IT201600129385A1 - Sistema di raffreddamento passivo a fluido bifase, particolarmente per il raffreddamento di apparati elettronici, quali apparati avionici. - Google Patents

Sistema di raffreddamento passivo a fluido bifase, particolarmente per il raffreddamento di apparati elettronici, quali apparati avionici.

Info

Publication number
IT201600129385A1
IT201600129385A1 IT102016000129385A IT201600129385A IT201600129385A1 IT 201600129385 A1 IT201600129385 A1 IT 201600129385A1 IT 102016000129385 A IT102016000129385 A IT 102016000129385A IT 201600129385 A IT201600129385 A IT 201600129385A IT 201600129385 A1 IT201600129385 A1 IT 201600129385A1
Authority
IT
Italy
Prior art keywords
avionics
electronic equipment
passive fluid
cooling system
phase passive
Prior art date
Application number
IT102016000129385A
Other languages
English (en)
Inventor
Antonio Moscatelli
Pierpaolo Borrelli
Antonio Romano
Original Assignee
Leonardo Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leonardo Spa filed Critical Leonardo Spa
Priority to IT102016000129385A priority Critical patent/IT201600129385A1/it
Priority to JP2017242747A priority patent/JP7191511B2/ja
Priority to ES17208559T priority patent/ES2761905T3/es
Priority to EP17208559.9A priority patent/EP3339789B1/en
Priority to CN201711381008.7A priority patent/CN108235648A/zh
Priority to RU2017144903A priority patent/RU2747858C2/ru
Priority to US15/848,604 priority patent/US10228193B2/en
Publication of IT201600129385A1 publication Critical patent/IT201600129385A1/it
Priority to HK18115197.9A priority patent/HK1256119A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0021—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for aircrafts or cosmonautics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT102016000129385A 2016-12-21 2016-12-21 Sistema di raffreddamento passivo a fluido bifase, particolarmente per il raffreddamento di apparati elettronici, quali apparati avionici. IT201600129385A1 (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IT102016000129385A IT201600129385A1 (it) 2016-12-21 2016-12-21 Sistema di raffreddamento passivo a fluido bifase, particolarmente per il raffreddamento di apparati elettronici, quali apparati avionici.
JP2017242747A JP7191511B2 (ja) 2016-12-21 2017-12-19 二相流体受動冷却システム、特に、航空電子機器等の電子機器を冷却するための二相流体受動冷却システム
ES17208559T ES2761905T3 (es) 2016-12-21 2017-12-19 Sistema pasivo de refrigeración que usa un fluido de fase dual, particularmente para refrigerar aparatos electrónicos tales como aparatos aviónicos
EP17208559.9A EP3339789B1 (en) 2016-12-21 2017-12-19 Passive cooling system using a dual-phase fluid, particularly for cooling electronic apparatuses, such as avionic apparatuses
CN201711381008.7A CN108235648A (zh) 2016-12-21 2017-12-20 冷却系统
RU2017144903A RU2747858C2 (ru) 2016-12-21 2017-12-20 Система пассивного охлаждения с двухфазной текучей средой, в частности, для охлаждения электронной аппаратуры, например приборов авионики
US15/848,604 US10228193B2 (en) 2016-12-21 2017-12-20 Passive cooling system using a dual-phase fluid, particularly for cooling electronic apparatuses, such as avionic apparatuses
HK18115197.9A HK1256119A1 (zh) 2016-12-21 2018-11-27 特別用於冷卻諸如航空電子設備等電子設備的使用兩相流體的被動冷卻系統

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102016000129385A IT201600129385A1 (it) 2016-12-21 2016-12-21 Sistema di raffreddamento passivo a fluido bifase, particolarmente per il raffreddamento di apparati elettronici, quali apparati avionici.

Publications (1)

Publication Number Publication Date
IT201600129385A1 true IT201600129385A1 (it) 2018-06-21

Family

ID=58670164

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102016000129385A IT201600129385A1 (it) 2016-12-21 2016-12-21 Sistema di raffreddamento passivo a fluido bifase, particolarmente per il raffreddamento di apparati elettronici, quali apparati avionici.

Country Status (8)

Country Link
US (1) US10228193B2 (it)
EP (1) EP3339789B1 (it)
JP (1) JP7191511B2 (it)
CN (1) CN108235648A (it)
ES (1) ES2761905T3 (it)
HK (1) HK1256119A1 (it)
IT (1) IT201600129385A1 (it)
RU (1) RU2747858C2 (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5688585A (en) 1993-08-05 1997-11-18 Guardian Industries Corp. Matchable, heat treatable, durable, IR-reflecting sputter-coated glasses and method of making same
WO2018044813A1 (en) * 2016-08-31 2018-03-08 Nlight, Inc. Laser cooling system
WO2019178003A1 (en) 2018-03-12 2019-09-19 Nlight, Inc. Fiber laser having variably wound optical fiber

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5697428A (en) * 1993-08-24 1997-12-16 Actronics Kabushiki Kaisha Tunnel-plate type heat pipe
US20060146496A1 (en) * 2005-01-06 2006-07-06 The Boeing Company Cooling apparatus, system, and associated method
US20070144574A1 (en) * 2004-10-06 2007-06-28 Tama-Tlo, Ltd. Solar battery system and thermoelectric hybrid solar battery system
US20150000871A1 (en) * 2013-07-01 2015-01-01 Hamilton Sundstrand Corporation Housing with heat pipes integrated into enclosure fins
EP2887788A2 (en) * 2013-12-20 2015-06-24 General Electric Company Electronics chassis and method of fabricating the same

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FR2379881A1 (fr) * 1977-02-04 1978-09-01 Commissariat Energie Atomique Bloc-pompe echangeur de chaleur pour reacteurs nucleaires
US4931905A (en) * 1989-01-17 1990-06-05 Grumman Aerospace Corporation Heat pipe cooled electronic circuit card
KR100294317B1 (ko) 1999-06-04 2001-06-15 이정현 초소형 냉각 장치
US6539731B2 (en) * 2001-03-30 2003-04-01 Arthus S. Kesten Dehumidification process and apparatus
TWI235906B (en) 2003-02-27 2005-07-11 Shwin-Chung Wong Microchannel heat pipe spreaders and microchannel loop heat pipes housed in a metal case and embodiments of the same
JP2005061690A (ja) 2003-08-08 2005-03-10 Sumitomo Electric Ind Ltd 薄型流路形成体、それを用いた温度制御装置、それを用いた情報機器およびその製造方法
JP2005209981A (ja) 2004-01-26 2005-08-04 Sumitomo Electric Ind Ltd 冷却ブロック、ヒータユニット及びそれを搭載した装置
CN2696126Y (zh) 2004-04-06 2005-04-27 谢步明 Igbt迷宫式水冷散热器
JP4496999B2 (ja) 2005-03-18 2010-07-07 ソニー株式会社 熱輸送装置及び電子機器
CN2842735Y (zh) 2005-10-24 2006-11-29 比亚迪股份有限公司 一种绝缘栅双极晶体管的平板式水冷散热器
US7758671B2 (en) * 2006-08-14 2010-07-20 Nanocap Technologies, Llc Versatile dehumidification process and apparatus
KR100833497B1 (ko) 2006-09-29 2008-05-29 한국전자통신연구원 전자기기용 열균일화 장치
JP2010243035A (ja) * 2009-04-03 2010-10-28 Sony Corp 熱輸送装置、電子機器及び熱輸送装置の製造方法
RU2556020C2 (ru) * 2010-01-12 2015-07-10 Ниппон Лайт Метал Компани, Лтд. Объединенная подложка с жидкостным охлаждением и способ изготовления объединенной подложки с жидкостным охлаждением
FI9342U1 (fi) * 2011-04-28 2011-08-17 Abb Oy Jäähdytysjärjestelmä
RU2581522C1 (ru) * 2014-12-15 2016-04-20 Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) Способ охлаждения электронного оборудования с использованием конденсатора-пленкоформирователя
KR101723460B1 (ko) * 2015-07-07 2017-04-06 한국에너지기술연구원 제습 시스템
JP6597892B2 (ja) 2016-05-09 2019-10-30 富士通株式会社 ループヒートパイプ及びその製造方法並びに電子機器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5697428A (en) * 1993-08-24 1997-12-16 Actronics Kabushiki Kaisha Tunnel-plate type heat pipe
US20070144574A1 (en) * 2004-10-06 2007-06-28 Tama-Tlo, Ltd. Solar battery system and thermoelectric hybrid solar battery system
US20060146496A1 (en) * 2005-01-06 2006-07-06 The Boeing Company Cooling apparatus, system, and associated method
US20150000871A1 (en) * 2013-07-01 2015-01-01 Hamilton Sundstrand Corporation Housing with heat pipes integrated into enclosure fins
EP2887788A2 (en) * 2013-12-20 2015-06-24 General Electric Company Electronics chassis and method of fabricating the same

Also Published As

Publication number Publication date
ES2761905T3 (es) 2020-05-21
JP7191511B2 (ja) 2022-12-19
RU2017144903A3 (it) 2021-03-25
RU2017144903A (ru) 2019-06-20
EP3339789B1 (en) 2019-10-23
US20180172358A1 (en) 2018-06-21
US10228193B2 (en) 2019-03-12
CN108235648A (zh) 2018-06-29
RU2747858C2 (ru) 2021-05-17
EP3339789A1 (en) 2018-06-27
HK1256119A1 (zh) 2019-09-13
JP2018152550A (ja) 2018-09-27

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