DE602007004373D1 - Leiterplatte - Google Patents
LeiterplatteInfo
- Publication number
- DE602007004373D1 DE602007004373D1 DE200760004373 DE602007004373T DE602007004373D1 DE 602007004373 D1 DE602007004373 D1 DE 602007004373D1 DE 200760004373 DE200760004373 DE 200760004373 DE 602007004373 T DE602007004373 T DE 602007004373T DE 602007004373 D1 DE602007004373 D1 DE 602007004373D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09554—Via connected to metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Elimination Of Static Electricity (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006116975A JP4178166B2 (ja) | 2006-04-20 | 2006-04-20 | 配線回路基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602007004373D1 true DE602007004373D1 (de) | 2010-03-11 |
Family
ID=38001889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200760004373 Active DE602007004373D1 (de) | 2006-04-20 | 2007-04-12 | Leiterplatte |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1848253B1 (de) |
JP (1) | JP4178166B2 (de) |
CN (1) | CN101060756B (de) |
DE (1) | DE602007004373D1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5214154B2 (ja) | 2007-01-19 | 2013-06-19 | 住友電気工業株式会社 | プリント配線板およびその製造方法 |
KR101103296B1 (ko) * | 2010-07-20 | 2012-01-11 | 엘지이노텍 주식회사 | Esd 보호용 스위칭 도체층이 형성된 인쇄회로기판 |
JP6808266B2 (ja) * | 2016-05-18 | 2021-01-06 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
KR20230015773A (ko) | 2021-07-23 | 2023-01-31 | 삼성전자주식회사 | 전자 부품의 차폐를 위한 도전성 레이어가 형성된 기판 및 이를 포함하는 전자 장치 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6459043B1 (en) * | 2001-03-29 | 2002-10-01 | 3M Innovative Properties Company | Flexible circuit with electrostatic damage limiting feature and method of manufacture |
JP3964822B2 (ja) * | 2003-05-07 | 2007-08-22 | 日東電工株式会社 | 回路付サスペンション基板の製造方法 |
US7489493B2 (en) * | 2003-12-01 | 2009-02-10 | Magnecomp Corporation | Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material |
-
2006
- 2006-04-20 JP JP2006116975A patent/JP4178166B2/ja not_active Expired - Fee Related
-
2007
- 2007-04-12 EP EP20070106016 patent/EP1848253B1/de not_active Expired - Fee Related
- 2007-04-12 DE DE200760004373 patent/DE602007004373D1/de active Active
- 2007-04-19 CN CN2007101013579A patent/CN101060756B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101060756A (zh) | 2007-10-24 |
JP2007294483A (ja) | 2007-11-08 |
EP1848253A1 (de) | 2007-10-24 |
EP1848253B1 (de) | 2010-01-20 |
JP4178166B2 (ja) | 2008-11-12 |
CN101060756B (zh) | 2011-04-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |