DE602005022783D1 - Kühlbaugruppe - Google Patents

Kühlbaugruppe

Info

Publication number
DE602005022783D1
DE602005022783D1 DE602005022783T DE602005022783T DE602005022783D1 DE 602005022783 D1 DE602005022783 D1 DE 602005022783D1 DE 602005022783 T DE602005022783 T DE 602005022783T DE 602005022783 T DE602005022783 T DE 602005022783T DE 602005022783 D1 DE602005022783 D1 DE 602005022783D1
Authority
DE
Germany
Prior art keywords
heat
circuit board
electronic component
heat sink
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005022783T
Other languages
English (en)
Inventor
Per Anders Holmberg
Ulf Erik Andretzky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of DE602005022783D1 publication Critical patent/DE602005022783D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/20—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Polarising Elements (AREA)
  • Inorganic Insulating Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
DE602005022783T 2005-06-23 2005-06-23 Kühlbaugruppe Active DE602005022783D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SE2005/001008 WO2006137763A1 (en) 2005-06-23 2005-06-23 Cooling asssembly

Publications (1)

Publication Number Publication Date
DE602005022783D1 true DE602005022783D1 (de) 2010-09-16

Family

ID=37570708

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005022783T Active DE602005022783D1 (de) 2005-06-23 2005-06-23 Kühlbaugruppe

Country Status (8)

Country Link
US (1) US7545646B2 (de)
EP (1) EP1900265B1 (de)
JP (1) JP2008547216A (de)
CN (1) CN101209006A (de)
AT (1) ATE476864T1 (de)
CA (1) CA2611578A1 (de)
DE (1) DE602005022783D1 (de)
WO (1) WO2006137763A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101063446B1 (ko) * 2006-05-30 2011-09-08 네오벌브 테크놀러지스 인크 높은 출력 및 높은 열발산 효율을 갖는 발광 다이오드 조명장비
US20080264608A1 (en) * 2007-04-30 2008-10-30 Trentent Tye Cooling mechanism comprising a heat pipe and water block
JP5639579B2 (ja) * 2008-04-29 2014-12-10 コーニンクレッカ フィリップス エヌ ヴェ 発光モジュール、ヒートシンク及び照射システム
US20110048677A1 (en) * 2009-08-31 2011-03-03 Kuo-Len Lin Heat-conducting assembly for heat pipes of different diameters and heat sink having the same
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
US9036353B2 (en) 2012-11-26 2015-05-19 Northrop Grumman Systems Corporation Flexible thermal interface for electronics
CN103415184A (zh) * 2013-07-23 2013-11-27 苏州天脉导热科技有限公司 一种热传递与热扩散器件的结合方法
KR102173141B1 (ko) * 2014-02-04 2020-11-02 삼성전자주식회사 히트 파이프를 포함하는 휴대 장치
WO2015184603A1 (zh) 2014-06-04 2015-12-10 华为技术有限公司 一种电子设备
US9750127B2 (en) 2015-12-04 2017-08-29 General Electric Company Circuit card assembly including heat transfer assembly and method of manufacturing such
US10119759B2 (en) * 2016-03-31 2018-11-06 Hoya Candeo Optronics Corporation Heat radiating apparatus and light illuminating apparatus with the same
US11543188B2 (en) 2016-06-15 2023-01-03 Delta Electronics, Inc. Temperature plate device
US11306974B2 (en) 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
WO2018053005A1 (en) * 2016-09-16 2018-03-22 Heraeus Noblelight America Llc Heatsink including thick film layer for uv led arrays, and methods of forming uv led arrays
EP3301999B1 (de) * 2016-09-30 2020-06-17 HP Scitex Ltd Led-kühlkörper
US9894803B1 (en) 2016-11-18 2018-02-13 Abaco Systems, Inc. Thermal sink with an embedded heat pipe
TWI685638B (zh) * 2018-09-14 2020-02-21 財團法人工業技術研究院 立體脈衝式熱管、立體脈衝式熱管組和散熱模組
US10667378B1 (en) * 2019-01-14 2020-05-26 Eagle Technology, Llc Electronic assemblies having embedded passive heat pipes and associated method
WO2024085050A1 (ja) * 2022-10-17 2024-04-25 京セラ株式会社 放熱基板及び放熱装置
WO2024085051A1 (ja) * 2022-10-17 2024-04-25 京セラ株式会社 放熱基板及び放熱装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5461673A (en) * 1977-10-25 1979-05-18 Oki Electric Ind Co Ltd Printed circuit board for radiation
JPS5715609A (en) * 1980-06-27 1982-01-27 Toshiba Corp Machining method and its device for turbine blade
JPS5748699A (en) * 1980-09-08 1982-03-20 Japan Gasoline Method of treating liquid containing radioactive nuclide
EP0353568A1 (de) * 1988-07-26 1990-02-07 Siemens Aktiengesellschaft Verfahren zum Reduzieren der beim Abspielen von Videomagnetbändern in Videorekordern auftretenden Bildstörungen und Vorrichtung zur Durchführung des Verfahrens
JPH0370968U (de) * 1989-11-15 1991-07-17
US5353192A (en) * 1993-02-08 1994-10-04 At&T Bell Laboratories Circuit card assembly
JPH07176661A (ja) * 1993-12-20 1995-07-14 Hitachi Cable Ltd ヒートシンク
JP3414996B2 (ja) * 1997-09-01 2003-06-09 株式会社Ｐｆｕ 基板実装型熱交換構造
TW450381U (en) * 1998-08-07 2001-08-11 Foxconn Prec Components Co Ltd Heat sink device
JP4493117B2 (ja) * 1999-03-25 2010-06-30 レノボ シンガポール プライヴェート リミテッド ノートブック型パーソナルコンピューターの冷却方法及び冷却装置
JP4223628B2 (ja) * 1999-05-20 2009-02-12 ティーエス ヒートロニクス 株式会社 電子機器冷却装置
JP3982947B2 (ja) * 1999-05-26 2007-09-26 株式会社フジクラ ヒートシンクの固定構造
US6639799B2 (en) * 2000-12-22 2003-10-28 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
JP3637304B2 (ja) * 2001-11-29 2005-04-13 株式会社東芝 小型電子機器
JP2003218294A (ja) * 2002-01-23 2003-07-31 Mitsubishi Electric Corp 放熱器
JP2003229689A (ja) * 2002-02-04 2003-08-15 Fujikura Ltd 電子素子の冷却装置
JP2004022786A (ja) * 2002-06-17 2004-01-22 Matsushita Electric Ind Co Ltd ファンユニット
US7057895B2 (en) * 2003-06-30 2006-06-06 Intel Corporation Thermal standoff for close proximity thermal management
JP4041023B2 (ja) * 2003-07-04 2008-01-30 株式会社東芝 配線基板
CN100377343C (zh) * 2004-09-21 2008-03-26 鸿富锦精密工业（深圳）有限公司 散热装置的制造方法

Also Published As

Publication number Publication date
CN101209006A (zh) 2008-06-25
ATE476864T1 (de) 2010-08-15
CA2611578A1 (en) 2006-12-28
EP1900265A1 (de) 2008-03-19
US20080198554A1 (en) 2008-08-21
JP2008547216A (ja) 2008-12-25
EP1900265B1 (de) 2010-08-04
WO2006137763A1 (en) 2006-12-28
US7545646B2 (en) 2009-06-09

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