AU2002306161A1
(en)
|
2001-06-12 |
2002-12-23 |
Liebert Corporation |
Single or dual buss thermal transfer system
|
US7133283B2
(en)
*
|
2002-01-04 |
2006-11-07 |
Intel Corporation |
Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
|
GB0207382D0
(en)
|
2002-03-28 |
2002-05-08 |
Holland Heating Uk Ltd |
Computer cabinet
|
US8464781B2
(en)
|
2002-11-01 |
2013-06-18 |
Cooligy Inc. |
Cooling systems incorporating heat exchangers and thermoelectric layers
|
US7806168B2
(en)
|
2002-11-01 |
2010-10-05 |
Cooligy Inc |
Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
|
US7836597B2
(en)
*
|
2002-11-01 |
2010-11-23 |
Cooligy Inc. |
Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
|
US20040112571A1
(en)
*
|
2002-11-01 |
2004-06-17 |
Cooligy, Inc. |
Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
|
US7401472B2
(en)
*
|
2003-01-17 |
2008-07-22 |
Tecumseh Products Company |
Modular heating or cooling system
|
US7046514B2
(en)
|
2003-03-19 |
2006-05-16 |
American Power Conversion Corporation |
Data center cooling
|
US6859366B2
(en)
|
2003-03-19 |
2005-02-22 |
American Power Conversion |
Data center cooling system
|
US7591302B1
(en)
*
|
2003-07-23 |
2009-09-22 |
Cooligy Inc. |
Pump and fan control concepts in a cooling system
|
DE10335197B4
(de)
*
|
2003-07-30 |
2005-10-27 |
Kermi Gmbh |
Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor
|
EP1507323B1
(de)
*
|
2003-08-13 |
2012-10-03 |
ABB Research Ltd. |
Gekapselte Schaltgeräte mit wärmeabführenden Elementen
|
US20050047085A1
(en)
*
|
2003-08-26 |
2005-03-03 |
Nagui Mankaruse |
High performance cooling systems
|
US7012807B2
(en)
*
|
2003-09-30 |
2006-03-14 |
International Business Machines Corporation |
Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
|
US7074123B2
(en)
|
2004-01-13 |
2006-07-11 |
Power Of 4, L.L.C. |
Cabinet for computer devices with air distribution device
|
FR2867608B1
(fr)
*
|
2004-03-12 |
2006-05-26 |
Metal Process |
Refroidisseur pour composant electronique de puissance
|
US7151667B2
(en)
*
|
2004-04-12 |
2006-12-19 |
Nvidia Corporation |
Modular, scalable thermal solution
|
US7359197B2
(en)
|
2004-04-12 |
2008-04-15 |
Nvidia Corporation |
System for efficiently cooling a processor
|
US20050269691A1
(en)
*
|
2004-06-04 |
2005-12-08 |
Cooligy, Inc. |
Counter flow micro heat exchanger for optimal performance
|
US7616444B2
(en)
*
|
2004-06-04 |
2009-11-10 |
Cooligy Inc. |
Gimballed attachment for multiple heat exchangers
|
FI117590B
(fi)
*
|
2004-06-11 |
2006-11-30 |
Abb Oy |
Jäähdytyselementti
|
US7227749B2
(en)
*
|
2004-12-07 |
2007-06-05 |
Rocky Research |
Thermal bus load control management for electronic systems
|
US7259963B2
(en)
*
|
2004-12-29 |
2007-08-21 |
American Power Conversion Corp. |
Rack height cooling
|
US7345877B2
(en)
|
2005-01-06 |
2008-03-18 |
The Boeing Company |
Cooling apparatus, system, and associated method
|
US20060187639A1
(en)
*
|
2005-02-23 |
2006-08-24 |
Lytron, Inc. |
Electronic component cooling and interface system
|
US7841199B2
(en)
*
|
2005-05-17 |
2010-11-30 |
American Power Conversion Corporation |
Cold aisle isolation
|
US7324336B2
(en)
*
|
2005-09-27 |
2008-01-29 |
Lockheed Martin Corporation |
Flow through cooling assemblies for conduction-cooled circuit modules
|
US20070076376A1
(en)
*
|
2005-09-30 |
2007-04-05 |
Intel Corporation |
Method, apparatus and computer system for providing for the transfer of thermal energy
|
US20070175621A1
(en)
*
|
2006-01-31 |
2007-08-02 |
Cooligy, Inc. |
Re-workable metallic TIM for efficient heat exchange
|
WO2007098077A2
(en)
*
|
2006-02-16 |
2007-08-30 |
Cooligy, Inc. |
Liquid cooling loops for server applications
|
US8289710B2
(en)
*
|
2006-02-16 |
2012-10-16 |
Liebert Corporation |
Liquid cooling systems for server applications
|
US20070227698A1
(en)
*
|
2006-03-30 |
2007-10-04 |
Conway Bruce R |
Integrated fluid pump and radiator reservoir
|
US20070227709A1
(en)
*
|
2006-03-30 |
2007-10-04 |
Girish Upadhya |
Multi device cooling
|
US8157001B2
(en)
|
2006-03-30 |
2012-04-17 |
Cooligy Inc. |
Integrated liquid to air conduction module
|
US20070230128A1
(en)
*
|
2006-04-04 |
2007-10-04 |
Vapro Inc. |
Cooling apparatus with surface enhancement boiling heat transfer
|
TWI403883B
(zh)
*
|
2006-04-11 |
2013-08-01 |
Cooligy Inc |
藉使用經模組匯流排型熱交換器連結之多流體熱交換迴路於個人電腦中冷卻多熱源之方法
|
US20070256815A1
(en)
*
|
2006-05-04 |
2007-11-08 |
Cooligy, Inc. |
Scalable liquid cooling system with modular radiators
|
US20070297136A1
(en)
*
|
2006-06-23 |
2007-12-27 |
Sun Micosystems, Inc. |
Modular liquid cooling of electronic components while preserving data center integrity
|
US20080013278A1
(en)
*
|
2006-06-30 |
2008-01-17 |
Fredric Landry |
Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles
|
US7450384B2
(en)
*
|
2006-07-06 |
2008-11-11 |
Hybricon Corporation |
Card cage with parallel flow paths having substantially similar lengths
|
US20080013283A1
(en)
*
|
2006-07-17 |
2008-01-17 |
Gilbert Gary L |
Mechanism for cooling electronic components
|
US7403384B2
(en)
*
|
2006-07-26 |
2008-07-22 |
Dell Products L.P. |
Thermal docking station for electronics
|
US20080043442A1
(en)
*
|
2006-08-16 |
2008-02-21 |
Strickland Travis C |
Computer system with thermal conduction
|
EP1937047B1
(de)
*
|
2006-12-23 |
2011-08-03 |
Abb Research Ltd. |
Flexible Heizkabelvorrichtung
|
WO2008104796A2
(en)
*
|
2007-03-01 |
2008-09-04 |
Carter, Stephen |
Data centers
|
US7957144B2
(en)
*
|
2007-03-16 |
2011-06-07 |
International Business Machines Corporation |
Heat exchange system for blade server systems and method
|
US8651172B2
(en)
|
2007-03-22 |
2014-02-18 |
Raytheon Company |
System and method for separating components of a fluid coolant for cooling a structure
|
US7957132B2
(en)
*
|
2007-04-16 |
2011-06-07 |
Fried Stephen S |
Efficiently cool data centers and electronic enclosures using loop heat pipes
|
CN101715536A
(zh)
*
|
2007-05-02 |
2010-05-26 |
固利吉股份有限公司 |
用于电子冷却应用的微管/多端口逆流散热器设计
|
DE102007023417A1
(de)
*
|
2007-05-18 |
2008-11-20 |
Daimler Ag |
Heizvorrichtung für Kondensatableiter
|
US7978474B2
(en)
*
|
2007-05-22 |
2011-07-12 |
Apple Inc. |
Liquid-cooled portable computer
|
US7900468B2
(en)
*
|
2007-07-11 |
2011-03-08 |
Liebert Corporation |
Method and apparatus for equalizing a pumped refrigerant system
|
US20090027856A1
(en)
*
|
2007-07-26 |
2009-01-29 |
Mccoy Scott |
Blade cooling system using wet and dry heat sinks
|
TW200934352A
(en)
|
2007-08-07 |
2009-08-01 |
Cooligy Inc |
Internal access mechanism for a server rack
|
US7921655B2
(en)
*
|
2007-09-21 |
2011-04-12 |
Raytheon Company |
Topping cycle for a sub-ambient cooling system
|
JP4859823B2
(ja)
*
|
2007-12-14 |
2012-01-25 |
株式会社日立製作所 |
冷却装置およびそれを用いた電子機器
|
US20090154091A1
(en)
|
2007-12-17 |
2009-06-18 |
Yatskov Alexander I |
Cooling systems and heat exchangers for cooling computer components
|
DE102008004342B3
(de)
*
|
2008-01-09 |
2009-07-30 |
Mdexx Gmbh |
Anordnung mit mindestens einer elektrischen Wicklung
|
US8170724B2
(en)
|
2008-02-11 |
2012-05-01 |
Cray Inc. |
Systems and associated methods for controllably cooling computer components
|
US9297571B1
(en)
|
2008-03-10 |
2016-03-29 |
Liebert Corporation |
Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
|
US7907409B2
(en)
*
|
2008-03-25 |
2011-03-15 |
Raytheon Company |
Systems and methods for cooling a computing component in a computing rack
|
US7898799B2
(en)
|
2008-04-01 |
2011-03-01 |
Cray Inc. |
Airflow management apparatus for computer cabinets and associated methods
|
US8164901B2
(en)
*
|
2008-04-16 |
2012-04-24 |
Julius Neudorfer |
High efficiency heat removal system for rack mounted computer equipment
|
US7626820B1
(en)
*
|
2008-05-15 |
2009-12-01 |
Sun Microsystems, Inc. |
Thermal transfer technique using heat pipes with integral rack rails
|
US8490678B2
(en)
*
|
2008-06-02 |
2013-07-23 |
Gerald Ho Kim |
Silicon-based thermal energy transfer device and apparatus
|
CN102171378A
(zh)
|
2008-08-05 |
2011-08-31 |
固利吉股份有限公司 |
用于光学和电子器件的热管理的键合金属和陶瓷板
|
AU2009282170B2
(en)
|
2008-08-11 |
2014-11-27 |
Green Revolution Cooling, Inc. |
Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
|
DE102008044645B3
(de)
*
|
2008-08-27 |
2010-02-18 |
Airbus Deutschland Gmbh |
Flugzeugsignalrechnersystem mit einer Mehrzahl von modularen Signalrechnereinheiten
|
US8031464B2
(en)
*
|
2008-09-08 |
2011-10-04 |
Intergraph Technologies Corporation |
Ruggedized computer capable of operating in high-temperature environments
|
US7903403B2
(en)
|
2008-10-17 |
2011-03-08 |
Cray Inc. |
Airflow intake systems and associated methods for use with computer cabinets
|
US8081459B2
(en)
|
2008-10-17 |
2011-12-20 |
Cray Inc. |
Air conditioning systems for computer systems and associated methods
|
WO2010096355A2
(en)
*
|
2009-02-17 |
2010-08-26 |
Parker Hannifin Corporation |
Cooling system utilizing multiple cold plates
|
US7978472B2
(en)
*
|
2009-06-10 |
2011-07-12 |
International Business Machines Corporation |
Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof
|
US8582298B2
(en)
*
|
2009-06-22 |
2013-11-12 |
Xyber Technologies |
Passive cooling enclosure system and method for electronics devices
|
US9036351B2
(en)
*
|
2009-06-22 |
2015-05-19 |
Xyber Technologies, Llc |
Passive cooling system and method for electronics devices
|
US20110079370A1
(en)
*
|
2009-07-17 |
2011-04-07 |
Textron Inc. |
Non-Uniform Height And Density Fin Design For Heat Sink
|
JP4783845B2
(ja)
|
2009-07-23 |
2011-09-28 |
東芝テック株式会社 |
電子機器
|
KR20120118456A
(ko)
*
|
2009-09-24 |
2012-10-26 |
파커-한니핀 코포레이션 |
냉각 시스템과, 변압기 냉각 시스템
|
JP5644767B2
(ja)
*
|
2009-09-29 |
2014-12-24 |
日本電気株式会社 |
電子機器装置の熱輸送構造
|
DE102009051298A1
(de)
*
|
2009-10-29 |
2011-05-05 |
Tlk-Thermo Gmbh |
Kühlsystem für eine Brennstoffzelle
|
JP2013509638A
(ja)
*
|
2009-10-30 |
2013-03-14 |
ヒューレット−パッカード デベロップメント カンパニー エル.ピー. |
ブレード・エンクロージャ用の熱バスバー
|
DE102009054585A1
(de)
*
|
2009-12-14 |
2011-06-16 |
Robert Bosch Gmbh |
Steuergerät
|
US8472181B2
(en)
|
2010-04-20 |
2013-06-25 |
Cray Inc. |
Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
|
TW201210454A
(en)
*
|
2010-08-24 |
2012-03-01 |
Hon Hai Prec Ind Co Ltd |
Server cabinet and liquid cooling system thereof
|
CN102378551A
(zh)
*
|
2010-08-24 |
2012-03-14 |
鸿富锦精密工业(深圳)有限公司 |
服务器机柜及其液冷散热系统
|
CN105828574B
(zh)
*
|
2010-08-26 |
2018-09-21 |
阿塞泰克丹麦公司 |
用于计算机服务器机架的冷却系统
|
CN102402261B
(zh)
*
|
2010-09-08 |
2014-11-12 |
神讯电脑(昆山)有限公司 |
具有防水功能的主机装置与其散热模块
|
TWI419641B
(zh)
*
|
2010-10-29 |
2013-12-11 |
Ind Tech Res Inst |
電子裝置之散熱結構
|
TW201221034A
(en)
*
|
2010-11-05 |
2012-05-16 |
Inventec Corp |
Cooling system of server and cooling method thereof
|
US20120279683A1
(en)
*
|
2011-05-05 |
2012-11-08 |
Alcatel-Lucent Usa Inc. |
Cooling apparatus for communications platforms
|
US8542489B2
(en)
*
|
2011-05-05 |
2013-09-24 |
Alcatel Lucent |
Mechanically-reattachable liquid-cooled cooling apparatus
|
US20130032313A1
(en)
*
|
2011-08-05 |
2013-02-07 |
Chun-Ming Wu |
Heat-dissipation unit and method of manufacturing same
|
US9049803B2
(en)
*
|
2011-09-22 |
2015-06-02 |
Panduit Corp. |
Thermal management infrastructure for IT equipment in a cabinet
|
US8934244B2
(en)
*
|
2011-10-28 |
2015-01-13 |
Dell Products L.P. |
System and method for cooling information handling resources
|
US9155230B2
(en)
*
|
2011-11-28 |
2015-10-06 |
Asetek Danmark A/S |
Cooling system for a server
|
WO2013119243A1
(en)
|
2012-02-09 |
2013-08-15 |
Hewlett-Packard Development Company, L.P. |
Heat dissipating system
|
KR101886477B1
(ko)
*
|
2012-03-12 |
2018-08-07 |
휴렛 팩커드 엔터프라이즈 디벨롭먼트 엘피 |
냉각 섹션을 갖는 랙 냉각 시스템
|
US9927187B2
(en)
|
2012-09-28 |
2018-03-27 |
Hewlett Packard Enterprise Development Lp |
Cooling assembly
|
JP6056362B2
(ja)
*
|
2012-10-12 |
2017-01-11 |
富士通株式会社 |
熱コネクタ及び電子機器
|
BR112015018354A2
(pt)
|
2013-01-31 |
2017-07-18 |
Hewlett Packard Development Co |
resfriamento de líquido
|
GB201303643D0
(en)
*
|
2013-03-01 |
2013-04-17 |
Iceotope Ltd |
Cooling system with redundancy
|
AU2014262796A1
(en)
|
2013-05-06 |
2015-12-24 |
Green Revolution Cooling, Inc. |
System and method of packaging computing resources for space and fire-resistance
|
WO2015175693A1
(en)
|
2014-05-13 |
2015-11-19 |
Green Revolution Cooling, Inc. |
System and method for air-cooling hard drives in liquid-cooled server rack
|
US9521782B2
(en)
*
|
2014-06-26 |
2016-12-13 |
General Electric Company |
Systems and methods for passive cooling of components within electrical devices
|
EP3185663A1
(de)
*
|
2014-08-18 |
2017-06-28 |
Murakumo Corporation |
System, informationsverarbeitungsvorrichtung und gestell
|
CN104363742B
(zh)
*
|
2014-11-13 |
2018-01-30 |
曙光信息产业股份有限公司 |
液冷服务器
|
CA3041616A1
(en)
|
2016-11-11 |
2018-05-17 |
Stulz Air Technology Systems, Inc. |
Dual mass cooling precision system
|
US10670650B2
(en)
*
|
2017-09-28 |
2020-06-02 |
Advantest Corporation |
Device testing with heat pipe cooling assembly
|
US10813246B2
(en)
*
|
2017-10-23 |
2020-10-20 |
Asia Vital Components (China) Co., Ltd. |
Chassis heat dissipation structure
|
US11359865B2
(en)
|
2018-07-23 |
2022-06-14 |
Green Revolution Cooling, Inc. |
Dual Cooling Tower Time Share Water Treatment System
|
US11540424B2
(en)
*
|
2018-09-14 |
2022-12-27 |
Mitsubishi Electric Corporation |
Electric power converter
|
US11147191B2
(en)
*
|
2018-10-29 |
2021-10-12 |
Quanta Computer Inc. |
Liquid cooling with outdoor chiller rack system
|
EP3829278B1
(de)
|
2019-11-29 |
2022-05-18 |
Ovh |
Kühlanordnung für einen in einem serverrack montierbaren server
|
US11147192B2
(en)
*
|
2019-12-23 |
2021-10-12 |
Baidu Usa Llc |
Fluid cooling system for an enclosed electronic package
|
US20210315120A1
(en)
*
|
2020-04-01 |
2021-10-07 |
Hamilton Sundstrand Corporation |
Wedge lock support columns in electronic chassis
|
USD982145S1
(en)
|
2020-10-19 |
2023-03-28 |
Green Revolution Cooling, Inc. |
Cooling system enclosure
|
USD998770S1
(en)
|
2020-10-19 |
2023-09-12 |
Green Revolution Cooling, Inc. |
Cooling system enclosure
|
US20220287206A1
(en)
*
|
2021-03-04 |
2022-09-08 |
TE Connectivity Services Gmbh |
Heat exchange assembly for an electrical device
|
US11805624B2
(en)
|
2021-09-17 |
2023-10-31 |
Green Revolution Cooling, Inc. |
Coolant shroud
|
US11925946B2
(en)
|
2022-03-28 |
2024-03-12 |
Green Revolution Cooling, Inc. |
Fluid delivery wand
|
US11839061B2
(en)
*
|
2022-04-25 |
2023-12-05 |
Hamilton Sundstrand Corporation |
Heat transfer interfaces for circuit card assembly (CCA) modules
|