DE602005015103D1 - Verbindungsstruktur zur Befestigung eines Halbleiterchips auf einem Metallsubstrat, Halbleiterchip und elektronisches Bauelement mit der Verbindungsstruktur, und Verfahren zur Herstellung der Verbindungsstruktur - Google Patents

Verbindungsstruktur zur Befestigung eines Halbleiterchips auf einem Metallsubstrat, Halbleiterchip und elektronisches Bauelement mit der Verbindungsstruktur, und Verfahren zur Herstellung der Verbindungsstruktur

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Publication number
DE602005015103D1
DE602005015103D1 DE602005015103T DE602005015103T DE602005015103D1 DE 602005015103 D1 DE602005015103 D1 DE 602005015103D1 DE 602005015103 T DE602005015103 T DE 602005015103T DE 602005015103 T DE602005015103 T DE 602005015103T DE 602005015103 D1 DE602005015103 D1 DE 602005015103D1
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Prior art keywords
connection structure
semiconductor chip
mounting
manufacturing
electronic device
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DE602005015103T
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English (en)
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Ralf Dipl-Phys Otremba
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Infineon Technologies AG
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Infineon Technologies AG
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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DE602005015103T 2005-07-28 2005-07-28 Verbindungsstruktur zur Befestigung eines Halbleiterchips auf einem Metallsubstrat, Halbleiterchip und elektronisches Bauelement mit der Verbindungsstruktur, und Verfahren zur Herstellung der Verbindungsstruktur Active DE602005015103D1 (de)

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