DE602006005318D1 - Elektronische Komponente - Google Patents

Elektronische Komponente

Info

Publication number
DE602006005318D1
DE602006005318D1 DE602006005318T DE602006005318T DE602006005318D1 DE 602006005318 D1 DE602006005318 D1 DE 602006005318D1 DE 602006005318 T DE602006005318 T DE 602006005318T DE 602006005318 T DE602006005318 T DE 602006005318T DE 602006005318 D1 DE602006005318 D1 DE 602006005318D1
Authority
DE
Germany
Prior art keywords
electronic component
electronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006005318T
Other languages
English (en)
Inventor
Takuya Owaki
Tadayoshi Adachi
Kazuya Yokokawa
Shinya Aoki
Takashi Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
Original Assignee
Miyazaki Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miyazaki Epson Corp filed Critical Miyazaki Epson Corp
Publication of DE602006005318D1 publication Critical patent/DE602006005318D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE602006005318T 2005-12-06 2006-12-04 Elektronische Komponente Active DE602006005318D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005351551A JP2007158039A (ja) 2005-12-06 2005-12-06 電子部品

Publications (1)

Publication Number Publication Date
DE602006005318D1 true DE602006005318D1 (de) 2009-04-09

Family

ID=37888380

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006005318T Active DE602006005318D1 (de) 2005-12-06 2006-12-04 Elektronische Komponente

Country Status (5)

Country Link
US (1) US20070126087A1 (de)
EP (1) EP1796267B1 (de)
JP (1) JP2007158039A (de)
CN (1) CN100521526C (de)
DE (1) DE602006005318D1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5848079B2 (ja) * 2011-09-26 2016-01-27 太陽誘電株式会社 弾性波デバイス及びその製造方法
JP5984912B2 (ja) * 2012-03-23 2016-09-06 オリンパス株式会社 積層型半導体の製造方法
KR102414843B1 (ko) * 2017-05-22 2022-06-30 삼성전기주식회사 음향파 디바이스 및 그 제조방법
JP6702296B2 (ja) * 2017-12-08 2020-06-03 株式会社村田製作所 電子部品

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3372065B2 (ja) * 1992-09-18 2003-01-27 株式会社村田製作所 弾性表面波装置
JP3355020B2 (ja) * 1994-04-12 2002-12-09 キンセキ株式会社 弾性表面波装置
JP3154640B2 (ja) * 1995-04-21 2001-04-09 三菱電機株式会社 表面弾性波装置のパッケージ
US6166437A (en) * 1999-04-12 2000-12-26 International Business Machines Corporation Silicon on silicon package with precision align macro
JP3301419B2 (ja) * 1999-09-29 2002-07-15 松下電器産業株式会社 電子部品の製造方法
JP3216638B2 (ja) * 1999-09-28 2001-10-09 松下電器産業株式会社 電子部品及びその製造方法
EP1143504A4 (de) * 1999-09-28 2005-10-12 Matsushita Electric Ind Co Ltd Elektronisches bauelement und dessen herstellungsverfahren
JP3386043B2 (ja) * 2000-08-09 2003-03-10 株式会社村田製作所 弾性表面波デバイス
JP3613194B2 (ja) * 2001-04-02 2005-01-26 松下電器産業株式会社 電子部品及びその製造方法
JP3747853B2 (ja) * 2002-01-08 2006-02-22 株式会社村田製作所 弾性表面波装置を備えた分波器

Also Published As

Publication number Publication date
JP2007158039A (ja) 2007-06-21
EP1796267A1 (de) 2007-06-13
CN1980056A (zh) 2007-06-13
US20070126087A1 (en) 2007-06-07
EP1796267B1 (de) 2009-02-25
CN100521526C (zh) 2009-07-29

Similar Documents

Publication Publication Date Title
DE602006014897D1 (de) Elektronische Ortsnummer
DE602006017908D1 (de) Leiterplatte
DE102006028992B8 (de) Elektronische Steuervorrichtung
DK2036062T3 (da) Elektronisk informationstavle
BRPI0619079A2 (pt) equipamento eletrônico
DE602007012385D1 (de) Elektronische Servolenkung
DE602007005098D1 (de) Mischskalige elektronische schnittstelle
DE602007000582D1 (de) Leiterplatte
DE602007011692D1 (de) Leiterplatte
DE602005021305D1 (de) Leiterplatte
DE502006000019D1 (de) Integrieter Schaltkreis
DE502006004466D1 (de) Elektrisches bauelement
DK1943406T3 (da) Byggeelement
DE502005003875D1 (de) Elektronische vorrichtung
FI6902U1 (fi) Biohajoava kartonki
DE602006015245D1 (de) Elektronische Anordnung
DE602006011224D1 (de) Elektronisches Gerät
DE112006001884A5 (de) Elektrisches Bauelement
DE602006019994D1 (de) Leiterplatte
DE602006021249D1 (de) Oberflächenmontierbare elektronische Schaltungseinheit
DE602006003697D1 (de) Elektronisches Akkordeon
DE602007006935D1 (de) Geräuscharme elektronische Schaltung
DE502006009152D1 (de) Leiterplatte
DE602006002642D1 (de) Treiberschaltung
DE602006006210D1 (de) 3d-elektronikmodul

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
R082 Change of representative

Ref document number: 1796267

Country of ref document: EP

Representative=s name: HOFFMANN & EITLE, 81925 MUENCHEN, DE