DE60228034D1 - Elektronische Karte - Google Patents

Elektronische Karte

Info

Publication number
DE60228034D1
DE60228034D1 DE60228034T DE60228034T DE60228034D1 DE 60228034 D1 DE60228034 D1 DE 60228034D1 DE 60228034 T DE60228034 T DE 60228034T DE 60228034 T DE60228034 T DE 60228034T DE 60228034 D1 DE60228034 D1 DE 60228034D1
Authority
DE
Germany
Prior art keywords
electronic card
card
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60228034T
Other languages
English (en)
Inventor
Minoru Fukunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE60228034D1 publication Critical patent/DE60228034D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07735—Physical layout of the record carrier the record carrier comprising means for protecting against electrostatic discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
DE60228034T 2001-09-28 2002-09-26 Elektronische Karte Expired - Lifetime DE60228034D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001304575A JP3735553B2 (ja) 2001-09-28 2001-09-28 カード型電子機器

Publications (1)

Publication Number Publication Date
DE60228034D1 true DE60228034D1 (de) 2008-09-18

Family

ID=19124476

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60228034T Expired - Lifetime DE60228034D1 (de) 2001-09-28 2002-09-26 Elektronische Karte

Country Status (5)

Country Link
US (1) US6784527B2 (de)
EP (1) EP1298967B1 (de)
JP (1) JP3735553B2 (de)
KR (1) KR100547963B1 (de)
DE (1) DE60228034D1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3785083B2 (ja) * 2001-11-07 2006-06-14 株式会社東芝 半導体装置、電子カード及びパッド再配置基板
US6903935B1 (en) * 2004-07-16 2005-06-07 Tien-Tzu Chen Memory card with a static electricity conducting board
JP4564321B2 (ja) * 2004-09-30 2010-10-20 株式会社東芝 カード型電子機器
CN100416827C (zh) * 2006-05-18 2008-09-03 威盛电子股份有限公司 封装元件
JP4996193B2 (ja) * 2006-10-06 2012-08-08 ルネサスエレクトロニクス株式会社 配線基板、半導体パッケージ
EP2138019A4 (de) * 2007-03-23 2011-05-04 Innovatier Inc Chipkarte und verfahren zur herstellung einer chipkarte
US9442539B2 (en) 2013-04-05 2016-09-13 Pny Technologies, Inc. Reduced length memory card
USD734756S1 (en) 2014-04-04 2015-07-21 Pny Technologies, Inc. Reduced length memory card
DE102015219979A1 (de) * 2015-10-14 2017-04-20 Conti Temic Microelectronic Gmbh Entstörmodul für einen elektrisch kommutierten Elektromotor, Verfahren zur Herstellung eines Entstörmoduls und Fahrzeug mit einem solchen Entstörmodul

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1204213A (en) * 1982-09-09 1986-05-06 Masahiro Takeda Memory card having static electricity protection
JPH0690872B2 (ja) * 1986-08-18 1994-11-14 東京電気株式会社 メモリ−カ−ド装置
JPH04345895A (ja) * 1991-05-22 1992-12-01 Hitachi Maxell Ltd メモリカード
JP2965183B2 (ja) * 1992-09-07 1999-10-18 ローム株式会社 Ｉｃカード
EP0653813B1 (de) * 1993-10-22 1998-05-27 Molex Incorporated System für Ableitung von elektrischen Ladungen in Verbindung mit Speicherkartensteckverbindern
JPH07302318A (ja) * 1994-03-09 1995-11-14 Seiko Epson Corp カード型電子装置
US5502620A (en) * 1994-03-11 1996-03-26 Molex Incorporated Grounded IC card
JPH08123929A (ja) * 1994-10-28 1996-05-17 Mitsubishi Plastics Ind Ltd Ｉｃメモリカード
US6150193A (en) * 1996-10-31 2000-11-21 Amkor Technology, Inc. RF shielded device
US6160705A (en) * 1997-05-09 2000-12-12 Texas Instruments Incorporated Ball grid array package and method using enhanced power and ground distribution circuitry
US6064113A (en) * 1998-01-13 2000-05-16 Lsi Logic Corporation Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedances
US6040622A (en) * 1998-06-11 2000-03-21 Sandisk Corporation Semiconductor package using terminals formed on a conductive layer of a circuit board
US6462273B1 (en) * 2001-03-16 2002-10-08 Micron Technology, Inc. Semiconductor card and method of fabrication

Also Published As

Publication number Publication date
JP3735553B2 (ja) 2006-01-18
JP2003108967A (ja) 2003-04-11
EP1298967B1 (de) 2008-08-06
US6784527B2 (en) 2004-08-31
EP1298967A2 (de) 2003-04-02
EP1298967A3 (de) 2005-03-30
KR100547963B1 (ko) 2006-02-02
US20030141580A1 (en) 2003-07-31
KR20030028381A (ko) 2003-04-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition