IT201900023076A1 - Sistema di raffreddamento per data center - Google Patents

Sistema di raffreddamento per data center

Info

Publication number
IT201900023076A1
IT201900023076A1 IT102019000023076A IT201900023076A IT201900023076A1 IT 201900023076 A1 IT201900023076 A1 IT 201900023076A1 IT 102019000023076 A IT102019000023076 A IT 102019000023076A IT 201900023076 A IT201900023076 A IT 201900023076A IT 201900023076 A1 IT201900023076 A1 IT 201900023076A1
Authority
IT
Italy
Prior art keywords
cooling system
data center
center
cooling
data
Prior art date
Application number
IT102019000023076A
Other languages
English (en)
Inventor
Franco Provenziani
Filippo Cataldo
Original Assignee
Provides Metalmeccanica S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Provides Metalmeccanica S R L filed Critical Provides Metalmeccanica S R L
Priority to IT102019000023076A priority Critical patent/IT201900023076A1/it
Priority to IT102020000001258A priority patent/IT202000001258A1/it
Priority to PCT/IB2020/061500 priority patent/WO2021111387A1/en
Priority to CN202080084444.1A priority patent/CN114762469A/zh
Priority to EP20829352.2A priority patent/EP4070631B1/en
Priority to CA3161561A priority patent/CA3161561A1/en
Priority to US17/756,442 priority patent/US11871546B2/en
Publication of IT201900023076A1 publication Critical patent/IT201900023076A1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
IT102019000023076A 2019-12-05 2019-12-05 Sistema di raffreddamento per data center IT201900023076A1 (it)

Priority Applications (7)

Application Number Priority Date Filing Date Title
IT102019000023076A IT201900023076A1 (it) 2019-12-05 2019-12-05 Sistema di raffreddamento per data center
IT102020000001258A IT202000001258A1 (it) 2019-12-05 2020-01-23 Dispositivo di raffreddamento per mezzi generatori di calore di sistemi elettronici
PCT/IB2020/061500 WO2021111387A1 (en) 2019-12-05 2020-12-04 Cooling system of electronic systems, in particular for data centre
CN202080084444.1A CN114762469A (zh) 2019-12-05 2020-12-04 电子系统、特别是用于数据中心的冷却系统
EP20829352.2A EP4070631B1 (en) 2019-12-05 2020-12-04 Cooling system of electronic systems, in particular for data centre
CA3161561A CA3161561A1 (en) 2019-12-05 2020-12-04 Cooling system of electronic systems, in particular for data centre
US17/756,442 US11871546B2 (en) 2019-12-05 2020-12-04 Cooling system of electronic systems, in particular for data centre

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102019000023076A IT201900023076A1 (it) 2019-12-05 2019-12-05 Sistema di raffreddamento per data center

Publications (1)

Publication Number Publication Date
IT201900023076A1 true IT201900023076A1 (it) 2021-06-05

Family

ID=70009250

Family Applications (2)

Application Number Title Priority Date Filing Date
IT102019000023076A IT201900023076A1 (it) 2019-12-05 2019-12-05 Sistema di raffreddamento per data center
IT102020000001258A IT202000001258A1 (it) 2019-12-05 2020-01-23 Dispositivo di raffreddamento per mezzi generatori di calore di sistemi elettronici

Family Applications After (1)

Application Number Title Priority Date Filing Date
IT102020000001258A IT202000001258A1 (it) 2019-12-05 2020-01-23 Dispositivo di raffreddamento per mezzi generatori di calore di sistemi elettronici

Country Status (1)

Country Link
IT (2) IT201900023076A1 (it)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030000721A1 (en) * 2001-06-27 2003-01-02 Garner Scott D. Thermal management system and method for electronics system
EP1448040A2 (en) * 2003-02-14 2004-08-18 Hitachi, Ltd. Liquid cooling system for a rack-mount server system
US20060146496A1 (en) * 2005-01-06 2006-07-06 The Boeing Company Cooling apparatus, system, and associated method
US20100328890A1 (en) * 2009-06-25 2010-12-30 International Business Machines Corporation Condenser structures with fin cavities facilitating vapor condensation cooling of coolant
JP2013065227A (ja) * 2011-09-20 2013-04-11 Hitachi Ltd サーバラックの冷却システム及びサーバ機器
EP3324716A2 (en) * 2016-10-27 2018-05-23 Rodolfo Caciolli System for the cooling of heat-producing electronic components

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1738127B1 (en) * 2004-03-31 2011-10-05 Belits Computer Systems, Inc. Low-profile thermosyphon-based cooling system for computers and other electronic devices
TWI274839B (en) * 2004-12-31 2007-03-01 Foxconn Tech Co Ltd Pulsating heat conveyance apparatus
ITTV20080145A1 (it) * 2008-11-14 2010-05-15 Uniheat Srl Sistema a tubo di calore oscillante a circuito chiuso in materiale polimerico
EP2988578B1 (en) * 2014-08-19 2021-05-19 ABB Schweiz AG Cooling element
DK3147621T3 (da) * 2015-09-24 2019-10-21 Abb Schweiz Ag Køleanordning og fremgangsmåde til afkøling af mindst to elektroniske strømanordninger

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030000721A1 (en) * 2001-06-27 2003-01-02 Garner Scott D. Thermal management system and method for electronics system
EP1448040A2 (en) * 2003-02-14 2004-08-18 Hitachi, Ltd. Liquid cooling system for a rack-mount server system
US20060146496A1 (en) * 2005-01-06 2006-07-06 The Boeing Company Cooling apparatus, system, and associated method
US20100328890A1 (en) * 2009-06-25 2010-12-30 International Business Machines Corporation Condenser structures with fin cavities facilitating vapor condensation cooling of coolant
JP2013065227A (ja) * 2011-09-20 2013-04-11 Hitachi Ltd サーバラックの冷却システム及びサーバ機器
EP3324716A2 (en) * 2016-10-27 2018-05-23 Rodolfo Caciolli System for the cooling of heat-producing electronic components

Also Published As

Publication number Publication date
IT202000001258A1 (it) 2021-07-23

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