DE60131485D1 - Leiterplatte - Google Patents
LeiterplatteInfo
- Publication number
- DE60131485D1 DE60131485D1 DE60131485T DE60131485T DE60131485D1 DE 60131485 D1 DE60131485 D1 DE 60131485D1 DE 60131485 T DE60131485 T DE 60131485T DE 60131485 T DE60131485 T DE 60131485T DE 60131485 D1 DE60131485 D1 DE 60131485D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0234—Resistors or by disposing resistive or lossy substances in or near power planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000053997A JP3652203B2 (ja) | 2000-02-29 | 2000-02-29 | 配線基板 |
JP2000053997 | 2000-02-29 | ||
JP2000130989A JP3615688B2 (ja) | 2000-04-28 | 2000-04-28 | 配線基板 |
JP2000130989 | 2000-04-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60131485D1 true DE60131485D1 (de) | 2008-01-03 |
DE60131485T2 DE60131485T2 (de) | 2008-10-09 |
Family
ID=26586394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60131485T Expired - Lifetime DE60131485T2 (de) | 2000-02-29 | 2001-02-27 | Leiterplatte |
Country Status (3)
Country | Link |
---|---|
US (1) | US6469259B2 (de) |
EP (1) | EP1130950B1 (de) |
DE (1) | DE60131485T2 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19907542C2 (de) * | 1999-02-22 | 2003-07-31 | Vacuumschmelze Gmbh | Flacher Magnetkern |
DE10291003D2 (de) * | 2001-03-08 | 2004-04-15 | Ilfa Industrieelektronik Und L | Mehrschichtige Leiterplatte |
JP3531621B2 (ja) * | 2001-04-12 | 2004-05-31 | 日本電気株式会社 | 携帯型無線利用機器 |
US20030042044A1 (en) * | 2001-08-30 | 2003-03-06 | Micron Technology, Inc. | Circuit board plane interleave apparatus and method |
JP2003283086A (ja) * | 2002-01-21 | 2003-10-03 | Hitachi Cable Ltd | 配線基板、配線基板の製造方法及び配線基板を用いた電子部品 |
WO2004077906A1 (en) * | 2003-02-28 | 2004-09-10 | Wireless Lan Systems Oy | A circuit board and arrangement for minimizing thermal and electromagnetic effects |
JP4101156B2 (ja) * | 2003-11-05 | 2008-06-18 | シャープ株式会社 | 回路基板 |
US7508062B2 (en) * | 2005-03-11 | 2009-03-24 | Lsi Corporation | Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs |
EP1910389A4 (de) * | 2005-05-31 | 2010-03-10 | Life Technologies Corp | Auftrennung und aufreinigung von nukleinsäure aus paraffinhaltigen proben |
US8134084B2 (en) | 2006-06-30 | 2012-03-13 | Shin-Etsu Polymer Co., Ltd. | Noise-suppressing wiring-member and printed wiring board |
WO2008018870A1 (en) * | 2006-08-09 | 2008-02-14 | Geomat Insights, Llc | Integral charge storage basement and wideband embedded decoupling structure for integrated circuit |
JP5165912B2 (ja) * | 2007-03-15 | 2013-03-21 | 株式会社日立製作所 | 低ノイズ半導体装置 |
JPWO2011114944A1 (ja) * | 2010-03-15 | 2013-06-27 | 日本電気株式会社 | ノイズ抑制構造 |
JP5088427B2 (ja) * | 2011-03-02 | 2012-12-05 | 第一精工株式会社 | 電気コネクタ及び電気コネクタ組立体 |
TW201316895A (zh) * | 2011-10-14 | 2013-04-16 | Hon Hai Prec Ind Co Ltd | 可抑制電磁干擾的電路板 |
CN107318215A (zh) * | 2016-04-26 | 2017-11-03 | 鸿富锦精密电子(天津)有限公司 | 印刷电路板及应用该印刷电路板的电子装置 |
JP6735185B2 (ja) * | 2016-08-25 | 2020-08-05 | 京セラ株式会社 | 多層配線基板および電子装置 |
JP6519630B1 (ja) * | 2017-10-30 | 2019-05-29 | ダイキン工業株式会社 | 電流検出装置 |
US11259403B1 (en) * | 2020-10-30 | 2022-02-22 | SK Hynix Inc. | Printed circuit board structure for solid state drives |
CN113194599B (zh) * | 2021-04-23 | 2022-05-03 | 四川九洲电器集团有限责任公司 | 一种基于多功能复合基板的一体化集成方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3090453B2 (ja) * | 1989-07-10 | 2000-09-18 | 株式会社日立製作所 | 厚膜薄膜積層基板およびそれを用いた電子回路装置 |
JPH09205290A (ja) * | 1996-01-24 | 1997-08-05 | Hitachi Ltd | 低emi構造を有する回路基板 |
JPH09266361A (ja) | 1996-03-28 | 1997-10-07 | Oki Electric Ind Co Ltd | 回路基板の電圧変動吸収構造 |
JPH10126014A (ja) * | 1996-10-23 | 1998-05-15 | Sony Corp | 回路基板 |
US5898576A (en) * | 1996-11-12 | 1999-04-27 | Bay Networks Inc. | Printed circuit board including a terminated power plane and method of manufacturing the same |
JP3926880B2 (ja) * | 1997-03-31 | 2007-06-06 | 富士通株式会社 | 多層プリント板 |
US6181571B1 (en) * | 1998-03-06 | 2001-01-30 | Canon Kabushiki Kaisha | Printed-wiring board and electronic device having the same wiring board |
JP4260243B2 (ja) * | 1998-05-25 | 2009-04-30 | 三菱電機株式会社 | 積層構造のプリント配線板 |
US6137064A (en) * | 1999-06-11 | 2000-10-24 | Teradyne, Inc. | Split via surface mount connector and related techniques |
-
2001
- 2001-02-27 EP EP01104820A patent/EP1130950B1/de not_active Expired - Lifetime
- 2001-02-27 US US09/795,765 patent/US6469259B2/en not_active Expired - Fee Related
- 2001-02-27 DE DE60131485T patent/DE60131485T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20010050182A1 (en) | 2001-12-13 |
EP1130950A2 (de) | 2001-09-05 |
DE60131485T2 (de) | 2008-10-09 |
EP1130950A3 (de) | 2003-12-17 |
EP1130950B1 (de) | 2007-11-21 |
US6469259B2 (en) | 2002-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8328 | Change in the person/name/address of the agent |
Representative=s name: WITTE, WELLER & PARTNER, 70178 STUTTGART |
|
8381 | Inventor (new situation) |
Inventor name: TAKESHITA, YOSHIHIRO, KAGOSHIMA 899-4312, JP Inventor name: TERAO, SHINYA, KAGOSHIMA 899-4312, JP Inventor name: TAKENOUCHI, SATORU, KAGOSHIMA 899-4312, JP Inventor name: KAJI, MASAKI, KAGOSHIMA 899-4312, JP Inventor name: KOGA, RYUJI, OKAYAMA-SHI, OKAYAMA 700-0080, JP |
|
8364 | No opposition during term of opposition |