as a heating paste based on carbon nanotubes, has not been reported. Even if the heating paste based on carbon nanotubes is designed to have high heat resistance, since the drying temperature (curing temperature) is close to 300 ° C, it is difficult to apply to soft substrates made of plastic such as PET and PI .

Although the oxidation temperature of the carbon nanotubes is high at 350 캜, it is difficult to bind the binder to such a high temperature, and it is difficult to produce such a screen printing or gravure printing even if a high heat resistant binder is designed.

The heating paste based on carbon nanotubes has a relatively high resistivity and is difficult to form a thick film, so that it is difficult to drive the surface heating element using the carbon nanotube with low voltage and low power.

On the other hand, most heating products have an applied voltage determined according to the size and usage environment of the product, so it is not easy to lower the resistance of the heating element in order to obtain high heat power or heat.

In the case of a transparent heat generating element, in order to lower the sheet resistance, loss of haze and permeability must be reduced. In such a case, however, the product may lose its commercial merit and the manufacturing cost may increase.

When an opaque heating element requires a large amount of heat in a short time using a limited voltage source, there is a problem that the sheet resistance of the heating element must be extremely reduced or the applied voltage must be increased.

Further, since the planar heating element is formed as a single layer, there is a limit to increase the amount of heat in a limited area or space.

In the case of the surface heating element using a carbon-based material, since the heat-generating durability is low, it is difficult to use a sintered electrode material as the electrode terminal, and therefore it is difficult to bond the electrode to the electrode terminal through soldering.

Korean Patent No. 10-1294596 (2013.08.09.)

Accordingly, an object of the present invention is to provide a multilayer heating element using an exothermic paste composition capable of emitting a large amount of heat in a limited area or space.

Another object of the present invention is to provide a multi-layer heating element using a heat-generating paste composition having a rapid temperature rise.

It is still another object of the present invention to provide a multilayer heating element using an exothermic paste composition capable of soldering a conductive wire to an electrode terminal using an electrode material of a sintered type.

To achieve the above object, the present invention provides a multilayer heating element in which a plurality of unit heating elements are stacked. Wherein the plurality of unit heat generating elements each include an insulating substrate, a planar heating element formed by printing an exothermic paste composition on an upper surface of the insulating substrate, and an end portion protruding outside the planar heating element, And a plurality of electrode terminals to which a voltage is applied. At this time, the electrode terminals positioned above and below each other of the plurality of unit heat generating elements are electrically connected to each other.

In the multilayer heating element according to the present invention, the plurality of electrode terminals are formed on the upper surface of the planar heating element or the upper surface of the insulating substrate below the planar heating element.

In the multilayer heating element according to the present invention, each of the plurality of unit heating elements may further include an insulating resin protective layer covering the planar heating element on the upper surface of the insulating substrate and the plurality of electrode terminals.

In the multilayer heating element according to the present invention, each of the plurality of unit heating elements may be formed on the upper surface of the planar heating element. Each of the plurality of unit heat generating elements may further include an insulating resin protective layer covering the planar heating element and a plurality of electrode terminals on the upper surface of the insulating substrate and exposing an upper surface of the plurality of electrode terminals to an upper surface.

In the multilayer heating element according to the present invention, the electrode terminals positioned above and below the plurality of unit heating elements may be electrically connected to each other by vias formed through the insulating substrate outside the planar heating element.

In the multilayer heating element according to the present invention, the unit heating element superimposed on the uppermost one of the plurality of unit heating elements may further include the planar heating element and an insulating insulating layer covering the plurality of electrode terminals on the plane heating element.

In the multilayer heating element according to the present invention, the insulating substrates of the plurality of unit heating elements may be the same in material, or at least one material may be different.

In the multilayer heating element according to the present invention, the planar heating element is formed by printing an exothermic paste composition on an insulating substrate. Wherein the exothermic paste composition comprises conductive particles comprising carbon nanotube particles and graphite particles; A mixed binder in which hexamethylene diisocyanate, polyvinyl acetal, and phenolic resin are mixed; Organic solvent; And a dispersing agent.

In the multilayered heating element according to the present invention, the exothermic paste composition preferably contains 0.2 to 6 parts by weight of carbon nanotube particles, 0.5 to 30 parts by weight of graphite particles, 5 to 30 parts by weight of a mixed binder, 29 to 80 parts by weight of the organic solvent, and 0.5 to 5 parts by weight of the dispersing agent.

The present invention also provides a multilayer printed wiring board comprising a first insulating substrate, a first surface heating element, a plurality of first electrode terminals, an insulating resin protective layer, a second insulating substrate, a plurality of second electrode terminals, a second surface heating element, Thereby providing a heating element. The first surface heating element is formed by printing a first heating paste composition on an upper surface of the first insulating substrate. The plurality of first electrode terminals are formed on the upper surface of the first planar heating element at regular intervals, and the ends of the first planar heating element protrude from the first planar heating element. The insulating resin protection layer covers the first surface heating element and the plurality of first electrode terminals on the upper surface of the first insulating substrate, and exposes the upper surface of the plurality of first electrode terminals to the upper surface. The second insulating substrate is laminated on the insulating resin protective layer, and vias are formed corresponding to the plurality of first electrode terminals. The plurality of second electrode terminals are formed on the upper surface of the second insulating substrate so as to correspond to the plurality of first electrode terminals and are electrically connected to the plurality of first electrode terminals through the vias. The second surface heating element is formed by printing a second heating paste composition on the upper surface of the second insulating substrate so as to cover the second electrode terminal. And the insulating thermal insulation layer covers the upper surface of the second planar heating element and the second insulating substrate.

The multilayer heating element according to the present invention has a structure in which the unit heating elements are stacked three-dimensionally, so that a large amount of heat can be produced in a limited area or space.

Since the exothermic paste composition for forming the planar heating element contained in the unit heating element includes a mixed binder in which conductive particles containing carbon nanotube particles and graphite particles and hexamethylene diisocyanate, polyvinyl acetal and phenolic resin are mixed, The heat resistance can be maintained even at a temperature of 200 ° C or higher, so that it is possible to rapidly heat to a high temperature.

Since the exothermic paste composition can maintain the heat resistance even at a temperature of 200 ° C or higher, the change in resistance with temperature is small, and a stable multilayered heating element can be provided.

Since the exothermic paste composition has a low specific resistance and is easy to control the thickness, high temperature heat can be generated at a low voltage and a low power, so that a more efficient multilayer heating element can be manufactured.

Since the exothermic paste composition is capable of screen printing, roll-to-roll gravure printing, roll-to-roll comb-coating, flexo printing and offset printing, it is not only advantageous for mass production but also easy control of the thickness of the surface heating element, Can be designed.

By forming the electrode terminal using the sintered electrode material on the surface heating element, the lead can be stably bonded to the electrode terminal because the lead can be bonded to the electrode terminal by soldering.

Since the substrate used for the unit heating element of the multilayer heating element according to the present invention is not limited to the same type but can be used for different types of substrates, there is an advantage that the range of application of the multilayer heating element can be expanded.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an image of a surface heating element specimen produced using an exothermic paste composition according to the present invention. FIG.
FIG. 2 is an image of the heat stability test of the surface heating element samples prepared according to the examples and the comparative examples.
Fig. 3 is an image of the surface heating element according to Comparative Example 1 in which the surface is swollen at 200 占 폚 under exothermic driving.
4 is a graph showing that the planar heating element according to Example 1 is stable for 20 days under heating operation at 300 캜.
5 is an exploded perspective view showing a multilayer heating element using an exothermic paste composition according to a first embodiment of the present invention.
Fig. 6 is a plan view of Fig. 5. Fig.
7 is a sectional view taken along line 7-7 of Fig.
8 is a sectional view taken along the line 8-8 in Fig.
9 and 10 are cross-sectional views showing a multilayer heating element using an exothermic paste composition according to a second embodiment of the present invention.
11 and 12 are cross-sectional views showing a multilayer heating element using an exothermic paste composition according to a third embodiment of the present invention.

In the following description, only parts necessary for understanding embodiments of the present invention will be described, and descriptions of other parts will be omitted to the extent that they do not disturb the gist of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor is not limited to the meaning of the terms in order to describe his invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents And variations are possible.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The exothermic paste composition according to the present invention includes conductive particles based on a carbonaceous material, a mixed binder, an organic solvent and a dispersant. The conductive particles include carbon nanotube particles and graphite particles. The mixed binder may be at least two of the following: polyester, epoxy, epoxy acrylate, hexamethylene diisocyanate, polyvinyl acetal, and phenol resin .

The exothermic paste composition according to the present invention comprises 0.2 to 6 parts by weight of carbon nanotube particles, 0.5 to 30 parts by weight of graphite particles, 5 to 30 parts by weight of a mixed binder, 29 to 29 parts by weight of an organic solvent, To 80 parts by weight, and the dispersing agent may include 0.5 to 5 parts by weight.

The carbon nanotube particles can be selected from single-walled carbon nanotubes, double-walled carbon nanotubes, multi-walled carbon nanotubes, or mixtures thereof. For example, the carbon nanotube particles may be multi wall carbon nanotubes. When the carbon nanotube particles are multi-walled carbon nanotubes, the diameter may be from 5 nm to 30 nm, and the length may be from 3 탆 to 40 탆.

The graphite particles may be nanoparticles and have a diameter of 1 탆 to 25 탆.

The mixed binder has a form in which at least two of polyester, epoxy, epoxy acrylate, hexamethylene diisocyanate, polyvinyl acetal and phenolic resin are mixed so that the exothermic paste composition can have heat resistance even at a temperature of about 300 캜.

For example, the mixed binder may have a mixed form of hexamethylene diisocyanate, polyvinyl acetal resin, and phenolic resin. Wherein the mixed binder includes 10 to 150 parts by weight of a polyvinyl acetal resin and 100 to 500 parts by weight of a phenolic resin based on 100 parts by weight of hexamethylene diisocyanate. When the phenol resin is 100 parts by weight or less based on 100 parts by weight of hexamethylene diisocyanate, the heat resistance is lowered. When the amount is more than 500 parts by weight, the flexibility of the surface heat generating element is lowered and the brittleness is increased.

As described above, in the present invention, by increasing the heat resistance of the mixed binder, even when the planar heating element is heated to a high temperature of about 300 캜, resistance change of the planar heating element and breakage of the planar heating element can be suppressed.

Here, the phenolic resin means a phenolic compound including phenol and phenol derivatives. For example, phenol derivatives include p-cresol, o-Guaiacol, Creosol, Catechol, 3-methoxy-1,2-benzenediol (3- methoxy-1,2-benzenediol, Homocatechol, Vinylguaiacol, Syringol, Iso-eugenol, Methoxyeugenol, o- Cresol, 3-methyl-1,2-benzenediol and (z) -2-methoxy-4- (1-propenyl) -phenol 2-methoxy-4- (1-propenyl) -phenol, 2,6-dimethoxy-4- (2-propenyl) Phenol, 3,4-dimethoxy-Phenol, 4-ethyl-1,3-benzenediol, Resole phenol, 4-methyl-1,2-benzenediol, 1,2,4-benzene triol, 2-methoxy-6-methylphenol 2-Methoxy-6-methylphenol, 2-Methoxy-4-vinylphenol or 4-ethyl-2-methoxy- , Etc. It is not.

The organic solvent is used for dispersing the conductive particles and the binder. The organic solvent is selected from the group consisting of Carbitol acetate, Butyl carbotol acetate, DBE (dibasic ester), Ethyl Carbitol, Ethyl Carbitol Acetate, Dipropylene Glycol Methyl ether, cellosolve acetate, butyl cellosolve acetate, butanol, and octanol.

Meanwhile, various methods commonly used may be applied to the dispersion process. For example, ultrasonic treatment (roll-milling), bead milling or ball milling Lt; / RTI >

The dispersing agent may be an ordinary dispersant used in the art such as BYK, an amphoteric surfactant such as Triton X-100, or an ionic surfactant such as SDS.

The exothermic paste composition according to the present invention may further comprise 0.5 to 5 parts by weight of a silane coupling agent as an additive to 100 parts by weight of the exothermic paste composition.

The silane coupling agent functions as an adhesion promoter for enhancing the adhesion force between the resins when the exothermic paste composition is blended. The silane coupling agent may be an epoxy-containing silane or a mercaptan-containing silane. Examples of such silane coupling agents include epoxy-containing 2- (3,4-epoxycyclohexyl) -ethyltrimethoxysilane, 3-glycidoxytrimethoxysilane, 3-glycidoxypropyltriethoxysilane, (Aminoethyl) 3-aminopropylmethyldimethoxysilane, N-2 (aminoethyl) 3-aminopropyltrimethoxysilane having an amine group and N-2 , N-2 (aminoethyl) 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl- Propylamine, N-phenyl-3-aminopropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltriethoxysilane, isocyanate, 3-isocyanate propyltriethoxysilane, and the like, but is not limited thereto.

Hereinafter, the heat generating paste composition according to the present invention and the planar heating element using the same will be described in detail with reference to test examples. The following test examples are only illustrative of the present invention, and the present invention is not limited by the following test examples.

Test Example

(1) Preparation of Examples and Comparative Examples

Examples (3 kinds) and comparative examples (3 kinds) were prepared as shown in Table 1 below.

It is to be noted that the composition ratios indicated in [Table 1] are expressed as% by weight.

[Table 1]

In Examples, carbon nanotube particles and graphite (CNP) particles (Examples 1 to 3) were added to a carbitol acetate solvent according to the composition of Table 1, BYK dispersant was added, and ultrasonic treatment was performed for 60 minutes To prepare dispersion A.

Thereafter, the master batch was prepared by adding the mixed binder to the carbitol acetate solvent and then mechanically stirring. Next, the dispersion A and the master batch were firstly kneaded by mechanical agitation, followed by a second-order kneading through a three-roll-mill process to prepare an exothermic paste composition.

In the comparative examples, the CNT particles were added to the carbitol acetate solvent according to the composition of [Table 1], BYK dispersant was added, and the dispersion was prepared by ultrasonication for 60 minutes. After that, ethyl cellulose was added to the carbitol acetate solvent and the master batch was prepared by mechanical stirring. Next, the dispersion B and the masterbatch were firstly kneaded through mechanical stirring and then subjected to a second-order kneading through a three-roll-milling process to prepare an exothermic paste composition.

(2) Evaluation of surface heating element characteristics

After heating paste compositions according to Examples and Comparative Examples were screen printed on a polyimide substrate with a size of 10 x 10 cm and cured, a silver paste electrode was printed on both ends and cured to prepare a surface heating element sample.

1 is an image of a surface heating element specimen produced using an exothermic paste composition according to the present invention. 1A is a planar heating element formed by screen printing an exothermic paste composition on a polyimide substrate. 1B is a planar heating element formed by screen printing a heating paste composition on a glass fiber mat. 1C and 1D are images obtained by coating a protective layer on top of the planar heating element of FIG. 1A (FIG. 1C is a black protective layer coating and FIG. 1D is a green protective layer coating).

As shown in Fig. 1A, specific resistances of the surface heating element samples (examples) and the surface heating element samples prepared according to the comparative example were measured (voltage / current applied is shown in Table 2).

Further, in order to confirm the effect of the temperature increase according to the applied voltage / current, the surface heating elements corresponding to the examples and comparative examples were heated to 40, 100 and 200 ° C, respectively, and the DC voltage and current Respectively.

In addition, the heat stability at 200 캜 was tested for each sample. In FIG. 2, images of heat stability tests of the surface heating element samples prepared according to Examples and Comparative Examples are shown, and the test results are summarized in Table 2 below.

[Table 2]

Referring to [Table 2], the specific resistance of the planar heating elements corresponding to the embodiments was measured to be smaller than that of the planar heating elements corresponding to the comparative examples. Accordingly, the driving voltage / The corresponding plane heating elements were measured to be smaller than those of the plane heating elements corresponding to the comparative examples. That is, it can be confirmed that the planar heating elements corresponding to the embodiments can be driven with lower voltage and lower power than the comparative example.

Specifically, in the planar heating elements according to Examples 1 to 3, stability was maintained for 20 days even under exothermic driving at 300 ° C (while no separate protective insulating layer was provided), whereas in Comparative Examples 1 to 3, A defective phenomenon was observed in which the surface of the heat generating portion was swollen within 2 hours (the temperature could be raised to 300 캜, but the defective phenomenon already started at 200 캜). In FIG. 3, the planar heating element according to Comparative Example 1 shows an image in which the surface is swollen under a 200 ° C heating drive. In FIG. 4, the planar heating element according to Example 1 has a stability (The X-axis in FIG. 4 is time (day), and the Y-axis represents the exothermic driving temperature). Referring to FIG. 4, it can be seen that the planar heating element manufactured using the heating paste composition according to the present invention is stably driven for 20 days under heating at 300 ° C.

Therefore, it has been confirmed that the exothermic paste composition according to the present invention can maintain the heat resistance even at a temperature of about 200 ° C or more, for example, about 300 ° C, thereby providing a planar heating element that can be heated to a high temperature.

There is provided a multilayer heating element in which multilayered surface heating elements formed by printing an exothermic paste composition according to the present invention on a substrate are laminated.

The multi-layer heating element using the heating paste composition according to the present invention will now be described with reference to the drawings.

First Embodiment

5 is an exploded perspective view showing a multilayer heating element using an exothermic paste composition according to a first embodiment of the present invention. Fig. 6 is a plan view of Fig. 5. Fig. 7 is a sectional view taken along line 7-7 of Fig. And Fig. 8 is a sectional view taken along the line 8-8 in Fig.

5 to 8, the multilayer heating element 100 according to the first embodiment has a structure in which a plurality of unit heating elements 10 and 20 are laminated in three dimensions. The unit heat generating elements (10, 20) include plane heat generating elements (13, 23) formed using an exothermic paste composition.

Although the multilayered heating element 100 according to the first embodiment has a structure in which two unit heating elements 10 and 20 are laminated, the present invention is not limited thereto. That is, it is needless to say that the multi-layer heating element 100 can be realized by stacking three or more unit heating elements.

The multilayered heating element 100 according to the first embodiment includes a first unit heating element 10 and a second unit heating element 20 stacked on the first unit heating element 10. The insulating heat insulating layer 30 may be formed on the second unit heat generating element 20. And the plurality of electrode terminals 15 and 25 corresponding to each other are electrically connected to the first and second unit heating elements 10 and 20, respectively.

The first unit heating element 10 includes a first insulating substrate 11, a first surface heating element 13, and a plurality of first electrode terminals 15. The first unit heating element 10 may further include a first insulating resin protective layer 17.

The first insulating substrate 11 is made of a material having insulation and heat insulating property, which functions to suppress the power applied to the first surface heat emission element 13 formed on the upper surface and heat to the outside. Examples of the material of the first insulating substrate 11 include polycarbonate, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide, cellulose ester, nylon, polypropylene, polyacrylonitrile, polysulfone, polyester Glass, fiberglass (mat), ceramic, mica stone, silicone rubber, SUS, copper, aluminum, and the like may be used. The material of the first insulating substrate 11 can be appropriately selected depending on the application field of the multilayer heating element 100 and the use temperature.

The first surface heating element 13 is formed by printing an exothermic paste composition according to the present invention on the upper surface of the first insulating substrate 11, followed by drying and curing. In other words, screen printing, gravure printing (to roll to roll gravure printing), comma coating (to roll to roll comma coating), flexo, imprinting, offset printing and the like can be used as the printing method of the first surface heating element 13. Drying and curing can be carried out at 100 ° C to 180 ° C.

The plurality of first electrode terminals 15 are formed at a predetermined interval in the first surface heat emission element 13 and the ends thereof protrude outward from the first surface heat emission element 13 to receive a voltage from the outside. The plurality of first electrode terminals 15 may be formed by attaching a thin film of copper material to the upper surface of the first surface heat emission element 13. Alternatively, the plurality of first electrode terminals 15 may be formed by printing, drying and curing a silver paste or a copper paste on the first surface heating element 13.

The first insulating resin protective layer 17 is formed to cover the first surface heating element 13 and the plurality of first electrode terminals 15 on the upper surface of the first insulating substrate 11, And the upper surface of the one-electrode terminal 15 is exposed. The first insulating resin protective layer 17 functions as a bonding member for protecting the first surface heating element 13 and the plurality of first electrode terminals 15 and for attaching the second unit heating element 20 to the upper surface . As the material of the first insulating resin protective layer 17, polyimide, epoxy resin, optically clear adhesive (OCA), or optically clear resin (OCR) may be used, but the present invention is not limited thereto. For example, when the multilayered heating element 100 is made of a transparent heating element, the heating paste composition according to the present invention is printed on the upper surface of the first insulating substrate 11 made of PET, PC, or PAN in a mesh pattern to form a first surface heating element The second insulating substrate 21 of the second unit heating element 20 can be joined to the first surface heating element 13 by using a first insulating resin protective layer 17 such as OCA or OCR. have.

The second unit heating element 20 includes a second insulating substrate 21, a second surface heating element 23, and a plurality of second electrode terminals 25. The second unit heating element 20 may further include a second insulating resin protective layer 27. That is, since the second unit heat generating element 20 has the same configuration as the first unit heat emitting element 10, detailed description is omitted.

At this time, the plurality of first and second electrode terminals 15 and 25 are electrically connected to the first and second electrode terminals 15 and 25 by using a sintered electrode material on the first and second surface heat emission elements 13 and 23, The lead can be stably bonded to the second electrode terminal 25 because the lead can be bonded to the second electrode terminal 25 by soldering. The connection of the leads can be performed after forming the via 29. It may be performed before or after the insulating thermal insulation layer 30 is formed.

The insulating insulating layer 30 is formed on the second surface heating element 23 of the second unit heating element 20, the first insulating resin protective layer 17 and the plurality of second electrode terminals 25 on the second surface heating element 23 Respectively. In the plurality of second electrode terminals 25, a portion to which external power is applied may be exposed to the outside of the insulation layer 30. The insulating thermal insulation layer 30 may be formed of an insulating material having a withstand voltage characteristic according to a voltage applied to the first and second surface heat emission elements 13 and 23. [ That is, an insulating material having a withstand voltage of 500 V or an insulating material having a withstand voltage of 1600 V or more may be used as the material of the insulating insulating layer 30. For example, as the material of the insulating insulating layer 30, an insulating paste including an organic material including silica (SiO ₂ ) or an inorganic material such as glass frit, and an insulating film may be used. In the case of an insulating paste, the insulating insulating layer 30 is formed by coating the insulating paste through doctoring or screen printing and curing.

On the other hand, in the first embodiment, the ends of the plurality of second electrode terminals 25 to which external power is applied, that is, the ends of the plurality of second electrode terminals 25 to which the lead wires are joined by soldering are exposed to the outside of the insulating heat insulating layer 30 An example has been disclosed, but the present invention is not limited thereto. In the case of forming the insulating insulation layer 30 after the leads are soldered to the terminals of the plurality of second electrode terminals 25, the entirety of the plurality of second electrode terminals 25, including the portions to which the leads are connected, As shown in FIG.

In the first embodiment, an example in which the insulating thermal insulation layer 30 is provided is described. However, the insulating thermal insulation layer 30 may not be provided. For example, when a mica-like substrate is used as the first insulating substrate 11 and a PI substrate is used as the second insulating substrate 21, the insulating insulating layer 30 may be omitted. In other words, since the mica stone substrate itself has the function of heat insulation, it is not necessary to form a separate insulating heat insulating layer 30 on the second unit heat generating element 20. Insulating layer 30 is formed on the second unit heat generating element 20 because the silicon rubber itself has the function of heat insulation even when the first or second insulating substrate 21 is a silicon rubber substrate You do not have to.

The electrode terminals 15 and 25 located above and below the first and second unit heating elements 10 and 20 are electrically connected to each other. That is, the first and second electrode terminals 15 and 25 located above and below the first and second unit heat generating elements 10 and 20 are electrically connected to the first and second surface heat emitting bodies 13 and 23, Are electrically connected to each other by vias (29) formed through the through holes (21). Here, the portion where the via 29 is formed is formed so as to vertically penetrate the first and second electrode terminals 15 and 25 exposed to the outside of the insulation layer 30.

The via 29 is formed by laminating the second unit heating element 20 on the first unit heating element 10 and then the second electrode terminal 25 and the second insulating resin protective layer 27 and the second insulating substrate 20 21 are formed. Then, the via hole 29 can be formed by filling the through hole with silver paste or copper paste, or by filling the conductive metal with electrolytic or electroless plating. The through hole can be formed by a drill or a laser.

The via 29 may be formed before or after the insulating thermal insulation layer 30 is formed. For example, when the via 29 is formed before forming the insulating insulating layer 30, the via 29 and the lead can be covered with the insulating insulating layer 30. The insulating thermal insulation layer 30 is formed such that the portion of the second electrode terminal 25 on which the via 29 is to be formed is exposed to the outside when the via 29 is formed after the insulation thermal insulation layer 30 is formed.

As described above, the multilayered heating element 100 according to the first embodiment is manufactured by stacking the first and second unit heating elements 10 and 20 three-dimensionally. Therefore, the multilayered heating element 100 is used for the first and second unit heating elements 10 and 20 The first and second insulating substrates 11 and 21 may be made of the same material or different materials. That is, the multilayer heating element 100 according to the first embodiment has an advantage that various insulating substrates 11 and 21 can be combined.

For example, PI / PI, mica stone / PI, PET / PET, glass / PI, silicone rubber / silicone rubber and the like can be used as the materials of the first and second insulating substrates 11 and 21, . Here, the material of the first and second insulating substrates 11 and 21 is described as "material of the first insulating substrate 11 / material of the second insulating substrate 21 ".

As described above, the multilayer heating element 100 according to the first embodiment is not only capable of forming two or more layers of the same substrate, but also can be combined with a different substrate depending on the application field.

Since the same type and different types of substrates can be used as the insulating substrates 11 and 21 used for the unit heating elements 10 and 20 of the multilayer heating element 100 according to the first embodiment, The application range of the product can be expanded.

When the multilayered heating element 100 is made of a transparent heating element, the heating paste composition according to the present invention is printed on the upper surface of the first insulating substrate 11 made of PET, PC, or PAN in a mesh pattern to form the first surface heating element 13 And the second insulating substrate 21 of the second unit heating element 20 is joined to the first surface heating element 13 by using a first insulating resin protective layer 17 such as OCA or OCR. The total amount of heat generation can be increased by forming the second surface heat emission element 23, which is the same as the first surface heat emission element 13, on the second insulation substrate 21. Such a transparent multi-layer heating element 100 can be applied to windshield, rear glass, side glass, sunroof, etc. of an automobile.

Generally, the automobile may require a large amount of heat in a certain area for the purpose of heating the room or heating the room. In such a case, the multi-layer heating element 100 according to the first embodiment may be applied. Other transparent multi-layer heating elements may be applied to window glass, but the present invention is not limited thereto.

The multilayered heating element 100 according to the first embodiment can be applied to gas transfer piping, household appliances, medical heating products, and the like.

Since the multilayered heating element 100 according to the first embodiment has a structure in which the unitary heating elements 10 and 20 are laminated in three dimensions, a large amount of heat can be produced in a limited area or space.

The exothermic paste composition for forming the planar heating elements (13, 23) contained in the unit heating elements (10, 20) is composed of conductive particles containing carbon nanotube particles and graphite particles and conductive particles containing hexamethylene diisocyanate, polyvinyl acetal and phenol resin It is possible to maintain the heat resistance even at a temperature of 200 DEG C or higher and to quickly heat to a high temperature. Further, the multilayered heating element 100 according to the first embodiment has a characteristic of quickly returning to the original temperature (normal temperature) in a short time. That is, the multilayered heating element 100 can be heated up to 200 DEG C in 3 to 10 seconds at room temperature under driving conditions of 50 V or less. When the voltage application is turned off after the temperature rise, the multilayer heating element 100 can return to the room temperature of the original temperature within 10 seconds.

Since the exothermic paste composition can maintain the heat resistance even at a temperature of 200 ° C or higher, the change in resistance according to the temperature is small, so that the stable multilayered heating element 100 can be provided. Accordingly, the multilayered heating element 100 can generate heat at 100 DEG C at a low power of 5 W or less.

Since the exothermic paste composition has a low resistivity and is easy to control the thickness, high temperature heating can be performed at low voltage and low power, so that a more efficient multilayer heating element 100 can be manufactured.

Since the exothermic paste composition is capable of screen printing, roll-to-roll gravure printing, roll-to-roll comb-coating and the like, it is advantageous for mass production as well as easy control of the thickness of the surface heating elements 13 and 23, 100) can be designed.

Since the electrode terminals 15 and 25 are formed on the surface heating elements 13 and 23 using the electrode material of the sintered type so that the wires can be joined to the electrode terminals 15 and 25 by soldering, (15, 25).

Second Embodiment

On the other hand, in the first embodiment, the example in which the electrode terminals 15 and 25 are formed on the surface heat emission elements 13 and 23 is described, but the present invention is not limited thereto. For example, as shown in Figs. 9 and 10, the electrode terminals 15 and 25 may be formed below the planar heating elements 13 and 23. Fig.

9 and 10 are cross-sectional views showing a multilayer heating element 200 using an exothermic paste composition according to a second embodiment of the present invention.

9 and 10, the multilayered heating element 200 according to the second embodiment has a structure in which the first and second unit heating elements 10 and 20 are laminated in three dimensions, and the second unit heating element 20, An insulating insulating layer 30 may be formed on the upper surface of the insulating layer 30.

The first unit heating element 10 includes a first insulating substrate 11, a first surface heating element 13, and a plurality of first electrode terminals 15. The first unit heating element 10 may further include a first insulating resin protective layer 17.

The first insulating substrate 11 is made of a material having insulation and heat insulating property, which functions to suppress the power applied to the first surface heat emission element 13 formed on the upper surface and heat to the outside.

A plurality of first electrode terminals 15 are formed on the upper surface of the first insulating substrate 11 at regular intervals. The plurality of first electrode terminals 15 may be formed by attaching a thin film of copper material to the upper surface of the first insulating substrate 11. Alternatively, the plurality of first electrode terminals 15 may be formed by printing, drying and curing silver paste or copper paste on the upper surface of the first insulating substrate 11.

The first surface heating element 13 is formed by printing an exothermic paste composition according to the present invention on the upper surface of the first insulating substrate 11 so as to cover the first electrode terminal 15, followed by drying and curing. In other words, screen printing, gravure printing (to roll to roll gravure printing), comma coating (to roll to roll comma coating), flexo, imprinting, offset printing and the like can be used as the printing method of the first surface heating element 13. Drying and curing can be carried out at 100 ° C to 180 ° C.

At this time, the end portions of the plurality of second electrode terminals 25 protrude from the first surface heat emission element 13 so that power can be supplied from the outside.

The first insulating resin protective layer 17 is formed so as to cover the first surface heating element 13 on the upper surface of the first insulating substrate 11 and the plurality of first electrode terminals 15. In the second embodiment, the first insulating resin protective layer 17 is formed such that the upper surface of the second surface heating element 23 is exposed to the upper surface of the first insulating resin protective layer 17. That is, the first insulating resin protective layer 17 is formed on the upper surface of the first insulating substrate 11 so as to surround the first surface heat emission element 13.

The second unit heating element 20 includes a second insulating substrate 21, a second surface heating element 23, and a plurality of second electrode terminals 25. The second unit heating element 20 may further include a second insulating resin protective layer 27. That is, since the second unit heat generating element 20 has the same configuration as the first unit heat emitting element 10, detailed description is omitted.

The insulating thermal insulating layer 30 is formed so as to cover the second surface heating element 23 and the second insulating resin protective layer 27 of the second unit heating element 20. [ In the second embodiment, an example in which the insulating heat insulating layer 30 is provided is described. However, the insulating heat insulating layer 30 may not be provided.

The electrode terminals 15 and 25 located above and below the first and second unit heating elements 10 and 20 are electrically connected to each other. That is, the first and second electrode terminals 15 and 25 located above and below the first and second unit heat generating elements 10 and 20 are electrically connected to the first and second surface heat emitting bodies 13 and 23, Are electrically connected to each other by vias (29) formed through the first insulating resin protective layer (21) and the first insulating resin protective layer (17). Here, the portion where the via 29 is formed is formed so as to vertically penetrate the first and second electrode terminals 15 and 25 exposed through the first and second surface heat emission elements 13 and 23.

The via 29 is formed by laminating the second insulating substrate 21 of the second unit heating element 20 on the first unit heating element 10 and then forming the second insulating substrate 21 and the first insulating resin protective layer 17 are formed. The via hole 29 can be formed by filling the through hole with silver paste or copper paste, or by filling the conductive metal with electrolytic or electroless plating. The through hole can be formed by a drill or a laser.

A plurality of second electrode terminals 25 may be formed on the upper surface of the second insulating substrate 21 after the vias 29 are formed. Or when a plurality of second electrode terminals 25 are formed by printing silver or copper paste on the upper surface of the second insulating substrate 21 after forming the through holes as described above, The via holes 29 can be formed together.

Or a plurality of second electrode terminals 25 are formed on the upper surface of the second insulating substrate 21 before forming the through holes. After the through holes are formed through the second electrode terminal 25, the second insulating substrate 21 and the first insulating resin protective layer 17, the through holes are filled with silver paste or copper paste, And the vias 29 can be formed by electroless plating.

Thus, since the multilayered heating element 200 according to the second embodiment is manufactured by stacking the first and second unit heating elements 10 and 20 three-dimensionally, the same as the multilayered heating element 100 according to the first embodiment A similar effect can be expected.

Third Embodiment

On the other hand, in the first embodiment, the electrode terminals 15 and 25 are formed on the planar heating elements 13 and 23. In the second embodiment, the electrode terminals 15 and 25 are formed on the planar heating elements 13 and 23 ). However, the present invention is not limited to this. For example, as shown in FIGS. 11 and 12, the electrode terminals 15 and 25 may be formed on the upper or lower surface of the planar heating elements 13 and 23, depending on the stacking position of the unit heating elements 13 and 23.

11 and 12 are cross-sectional views showing a multi-layer heating element 300 using an exothermic paste composition according to a third embodiment of the present invention.

11 and 12, the multilayered heating element 300 according to the second embodiment has a structure in which the first and second unit heating elements 10 and 20 are laminated in three dimensions, and the second unit heating element 20, An insulating insulating layer 30 may be formed on the upper surface of the insulating layer 30.

The first unit heating element 10 is formed on the first surface heating element 13 such that a plurality of first electrode terminals 15 are formed in the same manner as the first unit heating element 10 according to the first embodiment. Since the first unit heat generating element 10 has the same configuration as the first unit heat emitting element 10 according to the first embodiment, a detailed description thereof will be omitted.

The second unit heating element 20 is formed at the lower portion of the second surface heating element 23 in the same manner as the second unit heating element 20 according to the second embodiment. Since the second unit heat generating element 20 has the same configuration as the second unit heat emitting element 20 according to the second embodiment, detailed description is omitted.

The insulating thermal insulating layer 30 is formed so as to cover the second surface heating element 23 and the second insulating resin protective layer 27 of the second unit heating element 20. [ In the third embodiment, an example in which the insulating thermal insulation layer 30 is provided is described. However, the insulating thermal insulation layer 30 may not be provided.

The electrode terminals 15 and 25 located above and below the first and second unit heating elements 10 and 20 are electrically connected to each other. That is, the first and second electrode terminals 15 and 25 located above and below the first and second unit heat generating elements 10 and 20 are electrically connected to the first and second surface heat emitting bodies 13 and 23, Are electrically connected to each other by vias (29) formed through the through holes (21). Here, the portion where the via 29 is formed is formed so as to vertically penetrate the first and second electrode terminals 15 and 25 exposed through the first and second surface heat emission elements 13 and 23.

These vias 29 form through holes passing through the second insulating substrate 21 after the second insulating substrate 21 of the second unit heating element 20 is laminated on the first unit heating element 10 . Then, the via hole 29 can be formed by filling the through hole with silver paste or copper paste, or by filling the conductive metal with electrolytic or electroless plating. The through hole can be formed by a drill or a laser.

A plurality of second electrode terminals 25 may be formed on the upper surface of the second insulating substrate 21 after the vias 29 are formed. Or when a plurality of second electrode terminals 25 are formed by printing silver or copper paste on the upper surface of the second insulating substrate 21 after forming the through holes as described above, The via holes 29 can be formed together.

Or a plurality of second electrode terminals 25 are formed on the upper surface of the second insulating substrate 21 before forming the through holes. After the through holes are formed through the second electrode terminal 25, the second insulating substrate 21 and the first insulating resin protective layer 17, the through holes are filled with silver paste or copper paste, And the vias 29 can be formed by electroless plating.

The multilayered heating element 300 according to the third embodiment includes a first insulating substrate 11, a first surface heating element 13, a plurality of first electrode terminals 15, a first insulating resin protective layer 17, The second insulating resin substrate 21, the vias 29 and the plurality of second electrode terminals 25, the second surface heating element 23, the second insulating resin protective layer 27 and the insulating insulating layer 30 are stacked in this order .

Meanwhile, the multilayer heating element 300 according to the third embodiment includes a plurality of first electrode terminals 15, a second insulating substrate 21, vias 29, and a plurality of second electrode terminals 25 sequentially stacked However, the present invention is not limited to this. For example, the plurality of first electrode terminals 15, the second insulating substrate 21, the vias 29, and the plurality of second electrode terminals 25 may be manufactured as a single printed circuit board can do. Only the second insulating substrate 21, the vias 29 and the plurality of second electrode terminals 25 can be manufactured as a single printed circuit board by utilizing the manufacturing process of the printed circuit board.

Thus, since the multilayered heating element 300 according to the third embodiment is manufactured by stacking the first and second unit heating elements 10 and 20 in three dimensions, the multilayered heating element 300 is the same as the multilayered heating element 100 according to the first embodiment A similar effect can be expected.

It should be noted that the embodiments disclosed in the present specification and drawings are only illustrative of specific examples for the purpose of understanding, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: first unit heating element
11: first insulating substrate
13: first surface heating element
15: first electrode terminal
17: First insulating resin protective layer
20: second unit heating element
21: second insulating substrate
23: Second surface heating element
25: second electrode terminal
27: Second insulating resin protective layer
29: Via
30: Insulating insulation layer
100, 200, 300: multilayer heating element

Claims (12)

A multilayer heating element in which a plurality of unit heating elements are stacked,
The plurality of unit heat generating elements each include:
An insulating substrate;
A surface heating element formed on the upper surface of the insulating substrate by printing an exothermic paste composition comprising a mixed binder in which hexamethylene diisocyanate, polyvinyl acetal, and phenolic resin are mixed and conductive particles;
And a plurality of electrode terminals formed at predetermined intervals in the planar heating element and having an end protruded outside the planar heating element to receive a voltage,
And the electrode terminals located above and below the plurality of unit heat generating elements are electrically connected to each other. The semiconductor device according to claim 1,
Wherein the heat sink is formed on an upper surface of the planar heating element or an upper surface of the insulating substrate below the planar heating element. The heat generating element according to claim 1,
An insulating resin protective layer covering the planar heating element and the plurality of electrode terminals on the upper surface of the insulating substrate;
Further comprising a plurality of heating elements. The method according to claim 1,
The plurality of unit heat generating elements each include:
The plurality of electrode terminals are formed on the upper surface of the planar heating element,
An insulating resin protective layer covering the planar heating element on the upper surface of the insulating substrate and the plurality of electrode terminals, the upper surface of the insulating resin protective layer exposing the upper surface of the plurality of electrode terminals;
Further comprising a plurality of heating elements. The method according to claim 1,
Wherein the electrode terminals located above and below the plurality of unit heat generating elements are electrically connected to each other by vias formed through the insulating substrate outside the planar heat generating element. The method according to claim 1,
And a plurality of unit heat generating elements stacked on the uppermost one of the plurality of unit heat generating elements,
An insulating heat insulating layer covering the surface heat generating element and a plurality of electrode terminals on the surface heat generating element;
Further comprising a plurality of heating elements. The method according to claim 1,
Wherein the insulating substrates of the plurality of unit heating elements are made of the same material or different materials. The method according to claim 1,
Wherein the conductive particles of the exothermic paste composition comprise carbon nanotube particles and graphite particles. The heat generating paste composition according to claim 8,
Wherein 0.2 to 6 parts by weight of carbon nanotube particles, 0.5 to 30 parts by weight of graphite particles and 5 to 30 parts by weight of a mixed binder are contained relative to 100 parts by weight of an exothermic paste composition. A first insulating substrate;
A first surface heating element formed by printing a first heating paste composition on an upper surface of the first insulating substrate;
A plurality of first electrode terminals formed on an upper surface of the first planar heating element at regular intervals and protruding outward from the first planar heating element;
An insulating resin protective layer covering the first surface heating element and the plurality of first electrode terminals on the upper surface of the first insulating substrate and exposing the upper surface of the plurality of first electrode terminals to the upper surface;
A second insulating substrate laminated on the insulating resin protective layer and having vias corresponding to the plurality of first electrode terminals;
A plurality of second electrode terminals formed on the upper surface of the second insulating substrate to correspond to the plurality of first electrode terminals and electrically connected to the plurality of first electrode terminals through the vias;
A second surface heating element formed by printing a second heating paste composition on an upper surface of the second insulating substrate so as to cover the second electrode terminal;
And an insulating heat insulating layer covering the upper surface of the second surface heating element and the second insulating substrate,
The first and second exothermic paste compositions may each contain,
Conductive particles; And
A mixed binder in which hexamethylene diisocyanate, polyvinyl acetal, and phenolic resin are mixed;
And a plurality of heating elements. 11. The method of claim 10,
Wherein the conductive particles of the exothermic paste composition comprise carbon nanotube particles and graphite particles. The heat generating paste composition according to claim 11,
Wherein 0.2 to 6 parts by weight of carbon nanotube particles, 0.5 to 30 parts by weight of graphite particles and 5 to 30 parts by weight of a mixed binder are contained relative to 100 parts by weight of an exothermic paste composition.

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