DE60212222D1 - Elektronische Bauteile-Bestückungsvorrichtung - Google Patents

Elektronische Bauteile-Bestückungsvorrichtung

Info

Publication number
DE60212222D1
DE60212222D1 DE60212222T DE60212222T DE60212222D1 DE 60212222 D1 DE60212222 D1 DE 60212222D1 DE 60212222 T DE60212222 T DE 60212222T DE 60212222 T DE60212222 T DE 60212222T DE 60212222 D1 DE60212222 D1 DE 60212222D1
Authority
DE
Germany
Prior art keywords
electronic component
component mounting
mounting device
electronic
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60212222T
Other languages
English (en)
Other versions
DE60212222T2 (de
Inventor
Dai Yokoyama
Hideaki Watanabe
Kiyoshi Imai
Toshiyuki Koyama
Taira Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60212222D1 publication Critical patent/DE60212222D1/de
Publication of DE60212222T2 publication Critical patent/DE60212222T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Connection Of Motors, Electrical Generators, Mechanical Devices, And The Like (AREA)
DE60212222T 2001-02-15 2002-02-14 Elektronische Bauteile-Bestückungsvorrichtung Expired - Lifetime DE60212222T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001038681 2001-02-15
JP2001038681A JP4510307B2 (ja) 2001-02-15 2001-02-15 電子部品実装機

Publications (2)

Publication Number Publication Date
DE60212222D1 true DE60212222D1 (de) 2006-07-27
DE60212222T2 DE60212222T2 (de) 2006-10-05

Family

ID=18901608

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60212222T Expired - Lifetime DE60212222T2 (de) 2001-02-15 2002-02-14 Elektronische Bauteile-Bestückungsvorrichtung

Country Status (5)

Country Link
US (1) US6915561B2 (de)
EP (1) EP1233667B1 (de)
JP (1) JP4510307B2 (de)
CN (1) CN100512618C (de)
DE (1) DE60212222T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200386A (ja) * 2002-12-18 2004-07-15 Matsushita Electric Ind Co Ltd 部品実装機の配線配管装置
US20050132865A1 (en) * 2003-12-20 2005-06-23 Wridge Wilbur S.Jr. Cutting system with enhanced cutting blade depth control
KR20080060415A (ko) * 2006-12-27 2008-07-02 미래산업 주식회사 핸들러의 전자부품 픽커
US8167523B2 (en) * 2007-07-12 2012-05-01 Asm Assembly Automation Ltd Singulation handler comprising vision system
JP5492286B2 (ja) * 2012-12-26 2014-05-14 株式会社東芝 電子機器
CN103200785A (zh) * 2013-03-14 2013-07-10 东莞市升力智能科技有限公司 一种伺服电机驱动旋转的取料假贴机构
JP6154539B2 (ja) 2013-03-31 2017-06-28 エスゼット ディージェイアイ テクノロジー カンパニー リミテッドＳｚ Ｄｊｉ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ ペイロード搭載プラットフォーム
KR102545230B1 (ko) 2016-11-02 2023-06-19 삼성전자주식회사 피커 어셈블리 및 이를 구비하는 추출장치
KR102076397B1 (ko) * 2017-12-11 2020-02-11 이약우 단선방지 기능이 구비된 의료용 회전형 영상촬영장치
CN112886761B (zh) * 2021-01-22 2022-03-25 苏州汇川技术有限公司 电机和机器人

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985003404A1 (en) * 1984-01-23 1985-08-01 Dyna/Pert - Precima Limited Head for handling electrical components
JPH074142Y2 (ja) * 1987-08-29 1995-02-01 ぺんてる株式会社 ロボットの関節構造
US4866838A (en) 1988-10-13 1989-09-19 Ncr Corporation Integrated circuit chip insertion and removal tool
DE3938088A1 (de) 1989-11-16 1991-05-23 Bosch Gmbh Robert Bestueckkopf fuer elektronische bauelemente
JPH0582998A (ja) 1991-05-17 1993-04-02 Tokico Ltd 部品取付装置
JPH0557664A (ja) * 1991-09-02 1993-03-09 Matsushita Electric Ind Co Ltd 産業用ロボツトの旋回装置
JP3011010B2 (ja) * 1994-03-25 2000-02-21 松下電器産業株式会社 部品の保持ヘッド
US5783915A (en) * 1995-01-20 1998-07-21 Matsushita Electric Industrial Co., Ltd. Linear actuating apparatus
JP3340579B2 (ja) * 1995-02-22 2002-11-05 松下電器産業株式会社 電子部品実装装置
US5909837A (en) * 1997-05-09 1999-06-08 Quad Systems Corporation Contactless bonding tool heater
JP4038911B2 (ja) 1998-07-10 2008-01-30 ソニー株式会社 ディスク回転駆動機構及びディスクドライブ装置
GB0002677D0 (en) 1999-02-12 2000-03-29 Helmut Fischer Gmbh & Co Handling module for at least one component for mounting on and removal from a component carrier

Also Published As

Publication number Publication date
DE60212222T2 (de) 2006-10-05
US20020108237A1 (en) 2002-08-15
EP1233667A2 (de) 2002-08-21
EP1233667A3 (de) 2004-04-21
CN1372435A (zh) 2002-10-02
US6915561B2 (en) 2005-07-12
JP4510307B2 (ja) 2010-07-21
JP2002246796A (ja) 2002-08-30
EP1233667B1 (de) 2006-06-14
CN100512618C (zh) 2009-07-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)