DE10296928T5 - Einzel- oder Doppelbuswärmeübertragungssystem - Google Patents

Einzel- oder Doppelbuswärmeübertragungssystem Download PDF

Info

Publication number
DE10296928T5
DE10296928T5 DE10296928T DE10296928T DE10296928T5 DE 10296928 T5 DE10296928 T5 DE 10296928T5 DE 10296928 T DE10296928 T DE 10296928T DE 10296928 T DE10296928 T DE 10296928T DE 10296928 T5 DE10296928 T5 DE 10296928T5
Authority
DE
Germany
Prior art keywords
heat transfer
transfer system
double bus
bus heat
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10296928T
Other languages
English (en)
Inventor
Daniel B Baer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vertiv Corp
Original Assignee
Liebert Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liebert Corp filed Critical Liebert Corp
Publication of DE10296928T5 publication Critical patent/DE10296928T5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20772Liquid cooling without phase change within server blades for removing heat from heat source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20781Liquid cooling without phase change within cabinets for removing heat from server blades
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20809Liquid cooling with phase change within server blades for removing heat from heat source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/16Fastening; Joining with toothed elements, e.g. with serrations
DE10296928T 2001-06-12 2002-06-12 Einzel- oder Doppelbuswärmeübertragungssystem Withdrawn DE10296928T5 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29755201P 2001-06-12 2001-06-12
PCT/US2002/018835 WO2002102124A2 (en) 2001-06-12 2002-06-12 Single or dual buss thermal transfer system

Publications (1)

Publication Number Publication Date
DE10296928T5 true DE10296928T5 (de) 2004-10-07

Family

ID=23146794

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10296928T Withdrawn DE10296928T5 (de) 2001-06-12 2002-06-12 Einzel- oder Doppelbuswärmeübertragungssystem

Country Status (4)

Country Link
US (1) US6796372B2 (de)
AU (1) AU2002306161A1 (de)
DE (1) DE10296928T5 (de)
WO (1) WO2002102124A2 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014032649A1 (de) 2012-08-31 2014-03-06 Rittal Gmbh & Co. Kg Kühlanordnung für in einem innenraum eines schaltschranks angeordnete komponenten
EP3134699A1 (de) * 2014-04-23 2017-03-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wärmeübertragungsvorrichtung, solarkollektor und wärmerohr
WO2023284923A1 (de) * 2021-07-14 2023-01-19 Continental Automotive Technologies GmbH Elektronisches gerät mit einer schaltungsanordnung

Families Citing this family (122)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002306161A1 (en) 2001-06-12 2002-12-23 Liebert Corporation Single or dual buss thermal transfer system
US7133283B2 (en) * 2002-01-04 2006-11-07 Intel Corporation Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
GB0207382D0 (en) 2002-03-28 2002-05-08 Holland Heating Uk Ltd Computer cabinet
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7806168B2 (en) 2002-11-01 2010-10-05 Cooligy Inc Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US20040112571A1 (en) * 2002-11-01 2004-06-17 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7401472B2 (en) * 2003-01-17 2008-07-22 Tecumseh Products Company Modular heating or cooling system
US7046514B2 (en) 2003-03-19 2006-05-16 American Power Conversion Corporation Data center cooling
US6859366B2 (en) 2003-03-19 2005-02-22 American Power Conversion Data center cooling system
US7591302B1 (en) * 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
DE10335197B4 (de) * 2003-07-30 2005-10-27 Kermi Gmbh Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor
EP1507323B1 (de) * 2003-08-13 2012-10-03 ABB Research Ltd. Gekapselte Schaltgeräte mit wärmeabführenden Elementen
US20050047085A1 (en) * 2003-08-26 2005-03-03 Nagui Mankaruse High performance cooling systems
US7012807B2 (en) * 2003-09-30 2006-03-14 International Business Machines Corporation Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
US7074123B2 (en) 2004-01-13 2006-07-11 Power Of 4, L.L.C. Cabinet for computer devices with air distribution device
FR2867608B1 (fr) * 2004-03-12 2006-05-26 Metal Process Refroidisseur pour composant electronique de puissance
US7151667B2 (en) * 2004-04-12 2006-12-19 Nvidia Corporation Modular, scalable thermal solution
US7359197B2 (en) 2004-04-12 2008-04-15 Nvidia Corporation System for efficiently cooling a processor
US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
FI117590B (fi) * 2004-06-11 2006-11-30 Abb Oy Jäähdytyselementti
US7227749B2 (en) * 2004-12-07 2007-06-05 Rocky Research Thermal bus load control management for electronic systems
US7259963B2 (en) * 2004-12-29 2007-08-21 American Power Conversion Corp. Rack height cooling
US7345877B2 (en) 2005-01-06 2008-03-18 The Boeing Company Cooling apparatus, system, and associated method
US20060187639A1 (en) * 2005-02-23 2006-08-24 Lytron, Inc. Electronic component cooling and interface system
US7841199B2 (en) * 2005-05-17 2010-11-30 American Power Conversion Corporation Cold aisle isolation
US7324336B2 (en) * 2005-09-27 2008-01-29 Lockheed Martin Corporation Flow through cooling assemblies for conduction-cooled circuit modules
US20070076376A1 (en) * 2005-09-30 2007-04-05 Intel Corporation Method, apparatus and computer system for providing for the transfer of thermal energy
US20070175621A1 (en) * 2006-01-31 2007-08-02 Cooligy, Inc. Re-workable metallic TIM for efficient heat exchange
WO2007098077A2 (en) * 2006-02-16 2007-08-30 Cooligy, Inc. Liquid cooling loops for server applications
US8289710B2 (en) * 2006-02-16 2012-10-16 Liebert Corporation Liquid cooling systems for server applications
US20070227698A1 (en) * 2006-03-30 2007-10-04 Conway Bruce R Integrated fluid pump and radiator reservoir
US20070227709A1 (en) * 2006-03-30 2007-10-04 Girish Upadhya Multi device cooling
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US20070230128A1 (en) * 2006-04-04 2007-10-04 Vapro Inc. Cooling apparatus with surface enhancement boiling heat transfer
TWI403883B (zh) * 2006-04-11 2013-08-01 Cooligy Inc 藉使用經模組匯流排型熱交換器連結之多流體熱交換迴路於個人電腦中冷卻多熱源之方法
US20070256815A1 (en) * 2006-05-04 2007-11-08 Cooligy, Inc. Scalable liquid cooling system with modular radiators
US20070297136A1 (en) * 2006-06-23 2007-12-27 Sun Micosystems, Inc. Modular liquid cooling of electronic components while preserving data center integrity
US20080013278A1 (en) * 2006-06-30 2008-01-17 Fredric Landry Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles
US7450384B2 (en) * 2006-07-06 2008-11-11 Hybricon Corporation Card cage with parallel flow paths having substantially similar lengths
US20080013283A1 (en) * 2006-07-17 2008-01-17 Gilbert Gary L Mechanism for cooling electronic components
US7403384B2 (en) * 2006-07-26 2008-07-22 Dell Products L.P. Thermal docking station for electronics
US20080043442A1 (en) * 2006-08-16 2008-02-21 Strickland Travis C Computer system with thermal conduction
EP1937047B1 (de) * 2006-12-23 2011-08-03 Abb Research Ltd. Flexible Heizkabelvorrichtung
WO2008104796A2 (en) * 2007-03-01 2008-09-04 Carter, Stephen Data centers
US7957144B2 (en) * 2007-03-16 2011-06-07 International Business Machines Corporation Heat exchange system for blade server systems and method
US8651172B2 (en) 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
US7957132B2 (en) * 2007-04-16 2011-06-07 Fried Stephen S Efficiently cool data centers and electronic enclosures using loop heat pipes
CN101715536A (zh) * 2007-05-02 2010-05-26 固利吉股份有限公司 用于电子冷却应用的微管/多端口逆流散热器设计
DE102007023417A1 (de) * 2007-05-18 2008-11-20 Daimler Ag Heizvorrichtung für Kondensatableiter
US7978474B2 (en) * 2007-05-22 2011-07-12 Apple Inc. Liquid-cooled portable computer
US7900468B2 (en) * 2007-07-11 2011-03-08 Liebert Corporation Method and apparatus for equalizing a pumped refrigerant system
US20090027856A1 (en) * 2007-07-26 2009-01-29 Mccoy Scott Blade cooling system using wet and dry heat sinks
TW200934352A (en) 2007-08-07 2009-08-01 Cooligy Inc Internal access mechanism for a server rack
US7921655B2 (en) * 2007-09-21 2011-04-12 Raytheon Company Topping cycle for a sub-ambient cooling system
JP4859823B2 (ja) * 2007-12-14 2012-01-25 株式会社日立製作所 冷却装置およびそれを用いた電子機器
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
DE102008004342B3 (de) * 2008-01-09 2009-07-30 Mdexx Gmbh Anordnung mit mindestens einer elektrischen Wicklung
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US7907409B2 (en) * 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack
US7898799B2 (en) 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
US8164901B2 (en) * 2008-04-16 2012-04-24 Julius Neudorfer High efficiency heat removal system for rack mounted computer equipment
US7626820B1 (en) * 2008-05-15 2009-12-01 Sun Microsystems, Inc. Thermal transfer technique using heat pipes with integral rack rails
US8490678B2 (en) * 2008-06-02 2013-07-23 Gerald Ho Kim Silicon-based thermal energy transfer device and apparatus
CN102171378A (zh) 2008-08-05 2011-08-31 固利吉股份有限公司 用于光学和电子器件的热管理的键合金属和陶瓷板
AU2009282170B2 (en) 2008-08-11 2014-11-27 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
DE102008044645B3 (de) * 2008-08-27 2010-02-18 Airbus Deutschland Gmbh Flugzeugsignalrechnersystem mit einer Mehrzahl von modularen Signalrechnereinheiten
US8031464B2 (en) * 2008-09-08 2011-10-04 Intergraph Technologies Corporation Ruggedized computer capable of operating in high-temperature environments
US7903403B2 (en) 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
WO2010096355A2 (en) * 2009-02-17 2010-08-26 Parker Hannifin Corporation Cooling system utilizing multiple cold plates
US7978472B2 (en) * 2009-06-10 2011-07-12 International Business Machines Corporation Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof
US8582298B2 (en) * 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
US9036351B2 (en) * 2009-06-22 2015-05-19 Xyber Technologies, Llc Passive cooling system and method for electronics devices
US20110079370A1 (en) * 2009-07-17 2011-04-07 Textron Inc. Non-Uniform Height And Density Fin Design For Heat Sink
JP4783845B2 (ja) 2009-07-23 2011-09-28 東芝テック株式会社 電子機器
KR20120118456A (ko) * 2009-09-24 2012-10-26 파커-한니핀 코포레이션 냉각 시스템과, 변압기 냉각 시스템
JP5644767B2 (ja) * 2009-09-29 2014-12-24 日本電気株式会社 電子機器装置の熱輸送構造
DE102009051298A1 (de) * 2009-10-29 2011-05-05 Tlk-Thermo Gmbh Kühlsystem für eine Brennstoffzelle
JP2013509638A (ja) * 2009-10-30 2013-03-14 ヒューレット−パッカード デベロップメント カンパニー エル.ピー. ブレード・エンクロージャ用の熱バスバー
DE102009054585A1 (de) * 2009-12-14 2011-06-16 Robert Bosch Gmbh Steuergerät
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
TW201210454A (en) * 2010-08-24 2012-03-01 Hon Hai Prec Ind Co Ltd Server cabinet and liquid cooling system thereof
CN102378551A (zh) * 2010-08-24 2012-03-14 鸿富锦精密工业(深圳)有限公司 服务器机柜及其液冷散热系统
CN105828574B (zh) * 2010-08-26 2018-09-21 阿塞泰克丹麦公司 用于计算机服务器机架的冷却系统
CN102402261B (zh) * 2010-09-08 2014-11-12 神讯电脑(昆山)有限公司 具有防水功能的主机装置与其散热模块
TWI419641B (zh) * 2010-10-29 2013-12-11 Ind Tech Res Inst 電子裝置之散熱結構
TW201221034A (en) * 2010-11-05 2012-05-16 Inventec Corp Cooling system of server and cooling method thereof
US20120279683A1 (en) * 2011-05-05 2012-11-08 Alcatel-Lucent Usa Inc. Cooling apparatus for communications platforms
US8542489B2 (en) * 2011-05-05 2013-09-24 Alcatel Lucent Mechanically-reattachable liquid-cooled cooling apparatus
US20130032313A1 (en) * 2011-08-05 2013-02-07 Chun-Ming Wu Heat-dissipation unit and method of manufacturing same
US9049803B2 (en) * 2011-09-22 2015-06-02 Panduit Corp. Thermal management infrastructure for IT equipment in a cabinet
US8934244B2 (en) * 2011-10-28 2015-01-13 Dell Products L.P. System and method for cooling information handling resources
US9155230B2 (en) * 2011-11-28 2015-10-06 Asetek Danmark A/S Cooling system for a server
WO2013119243A1 (en) 2012-02-09 2013-08-15 Hewlett-Packard Development Company, L.P. Heat dissipating system
KR101886477B1 (ko) * 2012-03-12 2018-08-07 휴렛 팩커드 엔터프라이즈 디벨롭먼트 엘피 냉각 섹션을 갖는 랙 냉각 시스템
US9927187B2 (en) 2012-09-28 2018-03-27 Hewlett Packard Enterprise Development Lp Cooling assembly
JP6056362B2 (ja) * 2012-10-12 2017-01-11 富士通株式会社 熱コネクタ及び電子機器
BR112015018354A2 (pt) 2013-01-31 2017-07-18 Hewlett Packard Development Co resfriamento de líquido
GB201303643D0 (en) * 2013-03-01 2013-04-17 Iceotope Ltd Cooling system with redundancy
AU2014262796A1 (en) 2013-05-06 2015-12-24 Green Revolution Cooling, Inc. System and method of packaging computing resources for space and fire-resistance
WO2015175693A1 (en) 2014-05-13 2015-11-19 Green Revolution Cooling, Inc. System and method for air-cooling hard drives in liquid-cooled server rack
US9521782B2 (en) * 2014-06-26 2016-12-13 General Electric Company Systems and methods for passive cooling of components within electrical devices
EP3185663A1 (de) * 2014-08-18 2017-06-28 Murakumo Corporation System, informationsverarbeitungsvorrichtung und gestell
CN104363742B (zh) * 2014-11-13 2018-01-30 曙光信息产业股份有限公司 液冷服务器
CA3041616A1 (en) 2016-11-11 2018-05-17 Stulz Air Technology Systems, Inc. Dual mass cooling precision system
US10670650B2 (en) * 2017-09-28 2020-06-02 Advantest Corporation Device testing with heat pipe cooling assembly
US10813246B2 (en) * 2017-10-23 2020-10-20 Asia Vital Components (China) Co., Ltd. Chassis heat dissipation structure
US11359865B2 (en) 2018-07-23 2022-06-14 Green Revolution Cooling, Inc. Dual Cooling Tower Time Share Water Treatment System
US11540424B2 (en) * 2018-09-14 2022-12-27 Mitsubishi Electric Corporation Electric power converter
US11147191B2 (en) * 2018-10-29 2021-10-12 Quanta Computer Inc. Liquid cooling with outdoor chiller rack system
EP3829278B1 (de) 2019-11-29 2022-05-18 Ovh Kühlanordnung für einen in einem serverrack montierbaren server
US11147192B2 (en) * 2019-12-23 2021-10-12 Baidu Usa Llc Fluid cooling system for an enclosed electronic package
US20210315120A1 (en) * 2020-04-01 2021-10-07 Hamilton Sundstrand Corporation Wedge lock support columns in electronic chassis
USD982145S1 (en) 2020-10-19 2023-03-28 Green Revolution Cooling, Inc. Cooling system enclosure
USD998770S1 (en) 2020-10-19 2023-09-12 Green Revolution Cooling, Inc. Cooling system enclosure
US20220287206A1 (en) * 2021-03-04 2022-09-08 TE Connectivity Services Gmbh Heat exchange assembly for an electrical device
US11805624B2 (en) 2021-09-17 2023-10-31 Green Revolution Cooling, Inc. Coolant shroud
US11925946B2 (en) 2022-03-28 2024-03-12 Green Revolution Cooling, Inc. Fluid delivery wand
US11839061B2 (en) * 2022-04-25 2023-12-05 Hamilton Sundstrand Corporation Heat transfer interfaces for circuit card assembly (CCA) modules

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904933A (en) * 1974-10-23 1975-09-09 Control Data Corp Cooling apparatus for electronic modules
DE3679978D1 (de) * 1985-12-13 1991-08-01 Hasler Ag Ascom Verfahren und vorrichtung zum abfuehren der verlustwaerme wenigstens einer baugruppe elektrischer elemente.
JPH0682941B2 (ja) 1987-10-22 1994-10-19 富士通株式会社 冷却液供給装置
US4958257A (en) 1989-03-29 1990-09-18 Hughes Aircraft Company Heat conducting interface for electronic module
US5057968A (en) * 1989-10-16 1991-10-15 Lockheed Corporation Cooling system for electronic modules
DE4028003A1 (de) 1990-09-04 1992-03-05 Messerschmitt Boelkow Blohm Klemmelement zur halterung von elektronik-karten
US5271455A (en) * 1991-06-25 1993-12-21 Smoke/Fire Risk Management, Inc. Temperature limiting apparatus for elevator controls
US5482113A (en) 1993-08-25 1996-01-09 International Business Machines Corporation Convertible heat exchanger for air or water cooling of electronic circuit components and the like
US5829516A (en) 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
JP3805390B2 (ja) * 1994-09-05 2006-08-02 オリンパス株式会社 実像式変倍ファインダー光学系
JPH098190A (ja) 1995-06-22 1997-01-10 Calsonic Corp 電子部品用冷却装置
US6000125A (en) * 1996-01-30 1999-12-14 Samsung Electronics America, Inc. Method of heat dissipation from two surfaces of a microprocessor
US6111748A (en) * 1997-05-15 2000-08-29 Intel Corporation Flat fan heat exchanger and use thereof in a computing device
US6034872A (en) 1997-07-16 2000-03-07 International Business Machines Corporation Cooling computer systems
US5963425A (en) 1997-07-16 1999-10-05 International Business Machines Corporation Combined air and refrigeration cooling for computer systems
US5796581A (en) * 1997-07-30 1998-08-18 International Business Machines Corporation Rotational joint for hinged heat pipe cooling of a computer
US5982616A (en) 1997-08-20 1999-11-09 Compaq Computer Corporation Electronic apparatus with plug-in heat pipe module cooling system
US5986882A (en) 1997-10-16 1999-11-16 Compaq Computer Corporation Electronic apparatus having removable processor/heat pipe cooling device modules therein
US6097596A (en) * 1998-02-12 2000-08-01 International Business Machines Corporation Portable computer rotational heat pipe heat transfer
US6181553B1 (en) * 1998-09-04 2001-01-30 International Business Machines Corporation Arrangement and method for transferring heat from a portable personal computer
US6052285A (en) * 1998-10-14 2000-04-18 Sun Microsystems, Inc. Electronic card with blind mate heat pipes
US6058010A (en) 1998-11-06 2000-05-02 International Business Machines Corporation Enhanced test head liquid cooled cold plate
US6377452B1 (en) * 1998-12-18 2002-04-23 Furukawa Electric Co., Ltd. Heat pipe hinge structure for electronic device
US6377453B1 (en) 1999-01-29 2002-04-23 Hewlett-Packard Company Field replaceable module with enhanced thermal interface
JP4223628B2 (ja) * 1999-05-20 2009-02-12 ティーエス ヒートロニクス 株式会社 電子機器冷却装置
GB2354062A (en) 1999-09-13 2001-03-14 British Broadcasting Corp Cooling system for use in cooling electronic equipment
US6166907A (en) 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6489049B1 (en) * 2000-07-03 2002-12-03 Johnson Electro Mechanical Systems, Llc Electrochemical conversion system
AU2002306161A1 (en) 2001-06-12 2002-12-23 Liebert Corporation Single or dual buss thermal transfer system

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014032649A1 (de) 2012-08-31 2014-03-06 Rittal Gmbh & Co. Kg Kühlanordnung für in einem innenraum eines schaltschranks angeordnete komponenten
DE102012108110A1 (de) * 2012-08-31 2014-03-06 Rittal Gmbh & Co. Kg Kühlanordnung für in einem Innenraum eines Schaltschranks angeordnete Komponenten
DE102012108110B4 (de) * 2012-08-31 2014-06-26 Rittal Gmbh & Co. Kg Kühlanordnung für in einem Innenraum eines Schaltschranks angeordnete Komponenten
US9968013B2 (en) 2012-08-31 2018-05-08 Rittal Gmbh & Co. Kg Cooling arrangement for components disposed in an interior of a switch cabinet
EP3134699A1 (de) * 2014-04-23 2017-03-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wärmeübertragungsvorrichtung, solarkollektor und wärmerohr
EP3134699B1 (de) * 2014-04-23 2021-06-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wärmeübertragungsvorrichtung und solarkollektor
WO2023284923A1 (de) * 2021-07-14 2023-01-19 Continental Automotive Technologies GmbH Elektronisches gerät mit einer schaltungsanordnung

Also Published As

Publication number Publication date
WO2002102124A2 (en) 2002-12-19
AU2002306161A1 (en) 2002-12-23
US20020185262A1 (en) 2002-12-12
US6796372B2 (en) 2004-09-28
WO2002102124A3 (en) 2003-05-22

Similar Documents

Publication Publication Date Title
DE10296928T5 (de) Einzel- oder Doppelbuswärmeübertragungssystem
DE60012822D1 (de) Wärmetauscher
DE60037879D1 (de) Wärmetauscher
DE10083636T1 (de) Wärmetauscher
DE60023394D1 (de) Wärmetauscher
DE60040609D1 (de) Wärmetauscher
DE60034017D1 (de) Wärmetauscher
DE60027489D1 (de) Wärmetauscher
AU2003285045A8 (en) Heat transfer system
DE60030392D1 (de) Wertübertragungssysteme
GB2409511B (en) Heat exchanger system
ATA116899A (de) Wärmetauscher
AU2002307467A8 (en) Heat transfer system
DE50115676D1 (de) Heizungsanlage
DE10164661B4 (de) Wärmetransportsystem
FI990576A (fi) Lämmönvaihtimen jäähdytyselementti
GB2440281B (en) Heat transfer system
DE29902705U1 (de) Wärmetauscher
FI20012336A (fi) Lämmönsiirtojärjestely
ATA16172001A (de) Heizungsanlage
DE50203309D1 (de) Datenübertragungssystem
GB2382124B (en) Heat exchange system
FI20010274A (fi) Lämmitysjärjestelmä
NO991297D0 (no) Transfersystem
DE10082698D2 (de) Wärmetauscher

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law

Ref document number: 10296928

Country of ref document: DE

Date of ref document: 20041007

Kind code of ref document: P

8125 Change of the main classification

Ipc: H05K 720

8139 Disposal/non-payment of the annual fee