DE112009002460A5 - Flexible Leiterplatte - Google Patents

Flexible Leiterplatte Download PDF

Info

Publication number
DE112009002460A5
DE112009002460A5 DE112009002460T DE112009002460T DE112009002460A5 DE 112009002460 A5 DE112009002460 A5 DE 112009002460A5 DE 112009002460 T DE112009002460 T DE 112009002460T DE 112009002460 T DE112009002460 T DE 112009002460T DE 112009002460 A5 DE112009002460 A5 DE 112009002460A5
Authority
DE
Germany
Prior art keywords
circuit board
flexible circuit
flexible
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112009002460T
Other languages
English (en)
Other versions
DE112009002460B4 (de
Inventor
Andreas 92331 Vögerl
Tilo 91217 Liebl
Gerhard 91322 Bauer
Marion 91322 Gebhardt
Alexander 91595 Wenk
Jürgen 91056 Henniger
Karl-Heinz 68519 Baumann
Matthias Wieczorek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Freudenberg KG
Vitesco Technologies Germany GmbH
Original Assignee
Carl Freudenberg KG
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Freudenberg KG, Conti Temic Microelectronic GmbH filed Critical Carl Freudenberg KG
Publication of DE112009002460A5 publication Critical patent/DE112009002460A5/de
Application granted granted Critical
Publication of DE112009002460B4 publication Critical patent/DE112009002460B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777—Edge feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE112009002460.2T 2008-10-18 2009-10-09 Flexible Leiterplatte Active DE112009002460B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200810052244 DE102008052244A1 (de) 2008-10-18 2008-10-18 Flexible Leiterplatte
DE102008052244.9 2008-10-18
PCT/DE2009/001409 WO2010043203A1 (de) 2008-10-18 2009-10-09 Flexible leiterplatte

Publications (2)

Publication Number Publication Date
DE112009002460A5 true DE112009002460A5 (de) 2011-07-14
DE112009002460B4 DE112009002460B4 (de) 2022-01-20

Family

ID=41403905

Family Applications (2)

Application Number Title Priority Date Filing Date
DE200810052244 Withdrawn DE102008052244A1 (de) 2008-10-18 2008-10-18 Flexible Leiterplatte
DE112009002460.2T Active DE112009002460B4 (de) 2008-10-18 2009-10-09 Flexible Leiterplatte

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE200810052244 Withdrawn DE102008052244A1 (de) 2008-10-18 2008-10-18 Flexible Leiterplatte

Country Status (5)

Country Link
US (1) US8853547B2 (de)
EP (1) EP2345314A1 (de)
JP (1) JP5489013B2 (de)
DE (2) DE102008052244A1 (de)
WO (1) WO2010043203A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008052243A1 (de) 2008-10-18 2010-04-22 Carl Freudenberg Kg Schutzabdeckung für eine flexible Leiterplatte
CN106576424B (zh) * 2014-08-29 2020-08-25 拓自达电线株式会社 柔性印刷配线板用增强部件和具备柔性印刷配线板用增强部件的柔性印刷配线板
KR102637499B1 (ko) * 2018-12-17 2024-02-15 엘지디스플레이 주식회사 플렉서블 인쇄 회로 기판과 이를 포함하는 플렉서블 디스플레이 모듈 및 전자 기기
CN113597090B (zh) * 2021-07-28 2024-03-26 京东方科技集团股份有限公司 柔性电路板、显示面板及显示装置

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Also Published As

Publication number Publication date
DE102008052244A1 (de) 2010-04-22
JP2012506161A (ja) 2012-03-08
US20110232946A1 (en) 2011-09-29
DE112009002460B4 (de) 2022-01-20
WO2010043203A1 (de) 2010-04-22
EP2345314A1 (de) 2011-07-20
US8853547B2 (en) 2014-10-07
JP5489013B2 (ja) 2014-05-14

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