DE60209423D1 - Mikrochip-Kühlung auf Leiterplatte - Google Patents

Mikrochip-Kühlung auf Leiterplatte

Info

Publication number
DE60209423D1
DE60209423D1 DE60209423T DE60209423T DE60209423D1 DE 60209423 D1 DE60209423 D1 DE 60209423D1 DE 60209423 T DE60209423 T DE 60209423T DE 60209423 T DE60209423 T DE 60209423T DE 60209423 D1 DE60209423 D1 DE 60209423D1
Authority
DE
Germany
Prior art keywords
circuit board
microchip
cooling
microchip cooling
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60209423T
Other languages
English (en)
Other versions
DE60209423T2 (de
Inventor
Marcus Mueller
Jochen Zaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Verigy Singapore Pte Ltd
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Application granted granted Critical
Publication of DE60209423D1 publication Critical patent/DE60209423D1/de
Publication of DE60209423T2 publication Critical patent/DE60209423T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE60209423T 2002-11-08 2002-11-08 Mikrochip-Kühlung auf Leiterplatte Expired - Lifetime DE60209423T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02024869A EP1333492B1 (de) 2002-11-08 2002-11-08 Mikrochip-Kühlung auf Leiterplatte

Publications (2)

Publication Number Publication Date
DE60209423D1 true DE60209423D1 (de) 2006-04-27
DE60209423T2 DE60209423T2 (de) 2006-08-10

Family

ID=8185488

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60209423T Expired - Lifetime DE60209423T2 (de) 2002-11-08 2002-11-08 Mikrochip-Kühlung auf Leiterplatte

Country Status (3)

Country Link
US (1) US6809930B2 (de)
EP (1) EP1333492B1 (de)
DE (1) DE60209423T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6636062B2 (en) * 2001-04-10 2003-10-21 Delta Design, Inc. Temperature control device for an electronic component
GB0308305D0 (en) * 2003-04-10 2003-05-14 Hewlett Packard Development Co Digital message encryption and authentication
JP2004348650A (ja) * 2003-05-26 2004-12-09 Toshiba Corp 電子機器
DE60319523T2 (de) * 2003-08-07 2009-03-26 Harman Becker Automotive Systems Gmbh Vorrichtung zur Kühlung von Halbleiterbauteilen auf Leiterplatten
JP4182430B2 (ja) * 2003-11-28 2008-11-19 オムロン株式会社 送信機
JP4387777B2 (ja) * 2003-11-28 2009-12-24 株式会社東芝 電子機器
US7068510B2 (en) * 2003-12-04 2006-06-27 International Business Machines Corporation Dissipating heat reliably in computer systems
JP2005315156A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプおよびポンプを備える電子機器
JP4234635B2 (ja) * 2004-04-28 2009-03-04 株式会社東芝 電子機器
JP2005317796A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置および電子機器
JP2005317797A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、電子機器および冷却装置
JP2005315158A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置、および電子機器
JP4343032B2 (ja) * 2004-05-31 2009-10-14 株式会社東芝 冷却構造および投射型画像表示装置
JP2005344562A (ja) * 2004-06-01 2005-12-15 Toshiba Corp ポンプ、冷却装置および冷却装置を有する電子機器
JP4715231B2 (ja) * 2005-02-22 2011-07-06 日本電気株式会社 ヒートシンクの実装構造
US20070076377A1 (en) * 2005-10-03 2007-04-05 Matteo Gravina Bi-Polar Thermal Managment
JP4992287B2 (ja) * 2006-04-28 2012-08-08 日本電産株式会社 モータ
US7460371B2 (en) * 2006-05-25 2008-12-02 Agilent Technologies, Inc. Wiffle tree components, cooling systems, and methods of attaching a printed circuit board to a heat sink
US7782622B1 (en) * 2006-10-04 2010-08-24 Nvidia Corporation Attachment apparatus for electronic boards
DE102007049035B4 (de) 2007-10-11 2011-01-13 GE Fanuc Intelligent Platforms Embedded Systems, Inc. (n.d.Ges.d. Staates Delaware) Chipkühlvorrichtung mit Keilelement
DE102007052397B4 (de) 2007-10-31 2009-09-24 GE Fanuc Intelligent Platforms Embedded Systems, Inc. (n.d.Ges.d. Staates Delaware) Kühlanordnung zur thermischen Kontaktierung zwischen elektronischem Bauelement und Kühlkörper
US7957623B2 (en) * 2008-09-19 2011-06-07 Pyrophotonics Lasers Inc. Deformable thermal pads for optical fibers
US8891235B2 (en) * 2012-06-29 2014-11-18 Intel Corporation Thermal interface for multi-chip packages
DE102014106570B4 (de) 2014-05-09 2016-03-31 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Schalteinrichtung und Anordnung hiermit
WO2017111842A1 (en) * 2015-12-26 2017-06-29 Intel Corporation Adjustable gap structure for mobile devices

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3356904A (en) * 1966-12-07 1967-12-05 Rlf Ind Inc Heat dissipating arrangement for electrical components
US5089936A (en) * 1988-09-09 1992-02-18 Hitachi, Ltd. Semiconductor module
CA2002213C (en) * 1988-11-10 1999-03-30 Iwona Turlik High performance integrated circuit chip package and method of making same
US5190097A (en) * 1992-06-08 1993-03-02 Chrysler Corp Integrated clamping device for component heatsinking
WO1994029901A1 (de) * 1993-06-07 1994-12-22 Melcher Ag Befestigungsvorrichtung für halbleiter-schaltelemente
US5552961A (en) * 1995-05-18 1996-09-03 Northern Telecom Limited Electronic unit
US5735340A (en) * 1996-05-15 1998-04-07 Silicon Graphics, Inc. Heat sink with integral attachment mechanism
US5757621A (en) * 1996-06-06 1998-05-26 Lucent Technologies Inc. Heat sink assembly employing spring-loaded standoffs
US6046905A (en) * 1996-09-30 2000-04-04 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
US5883782A (en) * 1997-03-05 1999-03-16 Intel Corporation Apparatus for attaching a heat sink to a PCB mounted semiconductor package
US5960535A (en) * 1997-10-28 1999-10-05 Hewlett-Packard Company Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
US6275381B1 (en) * 1998-12-10 2001-08-14 International Business Machines Corporation Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
US6154365A (en) * 1999-02-26 2000-11-28 Intel Corporation Spring fixture that attaches a heat sink to a substrate for multiple cycle assembly/disassembly
JP2001110966A (ja) * 1999-10-12 2001-04-20 Showa Alum Corp 電子機器用放熱装置
US6504243B1 (en) * 2000-04-07 2003-01-07 Advanced Micro Devices, Inc. Removable heat transfer apparatus for a pin grid array (PGA) device, and associated installation and removal methods
US6459582B1 (en) * 2000-07-19 2002-10-01 Fujitsu Limited Heatsink apparatus for de-coupling clamping forces on an integrated circuit package
US6469893B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
US6545352B1 (en) * 2002-02-15 2003-04-08 Ericsson Inc. Assembly for mounting power semiconductive modules to heat dissipators

Also Published As

Publication number Publication date
US20040090745A1 (en) 2004-05-13
DE60209423T2 (de) 2006-08-10
US6809930B2 (en) 2004-10-26
EP1333492B1 (de) 2006-03-01
EP1333492A1 (de) 2003-08-06

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Representative=s name: SCHOPPE, ZIMMERMANN, STOECKELER & ZINKLER, 82049 PU

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: VERIGY (SINGAPORE) PTE. LTD., SINGAPORE, SG

R082 Change of representative

Ref document number: 1333492

Country of ref document: EP

Representative=s name: SCHOPPE, ZIMMERMANN, STOECKELER, ZINKLER & PARTNER