DE602004023665D1 - Laminiertes elektronisches Bauelement - Google Patents
Laminiertes elektronisches BauelementInfo
- Publication number
- DE602004023665D1 DE602004023665D1 DE602004023665T DE602004023665T DE602004023665D1 DE 602004023665 D1 DE602004023665 D1 DE 602004023665D1 DE 602004023665 T DE602004023665 T DE 602004023665T DE 602004023665 T DE602004023665 T DE 602004023665T DE 602004023665 D1 DE602004023665 D1 DE 602004023665D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic component
- laminated electronic
- laminated
- component
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/20—Arrangements for preventing discharge from edges of electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003049334 | 2003-02-26 | ||
JP2003177533 | 2003-06-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004023665D1 true DE602004023665D1 (de) | 2009-12-03 |
Family
ID=32775231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004023665T Expired - Lifetime DE602004023665D1 (de) | 2003-02-26 | 2004-02-26 | Laminiertes elektronisches Bauelement |
Country Status (3)
Country | Link |
---|---|
US (1) | US6985348B2 (de) |
EP (1) | EP1453114B1 (de) |
DE (1) | DE602004023665D1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006046494A1 (ja) * | 2004-10-25 | 2006-05-04 | Ngk Insulators, Ltd. | 圧電/電歪デバイス |
CN101238598B (zh) * | 2005-06-15 | 2012-07-11 | 京瓷株式会社 | 层叠型压电元件及使用其的喷射装置 |
EP1811583A1 (de) * | 2006-01-23 | 2007-07-25 | Delphi Technologies, Inc. | Piezoelektrischer Aktor |
ATE392719T1 (de) * | 2006-02-16 | 2008-05-15 | Delphi Tech Inc | Verfahren zum herstellen eines piezoelektrischen bauteils |
DE602007013843D1 (de) * | 2006-08-14 | 2011-05-26 | Ngk Insulators Ltd | Verfahren zur Herstellung eines piezoelektrischen/elektrostriktiven Elements |
CN102113143A (zh) * | 2008-07-29 | 2011-06-29 | 京瓷株式会社 | 层叠型压电元件、层叠型压电元件的制造方法、喷射装置及燃料喷射系统 |
CN102473835B (zh) | 2009-08-27 | 2014-06-25 | 京瓷株式会社 | 层叠型压电元件及具备该压电元件的喷射装置以及燃料喷射系统 |
JP5824337B2 (ja) * | 2011-11-16 | 2015-11-25 | 株式会社アドバンテスト | 試験用キャリア |
JPWO2013157293A1 (ja) * | 2012-04-19 | 2015-12-21 | 日本碍子株式会社 | 膜型圧電/電歪素子 |
JP6393345B2 (ja) * | 2015-01-22 | 2018-09-19 | アルプス電気株式会社 | 圧粉コア、該圧粉コアの製造方法、該圧粉コアを備える電気・電子部品、および該電気・電子部品が実装された電気・電子機器 |
DE102015117203A1 (de) | 2015-10-08 | 2017-04-13 | Epcos Ag | Drucksensor |
JP6838381B2 (ja) * | 2016-12-14 | 2021-03-03 | Tdk株式会社 | 積層電子部品 |
US20220265302A1 (en) * | 2021-02-19 | 2022-08-25 | Otsuka Medical Devices Co., Ltd. | Selectively insulated ultrasound transducers |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0639155B2 (ja) * | 1986-02-21 | 1994-05-25 | 名幸電子工業株式会社 | 銅張積層板の製造方法 |
US4803763A (en) * | 1986-08-28 | 1989-02-14 | Nippon Soken, Inc. | Method of making a laminated piezoelectric transducer |
US5254212A (en) * | 1990-09-13 | 1993-10-19 | Hitachi Metals, Ltd. | Method of fabricating electrostrictive-effect device |
JP3683144B2 (ja) * | 1999-12-16 | 2005-08-17 | 日本電気株式会社 | フィルム外装非水電解液二次電池 |
US6700306B2 (en) * | 2001-02-27 | 2004-03-02 | Kyocera Corporation | Laminated piezo-electric device |
JP4151278B2 (ja) * | 2001-04-12 | 2008-09-17 | 株式会社デンソー | セラミック積層体の製造方法 |
JP4042431B2 (ja) | 2001-04-27 | 2008-02-06 | 株式会社デンソー | セラミック積層体の製造方法 |
JP2003017768A (ja) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | 積層型圧電素子及び噴射装置 |
-
2004
- 2004-02-26 EP EP04251101A patent/EP1453114B1/de not_active Expired - Fee Related
- 2004-02-26 DE DE602004023665T patent/DE602004023665D1/de not_active Expired - Lifetime
- 2004-02-26 US US10/787,828 patent/US6985348B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6985348B2 (en) | 2006-01-10 |
US20040185278A1 (en) | 2004-09-23 |
EP1453114A3 (de) | 2006-06-07 |
EP1453114B1 (de) | 2009-10-21 |
EP1453114A2 (de) | 2004-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |