DE602005008482D1 - Baugruppe zum regeln der temperatur einer integrierten schaltung - Google Patents

Baugruppe zum regeln der temperatur einer integrierten schaltung

Info

Publication number
DE602005008482D1
DE602005008482D1 DE602005008482T DE602005008482T DE602005008482D1 DE 602005008482 D1 DE602005008482 D1 DE 602005008482D1 DE 602005008482 T DE602005008482 T DE 602005008482T DE 602005008482 T DE602005008482 T DE 602005008482T DE 602005008482 D1 DE602005008482 D1 DE 602005008482D1
Authority
DE
Germany
Prior art keywords
regulating
temperature
module
integrated circuit
gimbal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005008482T
Other languages
English (en)
Inventor
Jerry Ihor Tustaniwskyj
James Wittman Babcock
Henry Jen Kuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delta Design Inc
Original Assignee
Delta Design Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Design Inc filed Critical Delta Design Inc
Publication of DE602005008482D1 publication Critical patent/DE602005008482D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Control Of Temperature (AREA)
DE602005008482T 2004-11-18 2005-11-17 Baugruppe zum regeln der temperatur einer integrierten schaltung Expired - Fee Related DE602005008482D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/992,308 US7243704B2 (en) 2004-11-18 2004-11-18 Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end
PCT/US2005/042145 WO2006055906A2 (en) 2004-11-18 2005-11-17 Assembly for regulating the temperature of an integrated circuit

Publications (1)

Publication Number Publication Date
DE602005008482D1 true DE602005008482D1 (de) 2008-09-04

Family

ID=36129901

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005008482T Expired - Fee Related DE602005008482D1 (de) 2004-11-18 2005-11-17 Baugruppe zum regeln der temperatur einer integrierten schaltung

Country Status (6)

Country Link
US (1) US7243704B2 (de)
EP (1) EP1877809B1 (de)
CN (1) CN101115999A (de)
AT (1) ATE402419T1 (de)
DE (1) DE602005008482D1 (de)
WO (1) WO2006055906A2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US6988535B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Channeled flat plate fin heat exchange system, device and method
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
US20040233639A1 (en) * 2003-01-31 2004-11-25 Cooligy, Inc. Removeable heat spreader support mechanism and method of manufacturing thereof
US7591302B1 (en) * 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
US20070114010A1 (en) * 2005-11-09 2007-05-24 Girish Upadhya Liquid cooling for backlit displays
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
US20070175621A1 (en) * 2006-01-31 2007-08-02 Cooligy, Inc. Re-workable metallic TIM for efficient heat exchange
CN101438637B (zh) * 2006-02-16 2013-01-02 库利吉公司 应用于服务器的液体冷却回路
US20070227709A1 (en) * 2006-03-30 2007-10-04 Girish Upadhya Multi device cooling
TW200809477A (en) 2006-03-30 2008-02-16 Cooligy Inc Integrated fluid pump and radiator reservoir
US20070227698A1 (en) * 2006-03-30 2007-10-04 Conway Bruce R Integrated fluid pump and radiator reservoir
US20070256815A1 (en) * 2006-05-04 2007-11-08 Cooligy, Inc. Scalable liquid cooling system with modular radiators
US20080013278A1 (en) * 2006-06-30 2008-01-17 Fredric Landry Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles
CN101261295B (zh) * 2007-03-05 2010-08-25 海尔集团公司 用于lcd电视机调试生产线的自动插接工装及其控制电路
US20090000771A1 (en) * 2007-05-02 2009-01-01 James Horn Micro-tube/multi-port counter flow radiator design for electronic cooling applications
TW200934352A (en) 2007-08-07 2009-08-01 Cooligy Inc Internal access mechanism for a server rack
CN101267013B (zh) * 2008-04-30 2011-09-28 晶能光电（江西）有限公司 半导体外延片的压焊结构
US9500701B2 (en) * 2010-03-17 2016-11-22 Delta Design, Inc. Alignment mechanism
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
CN110879304B (zh) * 2018-09-06 2022-12-30 致茂电子股份有限公司 滑移式电子元件测试装置
US11378615B2 (en) 2020-04-20 2022-07-05 Aem Singapore Pte Ltd Thermal test head for an integrated circuit device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4791983A (en) * 1987-10-13 1988-12-20 Unisys Corporation Self-aligning liquid-cooling assembly
US5880930A (en) * 1997-06-18 1999-03-09 Silicon Graphics, Inc. Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism
US6323665B1 (en) * 1997-10-07 2001-11-27 Reliability Incorporated Apparatus capable of high power dissipation during burn-in of a device under test
US6116331A (en) * 1998-12-10 2000-09-12 Unisys Corporation Mechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profile
US6459582B1 (en) * 2000-07-19 2002-10-01 Fujitsu Limited Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
US6774661B1 (en) * 2003-03-18 2004-08-10 Unisys Corporation Initial contact method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed joint
US7301773B2 (en) * 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications

Also Published As

Publication number Publication date
WO2006055906A3 (en) 2006-09-08
EP1877809B1 (de) 2008-07-23
CN101115999A (zh) 2008-01-30
WO2006055906A2 (en) 2006-05-26
US7243704B2 (en) 2007-07-17
US20060102999A1 (en) 2006-05-18
ATE402419T1 (de) 2008-08-15
EP1877809A2 (de) 2008-01-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee