DK1846874T3 - Fremgangsmåde til anbringelse af en elektronisk byggegruppe ved et substrat samt en indretning til anbringelse af byggegruppen - Google Patents

Fremgangsmåde til anbringelse af en elektronisk byggegruppe ved et substrat samt en indretning til anbringelse af byggegruppen

Info

Publication number
DK1846874T3
DK1846874T3 DK06707949T DK06707949T DK1846874T3 DK 1846874 T3 DK1846874 T3 DK 1846874T3 DK 06707949 T DK06707949 T DK 06707949T DK 06707949 T DK06707949 T DK 06707949T DK 1846874 T3 DK1846874 T3 DK 1846874T3
Authority
DK
Denmark
Prior art keywords
building group
placing
applying
substrate
electronic building
Prior art date
Application number
DK06707949T
Other languages
English (en)
Inventor
Francois Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP05100694A external-priority patent/EP1686512A1/fr
Application filed by Nagraid Sa filed Critical Nagraid Sa
Application granted granted Critical
Publication of DK1846874T3 publication Critical patent/DK1846874T3/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Packaging Frangible Articles (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DK06707949T 2005-02-01 2006-02-01 Fremgangsmåde til anbringelse af en elektronisk byggegruppe ved et substrat samt en indretning til anbringelse af byggegruppen DK1846874T3 (da)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05100694A EP1686512A1 (fr) 2005-02-01 2005-02-01 Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble
EP05109094 2005-09-30
PCT/EP2006/050585 WO2006082199A2 (fr) 2005-02-01 2006-02-01 Procédé de placement d'un ensemble électronique sur un substrat et dispositif de placement d'un tel ensemble

Publications (1)

Publication Number Publication Date
DK1846874T3 true DK1846874T3 (da) 2009-03-09

Family

ID=36645615

Family Applications (1)

Application Number Title Priority Date Filing Date
DK06707949T DK1846874T3 (da) 2005-02-01 2006-02-01 Fremgangsmåde til anbringelse af en elektronisk byggegruppe ved et substrat samt en indretning til anbringelse af byggegruppen

Country Status (27)

Country Link
US (2) US7785932B2 (da)
EP (1) EP1846874B1 (da)
JP (1) JP4838813B2 (da)
KR (1) KR101145535B1 (da)
CN (1) CN101111855B (da)
AP (1) AP2226A (da)
AT (1) ATE413666T1 (da)
AU (1) AU2006210245B2 (da)
BR (1) BRPI0606562A8 (da)
CA (1) CA2595796C (da)
CY (1) CY1108717T1 (da)
DE (1) DE602006003528D1 (da)
DK (1) DK1846874T3 (da)
EG (1) EG25336A (da)
ES (1) ES2318724T3 (da)
HR (1) HRP20090045T3 (da)
MA (1) MA29242B1 (da)
ME (1) ME01052B (da)
MX (1) MX2007009166A (da)
PL (1) PL1846874T3 (da)
PT (1) PT1846874E (da)
RS (1) RS50718B (da)
RU (1) RU2398280C2 (da)
SI (1) SI1846874T1 (da)
TN (1) TNSN07302A1 (da)
WO (1) WO2006082199A2 (da)
ZA (1) ZA200707271B (da)

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WO2008082617A2 (en) 2006-12-29 2008-07-10 Solicore, Inc. Mailing apparatus for powered cards
WO2008082616A1 (en) 2006-12-29 2008-07-10 Solicore, Inc. Card configured to receive separate battery
WO2009001621A1 (ja) * 2007-06-26 2008-12-31 Murata Manufacturing Co., Ltd. 部品内蔵基板の製造方法
FR2951866B1 (fr) * 2009-10-27 2011-11-25 Arjowiggins Security Procede de fabrication d'un support integrant un dispositif electronique
DE102010011517A1 (de) * 2010-03-15 2011-09-15 Smartrac Ip B.V. Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung
US8963313B2 (en) * 2011-12-22 2015-02-24 Raytheon Company Heterogeneous chip integration with low loss interconnection through adaptive patterning
EP2736001A1 (fr) * 2012-11-27 2014-05-28 Gemalto SA Module électronique à interface de communication tridimensionnelle
EP2767935A1 (fr) 2013-02-18 2014-08-20 NagraID S.A. Couche plastique pour carte électronique
WO2016131499A1 (fr) * 2015-02-20 2016-08-25 Nagraid S.A. Procédé de fabrication d'un dispositif comportant au moins un élément électronique associé à un substrat et à une antenne
DE102015220855A1 (de) * 2015-10-26 2017-04-27 Robert Bosch Gmbh Sensorvorrichtung zur Erfassung mindestens einer Strömungseigenschaft eines fluiden Mediums
CA3015971A1 (en) * 2016-03-01 2017-09-08 Cardlab Aps A circuit layer for an integrated circuit card
US10580745B1 (en) * 2018-08-31 2020-03-03 Globalfoundries Inc. Wafer level packaging with integrated antenna structures

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US5234530A (en) * 1991-05-20 1993-08-10 Eastman Kodak Company Apparatus for controlling assembly force
US5406699A (en) * 1992-09-18 1995-04-18 Matsushita Electric Industrial Co., Ltd. Method of manufacturing an electronics package
FR2701139B1 (fr) 1993-02-01 1995-04-21 Solaic Sa Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté.
ZA941671B (en) * 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
JP3409380B2 (ja) * 1993-07-30 2003-05-26 カシオ計算機株式会社 プリント基板装置
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
KR100355209B1 (ko) * 1994-09-22 2003-02-11 로무 가부시키가이샤 비접촉형ic카드및그제조방법
DE19602821C1 (de) * 1996-01-26 1997-06-26 Siemens Ag Verfahren zur Herstellung einer Datenkarte
DE19609636C1 (de) * 1996-03-12 1997-08-14 Siemens Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte
FR2756955B1 (fr) 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
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Also Published As

Publication number Publication date
EP1846874B1 (fr) 2008-11-05
HRP20090045T3 (en) 2009-02-28
DE602006003528D1 (de) 2008-12-18
US20060172458A1 (en) 2006-08-03
CA2595796A1 (en) 2006-08-10
AP2226A (en) 2011-03-29
US8218332B2 (en) 2012-07-10
TNSN07302A1 (fr) 2008-12-31
RS50718B (sr) 2010-06-30
AU2006210245A1 (en) 2006-08-10
RU2398280C2 (ru) 2010-08-27
EG25336A (en) 2011-12-14
US20100328914A1 (en) 2010-12-30
WO2006082199A2 (fr) 2006-08-10
CN101111855A (zh) 2008-01-23
CY1108717T1 (el) 2014-04-09
ZA200707271B (en) 2009-05-27
EP1846874A2 (fr) 2007-10-24
ES2318724T3 (es) 2009-05-01
US7785932B2 (en) 2010-08-31
PL1846874T3 (pl) 2009-04-30
PT1846874E (pt) 2009-01-29
MA29242B1 (fr) 2008-02-01
WO2006082199A3 (fr) 2006-11-23
BRPI0606562A2 (pt) 2010-07-06
RU2007128621A (ru) 2009-03-10
BRPI0606562A8 (pt) 2016-08-02
MX2007009166A (es) 2007-09-12
AU2006210245B2 (en) 2011-04-14
SI1846874T1 (sl) 2009-04-30
CA2595796C (en) 2013-04-02
AP2007004088A0 (en) 2007-08-31
ATE413666T1 (de) 2008-11-15
KR20070103745A (ko) 2007-10-24
ME01052B (me) 2012-10-20
CN101111855B (zh) 2012-04-18
JP2008529292A (ja) 2008-07-31
JP4838813B2 (ja) 2011-12-14
KR101145535B1 (ko) 2012-05-15

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