DE602006015245D1 - Elektronische Anordnung - Google Patents

Elektronische Anordnung

Info

Publication number
DE602006015245D1
DE602006015245D1 DE602006015245T DE602006015245T DE602006015245D1 DE 602006015245 D1 DE602006015245 D1 DE 602006015245D1 DE 602006015245 T DE602006015245 T DE 602006015245T DE 602006015245 T DE602006015245 T DE 602006015245T DE 602006015245 D1 DE602006015245 D1 DE 602006015245D1
Authority
DE
Germany
Prior art keywords
electronic arrangement
electronic
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006015245T
Other languages
English (en)
Inventor
Akitoshi Yoshii
Taisuke Ahiko
Masumi Miyairi
Akio Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of DE602006015245D1 publication Critical patent/DE602006015245D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006—Apparatus or processes for applying terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
DE602006015245T 2005-02-28 2006-02-09 Elektronische Anordnung Active DE602006015245D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005054739A JP2006245049A (ja) 2005-02-28 2005-02-28 電子部品及び電子機器

Publications (1)

Publication Number Publication Date
DE602006015245D1 true DE602006015245D1 (de) 2010-08-19

Family

ID=36784111

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006015245T Active DE602006015245D1 (de) 2005-02-28 2006-02-09 Elektronische Anordnung

Country Status (7)

Country Link
US (1) US7339781B2 (de)
EP (1) EP1705675B1 (de)
JP (1) JP2006245049A (de)
CN (1) CN1828795A (de)
DE (1) DE602006015245D1 (de)
MY (1) MY141342A (de)
TW (1) TWI401713B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4418969B2 (ja) * 2005-06-03 2010-02-24 株式会社村田製作所 積層セラミックコンデンサ
JP4404089B2 (ja) * 2006-12-13 2010-01-27 Ｔｄｋ株式会社 貫通コンデンサアレイ
US8902565B2 (en) * 2010-05-26 2014-12-02 Kemet Electronics Corporation Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes
JP5353911B2 (ja) * 2011-01-28 2013-11-27 株式会社村田製作所 電子部品及び基板モジュール
KR101882998B1 (ko) * 2011-11-25 2018-07-30 삼성전기주식회사 적층 세라믹 전자부품
KR20140039016A (ko) * 2014-02-27 2014-03-31 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR102037264B1 (ko) * 2014-12-15 2019-10-29 삼성전기주식회사 기판 내장용 소자, 그 제조 방법 및 소자 내장 인쇄회로기판
JP6520610B2 (ja) * 2015-09-25 2019-05-29 Tdk株式会社 電子部品
JP6570478B2 (ja) * 2016-05-31 2019-09-04 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP2017216358A (ja) * 2016-05-31 2017-12-07 太陽誘電株式会社 積層セラミックコンデンサ
KR102121579B1 (ko) 2018-10-02 2020-06-10 삼성전기주식회사 적층 세라믹 전자부품
KR102148446B1 (ko) * 2018-10-02 2020-08-26 삼성전기주식회사 적층 세라믹 전자부품

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2830456B2 (ja) * 1990-11-06 1998-12-02 三菱マテリアル株式会社 セラミックコンデンサ
JP3227242B2 (ja) * 1992-07-28 2001-11-12 株式会社トーキン 積層セラミックコンデンサ並びにその製造方法
JPH07161223A (ja) * 1993-12-10 1995-06-23 Murata Mfg Co Ltd 導電性ペーストおよび積層セラミックコンデンサ
JPH08203771A (ja) * 1995-01-27 1996-08-09 Murata Mfg Co Ltd セラミック電子部品
JP3307133B2 (ja) * 1995-01-27 2002-07-24 株式会社村田製作所 セラミック電子部品
JPH097877A (ja) * 1995-04-18 1997-01-10 Rohm Co Ltd 多層セラミックチップ型コンデンサ及びその製造方法
JP3039417B2 (ja) * 1997-02-07 2000-05-08 株式会社村田製作所 積層セラミックコンデンサ
WO2001033588A1 (fr) * 1999-11-02 2001-05-10 Tdk Corporation Condensateur multicouche
JP3630056B2 (ja) * 2000-01-26 2005-03-16 株式会社村田製作所 チップ型電子部品及びチップ型コンデンサ
JP2001230151A (ja) * 2000-02-16 2001-08-24 Matsushita Electric Ind Co Ltd リードレスチップ部品
JP3475910B2 (ja) * 2000-05-24 2003-12-10 株式会社村田製作所 電子部品、電子部品の製造方法および回路基板
JP4438974B2 (ja) * 2000-10-05 2010-03-24 千住金属工業株式会社 ソルダペ−スト
JP2002203736A (ja) 2000-12-28 2002-07-19 Nec Tokin Corp 積層セラミックコンデンサの製造方法
JP2003197460A (ja) * 2001-12-26 2003-07-11 Murata Mfg Co Ltd 電子部品の製造方法および電子部品
US7075774B2 (en) * 2002-09-10 2006-07-11 Tdk Corporation Multilayer capacitor
JP4378941B2 (ja) * 2002-12-09 2009-12-09 株式会社村田製作所 電子部品の製造方法
JP4093188B2 (ja) * 2003-05-27 2008-06-04 株式会社村田製作所 積層セラミック電子部品とその実装構造および実装方法

Also Published As

Publication number Publication date
TWI401713B (zh) 2013-07-11
JP2006245049A (ja) 2006-09-14
EP1705675A2 (de) 2006-09-27
EP1705675A3 (de) 2008-04-30
CN1828795A (zh) 2006-09-06
MY141342A (en) 2010-04-16
TW200644007A (en) 2006-12-16
US7339781B2 (en) 2008-03-04
EP1705675B1 (de) 2010-07-07
US20060193103A1 (en) 2006-08-31

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