PL364153A1 - Układ chłodzenia drukowanej płytki PCB z co najmniej jednym elementem elektronicznym wydzielającym ciepło - Google Patents

Układ chłodzenia drukowanej płytki PCB z co najmniej jednym elementem elektronicznym wydzielającym ciepło

Info

Publication number
PL364153A1
PL364153A1 PL03364153A PL36415303A PL364153A1 PL 364153 A1 PL364153 A1 PL 364153A1 PL 03364153 A PL03364153 A PL 03364153A PL 36415303 A PL36415303 A PL 36415303A PL 364153 A1 PL364153 A1 PL 364153A1
Authority
PL
Poland
Prior art keywords
cooling system
generates heat
electronic element
printed pcb
pcb
Prior art date
Application number
PL03364153A
Other languages
English (en)
Inventor
Gracjan Górak
Original Assignee
Advanced Digital Broadcast Ltd.
Advanced Digital Broadcast Polska Sp.z o.o.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Digital Broadcast Ltd., Advanced Digital Broadcast Polska Sp.z o.o. filed Critical Advanced Digital Broadcast Ltd.
Priority to PL03364153A priority Critical patent/PL364153A1/pl
Priority to US11/016,339 priority patent/US20050157469A1/en
Publication of PL364153A1 publication Critical patent/PL364153A1/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
PL03364153A 2003-12-19 2003-12-19 Układ chłodzenia drukowanej płytki PCB z co najmniej jednym elementem elektronicznym wydzielającym ciepło PL364153A1 (pl)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PL03364153A PL364153A1 (pl) 2003-12-19 2003-12-19 Układ chłodzenia drukowanej płytki PCB z co najmniej jednym elementem elektronicznym wydzielającym ciepło
US11/016,339 US20050157469A1 (en) 2003-12-19 2004-12-17 Cooling arrangement for a printed circuit board with a heat-dissipating electronic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL03364153A PL364153A1 (pl) 2003-12-19 2003-12-19 Układ chłodzenia drukowanej płytki PCB z co najmniej jednym elementem elektronicznym wydzielającym ciepło

Publications (1)

Publication Number Publication Date
PL364153A1 true PL364153A1 (pl) 2005-06-27

Family

ID=34748262

Family Applications (1)

Application Number Title Priority Date Filing Date
PL03364153A PL364153A1 (pl) 2003-12-19 2003-12-19 Układ chłodzenia drukowanej płytki PCB z co najmniej jednym elementem elektronicznym wydzielającym ciepło

Country Status (2)

Country Link
US (1) US20050157469A1 (pl)
PL (1) PL364153A1 (pl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7304854B2 (en) * 2005-04-15 2007-12-04 Foxconn Technology Co., Ltd. Heat dissipating device for electronic component
TWI300679B (en) * 2006-02-22 2008-09-01 Au Optronics Corp Assembly of fpc and electric component
US7806574B2 (en) * 2006-04-16 2010-10-05 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
US8425085B2 (en) * 2006-04-16 2013-04-23 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
DE102007019098B4 (de) * 2007-04-23 2020-02-13 Continental Automotive Gmbh Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau
US8058659B2 (en) 2008-08-26 2011-11-15 Albeo Technologies, Inc. LED chip-based lighting products and methods of building
US8981629B2 (en) 2008-08-26 2015-03-17 Albeo Technologies, Inc. Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby
US9076951B2 (en) 2008-08-26 2015-07-07 Albeo Technologies, Inc. Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby
US10061363B2 (en) * 2015-09-04 2018-08-28 Apple Inc. Combination parallel path heatsink and EMI shield
KR102674888B1 (ko) 2016-08-08 2024-06-14 삼성전자주식회사 인쇄회로기판 조립체

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3004578B2 (ja) * 1995-05-12 2000-01-31 財団法人工業技術研究院 熱放散増強のための多熱導伝路とパッケージ統合性及び信頼性向上のための縁の周りを囲むキャップからなる集積回路パッケージ
US5870285A (en) * 1996-10-25 1999-02-09 International Business Machines Corporation Assembly mounting techniques for heat sinks in electronic packaging
US5920458A (en) * 1997-05-28 1999-07-06 Lucent Technologies Inc. Enhanced cooling of a heat dissipating circuit element
JP3982876B2 (ja) * 1997-06-30 2007-09-26 沖電気工業株式会社 弾性表面波装置
TW411037U (en) * 1999-06-11 2000-11-01 Ind Tech Res Inst Integrated circuit packaging structure with dual directions of thermal conduction path
JP3923703B2 (ja) * 2000-03-29 2007-06-06 ローム株式会社 放熱手段を有するプリント配線板
US6432742B1 (en) * 2000-08-17 2002-08-13 St Assembly Test Services Pte Ltd. Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages
TW511450B (en) * 2001-08-16 2002-11-21 Orient Semiconductor Elect Ltd Heat dissipation plate with inlay pin and its assembly components
WO2003079436A1 (en) * 2002-03-13 2003-09-25 Tiqit Computers, Inc. Computer assembly for facilitating heat dissipation
US6775140B2 (en) * 2002-10-21 2004-08-10 St Assembly Test Services Ltd. Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices
US20050077614A1 (en) * 2003-10-10 2005-04-14 Chengalva Suresh K. Semiconductor device heat sink package and method

Also Published As

Publication number Publication date
US20050157469A1 (en) 2005-07-21

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Legal Events

Date Code Title Description
DISC Decisions on discontinuance of the proceedings (taken after the publication of the particulars of the applications)