DE102006032925B8 - Elektronische Baugruppe und Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen - Google Patents

Elektronische Baugruppe und Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen Download PDF

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Publication number
DE102006032925B8
DE102006032925B8 DE102006032925A DE102006032925A DE102006032925B8 DE 102006032925 B8 DE102006032925 B8 DE 102006032925B8 DE 102006032925 A DE102006032925 A DE 102006032925A DE 102006032925 A DE102006032925 A DE 102006032925A DE 102006032925 B8 DE102006032925 B8 DE 102006032925B8
Authority
DE
Germany
Prior art keywords
integrated circuits
encapsulating
electronic components
electronic
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102006032925A
Other languages
English (en)
Other versions
DE102006032925A1 (de
DE102006032925B4 (de
Inventor
Jürgen Dr. Leib
Hidefumi Dr. Takatsuki Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102006032925A priority Critical patent/DE102006032925B8/de
Application filed by Schott AG filed Critical Schott AG
Priority to US12/307,174 priority patent/US8017435B2/en
Priority to KR1020087030560A priority patent/KR20090031360A/ko
Priority to EP07725728A priority patent/EP2041787A1/de
Priority to JP2009519810A priority patent/JP2009544161A/ja
Priority to CNA2007800238963A priority patent/CN101479844A/zh
Priority to AU2007276494A priority patent/AU2007276494A1/en
Priority to CA002653918A priority patent/CA2653918A1/en
Priority to PCT/EP2007/004847 priority patent/WO2008009328A1/de
Publication of DE102006032925A1 publication Critical patent/DE102006032925A1/de
Application granted granted Critical
Publication of DE102006032925B4 publication Critical patent/DE102006032925B4/de
Publication of DE102006032925B8 publication Critical patent/DE102006032925B8/de
Priority to US13/231,844 priority patent/US8399293B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1057—Mounting in enclosures for microelectro-mechanical devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
DE102006032925A 2006-07-15 2006-07-15 Elektronische Baugruppe und Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen Expired - Fee Related DE102006032925B8 (de)

Priority Applications (10)

Application Number Priority Date Filing Date Title
DE102006032925A DE102006032925B8 (de) 2006-07-15 2006-07-15 Elektronische Baugruppe und Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen
PCT/EP2007/004847 WO2008009328A1 (de) 2006-07-15 2007-06-01 Verfahren zur verkapselung elektronischer bauelemente und integrierter schaltungen
EP07725728A EP2041787A1 (de) 2006-07-15 2007-06-01 Verfahren zur verkapselung elektronischer bauelemente und integrierter schaltungen
JP2009519810A JP2009544161A (ja) 2006-07-15 2007-06-01 電子コンポーネントおよび集積回路を収納する方法
CNA2007800238963A CN101479844A (zh) 2006-07-15 2007-06-01 用于封装电子器件和集成电路的方法
AU2007276494A AU2007276494A1 (en) 2006-07-15 2007-06-01 Method for encasing electronic components and integrated circuits
US12/307,174 US8017435B2 (en) 2006-07-15 2007-06-01 Method for packaging electronic devices and integrated circuits
KR1020087030560A KR20090031360A (ko) 2006-07-15 2007-06-01 전자 소자 및 집적회로 패키징 방법
CA002653918A CA2653918A1 (en) 2006-07-15 2007-06-01 Method for encasing electronic components and integrated circuits
US13/231,844 US8399293B2 (en) 2006-07-15 2011-09-13 Method for packaging electronic devices and integrated circuits

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006062788 2006-07-15
DE102006032925A DE102006032925B8 (de) 2006-07-15 2006-07-15 Elektronische Baugruppe und Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen

Publications (3)

Publication Number Publication Date
DE102006032925A1 DE102006032925A1 (de) 2008-01-24
DE102006032925B4 DE102006032925B4 (de) 2008-07-31
DE102006032925B8 true DE102006032925B8 (de) 2008-11-06

Family

ID=38728650

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006032925A Expired - Fee Related DE102006032925B8 (de) 2006-07-15 2006-07-15 Elektronische Baugruppe und Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen

Country Status (9)

Country Link
US (2) US8017435B2 (de)
EP (1) EP2041787A1 (de)
JP (1) JP2009544161A (de)
KR (1) KR20090031360A (de)
CN (1) CN101479844A (de)
AU (1) AU2007276494A1 (de)
CA (1) CA2653918A1 (de)
DE (1) DE102006032925B8 (de)
WO (1) WO2008009328A1 (de)

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US7989248B2 (en) 2009-07-02 2011-08-02 Advanced Microfab, LLC Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
US8390083B2 (en) * 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
US9406580B2 (en) * 2011-03-16 2016-08-02 Synaptics Incorporated Packaging for fingerprint sensors and methods of manufacture
JP2012204403A (ja) * 2011-03-23 2012-10-22 Toshiba Corp 固体撮像装置及びその製造方法
CN103107153B (zh) * 2011-11-15 2016-04-06 精材科技股份有限公司 晶片封装体及其形成方法
DE102012202727B4 (de) * 2012-02-22 2015-07-02 Vectron International Gmbh Verfahren zur Verbindung eines ersten elektronischen Bauelements mit einem zweiten Bauelement
US9282642B2 (en) * 2012-09-28 2016-03-08 KYOCERA Circuit Solutions, Inc. Wiring board
US9173024B2 (en) * 2013-01-31 2015-10-27 Invensense, Inc. Noise mitigating microphone system
US9847462B2 (en) 2013-10-29 2017-12-19 Point Engineering Co., Ltd. Array substrate for mounting chip and method for manufacturing the same
CN104332452B (zh) * 2014-08-20 2017-04-19 深圳市汇顶科技股份有限公司 芯片封装模组
DE102015104410B4 (de) 2015-03-24 2018-09-13 Tdk-Micronas Gmbh Drucksensor
KR101689018B1 (ko) * 2015-04-28 2016-12-22 (주) 씨앤아이테크놀로지 포켓을 이용한 반도체 패키지의 전자파 차폐막 형성 방법
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
KR102507947B1 (ko) * 2015-10-15 2023-03-09 삼성전자주식회사 케이스 및 이를 포함하는 전자 장치
DE102016113347A1 (de) * 2016-07-20 2018-01-25 Infineon Technologies Ag Verfahren zum produzieren eines halbleitermoduls
DE102019101325A1 (de) * 2019-01-17 2020-07-23 USound GmbH Herstellungsverfahren für mehrere MEMS-Schallwandler
CN111665640B (zh) * 2019-03-08 2022-07-26 三赢科技（深圳）有限公司 结构光投射模组及其电子装置
DE102020100819A1 (de) * 2020-01-15 2021-07-15 Schott Ag Hermetisch verschlossene transparente Kavität und deren Umhäusung
DE102020117194B4 (de) 2020-06-30 2023-06-22 Schott Ag Hermetisch verschlossene Umhäusung und Verfahren zu deren Herstellung

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Publication number Priority date Publication date Assignee Title
EP0981159A1 (de) * 1998-08-18 2000-02-23 Siemens Building Technologies AG Verfahren zur Herstellung einer Mikroverbindung, mikroelektronisches System sowie nach dem Verfahren hergestellter Infrarotdetektor und dessen Verwendung
US6100108A (en) * 1997-02-17 2000-08-08 Denso Corporation Method of fabricating electronic circuit device
WO2001029529A2 (en) * 1999-10-21 2001-04-26 The Charles Stark Draper Laboratory, Inc. Integrated packaging of micromechanical sensors and control circuits
DE10147648A1 (de) * 2001-09-27 2003-04-17 Berliner Glas Kgaa Verfahren und Vorrichtung zur Ausbildung von Durchbrüchen in einer Glasscheibe, sowie Glasscheibe mit Durchbrüchen
US20030104651A1 (en) * 2001-12-04 2003-06-05 Samsung Electronics Co., Ltd. Low temperature hermetic sealing method having passivation layer
DE10206919A1 (de) * 2002-02-19 2003-08-28 Infineon Technologies Ag Verfahren zur Erzeugung einer Abdeckung, Verfahren zum Herstellen eines gehäusten Bauelements
US20040017004A1 (en) * 2001-08-17 2004-01-29 Takao Kasai Electronic device and production method therefor

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JPH05121985A (ja) * 1991-10-25 1993-05-18 Seiko Epson Corp 圧電振動子の製造方法
JP3471111B2 (ja) * 1995-03-20 2003-11-25 三菱電機株式会社 半導体装置
US5796165A (en) * 1996-03-19 1998-08-18 Matsushita Electronics Corporation High-frequency integrated circuit device having a multilayer structure
US6140144A (en) * 1996-08-08 2000-10-31 Integrated Sensing Systems, Inc. Method for packaging microsensors
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
JP3438709B2 (ja) 2000-08-31 2003-08-18 セイコーエプソン株式会社 圧電デバイス及びその製造方法と圧電発振器の製造方法
JP2002171150A (ja) * 2000-11-30 2002-06-14 Seiko Epson Corp 圧電デバイスのパッケージ構造
JP3896285B2 (ja) * 2002-01-24 2007-03-22 三菱電機株式会社 半導体装置の製造方法
US6806557B2 (en) * 2002-09-30 2004-10-19 Motorola, Inc. Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum
US6929974B2 (en) * 2002-10-18 2005-08-16 Motorola, Inc. Feedthrough design and method for a hermetically sealed microdevice
JP2004271312A (ja) * 2003-03-07 2004-09-30 Denso Corp 容量型半導体センサ装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6100108A (en) * 1997-02-17 2000-08-08 Denso Corporation Method of fabricating electronic circuit device
EP0981159A1 (de) * 1998-08-18 2000-02-23 Siemens Building Technologies AG Verfahren zur Herstellung einer Mikroverbindung, mikroelektronisches System sowie nach dem Verfahren hergestellter Infrarotdetektor und dessen Verwendung
WO2001029529A2 (en) * 1999-10-21 2001-04-26 The Charles Stark Draper Laboratory, Inc. Integrated packaging of micromechanical sensors and control circuits
US20040017004A1 (en) * 2001-08-17 2004-01-29 Takao Kasai Electronic device and production method therefor
DE10147648A1 (de) * 2001-09-27 2003-04-17 Berliner Glas Kgaa Verfahren und Vorrichtung zur Ausbildung von Durchbrüchen in einer Glasscheibe, sowie Glasscheibe mit Durchbrüchen
US20030104651A1 (en) * 2001-12-04 2003-06-05 Samsung Electronics Co., Ltd. Low temperature hermetic sealing method having passivation layer
DE10206919A1 (de) * 2002-02-19 2003-08-28 Infineon Technologies Ag Verfahren zur Erzeugung einer Abdeckung, Verfahren zum Herstellen eines gehäusten Bauelements

Also Published As

Publication number Publication date
EP2041787A1 (de) 2009-04-01
US20100059877A1 (en) 2010-03-11
KR20090031360A (ko) 2009-03-25
US20120003791A1 (en) 2012-01-05
AU2007276494A1 (en) 2008-01-24
US8399293B2 (en) 2013-03-19
CN101479844A (zh) 2009-07-08
JP2009544161A (ja) 2009-12-10
DE102006032925A1 (de) 2008-01-24
US8017435B2 (en) 2011-09-13
DE102006032925B4 (de) 2008-07-31
WO2008009328A1 (de) 2008-01-24
CA2653918A1 (en) 2008-01-24

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