RU2017144903A - Система пассивного охлаждения с двухфазной текучей средой, в частности, для охлаждения электронной аппаратуры, например, приборов авионики - Google Patents
Система пассивного охлаждения с двухфазной текучей средой, в частности, для охлаждения электронной аппаратуры, например, приборов авионики Download PDFInfo
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- RU2017144903A RU2017144903A RU2017144903A RU2017144903A RU2017144903A RU 2017144903 A RU2017144903 A RU 2017144903A RU 2017144903 A RU2017144903 A RU 2017144903A RU 2017144903 A RU2017144903 A RU 2017144903A RU 2017144903 A RU2017144903 A RU 2017144903A
- Authority
- RU
- Russia
- Prior art keywords
- duct
- cooling
- electronic equipment
- lamellar element
- particulator
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0021—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for aircrafts or cosmonautics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Claims (7)
1. Система охлаждения (10), предназначенная для охлаждения электронной аппаратуры, например, приборов авионики, содержащая
по меньшей мере один пластинчатый элемент (12), образующий стенку кожуха, в котором предполагается устанавливать электронную аппаратуру, упомянутый по меньшей мере один пластинчатый элемент имеет первую сторону (12а), обращенную в сторону аппаратуры, и вторую сторону (12b), противоположную первой стороне (12а), и контур текучей среды (14), образующийся в упомянутом по меньшей мере одном пластинчатом элементе (12),
отличающаяся
тем, что первый контур текучей среды (14) содержит первый проток (14а), образующийся на первой стороне (12а) упомянутого по меньшей мере одного пластинчатого элемента (12) и проходящий по первому лабиринту, и второй проток (14b), образующийся на второй стороне (12b) упомянутого по меньшей мере одного пластинчатого элемента (12) и проходящий по второму лабиринту, и
тем, что упомянутый по меньшей мере один пластинчатый элемент (12) имеет первое сквозное отверстие (18) и второе сквозное отверстие (20), через которые сообщаются первый проток (14а) и второй проток (14b), и
тем, что контур текучей среды (14) также содержит пористый разделительный элемент (22), размещаемый в первом сквозном отверстии (18), через которое текучая среда благодаря капиллярному натяжению перетекает из второго протока (14b) в первый проток (14а), текучая среда находится в газообразном состоянии в первом протоке (14а) и в жидком состоянии во втором протоке (14b).
2. Система охлаждения по п. 1 также содержит первую пленку (16а), прикрепленную к первой стороне (12а) упомянутого по меньшей мере одного пластинчатого элемента (12), для герметизации первого протока (14а), а также первое и второе отверстия (18 и 20) на той же стороне, что и первая сторона (12а), и вторую пленку (16b), прикрепленную ко второй стороне (12b) упомянутого по меньшей мере одного пластинчатого элемента (12), для герметизации второго протока (14b), а также первое и второе отверстия (18 и 20) на той же стороне, что и вторая сторона (12b).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102016000129385 | 2016-12-21 | ||
IT102016000129385A IT201600129385A1 (it) | 2016-12-21 | 2016-12-21 | Sistema di raffreddamento passivo a fluido bifase, particolarmente per il raffreddamento di apparati elettronici, quali apparati avionici. |
Publications (3)
Publication Number | Publication Date |
---|---|
RU2017144903A true RU2017144903A (ru) | 2019-06-20 |
RU2017144903A3 RU2017144903A3 (ru) | 2021-03-25 |
RU2747858C2 RU2747858C2 (ru) | 2021-05-17 |
Family
ID=58670164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
RU2017144903A RU2747858C2 (ru) | 2016-12-21 | 2017-12-20 | Система пассивного охлаждения с двухфазной текучей средой, в частности, для охлаждения электронной аппаратуры, например приборов авионики |
Country Status (8)
Country | Link |
---|---|
US (1) | US10228193B2 (ru) |
EP (1) | EP3339789B1 (ru) |
JP (1) | JP7191511B2 (ru) |
CN (1) | CN108235648A (ru) |
ES (1) | ES2761905T3 (ru) |
HK (1) | HK1256119A1 (ru) |
IT (1) | IT201600129385A1 (ru) |
RU (1) | RU2747858C2 (ru) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5688585A (en) | 1993-08-05 | 1997-11-18 | Guardian Industries Corp. | Matchable, heat treatable, durable, IR-reflecting sputter-coated glasses and method of making same |
EP3507871B1 (en) * | 2016-08-31 | 2023-06-07 | NLIGHT, Inc. | Laser cooling system |
US10784645B2 (en) | 2018-03-12 | 2020-09-22 | Nlight, Inc. | Fiber laser having variably wound optical fiber |
Family Cites Families (23)
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FR2379881A1 (fr) * | 1977-02-04 | 1978-09-01 | Commissariat Energie Atomique | Bloc-pompe echangeur de chaleur pour reacteurs nucleaires |
US4931905A (en) * | 1989-01-17 | 1990-06-05 | Grumman Aerospace Corporation | Heat pipe cooled electronic circuit card |
US5697428A (en) * | 1993-08-24 | 1997-12-16 | Actronics Kabushiki Kaisha | Tunnel-plate type heat pipe |
KR100294317B1 (ko) | 1999-06-04 | 2001-06-15 | 이정현 | 초소형 냉각 장치 |
US6539731B2 (en) * | 2001-03-30 | 2003-04-01 | Arthus S. Kesten | Dehumidification process and apparatus |
TWI235906B (en) | 2003-02-27 | 2005-07-11 | Shwin-Chung Wong | Microchannel heat pipe spreaders and microchannel loop heat pipes housed in a metal case and embodiments of the same |
JP2005061690A (ja) | 2003-08-08 | 2005-03-10 | Sumitomo Electric Ind Ltd | 薄型流路形成体、それを用いた温度制御装置、それを用いた情報機器およびその製造方法 |
JP2005209981A (ja) | 2004-01-26 | 2005-08-04 | Sumitomo Electric Ind Ltd | 冷却ブロック、ヒータユニット及びそれを搭載した装置 |
CN2696126Y (zh) | 2004-04-06 | 2005-04-27 | 谢步明 | Igbt迷宫式水冷散热器 |
WO2006038508A1 (ja) * | 2004-10-06 | 2006-04-13 | Tama-Tlo, Ltd. | 太陽電池システムおよび熱電気複合型太陽電池システム |
US7345877B2 (en) * | 2005-01-06 | 2008-03-18 | The Boeing Company | Cooling apparatus, system, and associated method |
JP4496999B2 (ja) | 2005-03-18 | 2010-07-07 | ソニー株式会社 | 熱輸送装置及び電子機器 |
CN2842735Y (zh) | 2005-10-24 | 2006-11-29 | 比亚迪股份有限公司 | 一种绝缘栅双极晶体管的平板式水冷散热器 |
US7758671B2 (en) * | 2006-08-14 | 2010-07-20 | Nanocap Technologies, Llc | Versatile dehumidification process and apparatus |
KR100833497B1 (ko) | 2006-09-29 | 2008-05-29 | 한국전자통신연구원 | 전자기기용 열균일화 장치 |
JP2010243035A (ja) * | 2009-04-03 | 2010-10-28 | Sony Corp | 熱輸送装置、電子機器及び熱輸送装置の製造方法 |
JP5876654B2 (ja) * | 2010-01-12 | 2016-03-02 | 日本軽金属株式会社 | 液冷一体型基板の製造方法 |
FI9342U1 (fi) * | 2011-04-28 | 2011-08-17 | Abb Oy | Jäähdytysjärjestelmä |
US20150000871A1 (en) * | 2013-07-01 | 2015-01-01 | Hamilton Sundstrand Corporation | Housing with heat pipes integrated into enclosure fins |
US9333599B2 (en) | 2013-12-20 | 2016-05-10 | General Electric Company | Electronics chassis and method of fabricating the same |
RU2581522C1 (ru) * | 2014-12-15 | 2016-04-20 | Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) | Способ охлаждения электронного оборудования с использованием конденсатора-пленкоформирователя |
KR101723460B1 (ko) * | 2015-07-07 | 2017-04-06 | 한국에너지기술연구원 | 제습 시스템 |
WO2017195254A1 (ja) | 2016-05-09 | 2017-11-16 | 富士通株式会社 | ループヒートパイプ及びその製造方法並びに電子機器 |
-
2016
- 2016-12-21 IT IT102016000129385A patent/IT201600129385A1/it unknown
-
2017
- 2017-12-19 EP EP17208559.9A patent/EP3339789B1/en active Active
- 2017-12-19 ES ES17208559T patent/ES2761905T3/es active Active
- 2017-12-19 JP JP2017242747A patent/JP7191511B2/ja active Active
- 2017-12-20 CN CN201711381008.7A patent/CN108235648A/zh active Pending
- 2017-12-20 RU RU2017144903A patent/RU2747858C2/ru active
- 2017-12-20 US US15/848,604 patent/US10228193B2/en active Active
-
2018
- 2018-11-27 HK HK18115197.9A patent/HK1256119A1/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
IT201600129385A1 (it) | 2018-06-21 |
RU2747858C2 (ru) | 2021-05-17 |
ES2761905T3 (es) | 2020-05-21 |
HK1256119A1 (zh) | 2019-09-13 |
EP3339789A1 (en) | 2018-06-27 |
RU2017144903A3 (ru) | 2021-03-25 |
CN108235648A (zh) | 2018-06-29 |
JP7191511B2 (ja) | 2022-12-19 |
US20180172358A1 (en) | 2018-06-21 |
EP3339789B1 (en) | 2019-10-23 |
JP2018152550A (ja) | 2018-09-27 |
US10228193B2 (en) | 2019-03-12 |
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