RS50718B - Postupak postavljanja elektronskog sklopa na supstrat i uređaj za postavljanje takvog sklopa - Google Patents

Postupak postavljanja elektronskog sklopa na supstrat i uređaj za postavljanje takvog sklopa

Info

Publication number
RS50718B
RS50718B RSP-2009/0051A RSP20090051A RS50718B RS 50718 B RS50718 B RS 50718B RS P20090051 A RSP20090051 A RS P20090051A RS 50718 B RS50718 B RS 50718B
Authority
RS
Serbia
Prior art keywords
applying
substrate
assembly
segment
chip
Prior art date
Application number
RSP-2009/0051A
Other languages
English (en)
Inventor
François Droz
Original Assignee
Nagraid Sa.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP05100694A external-priority patent/EP1686512A1/fr
Application filed by Nagraid Sa. filed Critical Nagraid Sa.
Publication of RS50718B publication Critical patent/RS50718B/sr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

Postupak rasporedjivanja u supstrat (7) bar jednog elektronskog sklopa koji sadrži čip (4), sa bar jednim električnim kontaktom (5,5') na jednoj od svojih strana i bar jednog segmenta (3,3') provodnog traga, koji je priključen na bar jedan pomenuti električni kontakt (5,5'), karakterisan time što sadrži sledeće etape:- formiranje bar jednog pomenutog segmenta (3,3') provodnog traga sa unapred odredjenim obodom;- obuhvatanje bar jednog pomenutog segmenta (3,3') traga sa uredjajem (6),- obuhvatanje čipa (4) sa uredjajem (6) koji nosi segmente (3,3') traga, tako da se kraj pomenutog segmenta (3,3') postavi paralelno uz kontakt (5,5') čipa (4) ili se stavi uz pomenuti kontakt (5,5');- postavljanje pomenutog elektronskog sklopa koju drži uredjaj (6) u odredjenom položaju u odnosu na pomenutu podlogu (7); i- pritiskanje pomenutog elektronskog sklopa u pomenutu podlogu (7). Prijava sadrži još 37 patentnih zahteva.
RSP-2009/0051A 2005-02-01 2006-02-01 Postupak postavljanja elektronskog sklopa na supstrat i uređaj za postavljanje takvog sklopa RS50718B (sr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05100694A EP1686512A1 (fr) 2005-02-01 2005-02-01 Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble
EP05109094 2005-09-30
PCT/EP2006/050585 WO2006082199A2 (fr) 2005-02-01 2006-02-01 Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble

Publications (1)

Publication Number Publication Date
RS50718B true RS50718B (sr) 2010-06-30

Family

ID=36645615

Family Applications (1)

Application Number Title Priority Date Filing Date
RSP-2009/0051A RS50718B (sr) 2005-02-01 2006-02-01 Postupak postavljanja elektronskog sklopa na supstrat i uređaj za postavljanje takvog sklopa

Country Status (27)

Country Link
US (2) US7785932B2 (sr)
EP (1) EP1846874B1 (sr)
JP (1) JP4838813B2 (sr)
KR (1) KR101145535B1 (sr)
CN (1) CN101111855B (sr)
AP (1) AP2226A (sr)
AT (1) ATE413666T1 (sr)
AU (1) AU2006210245B2 (sr)
BR (1) BRPI0606562A8 (sr)
CA (1) CA2595796C (sr)
CY (1) CY1108717T1 (sr)
DE (1) DE602006003528D1 (sr)
DK (1) DK1846874T3 (sr)
EG (1) EG25336A (sr)
ES (1) ES2318724T3 (sr)
HR (1) HRP20090045T3 (sr)
MA (1) MA29242B1 (sr)
ME (1) ME01052B (sr)
MX (1) MX2007009166A (sr)
PL (1) PL1846874T3 (sr)
PT (1) PT1846874E (sr)
RS (1) RS50718B (sr)
RU (1) RU2398280C2 (sr)
SI (1) SI1846874T1 (sr)
TN (1) TNSN07302A1 (sr)
WO (1) WO2006082199A2 (sr)
ZA (1) ZA200707271B (sr)

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US7967214B2 (en) 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
WO2009001621A1 (ja) * 2007-06-26 2008-12-31 Murata Manufacturing Co., Ltd. 部品内蔵基板の製造方法
FR2951866B1 (fr) * 2009-10-27 2011-11-25 Arjowiggins Security Procede de fabrication d'un support integrant un dispositif electronique
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
US8963313B2 (en) * 2011-12-22 2015-02-24 Raytheon Company Heterogeneous chip integration with low loss interconnection through adaptive patterning
EP2736001A1 (fr) * 2012-11-27 2014-05-28 Gemalto SA Module électronique à interface de communication tridimensionnelle
EP2767935A1 (fr) 2013-02-18 2014-08-20 NagraID S.A. Couche plastique pour carte électronique
BR112017017273A2 (pt) * 2015-02-20 2018-04-17 Nid Sa processo para fabricação de um dispositivo compreendendo pelo menos um elemento eletrônico associado a um substrato e a uma antena e produto obtido por meio deste processo
DE102015220855A1 (de) * 2015-10-26 2017-04-27 Robert Bosch Gmbh Sensorvorrichtung zur Erfassung mindestens einer Strömungseigenschaft eines fluiden Mediums
CA3015971A1 (en) * 2016-03-01 2017-09-08 Cardlab Aps A circuit layer for an integrated circuit card
US10580745B1 (en) * 2018-08-31 2020-03-03 Globalfoundries Inc. Wafer level packaging with integrated antenna structures

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Also Published As

Publication number Publication date
EG25336A (en) 2011-12-14
DE602006003528D1 (de) 2008-12-18
DK1846874T3 (da) 2009-03-09
WO2006082199A3 (fr) 2006-11-23
US7785932B2 (en) 2010-08-31
US20100328914A1 (en) 2010-12-30
EP1846874A2 (fr) 2007-10-24
ES2318724T3 (es) 2009-05-01
MA29242B1 (fr) 2008-02-01
RU2007128621A (ru) 2009-03-10
PT1846874E (pt) 2009-01-29
SI1846874T1 (sl) 2009-04-30
KR20070103745A (ko) 2007-10-24
CN101111855A (zh) 2008-01-23
CN101111855B (zh) 2012-04-18
ATE413666T1 (de) 2008-11-15
AU2006210245B2 (en) 2011-04-14
JP4838813B2 (ja) 2011-12-14
CA2595796A1 (en) 2006-08-10
CY1108717T1 (el) 2014-04-09
PL1846874T3 (pl) 2009-04-30
WO2006082199A2 (fr) 2006-08-10
ME01052B (me) 2012-10-20
HRP20090045T3 (en) 2009-02-28
US20060172458A1 (en) 2006-08-03
EP1846874B1 (fr) 2008-11-05
AP2226A (en) 2011-03-29
KR101145535B1 (ko) 2012-05-15
MX2007009166A (es) 2007-09-12
BRPI0606562A8 (pt) 2016-08-02
BRPI0606562A2 (pt) 2010-07-06
TNSN07302A1 (fr) 2008-12-31
CA2595796C (en) 2013-04-02
ZA200707271B (en) 2009-05-27
AP2007004088A0 (en) 2007-08-31
AU2006210245A1 (en) 2006-08-10
RU2398280C2 (ru) 2010-08-27
US8218332B2 (en) 2012-07-10
JP2008529292A (ja) 2008-07-31

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