DE602005008482D1 - Baugruppe zum regeln der temperatur einer integrierten schaltung - Google Patents
Baugruppe zum regeln der temperatur einer integrierten schaltungInfo
- Publication number
- DE602005008482D1 DE602005008482D1 DE602005008482T DE602005008482T DE602005008482D1 DE 602005008482 D1 DE602005008482 D1 DE 602005008482D1 DE 602005008482 T DE602005008482 T DE 602005008482T DE 602005008482 T DE602005008482 T DE 602005008482T DE 602005008482 D1 DE602005008482 D1 DE 602005008482D1
- Authority
- DE
- Germany
- Prior art keywords
- regulating
- temperature
- module
- integrated circuit
- gimbal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Control Of Temperature (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/992,308 US7243704B2 (en) | 2004-11-18 | 2004-11-18 | Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end |
PCT/US2005/042145 WO2006055906A2 (en) | 2004-11-18 | 2005-11-17 | Assembly for regulating the temperature of an integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005008482D1 true DE602005008482D1 (de) | 2008-09-04 |
Family
ID=36129901
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005008482T Expired - Fee Related DE602005008482D1 (de) | 2004-11-18 | 2005-11-17 | Baugruppe zum regeln der temperatur einer integrierten schaltung |
Country Status (6)
Country | Link |
---|---|
US (1) | US7243704B2 (de) |
EP (1) | EP1877809B1 (de) |
CN (1) | CN101115999A (de) |
AT (1) | ATE402419T1 (de) |
DE (1) | DE602005008482D1 (de) |
WO (1) | WO2006055906A2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10393588T5 (de) | 2002-11-01 | 2006-02-23 | Cooligy, Inc., Mountain View | Optimales Ausbreitungssystem, Vorrichtung und Verfahren für flüssigkeitsgekühlten, mikroskalierten Wärmetausch |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US7836597B2 (en) * | 2002-11-01 | 2010-11-23 | Cooligy Inc. | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system |
US20040233639A1 (en) * | 2003-01-31 | 2004-11-25 | Cooligy, Inc. | Removeable heat spreader support mechanism and method of manufacturing thereof |
US7044196B2 (en) * | 2003-01-31 | 2006-05-16 | Cooligy,Inc | Decoupled spring-loaded mounting apparatus and method of manufacturing thereof |
US7591302B1 (en) * | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
US20050269691A1 (en) * | 2004-06-04 | 2005-12-08 | Cooligy, Inc. | Counter flow micro heat exchanger for optimal performance |
US7616444B2 (en) * | 2004-06-04 | 2009-11-10 | Cooligy Inc. | Gimballed attachment for multiple heat exchangers |
US20070114010A1 (en) * | 2005-11-09 | 2007-05-24 | Girish Upadhya | Liquid cooling for backlit displays |
US7913719B2 (en) | 2006-01-30 | 2011-03-29 | Cooligy Inc. | Tape-wrapped multilayer tubing and methods for making the same |
US20070175621A1 (en) * | 2006-01-31 | 2007-08-02 | Cooligy, Inc. | Re-workable metallic TIM for efficient heat exchange |
US7539020B2 (en) * | 2006-02-16 | 2009-05-26 | Cooligy Inc. | Liquid cooling loops for server applications |
US20070227698A1 (en) * | 2006-03-30 | 2007-10-04 | Conway Bruce R | Integrated fluid pump and radiator reservoir |
US20070227709A1 (en) * | 2006-03-30 | 2007-10-04 | Girish Upadhya | Multi device cooling |
WO2007120530A2 (en) | 2006-03-30 | 2007-10-25 | Cooligy, Inc. | Integrated liquid to air conduction module |
US20070256815A1 (en) * | 2006-05-04 | 2007-11-08 | Cooligy, Inc. | Scalable liquid cooling system with modular radiators |
US20080013278A1 (en) * | 2006-06-30 | 2008-01-17 | Fredric Landry | Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles |
CN101261295B (zh) * | 2007-03-05 | 2010-08-25 | 海尔集团公司 | 用于lcd电视机调试生产线的自动插接工装及其控制电路 |
US20090000771A1 (en) * | 2007-05-02 | 2009-01-01 | James Horn | Micro-tube/multi-port counter flow radiator design for electronic cooling applications |
TW200924625A (en) | 2007-08-07 | 2009-06-01 | Cooligy Inc | Deformable duct guides that accommodate electronic connection lines |
CN101267013B (zh) * | 2008-04-30 | 2011-09-28 | 晶能光电(江西)有限公司 | 半导体外延片的压焊结构 |
US9500701B2 (en) * | 2010-03-17 | 2016-11-22 | Delta Design, Inc. | Alignment mechanism |
GB2543549B (en) * | 2015-10-21 | 2020-04-15 | Andor Tech Limited | Thermoelectric Heat pump system |
CN110879304B (zh) * | 2018-09-06 | 2022-12-30 | 致茂电子股份有限公司 | 滑移式电子元件测试装置 |
US11378615B2 (en) | 2020-04-20 | 2022-07-05 | Aem Singapore Pte Ltd | Thermal test head for an integrated circuit device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4791983A (en) * | 1987-10-13 | 1988-12-20 | Unisys Corporation | Self-aligning liquid-cooling assembly |
US5880930A (en) * | 1997-06-18 | 1999-03-09 | Silicon Graphics, Inc. | Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism |
US6323665B1 (en) * | 1997-10-07 | 2001-11-27 | Reliability Incorporated | Apparatus capable of high power dissipation during burn-in of a device under test |
US6116331A (en) * | 1998-12-10 | 2000-09-12 | Unisys Corporation | Mechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profile |
US6459582B1 (en) * | 2000-07-19 | 2002-10-01 | Fujitsu Limited | Heatsink apparatus for de-coupling clamping forces on an integrated circuit package |
US6501658B2 (en) * | 2001-02-16 | 2002-12-31 | Intel Corporation | Heatsink mounting with shock absorbers |
US6774661B1 (en) * | 2003-03-18 | 2004-08-10 | Unisys Corporation | Initial contact method of preventing an integrated circuit chip from being thermally destroyed, in a tester, due to a defective pressed joint |
US7301773B2 (en) * | 2004-06-04 | 2007-11-27 | Cooligy Inc. | Semi-compliant joining mechanism for semiconductor cooling applications |
-
2004
- 2004-11-18 US US10/992,308 patent/US7243704B2/en not_active Expired - Fee Related
-
2005
- 2005-11-17 WO PCT/US2005/042145 patent/WO2006055906A2/en active Application Filing
- 2005-11-17 AT AT05824949T patent/ATE402419T1/de not_active IP Right Cessation
- 2005-11-17 DE DE602005008482T patent/DE602005008482D1/de not_active Expired - Fee Related
- 2005-11-17 CN CNA2005800457957A patent/CN101115999A/zh active Pending
- 2005-11-17 EP EP05824949A patent/EP1877809B1/de not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
WO2006055906A3 (en) | 2006-09-08 |
EP1877809B1 (de) | 2008-07-23 |
EP1877809A2 (de) | 2008-01-16 |
US7243704B2 (en) | 2007-07-17 |
WO2006055906A2 (en) | 2006-05-26 |
US20060102999A1 (en) | 2006-05-18 |
CN101115999A (zh) | 2008-01-30 |
ATE402419T1 (de) | 2008-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |