DE602007005098D1 - Mischskalige elektronische schnittstelle - Google Patents

Mischskalige elektronische schnittstelle

Info

Publication number
DE602007005098D1
DE602007005098D1 DE602007005098T DE602007005098T DE602007005098D1 DE 602007005098 D1 DE602007005098 D1 DE 602007005098D1 DE 602007005098 T DE602007005098 T DE 602007005098T DE 602007005098 T DE602007005098 T DE 602007005098T DE 602007005098 D1 DE602007005098 D1 DE 602007005098D1
Authority
DE
Germany
Prior art keywords
electronic interface
mixed electronic
mixed
interface
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007005098T
Other languages
English (en)
Inventor
Gregory S Snider
Stanley R Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of DE602007005098D1 publication Critical patent/DE602007005098D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669—Nanowires or nanotubes
    • H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669—Nanowires or nanotubes
    • H01L29/0676—Nanowires or nanotubes oriented perpendicular or at an angle to a substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/202—Integrated devices comprising a common active layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70—Resistive array aspects
    • G11C2213/81—Array wherein the array conductors, e.g. word lines, bit lines, are made of nanowires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0094—Switches making use of nanoelectromechanical systems [NEMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/50—Bistable switching devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/701—Organic molecular electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE602007005098T 2006-01-27 2007-01-26 Mischskalige elektronische schnittstelle Active DE602007005098D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/342,076 US7544977B2 (en) 2006-01-27 2006-01-27 Mixed-scale electronic interface
PCT/US2007/001988 WO2007089522A1 (en) 2006-01-27 2007-01-26 Mixed-scale electronic interface

Publications (1)

Publication Number Publication Date
DE602007005098D1 true DE602007005098D1 (de) 2010-04-15

Family

ID=38080870

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007005098T Active DE602007005098D1 (de) 2006-01-27 2007-01-26 Mischskalige elektronische schnittstelle

Country Status (7)

Country Link
US (3) US7544977B2 (de)
EP (2) EP1977427B1 (de)
JP (1) JP4995837B2 (de)
KR (1) KR101099988B1 (de)
CN (1) CN101375344B (de)
DE (1) DE602007005098D1 (de)
WO (1) WO2007089522A1 (de)

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US7671398B2 (en) * 2005-02-23 2010-03-02 Tran Bao Q Nano memory, light, energy, antenna and strand-based systems and methods
US7741204B2 (en) * 2006-10-30 2010-06-22 Hewlett-Packard Development Company, L.P. Mixed-scale electronic interfaces
US8384007B2 (en) 2009-10-07 2013-02-26 Zena Technologies, Inc. Nano wire based passive pixel image sensor
US8735797B2 (en) 2009-12-08 2014-05-27 Zena Technologies, Inc. Nanowire photo-detector grown on a back-side illuminated image sensor
US9000353B2 (en) 2010-06-22 2015-04-07 President And Fellows Of Harvard College Light absorption and filtering properties of vertically oriented semiconductor nano wires
US9478685B2 (en) 2014-06-23 2016-10-25 Zena Technologies, Inc. Vertical pillar structured infrared detector and fabrication method for the same
US9515218B2 (en) 2008-09-04 2016-12-06 Zena Technologies, Inc. Vertical pillar structured photovoltaic devices with mirrors and optical claddings
US9406709B2 (en) 2010-06-22 2016-08-02 President And Fellows Of Harvard College Methods for fabricating and using nanowires
US8229255B2 (en) 2008-09-04 2012-07-24 Zena Technologies, Inc. Optical waveguides in image sensors
US8890271B2 (en) 2010-06-30 2014-11-18 Zena Technologies, Inc. Silicon nitride light pipes for image sensors
US8835831B2 (en) 2010-06-22 2014-09-16 Zena Technologies, Inc. Polarized light detecting device and fabrication methods of the same
US8748799B2 (en) 2010-12-14 2014-06-10 Zena Technologies, Inc. Full color single pixel including doublet or quadruplet si nanowires for image sensors
US9082673B2 (en) 2009-10-05 2015-07-14 Zena Technologies, Inc. Passivated upstanding nanostructures and methods of making the same
US8299472B2 (en) 2009-12-08 2012-10-30 Young-June Yu Active pixel sensor with nanowire structured photodetectors
US8274039B2 (en) 2008-11-13 2012-09-25 Zena Technologies, Inc. Vertical waveguides with various functionality on integrated circuits
US8269985B2 (en) 2009-05-26 2012-09-18 Zena Technologies, Inc. Determination of optimal diameters for nanowires
US9343490B2 (en) 2013-08-09 2016-05-17 Zena Technologies, Inc. Nanowire structured color filter arrays and fabrication method of the same
US9299866B2 (en) 2010-12-30 2016-03-29 Zena Technologies, Inc. Nanowire array based solar energy harvesting device
US8507840B2 (en) 2010-12-21 2013-08-13 Zena Technologies, Inc. Vertically structured passive pixel arrays and methods for fabricating the same
US20110115041A1 (en) * 2009-11-19 2011-05-19 Zena Technologies, Inc. Nanowire core-shell light pipes
US8866065B2 (en) 2010-12-13 2014-10-21 Zena Technologies, Inc. Nanowire arrays comprising fluorescent nanowires
US8546742B2 (en) 2009-06-04 2013-10-01 Zena Technologies, Inc. Array of nanowires in a single cavity with anti-reflective coating on substrate
US8519379B2 (en) 2009-12-08 2013-08-27 Zena Technologies, Inc. Nanowire structured photodiode with a surrounding epitaxially grown P or N layer
US8791470B2 (en) 2009-10-05 2014-07-29 Zena Technologies, Inc. Nano structured LEDs
US8889455B2 (en) 2009-12-08 2014-11-18 Zena Technologies, Inc. Manufacturing nanowire photo-detector grown on a back-side illuminated image sensor
US8114787B2 (en) * 2009-02-19 2012-02-14 Empire Technology Development Llc Integrated circuit nanowires
US7969774B2 (en) * 2009-03-10 2011-06-28 Micron Technology, Inc. Electronic devices formed of two or more substrates bonded together, electronic systems comprising electronic devices and methods of making electronic devices
EP2561322B1 (de) 2010-04-20 2021-08-04 Hewlett-Packard Development Company, L.P. Selbstanordnende, lumineszenzverbessernde vorrichtung für oberflächenverstärkte lumineszenz
WO2012015443A1 (en) 2010-07-30 2012-02-02 Hewlett-Packard Development Company, L.P. Optical fiber surface enhanced raman spectroscopy (sers) probe
WO2012054027A1 (en) 2010-10-20 2012-04-26 Hewlett-Packard Development Company, L.P. Chemical-analysis device integrated with metallic-nanofinger device for chemical sensing
WO2012054024A1 (en) 2010-10-20 2012-04-26 Hewlett-Packard Development Company, L.P. Metallic-nanofinger device for chemical sensing
US9310306B2 (en) 2011-02-17 2016-04-12 Hewlett-Packard Development Company, L.P. Apparatus for use in sensing applications
US8593629B2 (en) 2011-02-17 2013-11-26 Hewlett-Packard Development Company, L.P. Apparatus for performing SERS
US9377409B2 (en) 2011-07-29 2016-06-28 Hewlett-Packard Development Company, L.P. Fabricating an apparatus for use in a sensing application
US8520202B2 (en) 2011-09-15 2013-08-27 Hewlett-Packard Development Company, L.P. Asymmetrical-nanofinger device for surface-enhanced luminescense
US8605281B2 (en) 2011-10-13 2013-12-10 Hewlett-Packard Development Company, L.P. Probe having nano-fingers
CN112669714B (zh) * 2020-12-22 2022-09-20 业成科技（成都）有限公司 发光二极体显示器及其制作方法
US11742295B2 (en) * 2020-12-28 2023-08-29 Global Unichip Corporation Interface of integrated circuit die and method for arranging interface thereof

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US4486705A (en) 1981-01-16 1984-12-04 Burroughs Corporation Method of testing networks on a wafer having grounding points on its periphery
SE8104574L (sv) * 1981-07-28 1983-01-29 Svenska Flaektfabriken Ab Styranordning for en elektrostatisk stoftavskiljare
JP2001284572A (ja) * 2000-03-29 2001-10-12 Hewlett Packard Co <Hp> 電子デバイス
JP2002289621A (ja) * 2001-03-27 2002-10-04 Japan Science & Technology Corp ナノメータースケール素子の配線接続方法及びその評価方法とそのための配線接続装置及びその評価装置
EP1468423A2 (de) 2002-01-18 2004-10-20 California Institute Of Technology Architektur auf array-basis für die molekulare elektronik
DE60325903D1 (de) * 2002-07-25 2009-03-05 California Inst Of Techn Dreidimensionales Speicher-Array
DE10259634B4 (de) * 2002-12-18 2008-02-21 Qimonda Ag Verfahren zur Herstellung von Kontakten auf einem Wafer
US6774004B1 (en) * 2003-03-17 2004-08-10 Sharp Laboratories Of America, Inc. Nano-scale resistance cross-point memory array
US7256435B1 (en) * 2003-06-02 2007-08-14 Hewlett-Packard Development Company, L.P. Multilevel imprint lithography
US7191380B2 (en) 2003-09-10 2007-03-13 Hewlett-Packard Development Company, L.P. Defect-tolerant and fault-tolerant circuit interconnections
US7327037B2 (en) * 2004-04-01 2008-02-05 Lucent Technologies Inc. High density nanostructured interconnection
US7307271B2 (en) * 2004-11-05 2007-12-11 Hewlett-Packard Development Company, L.P. Nanowire interconnection and nano-scale device applications
JP4496094B2 (ja) * 2005-01-14 2010-07-07 シャープ株式会社 半導体装置及び半導体集積回路

Also Published As

Publication number Publication date
EP2096672A2 (de) 2009-09-02
EP1977427B1 (de) 2010-03-03
US7692215B2 (en) 2010-04-06
JP2009525193A (ja) 2009-07-09
KR20080094011A (ko) 2008-10-22
US20070205483A1 (en) 2007-09-06
KR101099988B1 (ko) 2011-12-28
JP4995837B2 (ja) 2012-08-08
EP2096672A3 (de) 2010-01-13
US20070176168A1 (en) 2007-08-02
US7833842B2 (en) 2010-11-16
CN101375344B (zh) 2012-04-04
EP1977427A1 (de) 2008-10-08
CN101375344A (zh) 2009-02-25
US20100081238A1 (en) 2010-04-01
WO2007089522A1 (en) 2007-08-09
US7544977B2 (en) 2009-06-09
EP2096672B1 (de) 2011-08-03

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Legal Events

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