ATE512573T1 - Kühlvorrichtung, system und zugehöriges verfahren - Google Patents
Kühlvorrichtung, system und zugehöriges verfahrenInfo
- Publication number
- ATE512573T1 ATE512573T1 AT05851466T AT05851466T ATE512573T1 AT E512573 T1 ATE512573 T1 AT E512573T1 AT 05851466 T AT05851466 T AT 05851466T AT 05851466 T AT05851466 T AT 05851466T AT E512573 T1 ATE512573 T1 AT E512573T1
- Authority
- AT
- Austria
- Prior art keywords
- circuit board
- printed circuit
- cooling apparatus
- cooling device
- associated method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/030,704 US7345877B2 (en) | 2005-01-06 | 2005-01-06 | Cooling apparatus, system, and associated method |
PCT/US2005/040595 WO2006073553A2 (en) | 2005-01-06 | 2005-11-09 | Cooling apparatus, system, and associated method |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE512573T1 true ATE512573T1 (de) | 2011-06-15 |
Family
ID=36589078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05851466T ATE512573T1 (de) | 2005-01-06 | 2005-11-09 | Kühlvorrichtung, system und zugehöriges verfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US7345877B2 (de) |
EP (1) | EP1834515B2 (de) |
JP (1) | JP4881879B2 (de) |
CN (1) | CN101095386B (de) |
AT (1) | ATE512573T1 (de) |
WO (1) | WO2006073553A2 (de) |
Families Citing this family (69)
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US7983042B2 (en) * | 2004-06-15 | 2011-07-19 | Raytheon Company | Thermal management system and method for thin membrane type antennas |
DE102006041788B4 (de) | 2006-09-06 | 2012-06-14 | Airbus Operations Gmbh | Luftfahrzeug-Elektronikkühleinrichtung für ein Luftfahrzeug mit einem Flüssigkeitskühlsystem |
CN100572908C (zh) * | 2006-11-17 | 2009-12-23 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
US20080115911A1 (en) * | 2006-11-22 | 2008-05-22 | Tyco Electronics Corporation | Heat dissipation system for solarlok photovoltaic interconnection system |
TWI316174B (en) * | 2006-11-29 | 2009-10-21 | Asustek Comp Inc | Heat-sink backing plate module, circuit board, and electronic apparatus having the same |
CN200994225Y (zh) * | 2006-12-29 | 2007-12-19 | 帛汉股份有限公司 | 电路基板结构 |
US7460367B2 (en) * | 2007-03-05 | 2008-12-02 | Tracewell Systems, Inc. | Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology |
DE102007045733B3 (de) * | 2007-09-25 | 2009-02-05 | Qimonda Ag | Speichermodul, Hauptplatine, Computersystem und Wärmeübertragungssystem |
US8919426B2 (en) * | 2007-10-22 | 2014-12-30 | The Peregrine Falcon Corporation | Micro-channel pulsating heat pipe |
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US8223494B2 (en) * | 2007-12-31 | 2012-07-17 | General Electric Company | Conduction cooled circuit board assembly |
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US9500416B2 (en) * | 2008-05-31 | 2016-11-22 | The Boeing Company | Thermal management device and method for making the same |
JP5404261B2 (ja) * | 2009-04-16 | 2014-01-29 | モレックス インコーポレイテド | 冷却装置、電子基板、電子機器 |
WO2010147199A1 (ja) * | 2009-06-19 | 2010-12-23 | 株式会社安川電機 | 配線基板および電力変換装置 |
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US8582298B2 (en) * | 2009-06-22 | 2013-11-12 | Xyber Technologies | Passive cooling enclosure system and method for electronics devices |
US9036351B2 (en) * | 2009-06-22 | 2015-05-19 | Xyber Technologies, Llc | Passive cooling system and method for electronics devices |
US8522569B2 (en) | 2009-10-27 | 2013-09-03 | Industrial Idea Partners, Inc. | Utilization of data center waste heat for heat driven engine |
FR2956280A1 (fr) * | 2010-02-09 | 2011-08-12 | Kontron Modular Computers Sa | Dispositif auxiliaire d'evacuation par conduction de la chaleur produite par une carte electronique |
CN101852378A (zh) * | 2010-07-02 | 2010-10-06 | 上海交通大学 | Led隧道照明灯 |
CN102316699B (zh) * | 2010-07-07 | 2015-10-14 | 富泰华工业(深圳)有限公司 | 冷却方法、使用该冷却设备方法的电路板维修装置及设备 |
CN101936676A (zh) * | 2010-09-13 | 2011-01-05 | 天津大学 | 多通道并联回路型脉动热管 |
TWI422318B (zh) * | 2010-10-29 | 2014-01-01 | Ind Tech Res Inst | 數據機房 |
TW201221034A (en) * | 2010-11-05 | 2012-05-16 | Inventec Corp | Cooling system of server and cooling method thereof |
FR2969379B1 (fr) * | 2010-12-17 | 2013-02-15 | Thales Sa | Refroidissement d'un equipement electronique |
JP5722710B2 (ja) * | 2011-06-16 | 2015-05-27 | 株式会社アドバンテスト | 基板組立体及び電子部品試験装置 |
US10006720B2 (en) | 2011-08-01 | 2018-06-26 | Teledyne Scientific & Imaging, Llc | System for using active and passive cooling for high power thermal management |
US9155230B2 (en) * | 2011-11-28 | 2015-10-06 | Asetek Danmark A/S | Cooling system for a server |
US9921003B2 (en) * | 2012-01-19 | 2018-03-20 | Lockheed Martin Corporation | Wickless heat pipe and thermal ground plane |
US8913391B2 (en) * | 2012-01-30 | 2014-12-16 | Alcatel Lucent | Board-level heat transfer apparatus for communication platforms |
US9132645B2 (en) * | 2012-11-29 | 2015-09-15 | Palo Alto Research Center Incorporated | Pulsating heat pipe spreader for ink jet printer |
WO2014085993A1 (en) * | 2012-12-05 | 2014-06-12 | Telefonaktiebolaget L M Ericsson (Publ) | System and method for regulating temperature of electronic component |
US11006548B2 (en) * | 2013-02-01 | 2021-05-11 | Smart Embedded Computing, Inc. | Method and device to provide uniform cooling in rugged environments |
FR3007122B1 (fr) * | 2013-06-18 | 2017-09-08 | Commissariat Energie Atomique | Refroidissement de composants electroniques et/ou electriques par caloduc pulse et element de conduction thermique |
EP2858464A1 (de) * | 2013-10-03 | 2015-04-08 | ABB Oy | Elektrische Vorrichtung |
US9826662B2 (en) * | 2013-12-12 | 2017-11-21 | General Electric Company | Reusable phase-change thermal interface structures |
US9333599B2 (en) | 2013-12-20 | 2016-05-10 | General Electric Company | Electronics chassis and method of fabricating the same |
JP6394331B2 (ja) * | 2013-12-27 | 2018-09-26 | 富士通株式会社 | 冷却部品及び電子機器 |
TW201617765A (zh) * | 2014-07-08 | 2016-05-16 | Adc科技股份有限公司 | 用於伺服器設備的改良軌道冷卻設置 |
US9827697B2 (en) * | 2014-08-29 | 2017-11-28 | The Boeing Company | Systems and methods for curing complex fiber-reinforced composite structures |
CN104244683A (zh) * | 2014-10-09 | 2014-12-24 | 中国航空工业集团公司洛阳电光设备研究所 | 电子机箱 |
US10220725B2 (en) * | 2015-05-13 | 2019-03-05 | Ge Global Sourcing Llc | System and method for passively cooling an enclosure |
EP3144625B1 (de) * | 2015-09-21 | 2018-07-04 | ABB Schweiz AG | Kühlanordnung und verfahren zu deren herstellung |
EP3147621B1 (de) * | 2015-09-24 | 2019-09-11 | ABB Schweiz AG | Kühlungsvorrichtung und verfahren zum kühlen von mindestens zwei elektronischen leistungsvorrichtungen |
US10383261B2 (en) * | 2015-10-20 | 2019-08-13 | Ge Global Sourcing Llc | Heat transfer chassis and method for forming the same |
US10136557B2 (en) * | 2015-12-04 | 2018-11-20 | General Electric Company | Thermal management systems and methods for heat generating electronics |
US9750160B2 (en) | 2016-01-20 | 2017-08-29 | Raytheon Company | Multi-level oscillating heat pipe implementation in an electronic circuit card module |
CN106028745B (zh) * | 2016-06-16 | 2019-04-30 | 北京纳源丰科技发展有限公司 | 一种基于二级热管的服务器机柜的散热结构 |
IT201600129385A1 (it) | 2016-12-21 | 2018-06-21 | Leonardo Spa | Sistema di raffreddamento passivo a fluido bifase, particolarmente per il raffreddamento di apparati elettronici, quali apparati avionici. |
EP3361847B1 (de) * | 2017-02-14 | 2021-03-31 | ABB Schweiz AG | Wärmetauscher |
US10178800B2 (en) * | 2017-03-30 | 2019-01-08 | Honeywell International Inc. | Support structure for electronics having fluid passageway for convective heat transfer |
EP3407693B1 (de) | 2017-05-22 | 2022-11-09 | Pfannenberg GmbH | Wärmetauscher zur kühlung eines elektronischen gehäuses |
DE102017222148A1 (de) * | 2017-12-07 | 2019-06-13 | Siemens Mobility GmbH | Lüfterloses Kühlsystem |
US10527365B1 (en) * | 2018-07-09 | 2020-01-07 | International Business Machines Corporation | Disconnect assembly for active cooling of packaged electronics |
US10921869B2 (en) * | 2019-06-27 | 2021-02-16 | Intel Corporation | Chassis embedded heat pipe |
WO2021032229A1 (de) * | 2019-08-19 | 2021-02-25 | Lea Kelbsch | Gehäuse für wärme abgebende bauteile |
KR102583698B1 (ko) * | 2019-08-20 | 2023-09-27 | 대련 마리타임 유니버시티 | 액체 금속 고온 진동형 히트 파이프 및 테스트 방법 |
US11112840B2 (en) * | 2019-08-22 | 2021-09-07 | Abaco Systems, Inc. | Electronics chassis with oscillating heat pipe (OHP) |
US11160184B2 (en) * | 2019-10-08 | 2021-10-26 | Hamilton Sundstrand Corporation | Vehicle circuit card assembly |
IT201900023076A1 (it) * | 2019-12-05 | 2021-06-05 | Provides Metalmeccanica S R L | Sistema di raffreddamento per data center |
WO2021111387A1 (en) * | 2019-12-05 | 2021-06-10 | Provides Metalmeccanica S.R.L. | Cooling system of electronic systems, in particular for data centre |
US11765871B2 (en) | 2020-03-26 | 2023-09-19 | Ge Aviation Systems Llc | Aircraft and method for thermal management |
US11849539B2 (en) * | 2020-08-13 | 2023-12-19 | Toyota Motor Engineering & Manufacturing North America, Inc. | Embedded cooling systems utilizing heat pipes |
EP4001820B1 (de) * | 2020-11-20 | 2024-05-29 | Nokia Technologies Oy | Oszillierendes wärmerohr |
DE102021213315A1 (de) | 2021-11-26 | 2023-06-01 | Robert Bosch Gesellschaft mit beschränkter Haftung | Kühlvorrichtung |
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JP2003329379A (ja) | 2002-05-10 | 2003-11-19 | Furukawa Electric Co Ltd:The | ヒートパイプ回路基板 |
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US20050174735A1 (en) * | 2003-08-26 | 2005-08-11 | Nagui Mankaruse | High performance cooling systems |
JP4408224B2 (ja) * | 2004-01-29 | 2010-02-03 | 富士通株式会社 | 放熱機能を有する筐体 |
CN100349285C (zh) | 2004-04-12 | 2007-11-14 | 中南大学 | 用于电子器件冷却的循环流动型脉动热管 |
US7193850B2 (en) * | 2004-08-31 | 2007-03-20 | Hamilton Sundstrand Corporation | Integrated heat removal and vibration damping for avionic equipment |
-
2005
- 2005-01-06 US US11/030,704 patent/US7345877B2/en active Active
- 2005-11-09 JP JP2007550364A patent/JP4881879B2/ja active Active
- 2005-11-09 WO PCT/US2005/040595 patent/WO2006073553A2/en active Application Filing
- 2005-11-09 CN CN2005800458470A patent/CN101095386B/zh active Active
- 2005-11-09 AT AT05851466T patent/ATE512573T1/de not_active IP Right Cessation
- 2005-11-09 EP EP05851466.2A patent/EP1834515B2/de active Active
Also Published As
Publication number | Publication date |
---|---|
EP1834515B1 (de) | 2011-06-08 |
CN101095386A (zh) | 2007-12-26 |
WO2006073553A3 (en) | 2007-03-01 |
EP1834515A2 (de) | 2007-09-19 |
WO2006073553A2 (en) | 2006-07-13 |
EP1834515B2 (de) | 2019-09-18 |
US7345877B2 (en) | 2008-03-18 |
US20060146496A1 (en) | 2006-07-06 |
JP4881879B2 (ja) | 2012-02-22 |
CN101095386B (zh) | 2012-06-13 |
JP2008527709A (ja) | 2008-07-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |