CN108235648A - 冷却系统 - Google Patents
冷却系统 Download PDFInfo
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- CN108235648A CN108235648A CN201711381008.7A CN201711381008A CN108235648A CN 108235648 A CN108235648 A CN 108235648A CN 201711381008 A CN201711381008 A CN 201711381008A CN 108235648 A CN108235648 A CN 108235648A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
- H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0021—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for aircrafts or cosmonautics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一种冷却系统,包括:形成在使用时将被冷却的电子设备壳体容纳在其内部的壳体的壁的至少一个板状构件,板状构件具有使用时朝向设备的第一侧和与第一侧相对的第二侧;以及形成在板状构件中的流体电路,其中,流体电路包括形成在板状构件的第一面上并且沿着第一曲径延伸的第一管道和形成在板状构件的第二面上并且沿着第二曲径延伸的第二管道。板状构件有第一通孔和第二通孔,第一管道和第二管道通过第一通孔和第二通孔彼此流体连通。流体电路进一步包括被放置于第一通孔中的多孔隔离元件,且工作流体通过毛细管作用经由多孔隔离元件从第二管道流向第一管道,工作流体在第一管道中为气相,而在第二管道中为液相。
Description
技术领域
本发明涉及特别是意在用于冷却电子设备,例如航空电子设备的冷却系统。
背景技术
上述类型的冷却系统可从EP 2 887 788得知。
空气或者液体冷却系统一般用于消散电子设备,比如安装在飞机上的航空电子设备所产生的热。这样的冷却系统是有源系统,因为它们采用了必须供电以进行操作的部件(例如,风扇、泵等等)。
双相流体冷却系统,所谓的LHP(环路热管)电路也是已知的。这样的冷却系统是无源系统,即它们不需要进行操作的电力供应。众所周知,LHP电路主要包括蒸发器设备,蒸发器设备具有包括双相流体并且通过多孔隔离元件彼此连通的第一部分和第二部分。在用作箱或者补偿室的第一部分中,流体为液相;而在用作实际的蒸发器,并且为了这个目的而被放置为与要被冷却的主体相接触以便从该主体接收热第二部分中,流体为气相。流体通过毛细管作用穿过多孔隔离元件从蒸发器设备的第一部分流向第二部分,然后在导管中流动并且通过冷凝器设备(例如盘管)从第二部分返回第一部分,在冷凝器设备中发生从气相到液相的转换。
预期在2020-2025年飞行的飞机与当前的飞机相比,将使用更多的电力并且会具有更多安装在同一块板上的电子电路。所以,散热密度也将比当前的更高,为100W/cm2的数量级。因此需要开发用于冷却电子设备,特别是航空电子设备的冷却系统,它允许比当前的双相流体冷却系统消散更多的热量,但是不会不利地影响其尺寸、质量、能耗、安全性和可靠性方面的特性。
发明内容
因此,本发明的目的在于提供一种双相流体无源冷却系统,其允许在电子设备的最高温度保持不变的情况下,向外部环境消散更高热功率,其允许降低电子设备的局部最高温度,从而提高设备的电子元件的可靠性和使用寿命,且在出现消散的功率短时增加(所谓的“功率峰值”)的情况下,其相当于恒温热容。
根据本发明通过利用双相流体的冷却系统完全实现了该目的和其他目的,其中,冷却系统包括:至少一个板状构件,所述至少一个板状构件形成使用时设备将容纳在其内部的壳体的一部分;以及设置在板状构件中的流体电路。其中,每个板状构件具有朝向设备(即,朝向壳体的内部)的第一侧和与第一侧相对(即,朝向壳体的外部)的第二侧;其中,流体电路包括形成在板状构件的第一侧上并且沿着第一曲径延伸的第一管道,以及形成在板状构件的第二面上并且沿着第二曲径延伸的第二管道;其中,板状构件有第一通孔和第二通孔,第一管道和第二管道通过第一通孔和第二通孔彼此流体连通;并且其中,流体电路进一步包括多孔隔离元件,多孔隔离元件该被放置于第一通孔,并且工作流体通过毛细管作用经由该多孔隔离元件从第二管道流向第一管道,工作流体在第一管道中是气相的,而在第二管道中是液相的。
附图说明
根据参考附图仅以非限制实例的方式给出的以下具体描述,本发明更多的特征和优点将变得更加显而易见,其中:
图1为从板状构件的第一侧的角度观察的本发明的冷却系统的透视图;
图2为从板状构件的第二侧的角度观察的本发明的冷却系统的透视图;
图3为通过图1中III-III所表示的剖面,图1和图2的冷却系统在放大的比例尺上的剖面图。
具体实施方式
参考附图,根据本发明的双相流体冷却系统(以下被简称为冷却系统)通常被表示为10。该冷却系统已经被认为用于冷却电子设备(图中未示出),比如特别是飞机的航空电子设备,但是从下列描述可以明显看出,它也可用于很多其他应用。
冷却系统10首先包括板状构件12,板状构件12形成要把电子设备容纳于其中的壳体的壁中的一个。板状构件12优选地被做成平坦的元件。在图中所示的实施例中,板状构件12为正方形(或者,更一般地,为矩形)。
板状构件12具有在工作条件下朝向电子设备(即,朝向壳体的内部)的第一侧12a(图1中所示)和与第一侧12a相对(并且因此在工作条件下朝向壳体的外部)的第二侧12b(图2中所示)。
包括作为工作流体的双相流体(例如水、氨水、丙烯等)的流体电路14在板状构件12中形成。流体电路14包括彼此连通的第一管道14a和第二管道14b。如图1所示,第一管道14a形成在板状构件12的第一侧12a上并且沿着第一曲径延伸。如图2所示,第二管道14b形成在板状构件12的第二侧12b上并且沿着第二曲径延伸。如图3所示,用于密封第一管道14a的第一膜16a被附接至板状构件12的第一侧12a上,同样地,用于密封第二管道14b的第二膜16b被附接至板状构件12的第二侧12b上。第一管道14a和第二管道14b沿其延伸的每个曲径基本上都在整个相应的侧12a和12b上延伸,并且被适当地整形从而使壳体的温度尽可能地一致。
板状构件12具有第一通孔18和第二通孔20,第一管道14a和第二管道14b通过第一通孔18和第二通孔20彼此流体连通。第一管道14a在流体通过同一个管道流动的方向上从第一孔18延伸至第二孔20,而第二管道14b在流体通过同一个管道流动的方向上从第二孔20延伸至第一孔18。工作流体在第一管道14a中是气相的,而在第二管道14b中是液相的。多孔隔离元件22被设置在第一孔18中,工作流体由毛细管作用通过多孔隔离元件22从第二管道14b流向第一管道14a。第一孔18的朝向第一侧12a的,即包含在多孔隔离元件22和第一膜16a之间的部分18a,与第一管道14a一起用作蒸发器设备,在这里从第二管道14b流过多孔分离元件22的液相的工作流体接收由电子设备消散的热并且蒸发。第二管道14b用作冷凝器设备,在这里从第一管道14a流过第二孔20的气相的工作流体向外部环境释放热,从而返回液相。第一孔18的朝向第二面12b的,即包含在多孔隔离元件22和第二膜16b之间的部分18b用作补偿室,在这里液相的工作流体在通过毛细管作用经由多孔隔离元件22流动之前被收集。
尽管在图中只示出了一个板状构件12,但是该冷却系统可包括如上所述的设置有流体电路14的更多板状构件12,以能够消散更高的热功率(散热功率与板状构件的表面成正比)。
冷却系统10工作如下。
电路14的第二管道14b中的液相的工作流体通过毛细管作用经由多孔分离元件22流动并且到达第一管道14a,在这里其通过由被电子设备(管道所面对的)接收的热量被转换为气相。然后,气相的工作流体在第一管道14a中从第一孔18流向第二孔20,并且通过第二孔20返回第二管道14b中。当工作流体沿着第二管道14b从第二孔20流向第一孔18时,它向外部环境排放热量并且被从气相转换为液相,并且最终通过多孔隔离元件22再次返回第二管道14a中。
根据本发明的冷却系统利用双相流体提供了优于已知的无源冷却系统的多个优点。
首先,本文中所提出的冷却系统不需要可利用的专门的自由空间,因为它完全形成在使用中内部容纳电子设备的壳体的一个或多个壁的厚度内。
第二,本发明的冷却系统很简单,而且制造起来并不昂贵,因为它只需要几个步骤:在板状构件中形成第一导管和第二管道以及第一孔和第二孔,用工作流体填充第一导管和第二管道,以及最后分别将第一膜和第二膜(例如通过胶水)附接在板状构件的第一侧和第二侧上。
此外,本发明的冷却系统允许通过蒸发吸收散热功率的峰值而保持温度基本恒定,并且因为板状构件上的温度一致,在电子设备的最高温度保持不变的情况下,允许向外部环境消散更高的(与板状构件的表面成正比的)热功率。
当然,在本发明的原理保持不变的情况下,实施例和构造上的细节可以根据仅仅以非限制性的实例的方式所描述和说明的内容广泛变化。
Claims (2)
1.一种用于冷却电子设备的冷却系统(10),所述冷却系统(10)包括:
至少一个板状构件(12),形成在使用时所述电子设备容纳在其内部的壳体的壁,所述至少一个板状构件(12)具有使用时朝向所述电子设备的第一侧(12a)和与所述第一侧(12a)相对的第二侧(12b);以及
流体电路(14),形成在所述至少一个板状构件(12)中,
其特征在于,
流体电路(14)包括形成在所述至少一个板状构件(12)的所述第一侧(12a)上并且沿着第一曲径延伸的第一管道(14a)和形成在所述至少一个板状构件(12)的所述第二侧(12b)上并且沿着第二曲径延伸的第二管道(14b);
所述至少一个板状构件(12)具有第一通孔(18)和第二通孔(20),第一管道(14a)和第二管道(14b)通过所述第一通孔(18)和所述第二通孔(20)彼此流体连通;以及
所述流体电路(14)进一步包括多孔隔离元件(22),所述多孔隔离元件(22)被放置于所述第一通孔(18)中,并且工作流体通过毛细管作用经由所述多孔隔离元件(22)从所述第二管道(14b)流向所述第一管道(14a),工作流体在所述第一管道(14a)中为气相,而在所述第二管道(14b)中为液相。
2.根据权利要求1所述的冷却系统,进一步包括附接至所述至少一个板状构件(12)的所述第一侧(12a)以密封所述第一管道(14a)以及所述第一通孔(18)和所述第二通孔(20)的第一膜(16a),以及附接至所述至少一个板状构件(12)的所述第二侧(12b)以密封第二管道(14b)以及第一通孔(18)和所述第二通孔(20)的第二膜(16b)。
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IT102016000129385A IT201600129385A1 (it) | 2016-12-21 | 2016-12-21 | Sistema di raffreddamento passivo a fluido bifase, particolarmente per il raffreddamento di apparati elettronici, quali apparati avionici. |
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US (1) | US10228193B2 (zh) |
EP (1) | EP3339789B1 (zh) |
JP (1) | JP7191511B2 (zh) |
CN (1) | CN108235648A (zh) |
ES (1) | ES2761905T3 (zh) |
HK (1) | HK1256119A1 (zh) |
IT (1) | IT201600129385A1 (zh) |
RU (1) | RU2747858C2 (zh) |
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US5688585A (en) | 1993-08-05 | 1997-11-18 | Guardian Industries Corp. | Matchable, heat treatable, durable, IR-reflecting sputter-coated glasses and method of making same |
EP3507871B1 (en) * | 2016-08-31 | 2023-06-07 | NLIGHT, Inc. | Laser cooling system |
US10784645B2 (en) | 2018-03-12 | 2020-09-22 | Nlight, Inc. | Fiber laser having variably wound optical fiber |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931905A (en) * | 1989-01-17 | 1990-06-05 | Grumman Aerospace Corporation | Heat pipe cooled electronic circuit card |
CN101524009A (zh) * | 2006-09-29 | 2009-09-02 | 韩国电子通信研究院 | 用于电子设备的热均匀化装置 |
CN101858701A (zh) * | 2009-04-03 | 2010-10-13 | 索尼公司 | 传热装置、电子设备及传热装置制造方法 |
CN203026506U (zh) * | 2011-04-28 | 2013-06-26 | Abb公司 | 冷却系统 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2379881A1 (fr) * | 1977-02-04 | 1978-09-01 | Commissariat Energie Atomique | Bloc-pompe echangeur de chaleur pour reacteurs nucleaires |
US5697428A (en) * | 1993-08-24 | 1997-12-16 | Actronics Kabushiki Kaisha | Tunnel-plate type heat pipe |
KR100294317B1 (ko) * | 1999-06-04 | 2001-06-15 | 이정현 | 초소형 냉각 장치 |
US6539731B2 (en) * | 2001-03-30 | 2003-04-01 | Arthus S. Kesten | Dehumidification process and apparatus |
TWI235906B (en) * | 2003-02-27 | 2005-07-11 | Shwin-Chung Wong | Microchannel heat pipe spreaders and microchannel loop heat pipes housed in a metal case and embodiments of the same |
JP2005061690A (ja) * | 2003-08-08 | 2005-03-10 | Sumitomo Electric Ind Ltd | 薄型流路形成体、それを用いた温度制御装置、それを用いた情報機器およびその製造方法 |
JP2005209981A (ja) * | 2004-01-26 | 2005-08-04 | Sumitomo Electric Ind Ltd | 冷却ブロック、ヒータユニット及びそれを搭載した装置 |
CN2696126Y (zh) * | 2004-04-06 | 2005-04-27 | 谢步明 | Igbt迷宫式水冷散热器 |
WO2006038508A1 (ja) * | 2004-10-06 | 2006-04-13 | Tama-Tlo, Ltd. | 太陽電池システムおよび熱電気複合型太陽電池システム |
US7345877B2 (en) * | 2005-01-06 | 2008-03-18 | The Boeing Company | Cooling apparatus, system, and associated method |
JP4496999B2 (ja) * | 2005-03-18 | 2010-07-07 | ソニー株式会社 | 熱輸送装置及び電子機器 |
CN2842735Y (zh) * | 2005-10-24 | 2006-11-29 | 比亚迪股份有限公司 | 一种绝缘栅双极晶体管的平板式水冷散热器 |
US7758671B2 (en) * | 2006-08-14 | 2010-07-20 | Nanocap Technologies, Llc | Versatile dehumidification process and apparatus |
US9320129B2 (en) * | 2010-01-12 | 2016-04-19 | Dowa Metaltech Co., Ltd. | Liquid-cooled integrated substrate and manufacturing method of liquid-cooled integrated substrate |
US20150000871A1 (en) * | 2013-07-01 | 2015-01-01 | Hamilton Sundstrand Corporation | Housing with heat pipes integrated into enclosure fins |
US9333599B2 (en) * | 2013-12-20 | 2016-05-10 | General Electric Company | Electronics chassis and method of fabricating the same |
RU2581522C1 (ru) * | 2014-12-15 | 2016-04-20 | Федеральное государственное бюджетное учреждение науки Институт теплофизики им. С.С. Кутателадзе Сибирского отделения Российской академии наук (ИТ СО РАН) | Способ охлаждения электронного оборудования с использованием конденсатора-пленкоформирователя |
KR101723460B1 (ko) * | 2015-07-07 | 2017-04-06 | 한국에너지기술연구원 | 제습 시스템 |
JP6597892B2 (ja) * | 2016-05-09 | 2019-10-30 | 富士通株式会社 | ループヒートパイプ及びその製造方法並びに電子機器 |
-
2016
- 2016-12-21 IT IT102016000129385A patent/IT201600129385A1/it unknown
-
2017
- 2017-12-19 EP EP17208559.9A patent/EP3339789B1/en active Active
- 2017-12-19 ES ES17208559T patent/ES2761905T3/es active Active
- 2017-12-19 JP JP2017242747A patent/JP7191511B2/ja active Active
- 2017-12-20 RU RU2017144903A patent/RU2747858C2/ru active
- 2017-12-20 US US15/848,604 patent/US10228193B2/en active Active
- 2017-12-20 CN CN201711381008.7A patent/CN108235648A/zh active Pending
-
2018
- 2018-11-27 HK HK18115197.9A patent/HK1256119A1/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4931905A (en) * | 1989-01-17 | 1990-06-05 | Grumman Aerospace Corporation | Heat pipe cooled electronic circuit card |
CN101524009A (zh) * | 2006-09-29 | 2009-09-02 | 韩国电子通信研究院 | 用于电子设备的热均匀化装置 |
CN101858701A (zh) * | 2009-04-03 | 2010-10-13 | 索尼公司 | 传热装置、电子设备及传热装置制造方法 |
CN203026506U (zh) * | 2011-04-28 | 2013-06-26 | Abb公司 | 冷却系统 |
Also Published As
Publication number | Publication date |
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JP2018152550A (ja) | 2018-09-27 |
EP3339789A1 (en) | 2018-06-27 |
RU2747858C2 (ru) | 2021-05-17 |
RU2017144903A (ru) | 2019-06-20 |
ES2761905T3 (es) | 2020-05-21 |
IT201600129385A1 (it) | 2018-06-21 |
EP3339789B1 (en) | 2019-10-23 |
US10228193B2 (en) | 2019-03-12 |
RU2017144903A3 (zh) | 2021-03-25 |
JP7191511B2 (ja) | 2022-12-19 |
US20180172358A1 (en) | 2018-06-21 |
HK1256119A1 (zh) | 2019-09-13 |
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