DE602004022238D1 - Termische Lösung für elektronische Geräte - Google Patents

Termische Lösung für elektronische Geräte

Info

Publication number
DE602004022238D1
DE602004022238D1 DE602004022238T DE602004022238T DE602004022238D1 DE 602004022238 D1 DE602004022238 D1 DE 602004022238D1 DE 602004022238 T DE602004022238 T DE 602004022238T DE 602004022238 T DE602004022238 T DE 602004022238T DE 602004022238 D1 DE602004022238 D1 DE 602004022238D1
Authority
DE
Germany
Prior art keywords
electronic devices
term solution
electronic device
heat source
external surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004022238T
Other languages
English (en)
Inventor
Martin David Smalc
Gary D Shives
Iii Robert Anderson Reynolds
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Graftech International Holdings Inc
Original Assignee
Graftech International Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34465685&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE602004022238(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Graftech International Holdings Inc filed Critical Graftech International Holdings Inc
Publication of DE602004022238D1 publication Critical patent/DE602004022238D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE602004022238T 2003-11-25 2004-10-21 Termische Lösung für elektronische Geräte Active DE602004022238D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/722,364 US6982874B2 (en) 2003-11-25 2003-11-25 Thermal solution for electronic devices

Publications (1)

Publication Number Publication Date
DE602004022238D1 true DE602004022238D1 (de) 2009-09-10

Family

ID=34465685

Family Applications (2)

Application Number Title Priority Date Filing Date
DE602004022238T Active DE602004022238D1 (de) 2003-11-25 2004-10-21 Termische Lösung für elektronische Geräte
DE04256484T Pending DE04256484T1 (de) 2003-11-25 2004-10-21 Termische Lösung für elektronische Geräte

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE04256484T Pending DE04256484T1 (de) 2003-11-25 2004-10-21 Termische Lösung für elektronische Geräte

Country Status (11)

Country Link
US (1) US6982874B2 (de)
EP (3) EP1536313B1 (de)
JP (1) JP2005159313A (de)
KR (1) KR100555610B1 (de)
CN (1) CN100559923C (de)
AT (1) ATE438132T1 (de)
DE (2) DE602004022238D1 (de)
HK (1) HK1078955A1 (de)
HU (1) HUE035539T2 (de)
PL (1) PL2259164T3 (de)
TW (1) TWI278275B (de)

Families Citing this family (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7292441B2 (en) * 2003-11-25 2007-11-06 Advanced Energy Technology Inc. Thermal solution for portable electronic devices
US7280359B2 (en) * 2003-12-11 2007-10-09 Matsushita Electric Industrial Co., Ltd. Heat-radiating structure of electronic apparatus
US7228894B2 (en) * 2004-04-30 2007-06-12 Hewlett-Packard Development Company, L.P. Heat spreader with controlled Z-axis conductivity
US20060070720A1 (en) * 2004-09-17 2006-04-06 Capp Joseph P Heat riser
US7799428B2 (en) * 2004-10-06 2010-09-21 Graftech International Holdings Inc. Sandwiched thermal solution
US7319590B1 (en) * 2004-10-27 2008-01-15 Raytheon Company Conductive heat transfer system and method for integrated circuits
KR100760509B1 (ko) * 2004-12-14 2007-09-20 삼성전자주식회사 폴더 타입 휴대용 무선단말기의 방열 장치
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法
US20090114633A1 (en) * 2005-02-17 2009-05-07 David Naylor Portable Pouch Heating Unit
US20090302023A1 (en) * 2008-05-12 2009-12-10 Thomas Caterina Heating unit for warming pallets of materials
US9945080B2 (en) * 2005-02-17 2018-04-17 Greenheat Ip Holdings, Llc Grounded modular heated cover
US20070262073A1 (en) * 2005-09-01 2007-11-15 David Naylor Modular heated cover
US8633425B2 (en) * 2005-02-17 2014-01-21 417 And 7/8, Llc Systems, methods, and devices for storing, heating, and dispensing fluid
US20090101632A1 (en) * 2005-02-17 2009-04-23 David Naylor Heating unit for direct current applications
US20090114634A1 (en) 2005-02-17 2009-05-07 David Naylor Heating unit for warming fluid conduits
US20090107975A1 (en) * 2005-02-17 2009-04-30 Thomas Caterina Heating unit for warming pallets
US9392646B2 (en) 2005-02-17 2016-07-12 417 And 7/8, Llc Pallet warmer heating unit
US20090107986A1 (en) * 2005-02-17 2009-04-30 David Naylor Three layer glued laminate heating unit
US10920379B2 (en) 2005-02-17 2021-02-16 Greenheat Ip Holdings Llc Grounded modular heated cover
US8258443B2 (en) * 2005-02-17 2012-09-04 417 And 7/8, Llc Heating unit for warming pallets
US7880121B2 (en) * 2005-02-17 2011-02-01 David Naylor Modular radiant heating apparatus
US20090107972A1 (en) * 2005-02-17 2009-04-30 David Naylor Heating unit for warming propane tanks
US9087669B2 (en) * 2005-06-27 2015-07-21 Graftech International Holdings Inc. Display device having improved properties
JP2007012913A (ja) 2005-06-30 2007-01-18 Polymatech Co Ltd 放熱シート及び放熱構造
US20080019097A1 (en) * 2005-10-11 2008-01-24 General Electric Company Thermal transport structure
US7297399B2 (en) * 2005-10-11 2007-11-20 General Electric Company Thermal transport structure and associated method
US7797808B2 (en) * 2005-10-11 2010-09-21 General Electric Company Thermal management system and associated method
KR100760770B1 (ko) * 2006-03-29 2007-09-21 삼성에스디아이 주식회사 플라즈마 표시장치
US20070257359A1 (en) * 2006-05-03 2007-11-08 Reis Bradley E Thermal Management Device For A Memory Module
US20070263352A1 (en) * 2006-05-15 2007-11-15 Motorola, Inc. Plastics Utilizing Thermally Conductive Film
US9034297B2 (en) 2006-06-08 2015-05-19 Directa Plus S.P.A. Production of nano-structures
US7754184B2 (en) * 2006-06-08 2010-07-13 Directa Plus Srl Production of nano-structures
KR100698727B1 (ko) * 2006-07-27 2007-03-23 자화전자(주) 흑연시트와 그 제조방법
US8220530B2 (en) * 2006-10-17 2012-07-17 Purdue Research Foundation Electrothermal interface material enhancer
JP2008205041A (ja) * 2007-02-16 2008-09-04 Toshiba Corp 電子機器および熱伝導部材
JP4934490B2 (ja) * 2007-05-07 2012-05-16 株式会社リコー 画像形成装置
WO2008143829A2 (en) * 2007-05-14 2008-11-27 Northwestern University Graphene oxide sheet laminate and method
US20090032218A1 (en) * 2007-07-31 2009-02-05 Adc Telecommunications, Inc. Apparatus for transferring between two heat conducting surfaces
US8051896B2 (en) * 2007-07-31 2011-11-08 Adc Telecommunications, Inc. Apparatus for spreading heat over a finned surface
US8235094B2 (en) * 2007-07-31 2012-08-07 Adc Telecommunications, Inc. Apparatus for transferring heat in a fin of a heat sink
KR101390082B1 (ko) 2007-08-01 2014-05-28 삼성전자주식회사 프로젝터를 구비하는 이동통신 단말기
US8919428B2 (en) * 2007-10-17 2014-12-30 Purdue Research Foundation Methods for attaching carbon nanotubes to a carbon substrate
US7764493B2 (en) 2008-01-04 2010-07-27 Apple Inc. Systems and methods for cooling electronic devices using airflow dividers
TWM336471U (en) * 2008-01-29 2008-07-11 Celsia Technologies Taiwan Inc Heat dissipating device used in memory module
WO2009115512A1 (en) * 2008-03-20 2009-09-24 Dsm Ip Assets Bv Heatsinks of thermally conductive plastic materials
US20100009174A1 (en) * 2008-07-10 2010-01-14 Reis Bradley E Heat Dissipation For Low Profile Devices
US7911780B2 (en) * 2008-08-29 2011-03-22 Apple Inc. Methods and apparatus for cooling electronic devices through user interfaces
US8541058B2 (en) * 2009-03-06 2013-09-24 Timothy S. Fisher Palladium thiolate bonding of carbon nanotubes
TW201035513A (en) * 2009-03-25 2010-10-01 Wah Hong Ind Corp Method for manufacturing heat dissipation interface device and product thereof
US8955580B2 (en) 2009-08-14 2015-02-17 Wah Hong Industrial Corp. Use of a graphite heat-dissipation device including a plating metal layer
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US20100314081A1 (en) * 2009-06-12 2010-12-16 Reis Bradley E High Temperature Graphite Heat Exchanger
US8081468B2 (en) 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
US20100321897A1 (en) * 2009-06-17 2010-12-23 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies
US8405600B2 (en) * 2009-12-04 2013-03-26 Graftech International Holdings Inc. Method for reducing temperature-caused degradation in the performance of a digital reader
CN203398244U (zh) 2010-05-21 2014-01-15 格拉弗技术国际控股有限公司 用于具有相对主表面的电池单元的热管理组件
US8339787B2 (en) 2010-09-08 2012-12-25 Apple Inc. Heat valve for thermal management in a mobile communications device
US8773856B2 (en) * 2010-11-08 2014-07-08 Graftech International Holdings Inc. Method of making an electronic device
EP2780776A4 (de) * 2011-11-15 2015-08-26 Henkel US IP LLC Elektronische vorrichtungen mit thermisch isolierenden schichten
EP2780775A4 (de) 2011-11-15 2015-08-26 Henkel IP & Holding GmbH Elektronische vorrichtungen mit thermisch isolierenden schichten
US9899120B2 (en) 2012-11-02 2018-02-20 Nanotek Instruments, Inc. Graphene oxide-coated graphitic foil and processes for producing same
US10229862B2 (en) * 2012-11-02 2019-03-12 Nanotek Instruments, Inc. Thermal management system containing a graphene oxide-coated graphitic foil laminate for electronic device application
US9533889B2 (en) 2012-11-26 2017-01-03 Nanotek Instruments, Inc. Unitary graphene layer or graphene single crystal
US9803124B2 (en) 2012-12-05 2017-10-31 Nanotek Instruments, Inc. Process for producing unitary graphene matrix composites containing carbon or graphite fillers
US9835390B2 (en) 2013-01-07 2017-12-05 Nanotek Instruments, Inc. Unitary graphene material-based integrated finned heat sink
US10566482B2 (en) 2013-01-31 2020-02-18 Global Graphene Group, Inc. Inorganic coating-protected unitary graphene material for concentrated photovoltaic applications
US10087073B2 (en) 2013-02-14 2018-10-02 Nanotek Instruments, Inc. Nano graphene platelet-reinforced composite heat sinks and process for producing same
WO2014163926A1 (en) * 2013-03-12 2014-10-09 Graftech International Holdings Inc. Portable electronic device thermal management system
WO2014158339A1 (en) * 2013-03-12 2014-10-02 Graftech International Holdings Inc. Thermal dissipation system
US9223363B2 (en) 2013-03-16 2015-12-29 Henkel IP & Holding GmbH Electronic devices assembled with heat absorbing and/or thermally insulating composition
CN103281888B (zh) * 2013-05-11 2015-08-19 深圳市同安泰电子科技有限公司 一种高导热天然石墨散热片的制备方法
US9411385B2 (en) 2013-05-13 2016-08-09 Google Technology Holdings LLC Electronic device assembly with compression gasket
TWM467917U (zh) * 2013-06-17 2013-12-11 Giant Technology Co Ltd 運用於電子罩蓋之多重散熱組件結構
JP6125972B2 (ja) * 2013-10-30 2017-05-10 東芝ホームテクノ株式会社 携帯情報端末
TWI657132B (zh) 2013-12-19 2019-04-21 德商漢高智慧財產控股公司 具有基質及經密封相變材料分散於其中之組合物及以其組裝之電子裝置
US9282681B2 (en) 2014-01-21 2016-03-08 Seagate Technology Llc Dissipating heat during device operation
US20150334871A1 (en) * 2014-05-19 2015-11-19 Laird Technologies, Inc. Thermal interface materials with thin film sealants
US10698458B2 (en) * 2014-06-02 2020-06-30 Microsoft Technology Licensing, Llc Integrated vapor chamber for thermal management of computing devices
US10037202B2 (en) 2014-06-03 2018-07-31 Microsoft Technology Licensing, Llc Techniques to isolating a portion of an online computing service
US9546764B2 (en) * 2014-07-25 2017-01-17 Graftech International Holdings Inc. Display device with flexible circuit board having graphite substrate
US20160081226A1 (en) * 2014-09-11 2016-03-17 Asia Vital Components Co., Ltd. Heat dissipation structure for mobile device
US9930785B2 (en) * 2014-10-15 2018-03-27 AzTrong Inc. Configurable heat conducting path for portable electronic device
CN105704978A (zh) * 2014-11-26 2016-06-22 英业达科技有限公司 电子装置
US10088878B2 (en) * 2014-12-15 2018-10-02 Dell Products L.P. Flexible heat spreader with differential thermal conductivity
JP6360198B2 (ja) * 2014-12-18 2018-07-18 株式会社カネカ グラファイト積層体、グラファイト積層体の製造方法、熱輸送用構造物およびロッド状の熱輸送体
WO2017019450A2 (en) 2015-07-24 2017-02-02 3M Innovative Properties Company Reflective stack with heat spreading layer
JP6543161B2 (ja) * 2015-07-27 2019-07-10 積水化学工業株式会社 熱伝導部材、熱伝導部材積層体及び熱伝導部材成形体
JP6393784B2 (ja) * 2015-09-07 2018-09-19 シク ジュ，ハク 電磁波吸収消滅および遮蔽用ならびに電子機器高放熱用融合シート、および、その製造方法
WO2017044712A1 (en) 2015-09-11 2017-03-16 Laird Technologies, Inc. Devices for absorbing energy from electronic components
US11416046B2 (en) * 2015-11-05 2022-08-16 Henkel Ag & Co. Kgaa Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
JP6332289B2 (ja) * 2016-01-18 2018-05-30 マツダ株式会社 電力制御機器の冷却構造
KR101823583B1 (ko) * 2016-03-09 2018-01-31 (주)애드포휴 크린시트가 부착된 케이스 직접 방열식 분전함
EP3540770B1 (de) * 2018-03-15 2022-06-01 Aptiv Technologies Limited Wärmeübertragungsvorrichtung
JP7324783B2 (ja) * 2018-06-07 2023-08-10 エスエイチティー スマート ハイ－テック エービー 積層グラフェンをベースとする熱伝導性フィルムおよびフィルムを製造する方法
KR20220093406A (ko) * 2019-05-15 2022-07-05 아비드 써멀 코포레이션 증기 챔버 열 스트랩 조립체 및 방법
JPWO2020255952A1 (de) * 2019-06-19 2020-12-24
US11439001B2 (en) * 2019-11-14 2022-09-06 Dell Products L.P. System and method for heat removal using a thermal potting solution in an information handling system
JP7236167B2 (ja) * 2020-06-10 2023-03-09 安立材料科技股▲ふん▼有限公司 高効率熱源管理を備えたケーシング構造
CN114610127A (zh) 2020-12-09 2022-06-10 安立材料科技股份有限公司 具有高效热管理功能的机壳结构
US11592883B2 (en) * 2021-07-30 2023-02-28 Dell Products L.P. Information handling system thermal management for dense structures

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991581A (en) 1962-03-21 1965-05-12 High Temperature Materials Inc Expanded pyrolytic graphite and process for producing the same
FR2616997B1 (fr) * 1987-06-16 1989-08-25 Thomson Csf Support pour circuit imprime, formant drain thermique a dilatation controlee, et procede de fabrication
US4895713A (en) 1987-08-31 1990-01-23 Union Carbide Corporation Intercalation of graphite
US5224030A (en) * 1990-03-30 1993-06-29 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Semiconductor cooling apparatus
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
JP3345986B2 (ja) * 1993-10-15 2002-11-18 松下電器産業株式会社 グラファイト熱伝導体およびそれを用いたコールドプレート
JPH0823183A (ja) * 1994-07-06 1996-01-23 Matsushita Electric Ind Co Ltd 部材の冷却構造
US5566752A (en) * 1994-10-20 1996-10-22 Lockheed Fort Worth Company High heat density transfer device
JP3233808B2 (ja) * 1995-03-17 2001-12-04 富士通株式会社 電子パッケージの冷却システム
US6090484A (en) * 1995-05-19 2000-07-18 The Bergquist Company Thermally conductive filled polymer composites for mounting electronic devices and method of application
US5930115A (en) * 1996-08-26 1999-07-27 Compaq Computer Corp. Apparatus, method and system for thermal management of a semiconductor device
US5991155A (en) * 1996-12-13 1999-11-23 Mitsubishi Denki Kabushiki Kaisha Heat sink assembly including flexible heat spreader sheet
US5902762A (en) 1997-04-04 1999-05-11 Ucar Carbon Technology Corporation Flexible graphite composite
US6131651A (en) * 1998-09-16 2000-10-17 Advanced Ceramics Corporation Flexible heat transfer device and method
US6257328B1 (en) 1997-10-14 2001-07-10 Matsushita Electric Industrial Co., Ltd. Thermal conductive unit and thermal connection structure using the same
US6245400B1 (en) 1998-10-07 2001-06-12 Ucar Graph-Tech Inc. Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner
JP3533987B2 (ja) * 1998-12-10 2004-06-07 富士通株式会社 電子機器筐体及びそれに用いる熱伝導パス部材
US6147127A (en) * 1999-01-07 2000-11-14 Rohm And Haas Company High surface area adsorbents and methods of preparation
JP2000281802A (ja) 1999-03-30 2000-10-10 Polymatech Co Ltd 熱伝導性成形体およびその製造方法ならびに半導体装置
US20020093121A1 (en) 1999-08-25 2002-07-18 Graftech Inc. Cover glass adhering device
US6503626B1 (en) 2000-02-25 2003-01-07 Graftech Inc. Graphite-based heat sink
US6482520B1 (en) 2000-02-25 2002-11-19 Jing Wen Tzeng Thermal management system
US20020157819A1 (en) 2001-04-04 2002-10-31 Julian Norley Graphite-based thermal dissipation component
US7166912B2 (en) 2001-04-05 2007-01-23 Advanced Energy Technology Inc. Isolated thermal interface
US6538892B2 (en) 2001-05-02 2003-03-25 Graftech Inc. Radial finned heat sink
JP2002344179A (ja) * 2001-05-18 2002-11-29 Matsushita Electric Ind Co Ltd 電子機器
JP4706125B2 (ja) * 2001-05-24 2011-06-22 パナソニック株式会社 機能ユニットの放熱緩衝構造を備えた情報処理装置
US6673289B2 (en) 2001-05-30 2004-01-06 Advanced Energy Technology Inc. Manufacture of materials from graphite particles
JP2003008263A (ja) * 2001-06-27 2003-01-10 Sony Corp 熱伝導部材および熱伝導部材を有する電子機器
JP3938681B2 (ja) * 2001-11-21 2007-06-27 信越化学工業株式会社 放熱構造体
US6758263B2 (en) 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
US6746768B2 (en) 2001-12-26 2004-06-08 Advanced Energy Technology Inc. Thermal interface material

Also Published As

Publication number Publication date
TWI278275B (en) 2007-04-01
EP2259164B8 (de) 2018-02-21
KR20050050565A (ko) 2005-05-31
EP2026164B1 (de) 2016-05-11
KR100555610B1 (ko) 2006-03-03
EP2259164B1 (de) 2017-12-06
EP1536313A3 (de) 2006-08-02
EP2259164A1 (de) 2010-12-08
JP2005159313A (ja) 2005-06-16
EP2026164A1 (de) 2009-02-18
EP1536313B1 (de) 2009-07-29
US6982874B2 (en) 2006-01-03
HUE035539T2 (en) 2018-05-02
PL2259164T3 (pl) 2018-06-29
HK1078955A1 (en) 2006-03-24
CN100559923C (zh) 2009-11-11
EP1536313A2 (de) 2005-06-01
CN1622745A (zh) 2005-06-01
TW200529734A (en) 2005-09-01
US20050111189A1 (en) 2005-05-26
DE04256484T1 (de) 2006-07-13
ATE438132T1 (de) 2009-08-15

Similar Documents

Publication Publication Date Title
DE602004022238D1 (de) Termische Lösung für elektronische Geräte
ATE532396T1 (de) Thermisches ableitsystem für tragbare elektronische vorrichtungen
TW200631491A (en) Sandwiched thermal solution
WO2005048298A3 (en) Sandwiched thermal solution
WO2006036362A3 (en) Integral heat spreader
ATE521083T1 (de) Anordnung zum thermomanagement
DE69908884D1 (de) Gerät zum Erhöhen der Kühlung einer elektronischen Einrichtung
DE60235447D1 (de) Vorhersage der verbleibenden lebensdauer einer feldgerät-elektronikschaltung
ATE515180T1 (de) Elektronische anordnung mit einer kühlung auf mehreren seiten, sowie verfahren
DE602005008482D1 (de) Baugruppe zum regeln der temperatur einer integrierten schaltung
ATE476753T1 (de) Electronische einrichtung, informationsprozessor und anordnung zum unterdrücken von elektromagnetischen störungen
FR2832241B1 (fr) Dispositif tracable par un identifiant electronique
ATE476864T1 (de) Kühlbaugruppe
TW200729436A (en) Integrated circuit device
TW200506586A (en) Fanless heat sink for computer equipment
ATE356541T1 (de) Elektronisches leistungssystem mit passiver kühlung
SE0502703L (sv) Elektrisk drivenhet med positioneringsaggregat, vilket trycker komponenter mot en kylare
DE60220816D1 (de) Fahrzeugmontierte elektronische vorrichtung
ATE327102T1 (de) Abschirmelement für elektromagnetische wellen und aufzeichnungsgerät mit einer solchen einrichtung
DE60226110D1 (de) Haltevorrichtung mit mindestens zwei elektronischen Bauteilen auf gegenüberliegenden Seiten einer Schaltplatine aufgebracht
DE60226076D1 (de) Kühlungseinrichtung mit direkter kühlung von aktiven elektronischen komponenten
DK1432295T3 (da) Köleanordning til en elektrisk og/eller elektronisk enhed
DE60212222D1 (de) Elektronische Bauteile-Bestückungsvorrichtung
DE50208227D1 (de) Elektronische Vorrichtung
ATE495655T1 (de) Elektronische vorrichtung

Legal Events

Date Code Title Description
8363 Opposition against the patent