DE602006006136D1 - Elektronisches Mikromodul und Herstellungsverfahren - Google Patents
Elektronisches Mikromodul und HerstellungsverfahrenInfo
- Publication number
- DE602006006136D1 DE602006006136D1 DE200660006136 DE602006006136T DE602006006136D1 DE 602006006136 D1 DE602006006136 D1 DE 602006006136D1 DE 200660006136 DE200660006136 DE 200660006136 DE 602006006136 T DE602006006136 T DE 602006006136T DE 602006006136 D1 DE602006006136 D1 DE 602006006136D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- electronic micromodule
- micromodule
- electronic
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0494—4th Group
- H01L2924/04941—TiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Networks & Wireless Communication (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0511750A FR2893734A1 (fr) | 2005-11-21 | 2005-11-21 | Micromodule electronique et procede de fabrication d'un tel micromodule |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006006136D1 true DE602006006136D1 (de) | 2009-05-20 |
Family
ID=36940463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200660006136 Active DE602006006136D1 (de) | 2005-11-21 | 2006-11-07 | Elektronisches Mikromodul und Herstellungsverfahren |
Country Status (4)
Country | Link |
---|---|
US (1) | US7667329B2 (de) |
EP (1) | EP1788514B1 (de) |
DE (1) | DE602006006136D1 (de) |
FR (1) | FR2893734A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006080322A1 (en) * | 2005-01-28 | 2006-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
JP2009093507A (ja) | 2007-10-11 | 2009-04-30 | Hitachi Ltd | Rfidタグ |
US9324700B2 (en) * | 2008-09-05 | 2016-04-26 | Stats Chippac, Ltd. | Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels |
FR2940486B1 (fr) * | 2008-12-22 | 2011-02-11 | Commissariat Energie Atomique | Procede de fabrication d'un assemblage de puces a moyens d'emission-reception radiofrequence reliees mecaniquement au moyen d'un ruban et assemblage |
EP2422300A4 (de) * | 2009-04-20 | 2013-09-04 | Flextronics Ap Llc | Miniatur-rfid-etikett |
US11423278B1 (en) * | 2010-06-11 | 2022-08-23 | Impinj, Inc. | RFID integrated circuits with large contact pads |
US9378956B2 (en) | 2011-08-25 | 2016-06-28 | Aeroflex Colorado Springs Inc. | Wafer structure for electronic integrated circuit manufacturing |
US9396947B2 (en) | 2011-08-25 | 2016-07-19 | Aeroflex Colorado Springs Inc. | Wafer structure for electronic integrated circuit manufacturing |
US9378955B2 (en) | 2011-08-25 | 2016-06-28 | Aeroflex Colorado Springs Inc. | Wafer structure for electronic integrated circuit manufacturing |
US9312133B2 (en) | 2011-08-25 | 2016-04-12 | Aeroflex Colorado Springs Inc. | Wafer structure for electronic integrated circuit manufacturing |
US10909440B2 (en) * | 2013-08-22 | 2021-02-02 | Texas Instruments Incorporated | RFID tag with integrated antenna |
JP6546711B1 (ja) * | 2019-04-10 | 2019-07-17 | 株式会社エスケーエレクトロニクス | 非接触情報担体 |
CN112530928B (zh) * | 2019-12-12 | 2024-01-19 | 友达光电股份有限公司 | 天线装置及其制造方法 |
EP4339833A1 (de) * | 2022-09-19 | 2024-03-20 | Assa Abloy AB | Rfid-anordnung |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4306655C2 (de) * | 1992-03-04 | 1997-04-30 | Toshiba Kawasaki Kk | Verfahren zum Herstellen eines planaren Induktionselements |
US6268796B1 (en) * | 1997-12-12 | 2001-07-31 | Alfred Gnadinger | Radio frequency identification transponder having integrated antenna |
FR2795235B1 (fr) * | 1999-06-15 | 2002-08-02 | Gemplus Card Int | Procede de realisation de dispositifs comprenant une puce associee a un element de circuit et dispositifs obtenus |
JP2001024145A (ja) * | 1999-07-13 | 2001-01-26 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
FR2802337A1 (fr) * | 1999-12-14 | 2001-06-15 | St Microelectronics Sa | Procede d'interconnexion de circuits integres |
US7051429B2 (en) * | 2003-04-11 | 2006-05-30 | Eastman Kodak Company | Method for forming a medium having data storage and communication capabilities |
-
2005
- 2005-11-21 FR FR0511750A patent/FR2893734A1/fr active Pending
-
2006
- 2006-11-07 DE DE200660006136 patent/DE602006006136D1/de active Active
- 2006-11-07 EP EP20060023093 patent/EP1788514B1/de not_active Expired - Fee Related
- 2006-11-20 US US11/561,699 patent/US7667329B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20070148981A1 (en) | 2007-06-28 |
EP1788514B1 (de) | 2009-04-08 |
EP1788514A1 (de) | 2007-05-23 |
US7667329B2 (en) | 2010-02-23 |
FR2893734A1 (fr) | 2007-05-25 |
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