DE60022495D1 - Keramischer heizer. - Google Patents

Keramischer heizer.

Info

Publication number
DE60022495D1
DE60022495D1 DE60022495T DE60022495T DE60022495D1 DE 60022495 D1 DE60022495 D1 DE 60022495D1 DE 60022495 T DE60022495 T DE 60022495T DE 60022495 T DE60022495 T DE 60022495T DE 60022495 D1 DE60022495 D1 DE 60022495D1
Authority
DE
Germany
Prior art keywords
ceramic heater
ceramic
heater
ceramic substrate
rmax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60022495T
Other languages
English (en)
Other versions
DE60022495T2 (de
Inventor
Yasutaka Ito
Yasuji Hiramatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of DE60022495D1 publication Critical patent/DE60022495D1/de
Application granted granted Critical
Publication of DE60022495T2 publication Critical patent/DE60022495T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60022495T 1999-08-09 2000-08-01 Keramischer heizer. Expired - Lifetime DE60022495T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP22569699 1999-08-09
JP22569699 1999-08-09
JP2000131210 2000-04-28
JP2000131210A JP2001118664A (ja) 1999-08-09 2000-04-28 セラミックヒータ
PCT/JP2000/005156 WO2001011923A1 (fr) 1999-08-09 2000-08-01 Dispositif de chauffe en ceramique

Publications (2)

Publication Number Publication Date
DE60022495D1 true DE60022495D1 (de) 2005-10-13
DE60022495T2 DE60022495T2 (de) 2006-06-29

Family

ID=26526784

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60022495T Expired - Lifetime DE60022495T2 (de) 1999-08-09 2000-08-01 Keramischer heizer.

Country Status (7)

Country Link
US (3) US6465763B1 (de)
EP (2) EP1437917A1 (de)
JP (1) JP2001118664A (de)
AT (1) ATE304279T1 (de)
DE (1) DE60022495T2 (de)
TW (1) TW480895B (de)
WO (1) WO2001011923A1 (de)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6967313B1 (en) * 1999-05-07 2005-11-22 Ibiden Company, Ltd. Hot plate and method of producing the same
US6835916B2 (en) 1999-08-09 2004-12-28 Ibiden, Co., Ltd Ceramic heater
JP2001118662A (ja) 1999-08-09 2001-04-27 Ibiden Co Ltd セラミックヒータ
JP2001118664A (ja) * 1999-08-09 2001-04-27 Ibiden Co Ltd セラミックヒータ
JP3381909B2 (ja) * 1999-08-10 2003-03-04 イビデン株式会社 半導体製造・検査装置用セラミックヒータ
WO2001013423A1 (fr) * 1999-08-10 2001-02-22 Ibiden Co., Ltd. Plaque ceramique pour dispositif de production de semi-conducteurs
JP3273773B2 (ja) 1999-08-12 2002-04-15 イビデン株式会社 半導体製造・検査装置用セラミックヒータ、半導体製造・検査装置用静電チャックおよびウエハプローバ用チャックトップ
EP1249433A4 (de) 1999-09-06 2005-01-05 Ibiden Co Ltd Brikett und keramisches substrat aus gesintertem kohlenstoffhaltigem aluminiumnitrid zur verwendung in vorrichtungen zur herstellung und untersuchung von halbleitern
WO2002091457A1 (fr) 1999-12-09 2002-11-14 Ibiden Co., Ltd. Plaque ceramique pour appareil de production/controle de semi-conducteurs
JP2001237053A (ja) * 1999-12-14 2001-08-31 Ibiden Co Ltd 半導体製造・検査装置用セラミックヒータおよび支持ピン
US20040222211A1 (en) * 1999-12-28 2004-11-11 Ibiden Co., Ltd. Carbon-containing aluminum nitride sintered body, and ceramic substrate for a semiconductor producing/examining device
US20040011782A1 (en) * 1999-12-29 2004-01-22 Ibiden Co., Ltd Ceramic heater
JP3228923B2 (ja) * 2000-01-18 2001-11-12 イビデン株式会社 半導体製造・検査装置用セラミックヒータ
JP3228924B2 (ja) * 2000-01-21 2001-11-12 イビデン株式会社 半導体製造・検査装置用セラミックヒータ
EP1193233A1 (de) 2000-02-07 2002-04-03 Ibiden Co., Ltd. Keramisches substrat zur herstellung von halbleitern/inspektions vorrichtung
US7011874B2 (en) * 2000-02-08 2006-03-14 Ibiden Co., Ltd. Ceramic substrate for semiconductor production and inspection devices
WO2001062686A1 (fr) * 2000-02-24 2001-08-30 Ibiden Co., Ltd. Piece frittee en nitrure d'aluminium, substrat en ceramique, corps chauffant en ceramique et mandrin electrostatique
JP2001244320A (ja) * 2000-02-25 2001-09-07 Ibiden Co Ltd セラミック基板およびその製造方法
JP2001247382A (ja) * 2000-03-06 2001-09-11 Ibiden Co Ltd セラミック基板
EP1205451A1 (de) 2000-03-07 2002-05-15 Ibiden Co., Ltd. Keramisches substrat zur herstellung/inspektion von halbleitern
JP2001253777A (ja) * 2000-03-13 2001-09-18 Ibiden Co Ltd セラミック基板
US20040149718A1 (en) * 2000-04-07 2004-08-05 Yasutaka Ito Ceramic heater
EP1233651A1 (de) * 2000-04-07 2002-08-21 Ibiden Co., Ltd. Keramisches heizelement
JP3565496B2 (ja) * 2000-04-13 2004-09-15 イビデン株式会社 セラミックヒータ、静電チャックおよびウエハプローバ
JP2001302330A (ja) * 2000-04-24 2001-10-31 Ibiden Co Ltd セラミック基板
US6677557B2 (en) * 2000-05-02 2004-01-13 Ibiden Co., Ltd. Ceramic heater
JP2002025758A (ja) * 2000-05-02 2002-01-25 Ibiden Co Ltd ホットプレートユニット
EP1211725A4 (de) 2000-05-10 2003-02-26 Ibiden Co Ltd Elektrostatische haltevorrichtung
US7071551B2 (en) * 2000-05-26 2006-07-04 Ibiden Co., Ltd. Device used to produce or examine semiconductors
JP3618640B2 (ja) * 2000-06-15 2005-02-09 イビデン株式会社 半導体製造・検査装置用ホットプレート
JP3516392B2 (ja) 2000-06-16 2004-04-05 イビデン株式会社 半導体製造・検査装置用ホットプレート
US6897414B2 (en) * 2000-07-03 2005-05-24 Ibiden Co., Ltd. Ceramic heater for semiconductor manufacturing/testing apparatus
WO2002003435A1 (fr) * 2000-07-04 2002-01-10 Ibiden Co., Ltd. Plaque chaude destinee a la fabrication et aux essais de semiconducteurs
US6967312B2 (en) * 2000-07-19 2005-11-22 Ibiden Co., Ltd. Semiconductor manufacturing/testing ceramic heater, production method for the ceramic heater and production system for the ceramic heater
WO2002009171A1 (fr) * 2000-07-25 2002-01-31 Ibiden Co., Ltd. Substrat ceramique pour appareil de fabrication/inspection de semi-conducteurs, element chauffant en ceramique, dispositif de retenue electrostatique sans attache et substrat pour testeur de tranches
WO2002019400A1 (fr) 2000-08-30 2002-03-07 Ibiden Co., Ltd. Dispositif ceramique chauffant permettant la production de semi-conducteurs et equipement d'inspection
JP2002076102A (ja) * 2000-08-31 2002-03-15 Ibiden Co Ltd セラミック基板
US20040035846A1 (en) * 2000-09-13 2004-02-26 Yasuji Hiramatsu Ceramic heater for semiconductor manufacturing and inspecting equipment
JP2002160974A (ja) * 2000-11-22 2002-06-04 Ibiden Co Ltd 窒化アルミニウム焼結体、窒化アルミニウム焼結体の製造方法、セラミック基板およびセラミック基板の製造方法
EP1345472A1 (de) 2000-11-24 2003-09-17 Ibiden Co., Ltd. Keramisches heizelement und verfahren zu seiner herstellung
EP1341216A1 (de) * 2000-12-05 2003-09-03 Ibiden Co., Ltd. Keramisches substrat für vorrrichtungen zur herstellung und überprüfung von halbleitern und verfahren zur herstellung dieses substrats
WO2002084717A1 (fr) * 2001-04-11 2002-10-24 Ibiden Co., Ltd. Dispositif ceramique chauffant pour installation de fabrication/inspection de semi-conducteurs
JP2002313890A (ja) * 2001-04-11 2002-10-25 Sumitomo Electric Ind Ltd 被加熱物搭載用ヒータ部材およびそれを用いた基板処理装置
IL154264A0 (en) * 2001-06-06 2003-09-17 Ibiden Co Ltd Wafer prober
CN1473452A (zh) * 2001-07-09 2004-02-04 IBIDEN�ɷ����޹�˾ 陶瓷加热器与陶瓷接合体
EP1422754A1 (de) 2001-08-10 2004-05-26 Ibiden Co., Ltd. Keramischer verbindungskörper
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JP2004146567A (ja) * 2002-10-24 2004-05-20 Sumitomo Electric Ind Ltd 半導体製造装置用セラミックスヒーター
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JP4569077B2 (ja) 2003-06-05 2010-10-27 住友電気工業株式会社 半導体あるいは液晶製造装置用保持体およびそれを搭載した半導体あるいは液晶製造装置
KR100506315B1 (ko) * 2003-08-22 2005-08-05 삼성전자주식회사 웨이퍼 베이크 시스템 및 그 동작 방법
JP2005166354A (ja) * 2003-12-01 2005-06-23 Ngk Insulators Ltd セラミックヒーター
US20060000822A1 (en) * 2004-02-23 2006-01-05 Kyocera Corporation Ceramic heater, wafer heating device using thereof and method for manufacturing a semiconductor substrate
TWI353631B (en) * 2004-06-28 2011-12-01 Kyocera Corp Wafer heating device and semiconductor equipment
US20060060145A1 (en) * 2004-09-17 2006-03-23 Van Den Berg Jannes R Susceptor with surface roughness for high temperature substrate processing
US20060088692A1 (en) * 2004-10-22 2006-04-27 Ibiden Co., Ltd. Ceramic plate for a semiconductor producing/examining device
TWI281833B (en) * 2004-10-28 2007-05-21 Kyocera Corp Heater, wafer heating apparatus and method for manufacturing heater
JP2007053280A (ja) * 2005-08-19 2007-03-01 Sumitomo Electric Ind Ltd 半導体加熱ヒータ用容器
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JP5683063B2 (ja) * 2007-09-05 2015-03-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 窒化アルミニウム又は酸化ベリリウムのセラミックカバーウェハ
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JP5915026B2 (ja) * 2011-08-26 2016-05-11 住友大阪セメント株式会社 温度測定用板状体及びそれを備えた温度測定装置
FR2992313B1 (fr) * 2012-06-21 2014-11-07 Eurokera Article vitroceramique et procede de fabrication
US9088085B2 (en) * 2012-09-21 2015-07-21 Novellus Systems, Inc. High temperature electrode connections
JP6497761B2 (ja) * 2015-02-23 2019-04-10 エム キューブド テクノロジーズ，インコーポレーテッドＭ Ｃｕｂｅｄ Ｔｅｃｈｎｏｌｏｇｉｅｓ， Ｉｎｃ． 静電チャック用薄膜電極
JP6401638B2 (ja) * 2015-03-17 2018-10-10 株式会社Kelk 加熱装置
JP6804828B2 (ja) * 2015-04-20 2020-12-23 日本特殊陶業株式会社 セラミックヒータ及び静電チャック
JP6758143B2 (ja) * 2016-09-29 2020-09-23 日本特殊陶業株式会社 加熱装置
JP7259765B2 (ja) * 2017-12-28 2023-04-18 住友大阪セメント株式会社 静電チャック装置
CN110645794B (zh) * 2019-08-30 2021-04-06 西安工业大学 半密闭非真空氮气保护电路模块烧结系统

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Also Published As

Publication number Publication date
EP1185145A1 (de) 2002-03-06
EP1185145B1 (de) 2005-09-07
US6861620B2 (en) 2005-03-01
EP1185145A4 (de) 2003-01-15
EP1437917A1 (de) 2004-07-14
US6465763B1 (en) 2002-10-15
JP2001118664A (ja) 2001-04-27
US6710307B2 (en) 2004-03-23
US20040045951A1 (en) 2004-03-11
US20020158061A1 (en) 2002-10-31
DE60022495T2 (de) 2006-06-29
TW480895B (en) 2002-03-21
WO2001011923A1 (fr) 2001-02-15
ATE304279T1 (de) 2005-09-15

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