JP6393784B2 - 電磁波吸収消滅および遮蔽用ならびに電子機器高放熱用融合シート、および、その製造方法 - Google Patents
電磁波吸収消滅および遮蔽用ならびに電子機器高放熱用融合シート、および、その製造方法 Download PDFInfo
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- JP6393784B2 JP6393784B2 JP2016570243A JP2016570243A JP6393784B2 JP 6393784 B2 JP6393784 B2 JP 6393784B2 JP 2016570243 A JP2016570243 A JP 2016570243A JP 2016570243 A JP2016570243 A JP 2016570243A JP 6393784 B2 JP6393784 B2 JP 6393784B2
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- sheet
- graphite
- porous metal
- metal sheet
- fusion
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Description
本発明の第1実施例に係る電磁波吸収消滅および遮蔽用融合シートの製造方法は、図8を参照すると、大きく仮成形グラファイトシートの準備段階(s10)と、焼結シート21からなる多気孔金属シートの成形段階(s20)、融合シートの形成段階(s30)、放熱薄層の形成段階(s40)から構成される。
本発明の第2実施例に係る電磁波吸収消滅および遮蔽用融合シートの製造方法は、図9を参照すると、大きく仮成形グラファイトシートの準備段階(s11)と、電解鋳造シート22からなる多気孔金属シートの成形段階(s21)と、融合シートの形成段階(s31)と、放熱薄層の形成段階(s41)とから構成される。
本発明の第3実施例に係る電磁波吸収消滅および遮蔽用融合シートの製造方法は、図10を参照すると、大きく仮成形グラファイトシートの準備段階(s12)と、金属薄板シート23からなる多気孔金属シートの成形段階(s22)と、融合シートの形成段階(s32)と、放熱薄層の形成段階(s42)とから構成される。
本発明の第4実施例に係る電磁波吸収消滅および遮蔽用融合シートの製造方法は、図11を参照すると、大きく仮成形グラファイトシートの準備段階(s13)と、金属薄板シート23からなる多気孔金属シートの成形段階(s23)と、融合シートの形成段階(s33)と、放熱薄層の形成段階(s43)とから構成される。
本発明の第1実施例に係る電子機器高放熱用融合シートの製造方法は、図8を参照すると、大きく仮成形グラファイトシートの準備段階(s10)と、焼結シート21からなる多気孔金属シートの成形段階(s20)、融合シートの形成段階(s30)、放熱薄層の形成段階(s40)から構成される。
本発明の第2実施例に係る電子機器高放熱用融合シートの製造方法は、図9を参照すると、大きく仮成形グラファイトシートの準備段階(s11)と、電解鋳造シート22からなる多気孔金属シートの成形段階(s21)、融合シートの形成段階(s31)、放熱薄層の形成段階(s41)から構成される。
本発明の第3実施例に係る電子機器高放熱用融合シートの製造方法は、図10を参照すると、大きく仮成形グラファイトシートの準備段階(s12)と、金属薄板シート23からなる多気孔金属シートの成形段階(s22)、融合シートの形成段階(s32)、放熱薄層の形成段階(s42)から構成される。
本発明の第4実施例に係る電子機器高放熱用融合シートの製造方法は、図11を参照すると、大きく仮成形グラファイトシートの準備段階(s13)と、金属薄板シート23からなる多気孔金属シートの成形段階(s23)、融合シートの形成段階(s33)、放熱薄層の形成段階(s43)から構成される。
10…仮成形グラファイトシート
20…多気孔金属シート
20a…空隙
21…焼結シート
22…電解鋳造シート
23…金属薄板シート
23a…曲面部
23b…傾斜面部
24…ネットシート
24a…縦線ワイヤー
24b…横線ワイヤー
30…放熱膜層
33…接着物
35…金属薄板
40…絶縁物
Claims (14)
- 黒鉛成分を含むグラファイト基材をシート形態で成形し、ただし密度が0.1〜1.5g/cm3の範囲を有するようにして結晶構造が不完全な状態で形成された仮成形グラファイトシートと;上面と下面とで連結される微細な孔や隙間からなる0.01mm〜0.5mmの大きさを有する複数個の空隙を含み、前記仮成形グラファイトシートが一面に積層されて密度が2.0g/cm3〜6.0g/cm3となるように加圧成形されることにより、前記グラファイト基材の結晶粒子の一部が前記複数個の空隙に含浸されながら物理的に相互付着結合される多気孔金属シート;を含む構成を特徴とする電磁波吸収消滅および遮蔽用融合シート。
- 前記仮成形グラファイトシートは、黒鉛もしくは黒鉛粉末を圧着成形するか、または、黒鉛に有機系、無機系、セラミック系のうちのいずれか一つもしくは一つ以上を組成した黒鉛組成物を使用するか、または、黒鉛に有機系、無機系、セラミック系のうちのいずれか一つもしくは一つ以上を組成した放熱樹脂を混合して得られた混合物のうちのいずれか一つから成形されたことを特徴とする、請求項1に記載の電磁波吸収消滅および遮蔽用融合シート。
- 前記多気孔金属シートには、銅、錫、亜鉛、アルミニウム、または、ステンレス系の金属粉末を1μm〜200μmの粒度サイズにして溶融温度より10〜30%低い温度で加熱して焼結し、これを加圧して得られた焼結シートが使用されることを特徴とする、請求項1に記載の電磁波吸収消滅および遮蔽用融合シート。
- 前記多気孔金属シートは、高温で気化または液化する樹脂から成形された成形フレームを電解鋳造に浸漬して通電させることにより金属を電着して電着層を形成し、この電着層が形成された成形フレームを加熱して樹脂を除去することにより得られた金属電解鋳造シートであることを特徴とする、請求項1に記載の電磁波吸収消滅および遮蔽用融合シート。
- 前記多気孔金属シートは、銅、錫、亜鉛、アルミニウム、または、ステンレス系の金属材からなる薄板にパンチング、レーザー、または、エッチング工法で空隙孔を形成して得られたシート部材であって、前記空隙孔は、前記仮成形グラファイトシートが加圧成形により付着された状態でその結晶構造が壊れないように前記仮成形グラファイトシートが付着される一側の表面を基準にその表面と曲面成形をなす曲面部と、この曲面部で内側に行くほど直径がなだらかに減少する傾斜面部とを含む構成を特徴とする、請求項1に記載の電磁波吸収消滅および遮蔽用融合シート。
- 前記多気孔金属シートは、断面が円形である金属材からなる縦線ワイヤーと横線ワイヤーとを互いに交差するように編んだネットシートであることを特徴とする、請求項1に記載の電磁波吸収消滅および遮蔽用融合シート。
- 前記多気孔金属シートは、前記仮成形グラファイトシートが付着されない他面に加圧、塗布または含浸により一体に付着形成されるものであって、一部が多気孔金属シートの表面に形成された空隙を通じて反対側の前記仮成形グラファイトシート側に含浸されて結束する金属および有無機系の樹脂からなる放熱膜層がさらに備えられ;前記放熱膜層が、前記多気孔金属シートの表面にPVC、PC、ウレタン、シリコン、ABS、UVのうちのいずれか一つまたは一つ以上を組成した絶縁樹脂組成物をコーティングして形成された絶縁物、接着性分を有する樹脂を塗布して得られた粘着物、両面テープを付着させて得られた接着物、または、アルミニウムもしくはアルミニウム合金からなる薄板を付着させることにより形成された金属薄板のうちのいずれか一つまたは一つ以上が積層形成されることを特徴とする、請求項1に記載の電磁波吸収消滅および遮蔽用融合シート。
- 電磁波吸収消滅および遮蔽用融合シートの製造方法において、グラファイト基材から密度が0.1g/cm3〜1.5g/cm3の範囲を有する結晶構造が不完全な状態のシート形態を得る仮成形グラファイトシートの準備段階;300℃〜1800℃の溶融温度を有する銅系、錫系、亜鉛系、アルミニウム系、または、ステンレス系の金属粉末であって、金属粉末の粒度は、1μm〜200μmの大きさを有する金属粉末を溶融温度より10〜30%低い温度雰囲気下の条件で10分〜300分加熱して、0.05mm〜3.0mmの空隙を有する多気孔性焼結体を得る多気孔金属シートの成形段階;前記仮成形グラファイトシートを前記多気孔金属シートの一表面に積層した後、加圧成形して前記仮成形グラファイトシートを構成するグラファイト結晶が前記多気孔金属シートの表面空隙に含浸されながら一体に付着結合されるようにする段階であって、密度が2.0g/cm3〜6.0g/cm3の範囲を有するように加圧成形しながら空隙を0.01mm〜0.5mmの大きさとする融合シートの形成段階;を含んで構成されることを特徴とする電磁波吸収消滅および遮蔽用融合シートの製造方法。
- 電磁波吸収消滅および遮蔽用融合シートの製造方法において、グラファイト基材から密度が0.1g/cm3〜1.5g/cm3の範囲を有する結晶構造が不完全な状態のシート形態を得る仮成形グラファイトシートの準備段階;高温で気化または液化する樹脂から成形された板状の成形フレーム外面に通電液を塗布して通電層を形成し、これを電解鋳造に浸漬および通電させて金属を電着して電着層を形成した後、前記成形フレームを加熱して樹脂を除去して成形することにより行われる仮成形多気孔金属シートの成形段階;前記仮成形多気孔金属シートを厚さ0.01mm〜50mmになるように1回〜10回、加圧して行われる多気孔金属シートの成形段階;前記仮成形グラファイトシートを前記多気孔金属シートの一表面に積層した後、加圧成形して前記仮成形グラファイトシートを構成するグラファイト結晶が前記多気孔金属シートの表面空隙に含浸されながら一体に付着結合されるようにする段階であって、密度が2.0g/cm3〜6.0g/cm3の範囲を有するように加圧成形しながら空隙を0.01mm〜0.5mmの大きさとする融合シートの形成段階;を含む構成を特徴とする電磁波吸収消滅および遮蔽用融合シートの製造方法。
- 電磁波吸収消滅および遮蔽用融合シートの製造方法において、グラファイト基材から密度が0.1g/cm3〜1.5g/cm3の範囲を有する結晶構造が不完全な状態のシート形態を得る仮成形グラファイトシートの準備段階;銅、錫、亜鉛、アルミニウム、または、ステンレス系の金属材からなる薄板にパンチング、レーザー、または、エッチング工法で空隙孔を形成したシート部材であって、前記空隙孔は、仮成形グラファイトシートが加圧成形により付着された状態でその結晶構造が壊れないように前記仮成形グラファイトシートが付着される一側の表面を基準にその表面と曲面成形をなす曲面部と、この曲面部で孔の内側に行くほど直径がなだらかに減少する傾斜面部とを形成して行われる多気孔金属シートの成形段階;前記仮成形グラファイトシートを多気孔金属シートの一表面に積層した後、加圧成形して前記仮成形グラファイトシートを構成するグラファイト結晶が前記多気孔金属シートの表面空隙に含浸されながら一体に付着結合されるようにする段階であって、密度が2.0g/cm3〜6.0g/cm3の範囲を有するように加圧成形しながら空隙を0.01mm〜0.5mmの大きさとする融合シートの形成段階;から構成されることを特徴とする電磁波吸収消滅および遮蔽用融合シートの製造方法。
- 電磁波吸収消滅および遮蔽用融合シートの製造方法において、グラファイト基材から密度が0.1g/cm3〜1.5g/cm3の範囲を有する結晶構造が不完全な状態のシート形態を得る仮成形グラファイトシートの準備段階;断面が円形である金属材からなる縦線ワイヤーと横線ワイヤーとを互いに交差するように編んで行われる段階であって、前記縦線ワイヤーと横線ワイヤーとの間に空隙が形成されるネット模様の多気孔金属シートの成形段階;前記仮成形グラファイトシートを前記多気孔金属シートの一表面に積層した後、加圧成形して前記仮成形グラファイトシートを構成するグラファイト結晶が前記多気孔金属シートの表面空隙に含浸されながら一体に付着結合されるようにする段階であって、密度が2.0g/cm3〜6.0g/cm3の範囲を有するように加圧成形しながら空隙を0.01mm〜0.5mmの大きさとする融合シートの形成段階;を含んで構成されることを特徴とする電磁波吸収消滅および遮蔽用融合シートの製造方法。
- 前記多気孔金属シートの成形段階に続き、500℃〜600℃で10〜40分間加熱して非晶質化させる非晶質金属シートの成形段階を行い;前記非晶質金属シートに仮成形グラファイトシートを付着して圧着成形する段階をさらに含むことを特徴とする、請求項8〜11のいずれか一項に記載の電磁波吸収消滅および遮蔽用融合シートの製造方法。
- 前記仮成形グラファイトシートが一面に付着された多気孔金属シートの他面に加圧、塗布または含浸により一体に付着形成される段階であって、一部が多気孔金属シートの表面に形成された空隙に含浸されて反対側の前記仮成形グラファイトシートに付着されることにより、一体に結束力を生成させる有無機系の樹脂からなる放熱膜層の形成段階;または前記仮成形グラファイトシートが一面に付着された多気孔金属シートの他面に加圧、塗布または含浸により一体に付着形成される段階であって、一部が多気孔金属シートの表面に形成された空隙に含浸されて結束力を生成させる、アルミニウムまたはアルミニウム合金からなる薄板に備えられる放熱膜層の形成段階;を含んで構成されることを特徴とする、請求項8〜11のいずれか一項に記載の電磁波吸収消滅および遮蔽用融合シートの製造方法。
- 黒鉛成分を含むグラファイト基材をシート形態で成形し、ただし密度が0.1〜1.5g/cm3の範囲を有するようにして結晶構造が不完全な状態で形成された仮成形グラファイトシートと;上面と下面とで連結される微細な孔や隙間からなる0.001mm〜0.05mmの大きさを有する複数個の空隙を含み、前記仮成形グラファイトシートが一面に積層されて密度が2.0g/cm3〜6.0g/cm3となるように加圧成形されることにより、前記グラファイト基材の結晶粒子の一部が前記複数個の空隙に含浸されながら物理的に相互付着結合される多気孔金属シート;を含む構成を特徴とする電子機器高放熱用融合シート。
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KR102205030B1 (ko) | 2013-12-17 | 2021-01-20 | 삼성디스플레이 주식회사 | 표시장치 |
CN104883381B (zh) | 2014-05-27 | 2018-09-04 | 陈杰 | 分布式存储的数据存取方法及系统 |
GB201413701D0 (en) * | 2014-08-01 | 2014-09-17 | Isis Innovation | Process |
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CN108260366B (zh) | 2020-01-14 |
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JP2018501633A (ja) | 2018-01-18 |
ES2746161T3 (es) | 2020-03-04 |
EP3174375B1 (en) | 2019-06-26 |
EP3174375A4 (en) | 2018-04-04 |
EP3174375A1 (en) | 2017-05-31 |
US11052636B2 (en) | 2021-07-06 |
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