DE60119194D1 - Leiterplattenanordnung - Google Patents

Leiterplattenanordnung

Info

Publication number
DE60119194D1
DE60119194D1 DE60119194T DE60119194T DE60119194D1 DE 60119194 D1 DE60119194 D1 DE 60119194D1 DE 60119194 T DE60119194 T DE 60119194T DE 60119194 T DE60119194 T DE 60119194T DE 60119194 D1 DE60119194 D1 DE 60119194D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
board assembly
assembly
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60119194T
Other languages
English (en)
Other versions
DE60119194T2 (de
Inventor
Kah Phang Loh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Technology Corp
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Application granted granted Critical
Publication of DE60119194D1 publication Critical patent/DE60119194D1/de
Publication of DE60119194T2 publication Critical patent/DE60119194T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
DE60119194T 2000-02-22 2001-02-09 Leiterplattenanordnung Expired - Fee Related DE60119194T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200000573 2000-02-22
SG200000573A SG91855A1 (en) 2000-02-22 2000-02-22 Circuit board assembly

Publications (2)

Publication Number Publication Date
DE60119194D1 true DE60119194D1 (de) 2006-06-08
DE60119194T2 DE60119194T2 (de) 2006-08-31

Family

ID=20430523

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60119194T Expired - Fee Related DE60119194T2 (de) 2000-02-22 2001-02-09 Leiterplattenanordnung

Country Status (5)

Country Link
US (1) US6717820B1 (de)
EP (1) EP1128714B9 (de)
JP (1) JP2001298200A (de)
DE (1) DE60119194T2 (de)
SG (1) SG91855A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4193447B2 (ja) 2002-08-23 2008-12-10 日本電気株式会社 カード型光通信モジュール
JP4210240B2 (ja) * 2004-06-03 2009-01-14 ローム株式会社 光通信モジュール
JP4455301B2 (ja) * 2004-12-07 2010-04-21 日東電工株式会社 配線回路基板およびその接続構造
JP4646618B2 (ja) * 2004-12-20 2011-03-09 イビデン株式会社 光路変換部材、多層プリント配線板および光通信用デバイス
JP2006228895A (ja) * 2005-02-16 2006-08-31 Alps Electric Co Ltd 立体回路モジュール及びその製造方法
KR101017975B1 (ko) 2010-06-22 2011-03-02 주식회사 로스윈 휴대단말기용 안테나 및 그 제조 방법
US8737080B2 (en) 2011-01-14 2014-05-27 Qualcomm Incorporated Modular surface mount package for a system on a chip
DE102013211640A1 (de) * 2013-06-20 2014-12-24 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung
US9967984B1 (en) * 2015-01-14 2018-05-08 Vlt, Inc. Power adapter packaging
US9936580B1 (en) 2015-01-14 2018-04-03 Vlt, Inc. Method of forming an electrical connection to an electronic module
US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
CN107710887B (zh) * 2015-06-19 2020-02-21 日本电信电话株式会社 柔性印刷电路板的焊料接合构造
US9493083B1 (en) 2015-06-22 2016-11-15 Delphi Technologies, Inc. Electrical plug adapter
US9693459B2 (en) 2015-07-16 2017-06-27 Delphi Technologies, Inc. Circuit board assembly and method of manufacturing same
CN105228345A (zh) * 2015-11-05 2016-01-06 福建众益太阳能科技股份公司 太阳能灯、用于太阳能灯的pcb线路板及其制作方法
TWI733074B (zh) * 2019-01-09 2021-07-11 榮晶生物科技股份有限公司 微型電子裝置及其電路基板
DE202019106231U1 (de) * 2019-11-08 2019-12-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Rotationsfähiger optischer Kurzstrecken-Transceiver

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4119427A1 (de) * 1991-06-13 1992-12-17 H Albert Tu Kompaktschaltplatte eines computers
JPH06334298A (ja) * 1993-05-27 1994-12-02 Fujitsu Ltd 表面実装部品の搭載構造
US5506445A (en) * 1994-06-24 1996-04-09 Hewlett-Packard Company Optical transceiver module
WO1997017627A1 (en) * 1995-11-08 1997-05-15 Siemens Microelectronics, Inc. Low profile optical device with multiple mounting configurations
JP3393013B2 (ja) * 1996-07-22 2003-04-07 株式会社シチズン電子 赤外線送受信モジュールの構造
JP3786227B2 (ja) * 1997-02-19 2006-06-14 シチズン電子株式会社 赤外線データ通信モジュール及びその製造方法
TW346687B (en) * 1997-09-15 1998-12-01 Ind Tech Res Inst Package of semiconductor laser diode and compact disk with two-wavelength read/write head
JP3198332B2 (ja) * 1997-12-16 2001-08-13 ローム株式会社 表示装置のマザーボードへの実装方法、および表示装置の実装構造
US5977567A (en) * 1998-01-06 1999-11-02 Lightlogic, Inc. Optoelectronic assembly and method of making the same
JPH11214795A (ja) * 1998-01-21 1999-08-06 Oki Electric Ind Co Ltd 光半導体モジュール
DE19808004A1 (de) * 1998-02-26 1999-09-09 Vishay Semiconductor Gmbh Bauteil zur optischen Datenübertragung
US6252252B1 (en) * 1998-04-16 2001-06-26 Sanyo Electric Co., Ltd. Optical semiconductor device and optical semiconductor module equipped with the same
DE19816794A1 (de) * 1998-04-16 1999-10-21 Bosch Gmbh Robert Leiterplattenverbund

Also Published As

Publication number Publication date
US6717820B1 (en) 2004-04-06
DE60119194T2 (de) 2006-08-31
EP1128714A1 (de) 2001-08-29
EP1128714B9 (de) 2006-07-26
JP2001298200A (ja) 2001-10-26
EP1128714B1 (de) 2006-05-03
SG91855A1 (en) 2002-10-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US

8328 Change in the person/name/address of the agent

Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELLSCHA

8327 Change in the person/name/address of the patent owner

Owner name: LITE-ON TECHNOLOGY CORP., NEIHU, TAIPEI, TW

8328 Change in the person/name/address of the agent

Representative=s name: HOEFER & PARTNER, 81543 MUENCHEN

8339 Ceased/non-payment of the annual fee