DK3147621T3 - Køleanordning og fremgangsmåde til afkøling af mindst to elektroniske strømanordninger - Google Patents

Køleanordning og fremgangsmåde til afkøling af mindst to elektroniske strømanordninger Download PDF

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Publication number
DK3147621T3
DK3147621T3 DK15186625.8T DK15186625T DK3147621T3 DK 3147621 T3 DK3147621 T3 DK 3147621T3 DK 15186625 T DK15186625 T DK 15186625T DK 3147621 T3 DK3147621 T3 DK 3147621T3
Authority
DK
Denmark
Prior art keywords
cooling
power devices
electronic power
cooling device
electronic
Prior art date
Application number
DK15186625.8T
Other languages
English (en)
Inventor
Bruno Agostini
Francesco Agostini
Daniele Torresin
Mathieu Habert
Original Assignee
Abb Schweiz Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Schweiz Ag filed Critical Abb Schweiz Ag
Application granted granted Critical
Publication of DK3147621T3 publication Critical patent/DK3147621T3/da

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0278—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits in the form of stacked distribution plates or perforated plates arranged over end plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
DK15186625.8T 2015-09-24 2015-09-24 Køleanordning og fremgangsmåde til afkøling af mindst to elektroniske strømanordninger DK3147621T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15186625.8A EP3147621B1 (en) 2015-09-24 2015-09-24 Cooling device and method for cooling at least two power electronic devices

Publications (1)

Publication Number Publication Date
DK3147621T3 true DK3147621T3 (da) 2019-10-21

Family

ID=54199034

Family Applications (1)

Application Number Title Priority Date Filing Date
DK15186625.8T DK3147621T3 (da) 2015-09-24 2015-09-24 Køleanordning og fremgangsmåde til afkøling af mindst to elektroniske strømanordninger

Country Status (4)

Country Link
US (1) US10080315B2 (da)
EP (1) EP3147621B1 (da)
CN (1) CN106971990B (da)
DK (1) DK3147621T3 (da)

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* Cited by examiner, † Cited by third party
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TWD181171S (zh) * 2016-07-22 2017-02-01 黃崇賢 散熱器(2)
TWD181170S (zh) * 2016-07-22 2017-02-01 黃崇賢 散熱器(1)
EP3407693B1 (en) * 2017-05-22 2022-11-09 Pfannenberg GmbH Heat exchanger for cooling an electronic enclosure
EP3723463B1 (en) * 2019-04-10 2023-03-01 ABB Schweiz AG Heat exchanger with integrated two-phase heat spreader
US11051428B2 (en) * 2019-10-31 2021-06-29 Hamilton Sunstrand Corporation Oscillating heat pipe integrated thermal management system for power electronics
IT201900023076A1 (it) * 2019-12-05 2021-06-05 Provides Metalmeccanica S R L Sistema di raffreddamento per data center
EP4001820A1 (en) * 2020-11-20 2022-05-25 Nokia Technologies Oy Oscillating heat pipe
CN112996358B (zh) * 2021-02-18 2022-04-08 南京航空航天大学 基于脉动热管的楔形扰流相变热沉装置及换热方法
DE102021115922A1 (de) 2021-06-21 2022-12-22 Bayerische Motoren Werke Aktiengesellschaft Anordnung eines pulsierenden Wärmerohrs zur Kühlung von leistungselektronischen Komponenten in einem Kraftfahrzeug
CN113691268B (zh) * 2021-08-16 2023-03-10 合肥水泥研究设计院有限公司 一种数据传输及接收装置
TWI819867B (zh) * 2022-10-27 2023-10-21 新加坡商鴻運科股份有限公司 歧管、機櫃及資料中心冷卻系統

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TW331586B (en) * 1997-08-22 1998-05-11 Biing-Jiun Hwang Network-type heat pipe device
EP2234154B1 (en) * 2000-04-19 2016-03-30 Denso Corporation Coolant cooled type semiconductor device
EP2216892B1 (en) * 2003-08-21 2012-01-18 Denso Corporation Mounting structure of a semiconductor device
US7345877B2 (en) * 2005-01-06 2008-03-18 The Boeing Company Cooling apparatus, system, and associated method
US20080087406A1 (en) * 2006-10-13 2008-04-17 The Boeing Company Cooling system and associated method for planar pulsating heat pipe
JP5006122B2 (ja) * 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
EP2031332B1 (en) * 2007-08-27 2010-09-15 ABB Research LTD Heat exchanger for power-electronics components
US8919426B2 (en) * 2007-10-22 2014-12-30 The Peregrine Falcon Corporation Micro-channel pulsating heat pipe
US7843693B2 (en) * 2007-11-02 2010-11-30 The Boeing Company Method and system for removing heat
US20090323276A1 (en) * 2008-06-25 2009-12-31 Mongia Rajiv K High performance spreader for lid cooling applications
EP2270413A1 (en) * 2009-06-10 2011-01-05 ABB Research Ltd. Anti-gravity thermosyphon heat exchanger and a power module
CN102696103B (zh) * 2009-09-28 2016-01-13 Abb研究有限公司 用于冷却电子构件的冷却模块
EP2328172B1 (en) * 2009-10-02 2019-06-26 Abb Research Ltd. A power-electronic arrangement
EP2444770B1 (en) 2010-10-20 2020-02-12 ABB Schweiz AG Heat Exchanger Based on Pulsating Heat Pipe Principle
US8659042B2 (en) * 2010-12-21 2014-02-25 Palo Alto Research Center Incorporated Integrated reflector and thermal spreader and thermal spray fabrication method
CN102121802B (zh) * 2011-03-25 2012-05-30 长沙理工大学 双面槽道板式脉动热管
JP5652370B2 (ja) * 2011-03-30 2015-01-14 株式会社デンソー 電力変換装置
US8916410B2 (en) * 2011-05-27 2014-12-23 Csi Cells Co., Ltd Methods of manufacturing light to current converter devices
EP2544518A1 (en) * 2011-07-07 2013-01-09 ABB Research Ltd. Cooling apparatus for cooling a power electronic device
ES2638857T3 (es) * 2012-03-28 2017-10-24 Abb Research Ltd. Intercambiador de calor para convertidores de tracción
EP2793261B1 (en) * 2013-04-18 2016-04-13 ABB Technology Oy An apparatus
CN103441110B (zh) * 2013-08-23 2016-05-25 电子科技大学 一种采用脉动流及叶脉式微流道的散热装置
TWI579519B (zh) * 2013-09-02 2017-04-21 財團法人工業技術研究院 脈衝型多管式熱管
EP2857783A1 (en) * 2013-10-04 2015-04-08 ABB Technology AG Heat exchange device based on a pulsating heat pipe
TWI580921B (zh) * 2014-05-09 2017-05-01 財團法人工業技術研究院 脈衝型多管式熱管

Also Published As

Publication number Publication date
CN106971990B (zh) 2021-07-13
US20170094843A1 (en) 2017-03-30
EP3147621B1 (en) 2019-09-11
EP3147621A1 (en) 2017-03-29
CN106971990A (zh) 2017-07-21
US10080315B2 (en) 2018-09-18

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