DK1432295T3 - Köleanordning til en elektrisk og/eller elektronisk enhed - Google Patents

Köleanordning til en elektrisk og/eller elektronisk enhed

Info

Publication number
DK1432295T3
DK1432295T3 DK02028617T DK02028617T DK1432295T3 DK 1432295 T3 DK1432295 T3 DK 1432295T3 DK 02028617 T DK02028617 T DK 02028617T DK 02028617 T DK02028617 T DK 02028617T DK 1432295 T3 DK1432295 T3 DK 1432295T3
Authority
DK
Denmark
Prior art keywords
main body
electrical
electronic device
cooling
cooling device
Prior art date
Application number
DK02028617T
Other languages
English (en)
Inventor
Stefan Wellhoefer
Original Assignee
Innowert Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innowert Gmbh filed Critical Innowert Gmbh
Application granted granted Critical
Publication of DK1432295T3 publication Critical patent/DK1432295T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DK02028617T 2002-12-20 2002-12-20 Köleanordning til en elektrisk og/eller elektronisk enhed DK1432295T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02028617A EP1432295B1 (de) 2002-12-20 2002-12-20 Kühlvorrichtung für eine elektrische und/oder elektronische Einheit

Publications (1)

Publication Number Publication Date
DK1432295T3 true DK1432295T3 (da) 2005-08-08

Family

ID=32338073

Family Applications (1)

Application Number Title Priority Date Filing Date
DK02028617T DK1432295T3 (da) 2002-12-20 2002-12-20 Köleanordning til en elektrisk og/eller elektronisk enhed

Country Status (8)

Country Link
US (1) US7079391B2 (da)
EP (1) EP1432295B1 (da)
JP (1) JP3895322B2 (da)
CN (1) CN1231108C (da)
AT (1) ATE293349T1 (da)
DE (1) DE50202798D1 (da)
DK (1) DK1432295T3 (da)
ES (1) ES2241948T3 (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2329756A (en) 1997-09-25 1999-03-31 Univ Bristol Assemblies of light emitting diodes
AU2003298561A1 (en) 2002-08-23 2004-05-13 Jonathan S. Dahm Method and apparatus for using light emitting diodes
DE502004007887D1 (de) * 2004-05-18 2008-10-02 Soemtron Ag Kühlvorrichtung
US20070151712A1 (en) * 2006-01-05 2007-07-05 Foster Jimmy G Sr Heat sink for distributing a thermal load
US20090114374A1 (en) * 2006-02-22 2009-05-07 Kyushu University, National University Corporation Heat removal method and heat removal apparatus
US8047686B2 (en) * 2006-09-01 2011-11-01 Dahm Jonathan S Multiple light-emitting element heat pipe assembly
CN101203117B (zh) * 2006-12-13 2010-08-25 富准精密工业(深圳)有限公司 散热装置
JP2011123288A (ja) * 2009-12-10 2011-06-23 Sumitomo Chemical Co Ltd 位相差フィルムの製造方法
CN103629962A (zh) * 2012-08-23 2014-03-12 富瑞精密组件（昆山）有限公司 热管及其制造方法
CN103851940B (zh) * 2012-12-04 2017-05-10 富瑞精密组件（昆山）有限公司 热管及其制造方法
EP3010321B1 (en) * 2014-10-14 2021-12-01 Magneti Marelli S.p.A. Liquid cooling system for an electronic component

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3603382A (en) * 1969-11-03 1971-09-07 Nasa Radial heat flux transformer
JPS5936827B2 (ja) * 1979-01-12 1984-09-06 日本電信電話株式会社 集積回路素子の冷却装置
US4633371A (en) * 1984-09-17 1986-12-30 Amdahl Corporation Heat pipe heat exchanger for large scale integrated circuits
US4951740A (en) * 1988-06-27 1990-08-28 Texas A & M University System Bellows heat pipe for thermal control of electronic components
JPH08264694A (ja) * 1995-03-20 1996-10-11 Calsonic Corp 電子部品用冷却装置
CN1179188C (zh) * 1998-04-15 2004-12-08 古河电气工业株式会社 板式散热管和冷却装置
US20010050164A1 (en) * 1999-08-18 2001-12-13 Agilent Technologies, Inc. Cooling apparatus for electronic devices
JP2001221584A (ja) * 2000-02-10 2001-08-17 Mitsubishi Electric Corp ループ型ヒートパイプ
US6315033B1 (en) * 2000-05-22 2001-11-13 Jia Hao Li Heat dissipating conduit
US6907918B2 (en) * 2002-02-13 2005-06-21 Thermal Corp. Deformable end cap for heat pipe
TW557350B (en) * 2003-01-06 2003-10-11 Jiun-Guang Luo One-way airstream hollow cavity energy transferring device

Also Published As

Publication number Publication date
US7079391B2 (en) 2006-07-18
CN1231108C (zh) 2005-12-07
ATE293349T1 (de) 2005-04-15
EP1432295B1 (de) 2005-04-13
JP3895322B2 (ja) 2007-03-22
DE50202798D1 (de) 2005-05-19
US20040130871A1 (en) 2004-07-08
ES2241948T3 (es) 2005-11-01
JP2004207737A (ja) 2004-07-22
EP1432295A1 (de) 2004-06-23
CN1516547A (zh) 2004-07-28

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