DE602006020226D1 - Elektronisches Bauteil und dessen Herstellungsverfahren - Google Patents

Elektronisches Bauteil und dessen Herstellungsverfahren

Info

Publication number
DE602006020226D1
DE602006020226D1 DE602006020226T DE602006020226T DE602006020226D1 DE 602006020226 D1 DE602006020226 D1 DE 602006020226D1 DE 602006020226 T DE602006020226 T DE 602006020226T DE 602006020226 T DE602006020226 T DE 602006020226T DE 602006020226 D1 DE602006020226 D1 DE 602006020226D1
Authority
DE
Germany
Prior art keywords
manufacturing process
electronic component
electronic
manufacturing
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006020226T
Other languages
English (en)
Inventor
Yoshihiro Mizuno
Xiaoyu Mi
Tsuyoshi Matsumoto
Hisao Okuda
Satoshi Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE602006020226D1 publication Critical patent/DE602006020226D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE602006020226T 2005-11-25 2006-10-23 Elektronisches Bauteil und dessen Herstellungsverfahren Active DE602006020226D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005340121A JP2007149827A (ja) 2005-11-25 2005-11-25 電子部品製造方法および電子部品

Publications (1)

Publication Number Publication Date
DE602006020226D1 true DE602006020226D1 (de) 2011-04-07

Family

ID=37649522

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006020226T Active DE602006020226D1 (de) 2005-11-25 2006-10-23 Elektronisches Bauteil und dessen Herstellungsverfahren

Country Status (6)

Country Link
US (1) US7808030B2 (de)
EP (1) EP1791404B1 (de)
JP (1) JP2007149827A (de)
KR (1) KR100763740B1 (de)
CN (1) CN100472754C (de)
DE (1) DE602006020226D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7814112B2 (en) * 2006-06-09 2010-10-12 Ebay Inc. Determining relevancy and desirability of terms
US7544580B2 (en) * 2006-12-22 2009-06-09 United Microelectronics Corp. Method for manufacturing passive components
JP5133047B2 (ja) * 2007-12-28 2013-01-30 太陽誘電株式会社 電子部品の製造方法
US20130271251A1 (en) * 2012-04-12 2013-10-17 Cyntec Co., Ltd. Substrate-Less Electronic Component
JP5737313B2 (ja) * 2013-03-28 2015-06-17 Tdk株式会社 電子部品及びその製造方法
US9893048B2 (en) 2015-09-14 2018-02-13 Qualcomm Incorporated Passive-on-glass (POG) device and method
KR102521554B1 (ko) * 2015-12-07 2023-04-13 삼성전자주식회사 배선 구조물, 배선 구조물 설계 방법, 및 배선 구조물 형성 방법
DE102017127920A1 (de) 2017-01-26 2018-07-26 Taiwan Semiconductor Manufacturing Company, Ltd. Erhöhte Durchkontaktierung für Anschlüsse auf unterschiedlichen Ebenen
US10297494B2 (en) 2017-01-26 2019-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Raised via for terminal connections on different planes
JP7139594B2 (ja) * 2017-11-30 2022-09-21 凸版印刷株式会社 ガラスコア、多層配線基板、及びガラスコアの製造方法
US10622302B2 (en) 2018-02-14 2020-04-14 Taiwan Semiconductor Manufacturing Company, Ltd. Via for semiconductor device connection and methods of forming the same
DE102018126130B4 (de) 2018-06-08 2023-08-10 Taiwan Semiconductor Manufacturing Co., Ltd. Halbleitervorrichtung und -verfahren
US11158775B2 (en) 2018-06-08 2021-10-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method
US10992100B2 (en) 2018-07-06 2021-04-27 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method
JP7266996B2 (ja) 2018-11-20 2023-05-01 太陽誘電株式会社 インダクタ、フィルタおよびマルチプレクサ
CN111243852B (zh) * 2020-03-05 2021-07-30 上海迈铸半导体科技有限公司 一种降低螺线线圈的尾部长度公差的方法及螺线线圈及螺线电感

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384953A (ja) * 1989-08-28 1991-04-10 Seiko Epson Corp 半導体集積回路装置
JP2926790B2 (ja) * 1989-10-26 1999-07-28 日本電気株式会社 半導体装置
JPH0461264A (ja) 1990-06-29 1992-02-27 Nippon Telegr & Teleph Corp <Ntt> Ｌｃ複合素子
JPH06125011A (ja) * 1992-10-09 1994-05-06 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP3208119B2 (ja) 1994-03-10 2001-09-10 松下電器産業株式会社 高周波半導体装置
KR100268424B1 (ko) * 1998-08-07 2000-10-16 윤종용 반도체 장치의 배선 형성 방법
JP2002033239A (ja) * 2000-07-14 2002-01-31 Hitachi Ltd Ｌｃフィルタ
JP4256575B2 (ja) * 2000-08-15 2009-04-22 パナソニック株式会社 バイアホールを備えた高周波受動回路および高周波増幅器
JP4226804B2 (ja) 2001-06-25 2009-02-18 株式会社東芝 半導体装置及びその製造方法
US6998696B2 (en) * 2001-09-21 2006-02-14 Casper Michael D Integrated thin film capacitor/inductor/interconnect system and method
JP3590034B2 (ja) * 2002-04-26 2004-11-17 Ｎｅｃエレクトロニクス株式会社 半導体容量素子及びその製造方法
JP3882779B2 (ja) * 2002-05-27 2007-02-21 日本電気株式会社 薄膜キャパシタ、薄膜キャパシタを含む複合受動部品、それらの製造方法およびそれらを内蔵した配線基板
US6818469B2 (en) * 2002-05-27 2004-11-16 Nec Corporation Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same
JP3944455B2 (ja) * 2003-01-31 2007-07-11 松下電器産業株式会社 半導体装置及びその製造方法
JP2004273920A (ja) * 2003-03-11 2004-09-30 Toshiba Corp 半導体装置
JP4016340B2 (ja) * 2003-06-13 2007-12-05 ソニー株式会社 半導体装置及びその実装構造、並びにその製造方法
JP4762531B2 (ja) 2004-11-30 2011-08-31 太陽誘電株式会社 電子部品及びその製造方法

Also Published As

Publication number Publication date
US20070122992A1 (en) 2007-05-31
US7808030B2 (en) 2010-10-05
EP1791404B1 (de) 2011-02-23
KR20070055332A (ko) 2007-05-30
CN1971877A (zh) 2007-05-30
JP2007149827A (ja) 2007-06-14
EP1791404A1 (de) 2007-05-30
KR100763740B1 (ko) 2007-10-04
CN100472754C (zh) 2009-03-25

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