JP5639579B2 - 発光モジュール、ヒートシンク及び照射システム - Google Patents
発光モジュール、ヒートシンク及び照射システム Download PDFInfo
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- JP5639579B2 JP5639579B2 JP2011506807A JP2011506807A JP5639579B2 JP 5639579 B2 JP5639579 B2 JP 5639579B2 JP 2011506807 A JP2011506807 A JP 2011506807A JP 2011506807 A JP2011506807 A JP 2011506807A JP 5639579 B2 JP5639579 B2 JP 5639579B2
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- Prior art keywords
- cooling
- heat sink
- light emitting
- emitting module
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001816 cooling Methods 0.000 claims description 208
- 239000012809 cooling fluid Substances 0.000 claims description 22
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000002470 thermal conductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/73—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements being adjustable with respect to each other, e.g. hinged
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Description
Claims (11)
- 光源とヒートシンクとを有する発光モジュールであって、
前記光源が、前記ヒートシンク上に付加され、前記ヒートシンクに熱的に接続され、
前記ヒートシンクが、冷却流体を流すための冷却管である冷却体に取り外し可能に取り付けられ、
前記ヒートシンクの外壁の少なくとも部分は、前記光源により生成された熱を前記冷却体に伝達させるために前記冷却体の外壁の少なくとも一部に適合する形状を有し、
当該発光モジュールは、前記冷却管を流れる前記冷却流体の流れの遮断を必要とすることなく前記ヒートシンクを前記冷却体に取り外し可能に取り付けるための弾性取り付け手段を有し、前記弾性取り付け手段は、前記冷却管に沿った任意の位置で、前記ヒートシンクが前記冷却管に対し取り付けられ、かつ該取り付け位置で前記冷却管から取り除かれることを可能にし、
前記弾性取り付け手段は、前記冷却管の一部を受け入れ、前記ヒートシンクを前記冷却管に固定するように構成され、前記弾性取り付け手段は、前記固定の際、前記ヒートシンクが前記冷却管に対し押され前記冷却管に固定されるように、前記ヒートシンクを前記冷却管に圧力ばめで固定する、発光モジュール。 - 前記光源は、前記ヒートシンク上に付加される、請求項1に記載の発光モジュール。
- 前記ヒートシンクの前記外壁は、前記ヒートシンクの内側に湾曲され、
湾曲した前記外壁は、前記冷却体の半径に実質的に適合する半径により規定される、請求項1又は請求項2に記載の発光モジュール。 - 前記ヒートシンクの前記外壁は、第1の半径により規定される第1の湾曲壁部分と、前記第1の半径よりも大きい第2の半径により規定される第2の湾曲壁部分とを有する、請求項1〜3のうちいずれか一項に記載の発光モジュール。
- 前記第1の湾曲壁部分は、前記第2の湾曲壁部分内に一体化される、請求項4に記載の発光モジュール。
- 前記ヒートシンクの前記外壁は、実質的に円柱の形状をもつ、請求項3〜5のうちいずれか一項に記載の発光モジュール。
- 前記ヒートシンクは、前記冷却体と前記光源との間に導電性パスを有する、請求項1〜6のうちいずれか一項に記載の発光モジュール。
- 前記弾性取り付け手段は、前記ヒートシンク及び前記冷却体に力を付加するように構成され、これにより、前記ヒートシンクと前記冷却体との間の熱伝達を可能にするために前記冷却体に対して前記ヒートシンクをクランピングする、請求項1〜7のうちいずれか一項に記載の発光モジュール。
- 請求項1〜8のうちいずれか一項に記載の発光モジュールで使用する、ヒートシンク。
- 冷却体を有する冷却回路と請求項1〜8のうちいずれか一項に記載の発光モジュールとを有する、照射システム。
- 前記冷却体は、冷却流体をガイドする冷却管を有する、請求項10に記載の照射システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08155319 | 2008-04-29 | ||
EP08155319.0 | 2008-04-29 | ||
PCT/IB2009/051648 WO2009133495A1 (en) | 2008-04-29 | 2009-04-22 | Light emitting module, heat sink and illumination system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011519141A JP2011519141A (ja) | 2011-06-30 |
JP5639579B2 true JP5639579B2 (ja) | 2014-12-10 |
Family
ID=40751029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011506807A Active JP5639579B2 (ja) | 2008-04-29 | 2009-04-22 | 発光モジュール、ヒートシンク及び照射システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US8622588B2 (ja) |
EP (1) | EP2271874B1 (ja) |
JP (1) | JP5639579B2 (ja) |
CN (1) | CN102016407B (ja) |
WO (1) | WO2009133495A1 (ja) |
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KR20220132531A (ko) | 2019-12-10 | 2022-09-30 | 아그네틱스, 인크. | 조사기 및 카메라 및/또는 센서를 사용하는 제어된 환경 원예를 위한 다중센서 이미징 방법 및 장치 |
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2009
- 2009-04-22 CN CN200980115257.9A patent/CN102016407B/zh active Active
- 2009-04-22 WO PCT/IB2009/051648 patent/WO2009133495A1/en active Application Filing
- 2009-04-22 US US12/989,445 patent/US8622588B2/en active Active
- 2009-04-22 EP EP09738508.2A patent/EP2271874B1/en active Active
- 2009-04-22 JP JP2011506807A patent/JP5639579B2/ja active Active
Also Published As
Publication number | Publication date |
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CN102016407B (zh) | 2014-11-19 |
US8622588B2 (en) | 2014-01-07 |
WO2009133495A1 (en) | 2009-11-05 |
CN102016407A (zh) | 2011-04-13 |
EP2271874B1 (en) | 2013-12-04 |
JP2011519141A (ja) | 2011-06-30 |
US20110037369A1 (en) | 2011-02-17 |
EP2271874A1 (en) | 2011-01-12 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |