HK1078955A1 - Thermal solution for electronic devices - Google Patents

Thermal solution for electronic devices

Info

Publication number
HK1078955A1
HK1078955A1 HK05110839.9A HK05110839A HK1078955A1 HK 1078955 A1 HK1078955 A1 HK 1078955A1 HK 05110839 A HK05110839 A HK 05110839A HK 1078955 A1 HK1078955 A1 HK 1078955A1
Authority
HK
Hong Kong
Prior art keywords
thermal solution
electronic devices
electronic device
heat source
external surface
Prior art date
Application number
HK05110839.9A
Other languages
English (en)
Inventor
Martin David Smalc
Gary D Shives
Iii Robert Anderson Reynolds
Original Assignee
Graftech Int Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34465685&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1078955(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Graftech Int Holdings Inc filed Critical Graftech Int Holdings Inc
Publication of HK1078955A1 publication Critical patent/HK1078955A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
HK05110839.9A 2003-11-25 2005-11-28 Thermal solution for electronic devices HK1078955A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/722,364 US6982874B2 (en) 2003-11-25 2003-11-25 Thermal solution for electronic devices

Publications (1)

Publication Number Publication Date
HK1078955A1 true HK1078955A1 (en) 2006-03-24

Family

ID=34465685

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05110839.9A HK1078955A1 (en) 2003-11-25 2005-11-28 Thermal solution for electronic devices

Country Status (11)

Country Link
US (1) US6982874B2 (de)
EP (3) EP2026164B1 (de)
JP (1) JP2005159313A (de)
KR (1) KR100555610B1 (de)
CN (1) CN100559923C (de)
AT (1) ATE438132T1 (de)
DE (2) DE04256484T1 (de)
HK (1) HK1078955A1 (de)
HU (1) HUE035539T2 (de)
PL (1) PL2259164T3 (de)
TW (1) TWI278275B (de)

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CN1622745A (zh) 2005-06-01
KR20050050565A (ko) 2005-05-31
EP1536313A3 (de) 2006-08-02
EP2026164B1 (de) 2016-05-11
PL2259164T3 (pl) 2018-06-29
EP2259164B8 (de) 2018-02-21
TW200529734A (en) 2005-09-01
TWI278275B (en) 2007-04-01
ATE438132T1 (de) 2009-08-15
EP2259164B1 (de) 2017-12-06
EP2259164A1 (de) 2010-12-08
DE602004022238D1 (de) 2009-09-10
CN100559923C (zh) 2009-11-11
US20050111189A1 (en) 2005-05-26
HUE035539T2 (en) 2018-05-02
EP1536313B1 (de) 2009-07-29
KR100555610B1 (ko) 2006-03-03
EP1536313A2 (de) 2005-06-01
EP2026164A1 (de) 2009-02-18
DE04256484T1 (de) 2006-07-13
US6982874B2 (en) 2006-01-03
JP2005159313A (ja) 2005-06-16

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Effective date: 20161021