DE60231610D1 - Mehrschichtige gedruckte Leiterplatte - Google Patents

Mehrschichtige gedruckte Leiterplatte

Info

Publication number
DE60231610D1
DE60231610D1 DE60231610T DE60231610T DE60231610D1 DE 60231610 D1 DE60231610 D1 DE 60231610D1 DE 60231610 T DE60231610 T DE 60231610T DE 60231610 T DE60231610 T DE 60231610T DE 60231610 D1 DE60231610 D1 DE 60231610D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
multilayer printed
multilayer
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60231610T
Other languages
English (en)
Inventor
Shigemasa Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Application granted granted Critical
Publication of DE60231610D1 publication Critical patent/DE60231610D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Inorganic Insulating Materials (AREA)
DE60231610T 2002-07-29 2002-12-23 Mehrschichtige gedruckte Leiterplatte Expired - Lifetime DE60231610D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002219217A JP3888254B2 (ja) 2002-07-29 2002-07-29 多層プリント配線板

Publications (1)

Publication Number Publication Date
DE60231610D1 true DE60231610D1 (de) 2009-04-30

Family

ID=30112893

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60231610T Expired - Lifetime DE60231610D1 (de) 2002-07-29 2002-12-23 Mehrschichtige gedruckte Leiterplatte

Country Status (4)

Country Link
US (1) US6713163B2 (de)
EP (1) EP1387605B1 (de)
JP (1) JP3888254B2 (de)
DE (1) DE60231610D1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060045208A (ko) * 2004-11-12 2006-05-17 삼성테크윈 주식회사 반도체 팩키지용 회로기판 및 이의 제조방법
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法
KR100824717B1 (ko) * 2006-04-07 2008-04-24 박종길 방열기판 및 그 제조방법
TWI365525B (en) * 2007-12-24 2012-06-01 Ind Tech Res Inst An ultra thin package for a sensor chip of a micro electro mechanical system
JP2012507599A (ja) * 2008-10-29 2012-03-29 アイシーエル−アイピー アメリカ インコーポレイテッド リン含有難燃性エポキシ樹脂組成物、プリプレグおよびその積層板
AT12325U1 (de) * 2009-06-30 2012-03-15 Austria Tech & System Tech Mehrlagige leiterplatte, insbesondere flammbeständige und/oder rauchgas unterdrückende mehrlagige leiterplatte
WO2014206487A1 (en) 2013-06-28 2014-12-31 Fundacion Imdea Materiales A halogen free flame retardant epoxy resin composition
JP6983603B2 (ja) * 2017-09-27 2021-12-17 京セラ株式会社 有機絶縁体、金属張積層板および配線基板
CN113056799B (zh) 2018-11-15 2023-03-31 京瓷株式会社 有机绝缘体、覆金属层叠板及布线基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823694B2 (ja) * 1988-08-04 1996-03-06 富士写真フイルム株式会社 液状感光性樹脂組成物
JPH05318650A (ja) * 1992-05-15 1993-12-03 Toshiba Chem Corp 銅張積層板
JP2787846B2 (ja) * 1993-04-13 1998-08-20 住友ベークライト株式会社 印刷回路用積層板
KR100228047B1 (ko) * 1995-09-29 1999-11-01 야부키 가즈시게 할로겐프리의 난연성 에폭시수지조성물 및 그를함유하는 프리프래그 및 적층판
JP2000290474A (ja) * 1999-04-01 2000-10-17 Asahi Chem Ind Co Ltd 難燃・硬化性樹脂組成物
JP2001049085A (ja) * 1999-08-09 2001-02-20 Toshiba Chem Corp ハロゲンフリーの難燃性エポキシ樹脂組成物、プリプレグおよび積層製品
JP4423779B2 (ja) * 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
JP4633214B2 (ja) * 1999-12-08 2011-02-16 富士通株式会社 エポキシ樹脂組成物
JP3394029B2 (ja) * 2000-03-21 2003-04-07 大塚化学株式会社 難燃性エポキシ樹脂組成物、及びその成形物、及び電子部品
JP2002040632A (ja) * 2000-07-21 2002-02-06 Showa Denko Kk レジストインキ組成物
JP3905325B2 (ja) * 2001-04-23 2007-04-18 富士通株式会社 多層プリント配線板

Also Published As

Publication number Publication date
EP1387605A2 (de) 2004-02-04
US6713163B2 (en) 2004-03-30
EP1387605B1 (de) 2009-03-18
JP3888254B2 (ja) 2007-02-28
EP1387605A3 (de) 2004-11-24
US20040018348A1 (en) 2004-01-29
JP2004063718A (ja) 2004-02-26

Similar Documents

Publication Publication Date Title
DE60232383D1 (de) Mehrschichtige Leiterplatte
FI20022140A (fi) Joustava painettu piirilevy
DE60045566D1 (de) Mehrschicht-Leiterplatte
HK1075169A1 (en) Technique for interconnecting multilayer circuit boards
DE69942711D1 (de) Mehrschichtige gedruckte Leiterplatte
DE60135963D1 (de) Mehrschichtelektronikbauteil
GB2422491B (en) Printed Circuit Board
HK1054462A1 (en) Flexible printed circuit board
DE602004028794D1 (de) Leiterplatte
DE60309777D1 (de) Anschlusskontakt für Leiterplatte
AU2003295369A8 (en) Cross connect via for multilayer printed circuit boards
DE60143235D1 (de) Mehrschichtige Leiterplatte
DE10291003D2 (de) Mehrschichtige Leiterplatte
DE60039569D1 (de) Gedruckte Leiterplatte
GB0403017D0 (en) HF multilayer printed circuit board
TW487272U (en) Multilayer circuit boards
AU2003272831A8 (en) Circuit board threadplate
DE60119194D1 (de) Leiterplattenanordnung
AU2003275432A8 (en) Circuit board standoff
GB2404089B (en) Printed circuit board assembly
DE60231610D1 (de) Mehrschichtige gedruckte Leiterplatte
DE602004015387D1 (de) Leiterplatte
DE69939157D1 (de) Gedruckte Leiterplatte
DE69938982D1 (de) Mehrlagen Gedruckteschaltungsplatte
DE60020193D1 (de) Mehrschichtige Leiterplatte

Legal Events

Date Code Title Description
8364 No opposition during term of opposition