DE602007000582D1 - Leiterplatte - Google Patents

Leiterplatte

Info

Publication number
DE602007000582D1
DE602007000582D1 DE602007000582T DE602007000582T DE602007000582D1 DE 602007000582 D1 DE602007000582 D1 DE 602007000582D1 DE 602007000582 T DE602007000582 T DE 602007000582T DE 602007000582 T DE602007000582 T DE 602007000582T DE 602007000582 D1 DE602007000582 D1 DE 602007000582D1
Authority
DE
Germany
Prior art keywords
circuit board
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007000582T
Other languages
English (en)
Inventor
Jun Ishii
Yasunari Ooyabu
Visit Thaveeprungsriporn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE602007000582D1 publication Critical patent/DE602007000582D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1328—Shrinkable or shrunk [e.g., due to heat, solvent, volatile agent, restraint removal, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article
    • Y10T428/1393—Multilayer [continuous layer]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y10T428/257—Iron oxide or aluminum oxide
DE602007000582T 2006-06-22 2007-06-06 Leiterplatte Active DE602007000582D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006172744A JP4187757B2 (ja) 2006-06-22 2006-06-22 配線回路基板

Publications (1)

Publication Number Publication Date
DE602007000582D1 true DE602007000582D1 (de) 2009-04-09

Family

ID=38442616

Family Applications (2)

Application Number Title Priority Date Filing Date
DE602007013758T Active DE602007013758D1 (de) 2006-06-22 2007-06-06 Verdrahtete Leiterplatte
DE602007000582T Active DE602007000582D1 (de) 2006-06-22 2007-06-06 Leiterplatte

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE602007013758T Active DE602007013758D1 (de) 2006-06-22 2007-06-06 Verdrahtete Leiterplatte

Country Status (5)

Country Link
US (2) US7737365B2 (de)
EP (2) EP2040519B1 (de)
JP (1) JP4187757B2 (de)
CN (2) CN101094561B (de)
DE (2) DE602007013758D1 (de)

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JP4222882B2 (ja) * 2003-06-03 2009-02-12 日東電工株式会社 配線回路基板
JP4916235B2 (ja) 2006-06-29 2012-04-11 日東電工株式会社 配線回路基板
JP4923295B2 (ja) 2006-09-13 2012-04-25 株式会社東芝 サスペンション装置
US7972897B2 (en) * 2007-02-05 2011-07-05 Intermolecular, Inc. Methods for forming resistive switching memory elements
JP2009026875A (ja) * 2007-07-18 2009-02-05 Nitto Denko Corp 配線回路基板
JP5161617B2 (ja) * 2008-03-03 2013-03-13 日本メクトロン株式会社 フレキシブル回路基板、及びその製造方法
JP4547035B2 (ja) * 2008-11-10 2010-09-22 日東電工株式会社 配線回路基板およびその製造方法
JP5591592B2 (ja) * 2010-06-01 2014-09-17 日本発條株式会社 ヘッド・サスペンション配線構造
JP2012079378A (ja) * 2010-09-30 2012-04-19 Toshiba Corp 配線構造、データ記録装置、及び電子機器
JP5603744B2 (ja) * 2010-11-10 2014-10-08 日東電工株式会社 回路付サスペンション基板およびその製造方法
WO2014104300A1 (ja) * 2012-12-27 2014-07-03 京セラ株式会社 配線基板、電子装置および発光装置
KR101416159B1 (ko) * 2013-09-06 2014-07-14 주식회사 기가레인 접촉 패드를 구비하는 인쇄회로기판
JP6280828B2 (ja) * 2014-07-07 2018-02-14 日東電工株式会社 回路付サスペンション基板
US9664577B1 (en) * 2014-08-26 2017-05-30 Amazon Technologies, Inc. Force-sensitive resistor assemblies and methods
JP6588328B2 (ja) * 2015-12-21 2019-10-09 日本発條株式会社 配線回路基板の製造方法
JP6517754B2 (ja) * 2016-07-12 2019-05-22 日本碍子株式会社 配線基板接合体
WO2019124307A1 (ja) * 2017-12-20 2019-06-27 住友電気工業株式会社 プリント配線板の製造方法及び積層体
WO2019221336A1 (ko) * 2018-05-17 2019-11-21 엘지전자 주식회사 이동 단말기
JP2021128813A (ja) * 2020-02-17 2021-09-02 日東電工株式会社 配線回路基板

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EP2040519A2 (de) 2009-03-25
US20090183907A1 (en) 2009-07-23
CN101094561A (zh) 2007-12-26
EP1871152B1 (de) 2009-02-25
DE602007013758D1 (de) 2011-05-19
US7737365B2 (en) 2010-06-15
CN101557678B (zh) 2011-04-13
EP2040519A3 (de) 2009-05-06
US8247700B2 (en) 2012-08-21
EP1871152A1 (de) 2007-12-26
JP2008004756A (ja) 2008-01-10
CN101557678A (zh) 2009-10-14
EP2040519B1 (de) 2011-04-06
US20070295534A1 (en) 2007-12-27
CN101094561B (zh) 2010-07-21
JP4187757B2 (ja) 2008-11-26

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