FR2871336B1 - Circuit imprime flex-rigide par collage - Google Patents

Circuit imprime flex-rigide par collage

Info

Publication number
FR2871336B1
FR2871336B1 FR0451084A FR0451084A FR2871336B1 FR 2871336 B1 FR2871336 B1 FR 2871336B1 FR 0451084 A FR0451084 A FR 0451084A FR 0451084 A FR0451084 A FR 0451084A FR 2871336 B1 FR2871336 B1 FR 2871336B1
Authority
FR
France
Prior art keywords
collage
flex
printed circuit
rigid printed
rigid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0451084A
Other languages
English (en)
Other versions
FR2871336A1 (fr
Inventor
Jean Marc Degottex
Carol Ouchakoff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BREE IND SOC PAR ACTIONS SIMPL
Original Assignee
BREE IND SOC PAR ACTIONS SIMPL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BREE IND SOC PAR ACTIONS SIMPL filed Critical BREE IND SOC PAR ACTIONS SIMPL
Priority to FR0451084A priority Critical patent/FR2871336B1/fr
Priority to PCT/FR2005/001357 priority patent/WO2006000694A1/fr
Priority to EP05775280A priority patent/EP1803338A1/fr
Publication of FR2871336A1 publication Critical patent/FR2871336A1/fr
Application granted granted Critical
Publication of FR2871336B1 publication Critical patent/FR2871336B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR0451084A 2004-06-02 2004-06-02 Circuit imprime flex-rigide par collage Expired - Fee Related FR2871336B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0451084A FR2871336B1 (fr) 2004-06-02 2004-06-02 Circuit imprime flex-rigide par collage
PCT/FR2005/001357 WO2006000694A1 (fr) 2004-06-02 2005-06-02 Circuit imprime flex-rigide par collage
EP05775280A EP1803338A1 (fr) 2004-06-02 2005-06-02 Circuit imprime flex-rigide par collage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0451084A FR2871336B1 (fr) 2004-06-02 2004-06-02 Circuit imprime flex-rigide par collage

Publications (2)

Publication Number Publication Date
FR2871336A1 FR2871336A1 (fr) 2005-12-09
FR2871336B1 true FR2871336B1 (fr) 2007-01-19

Family

ID=34944898

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0451084A Expired - Fee Related FR2871336B1 (fr) 2004-06-02 2004-06-02 Circuit imprime flex-rigide par collage

Country Status (3)

Country Link
EP (1) EP1803338A1 (fr)
FR (1) FR2871336B1 (fr)
WO (1) WO2006000694A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2919781A1 (fr) 2007-07-31 2009-02-06 Beauce Realisations Et Etudes Procede de fabrication d'un circuit imprime semi-flexible, plaque utilisee pour un tel procede, circuit imprime et dispositif electronique associes
ITFI20070206A1 (it) 2007-09-14 2009-03-15 Saeco Ipr Ltd "un porta-filtro per macchine da caffe' con dispositivi per la regolazione della qualita' del caffe' e macchina comprendente detto porta-filtro"
US20110024160A1 (en) 2009-07-31 2011-02-03 Clifton Quan Multi-layer microwave corrugated printed circuit board and method
US8127432B2 (en) 2009-11-17 2012-03-06 Raytheon Company Process for fabricating an origami formed antenna radiating structure
US8043464B2 (en) 2009-11-17 2011-10-25 Raytheon Company Systems and methods for assembling lightweight RF antenna structures
US8362856B2 (en) 2009-11-17 2013-01-29 Raytheon Company RF transition with 3-dimensional molded RF structure
US9072164B2 (en) 2009-11-17 2015-06-30 Raytheon Company Process for fabricating a three dimensional molded feed structure
DE102013000077A1 (de) * 2013-01-08 2014-07-10 Carl Freudenberg Kg Anordnung mit einer flexiblen Leiterplatte
CN105992467B (zh) * 2016-07-01 2019-03-05 广东三泰迈高光电科技有限公司 一种柔性电路板的压边工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57205179U (fr) * 1981-06-24 1982-12-27
JPS61127195A (ja) * 1984-11-22 1986-06-14 ソニー株式会社 プリント配線基板接続体
FR2580135B1 (fr) * 1985-04-05 1988-08-12 Trt Telecom Radio Electr
JPS6484788A (en) * 1987-09-28 1989-03-30 Nec Corp Printed wiring board
ATE91377T1 (de) * 1989-07-15 1993-07-15 Freudenberg Carl Fa Verfahren zur herstellung von starre und flexible bereiche aufweisenden leiterplatten oder leiterplatten-innenlagen.
US5219292A (en) * 1992-04-03 1993-06-15 Motorola, Inc. Printed circuit board interconnection
DE4327560A1 (de) * 1993-08-17 1995-02-23 Hottinger Messtechnik Baldwin Verfahren zum Kontaktieren von Leiterbahnanordnungen und Kontaktanordnung
JPH07170029A (ja) * 1993-12-15 1995-07-04 Nippon Avionics Co Ltd フレキシブル・プリント配線板およびその製造方法
JP3607412B2 (ja) * 1996-05-14 2005-01-05 アルプス電気株式会社 座標入力装置の製造方法

Also Published As

Publication number Publication date
WO2006000694A1 (fr) 2006-01-05
FR2871336A1 (fr) 2005-12-09
EP1803338A1 (fr) 2007-07-04

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20150227