DE60135963D1 - Mehrschichtelektronikbauteil - Google Patents
MehrschichtelektronikbauteilInfo
- Publication number
- DE60135963D1 DE60135963D1 DE60135963T DE60135963T DE60135963D1 DE 60135963 D1 DE60135963 D1 DE 60135963D1 DE 60135963 T DE60135963 T DE 60135963T DE 60135963 T DE60135963 T DE 60135963T DE 60135963 D1 DE60135963 D1 DE 60135963D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic component
- multilayer electronic
- multilayer
- component
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000307097A JP4332634B2 (ja) | 2000-10-06 | 2000-10-06 | 積層型電子部品 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60135963D1 true DE60135963D1 (de) | 2008-11-13 |
Family
ID=18787660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60135963T Expired - Lifetime DE60135963D1 (de) | 2000-10-06 | 2001-10-08 | Mehrschichtelektronikbauteil |
Country Status (5)
Country | Link |
---|---|
US (1) | US6452781B1 (de) |
EP (1) | EP1195783B1 (de) |
JP (1) | JP4332634B2 (de) |
DE (1) | DE60135963D1 (de) |
TW (1) | TW516052B (de) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001185442A (ja) * | 1999-12-27 | 2001-07-06 | Murata Mfg Co Ltd | 積層コンデンサ、デカップリングコンデンサの接続構造および配線基板 |
US6760227B2 (en) * | 2000-11-02 | 2004-07-06 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and manufacturing method thereof |
US6545346B2 (en) * | 2001-03-23 | 2003-04-08 | Intel Corporation | Integrated circuit package with a capacitor |
US7152291B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
EP1369922B1 (de) * | 2002-06-07 | 2011-03-09 | STMicroelectronics Srl | Mehrschichtige Metallstruktur eines Spannungsversorgungsringes mit großem parasitärem Widerstand |
CN100354995C (zh) * | 2002-09-27 | 2007-12-12 | 京瓷株式会社 | 电容器、布线基板、去耦电路及高频电路 |
CN100437850C (zh) * | 2002-10-30 | 2008-11-26 | 京瓷株式会社 | 电容器,布线基板,退耦电路以及高频电路 |
US6950300B2 (en) * | 2003-05-06 | 2005-09-27 | Marvell World Trade Ltd. | Ultra low inductance multi layer ceramic capacitor |
US6992387B2 (en) * | 2003-06-23 | 2006-01-31 | Intel Corporation | Capacitor-related systems for addressing package/motherboard resonance |
KR100714608B1 (ko) * | 2004-12-03 | 2007-05-07 | 삼성전기주식회사 | 적층형 칩 커패시터 |
KR100649579B1 (ko) * | 2004-12-07 | 2006-11-28 | 삼성전기주식회사 | 적층형 캐패시터 및 적층형 캐패시터 어레이 |
JP4167231B2 (ja) * | 2005-01-13 | 2008-10-15 | Tdk株式会社 | 積層コンデンサ、及び、積層コンデンサの等価直列抵抗調整方法 |
JP2006286731A (ja) * | 2005-03-31 | 2006-10-19 | Tdk Corp | 積層コンデンサ |
JP2006295077A (ja) * | 2005-04-14 | 2006-10-26 | Rohm Co Ltd | セラミック製チップ型電子部品とその製造方法 |
DE102005022142B4 (de) * | 2005-05-12 | 2011-12-15 | Epcos Ag | Verfahren zur Herstellung eines elektrischen Durchführungsbauelementes |
DE102005036102A1 (de) * | 2005-08-01 | 2007-02-08 | Epcos Ag | Elektrisches Bauelement |
US7652869B2 (en) | 2005-08-19 | 2010-01-26 | Tdk Corporation | Multilayer capacitor |
KR100846080B1 (ko) | 2005-08-19 | 2008-07-14 | 티디케이가부시기가이샤 | 적층 콘덴서 |
US7697262B2 (en) * | 2005-10-31 | 2010-04-13 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
US7414857B2 (en) * | 2005-10-31 | 2008-08-19 | Avx Corporation | Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
US7292429B2 (en) * | 2006-01-18 | 2007-11-06 | Kemet Electronics Corporation | Low inductance capacitor |
DE102006007331A1 (de) * | 2006-02-16 | 2007-08-23 | Infineon Technologies Ag | Mehrlagen-Kapazitäts-Anordnung und Verfahren zum Herstellen derselben |
JP2007234800A (ja) * | 2006-02-28 | 2007-09-13 | Tdk Corp | 電子部品及びその製造方法 |
JP4433204B2 (ja) * | 2006-03-10 | 2010-03-17 | Tdk株式会社 | 積層セラミックコンデンサ |
JP4738218B2 (ja) * | 2006-03-20 | 2011-08-03 | 日本特殊陶業株式会社 | 積層型電子部品 |
JP4335237B2 (ja) * | 2006-07-21 | 2009-09-30 | Tdk株式会社 | 貫通型積層コンデンサ |
JP4896642B2 (ja) * | 2006-09-12 | 2012-03-14 | Tdk株式会社 | 積層コンデンサ及び電子機器 |
US7545623B2 (en) * | 2006-11-27 | 2009-06-09 | Kemet Electronics Corporation | Interposer decoupling array having reduced electrical shorts |
JP4434228B2 (ja) * | 2007-03-30 | 2010-03-17 | Tdk株式会社 | 積層コンデンサアレイ |
US8238116B2 (en) | 2007-04-13 | 2012-08-07 | Avx Corporation | Land grid feedthrough low ESL technology |
KR100925623B1 (ko) * | 2007-08-31 | 2009-11-06 | 삼성전기주식회사 | 적층형 칩 커패시터 및 이를 구비한 회로기판 장치 및회로기판 |
JP4548492B2 (ja) * | 2008-02-13 | 2010-09-22 | Tdk株式会社 | 積層コンデンサアレイ |
US8446705B2 (en) * | 2008-08-18 | 2013-05-21 | Avx Corporation | Ultra broadband capacitor |
US8242375B2 (en) * | 2008-09-18 | 2012-08-14 | United Technologies Corporation | Conductive emissions protection |
US8713857B2 (en) * | 2008-12-03 | 2014-05-06 | Michael Logue | Modular panel system |
KR20110072938A (ko) * | 2009-12-23 | 2011-06-29 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조방법 |
JP5218545B2 (ja) * | 2010-12-24 | 2013-06-26 | Tdk株式会社 | 積層コンデンサ |
KR101376839B1 (ko) * | 2012-10-12 | 2014-03-20 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
US9299498B2 (en) * | 2012-11-15 | 2016-03-29 | Eulex Corp. | Miniature wire-bondable capacitor |
US9731456B2 (en) | 2013-03-14 | 2017-08-15 | Sabic Global Technologies B.V. | Method of manufacturing a functionally graded article |
KR101477405B1 (ko) * | 2013-07-05 | 2014-12-29 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 실장 기판 |
KR101477426B1 (ko) * | 2013-11-04 | 2014-12-29 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
KR102150558B1 (ko) * | 2015-05-29 | 2020-09-01 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 제조 방법 |
KR101867982B1 (ko) | 2016-07-20 | 2018-06-18 | 삼성전기주식회사 | 커패시터 및 그 실장 기판 |
KR102494324B1 (ko) * | 2016-07-27 | 2023-02-01 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
KR102427927B1 (ko) * | 2017-11-10 | 2022-08-02 | 삼성전기주식회사 | 3단자 적층형 커패시터 |
KR102584968B1 (ko) * | 2018-05-31 | 2023-10-05 | 삼성전기주식회사 | 커패시터 부품 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6481306A (en) * | 1987-09-24 | 1989-03-27 | Nec Corp | Laminated ceramic capacitor and manufacture thereof |
US4864465A (en) * | 1988-05-10 | 1989-09-05 | The United States Of America | Viad chip capacitor and method for making same |
US5521332A (en) * | 1992-08-31 | 1996-05-28 | Kyocera Corporation | High dielectric layer-containing alumina-based wiring substrate and package for semiconductor device |
US5386339A (en) * | 1993-07-29 | 1995-01-31 | Hughes Aircraft Company | Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink |
US5402003A (en) * | 1993-11-12 | 1995-03-28 | Trw Inc. | Low dielectric constant interconnect for multichip modules |
JPH07326536A (ja) * | 1994-05-31 | 1995-12-12 | Kyocera Corp | セラミックコンデンサ |
JPH0855758A (ja) * | 1994-08-10 | 1996-02-27 | Sumitomo Metal Ind Ltd | 積層コンデンサ |
JPH0897070A (ja) * | 1994-09-22 | 1996-04-12 | Kyocera Corp | セラミックコンデンサ |
US5798563A (en) * | 1997-01-28 | 1998-08-25 | International Business Machines Corporation | Polytetrafluoroethylene thin film chip carrier |
JPH10270282A (ja) * | 1997-03-21 | 1998-10-09 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサ |
WO1998047331A1 (fr) * | 1997-04-16 | 1998-10-22 | Kabushiki Kaisha Toshiba | Tableau de connexions, son procede de fabrication et boitier de semi-conducteur |
JPH10303068A (ja) * | 1997-04-25 | 1998-11-13 | Matsushita Electric Ind Co Ltd | 複合積層セラミック部品 |
US5880925A (en) | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
JPH11135356A (ja) * | 1997-10-30 | 1999-05-21 | Kyocera Corp | 積層セラミックコンデンサ |
JP2991175B2 (ja) | 1997-11-10 | 1999-12-20 | 株式会社村田製作所 | 積層コンデンサ |
JPH11204372A (ja) * | 1997-11-14 | 1999-07-30 | Murata Mfg Co Ltd | 積層コンデンサ |
TW457498B (en) * | 1998-12-03 | 2001-10-01 | Murata Manufacturing Co | Semiconductor ceramic and semiconductor ceramic device |
JP4000701B2 (ja) * | 1999-01-14 | 2007-10-31 | 株式会社村田製作所 | 積層コンデンサ |
JP3489728B2 (ja) * | 1999-10-18 | 2004-01-26 | 株式会社村田製作所 | 積層コンデンサ、配線基板および高周波回路 |
US6292351B1 (en) | 1999-11-17 | 2001-09-18 | Tdk Corporation | Multilayer ceramic capacitor for three-dimensional mounting |
-
2000
- 2000-10-06 JP JP2000307097A patent/JP4332634B2/ja not_active Expired - Lifetime
-
2001
- 2001-10-04 US US09/969,643 patent/US6452781B1/en not_active Expired - Lifetime
- 2001-10-05 TW TW090124649A patent/TW516052B/zh not_active IP Right Cessation
- 2001-10-08 EP EP01123327A patent/EP1195783B1/de not_active Expired - Lifetime
- 2001-10-08 DE DE60135963T patent/DE60135963D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2002118032A (ja) | 2002-04-19 |
EP1195783A3 (de) | 2006-06-07 |
US20020041006A1 (en) | 2002-04-11 |
US6452781B1 (en) | 2002-09-17 |
TW516052B (en) | 2003-01-01 |
EP1195783A2 (de) | 2002-04-10 |
EP1195783B1 (de) | 2008-10-01 |
JP4332634B2 (ja) | 2009-09-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |