DE102010022204A8 - Elektrisches Bauelement mit flacher Bauform und Herstellungsverfahren - Google Patents

Elektrisches Bauelement mit flacher Bauform und Herstellungsverfahren Download PDF

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Publication number
DE102010022204A8
DE102010022204A8 DE102010022204A DE102010022204A DE102010022204A8 DE 102010022204 A8 DE102010022204 A8 DE 102010022204A8 DE 102010022204 A DE102010022204 A DE 102010022204A DE 102010022204 A DE102010022204 A DE 102010022204A DE 102010022204 A8 DE102010022204 A8 DE 102010022204A8
Authority
DE
Germany
Prior art keywords
manufacturing process
electric component
flat design
flat
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102010022204A
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English (en)
Other versions
DE102010022204A1 (de
DE102010022204B4 (de
Inventor
Wolfgang Pahl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102010022204.6A priority Critical patent/DE102010022204B4/de
Application filed by Epcos AG filed Critical Epcos AG
Priority to CN201180024653.8A priority patent/CN102893632B/zh
Priority to JP2013510581A priority patent/JP5903094B2/ja
Priority to US13/698,350 priority patent/US9084366B2/en
Priority to PCT/EP2011/057889 priority patent/WO2011144570A1/de
Priority to KR1020127033168A priority patent/KR101761967B1/ko
Publication of DE102010022204A1 publication Critical patent/DE102010022204A1/de
Publication of DE102010022204A8 publication Critical patent/DE102010022204A8/de
Application granted granted Critical
Publication of DE102010022204B4 publication Critical patent/DE102010022204B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
DE102010022204.6A 2010-05-20 2010-05-20 Elektrisches Bauelement mit flacher Bauform und Herstellungsverfahren Active DE102010022204B4 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE102010022204.6A DE102010022204B4 (de) 2010-05-20 2010-05-20 Elektrisches Bauelement mit flacher Bauform und Herstellungsverfahren
JP2013510581A JP5903094B2 (ja) 2010-05-20 2011-05-16 平坦構造の電子部品及びその製造方法
US13/698,350 US9084366B2 (en) 2010-05-20 2011-05-16 Electric component having a shallow physical shape, and method of manufacture
PCT/EP2011/057889 WO2011144570A1 (de) 2010-05-20 2011-05-16 Elektrisches bauelement mit flacher bauform und herstellungsverfahren
CN201180024653.8A CN102893632B (zh) 2010-05-20 2011-05-16 具有平面结构形式的电元件和制造方法
KR1020127033168A KR101761967B1 (ko) 2010-05-20 2011-05-16 평면 형태를 가진 전기 소자 및 그 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010022204.6A DE102010022204B4 (de) 2010-05-20 2010-05-20 Elektrisches Bauelement mit flacher Bauform und Herstellungsverfahren

Publications (3)

Publication Number Publication Date
DE102010022204A1 DE102010022204A1 (de) 2011-11-24
DE102010022204A8 true DE102010022204A8 (de) 2012-05-16
DE102010022204B4 DE102010022204B4 (de) 2016-03-31

Family

ID=44486433

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102010022204.6A Active DE102010022204B4 (de) 2010-05-20 2010-05-20 Elektrisches Bauelement mit flacher Bauform und Herstellungsverfahren

Country Status (6)

Country Link
US (1) US9084366B2 (de)
JP (1) JP5903094B2 (de)
KR (1) KR101761967B1 (de)
CN (1) CN102893632B (de)
DE (1) DE102010022204B4 (de)
WO (1) WO2011144570A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8542850B2 (en) 2007-09-12 2013-09-24 Epcos Pte Ltd Miniature microphone assembly with hydrophobic surface coating
DE102007058951B4 (de) 2007-12-07 2020-03-26 Snaptrack, Inc. MEMS Package
DE102010006132B4 (de) 2010-01-29 2013-05-08 Epcos Ag Miniaturisiertes elektrisches Bauelement mit einem Stapel aus einem MEMS und einem ASIC
CN103545303B (zh) * 2012-07-17 2018-02-09 马维尔国际贸易有限公司 集成电路封装体组件、用于组装印刷电路板的方法 和集成电路封装体
US9467785B2 (en) * 2013-03-28 2016-10-11 Knowles Electronics, Llc MEMS apparatus with increased back volume
JP6914540B2 (ja) * 2016-07-29 2021-08-04 国立大学法人東北大学 マイクロフォン、電子機器及びパッケージング方法
DE102018216282A1 (de) * 2018-09-25 2020-03-26 Robert Bosch Gmbh Verfahren zur Herstellung eines MEMS-Sensors
JP6991300B2 (ja) * 2020-12-10 2022-01-12 ローム株式会社 電子部品
CN112973814B (zh) * 2021-03-03 2022-03-18 北京理工大学 一种用于多层微流控芯片的层间自动对准键合装置及方法
CN113573220B (zh) * 2021-07-28 2023-01-03 杭州安普鲁薄膜科技有限公司 一种带有防尘透声膜组件的mems复合件

Citations (5)

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DE19810756A1 (de) * 1998-03-12 1999-09-23 Fraunhofer Ges Forschung Sensoranordnung zur Messung von Druck, Kraft oder Meßgrößen, die sich auf Druck oder Kraft zurückführen lassen, Verfahren zur Herstellung der Sensoranordnung, Sensorelement und Verfahren zur Herstellung des Sensorelements
DE69626747T2 (de) * 1995-11-16 2003-09-04 Matsushita Electric Ind Co Ltd Gedruckte Leiterplatte und ihre Anordnung
DE102005007423B3 (de) * 2005-02-18 2006-06-14 Atmel Germany Gmbh Verfahren zur Integration eines elektronischen Bauteils oder dergleichen in ein Substrat
DE102005002751A1 (de) * 2005-01-20 2006-08-24 Alre-It Regeltechnik Gmbh Leiterplatte mit funktionalem Element und Verfahren zur Positionisierung eines funktionalen Elements auf einer Leiterplatte
DE102005053765A1 (de) * 2005-11-10 2007-05-16 Epcos Ag MEMS-Package und Verfahren zur Herstellung

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US6088463A (en) * 1998-10-30 2000-07-11 Microtronic A/S Solid state silicon-based condenser microphone
JP3398721B2 (ja) * 1999-05-20 2003-04-21 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
JP2002083890A (ja) 2000-09-06 2002-03-22 Sanyo Electric Co Ltd 半導体モジュール
US7024936B2 (en) * 2002-06-18 2006-04-11 Corporation For National Research Initiatives Micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
JP2006294825A (ja) 2005-04-11 2006-10-26 Renesas Technology Corp 半導体集積回路装置
EP1771036A3 (de) 2005-09-26 2013-05-22 Yamaha Corporation Kondensatormikrofon und Membran für ein Kondensatormikrofon
DE102005053767B4 (de) 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
JP2007184415A (ja) 2006-01-06 2007-07-19 Matsushita Electric Ind Co Ltd 半導体素子実装用基板および高周波半導体装置ならびにこれを用いた電子機器
DE102006019446B4 (de) * 2006-04-24 2008-04-24 Multi Umwelttechnologie Ag Trägermedium zur Immobilisierung von Mikroorganismen und Verfahren zur Herstellung dieses Trägermediums
ITMI20070099A1 (it) * 2007-01-24 2008-07-25 St Microelectronics Srl Dispositivo elettronico comprendente dispositivi sensori differenziali mems e substrati bucati
JP5192864B2 (ja) 2007-03-22 2013-05-08 日本特殊陶業株式会社 部品内蔵配線基板の製造方法
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DE102008005686B9 (de) 2008-01-23 2019-06-27 Tdk Corporation MEMS-Bauelement und Verfahren zur Herstellung eines MEMS-Bauelements
CN201345734Y (zh) * 2008-12-26 2009-11-11 瑞声声学科技(深圳)有限公司 硅基麦克风
DE102009019446B4 (de) 2009-04-29 2014-11-13 Epcos Ag MEMS Mikrofon

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69626747T2 (de) * 1995-11-16 2003-09-04 Matsushita Electric Ind Co Ltd Gedruckte Leiterplatte und ihre Anordnung
DE19810756A1 (de) * 1998-03-12 1999-09-23 Fraunhofer Ges Forschung Sensoranordnung zur Messung von Druck, Kraft oder Meßgrößen, die sich auf Druck oder Kraft zurückführen lassen, Verfahren zur Herstellung der Sensoranordnung, Sensorelement und Verfahren zur Herstellung des Sensorelements
DE102005002751A1 (de) * 2005-01-20 2006-08-24 Alre-It Regeltechnik Gmbh Leiterplatte mit funktionalem Element und Verfahren zur Positionisierung eines funktionalen Elements auf einer Leiterplatte
DE102005007423B3 (de) * 2005-02-18 2006-06-14 Atmel Germany Gmbh Verfahren zur Integration eines elektronischen Bauteils oder dergleichen in ein Substrat
DE102005053765A1 (de) * 2005-11-10 2007-05-16 Epcos Ag MEMS-Package und Verfahren zur Herstellung

Also Published As

Publication number Publication date
CN102893632A (zh) 2013-01-23
WO2011144570A1 (de) 2011-11-24
DE102010022204A1 (de) 2011-11-24
CN102893632B (zh) 2016-11-02
US9084366B2 (en) 2015-07-14
US20130121523A1 (en) 2013-05-16
KR101761967B1 (ko) 2017-08-04
DE102010022204B4 (de) 2016-03-31
KR20130113339A (ko) 2013-10-15
JP5903094B2 (ja) 2016-04-13
JP2013533122A (ja) 2013-08-22

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R018 Grant decision by examination section/examining division
R020 Patent grant now final
R081 Change of applicant/patentee

Owner name: TDK CORPORATION, JP

Free format text: FORMER OWNER: EPCOS AG, 81669 MUENCHEN, DE

R082 Change of representative

Representative=s name: EPPING HERMANN FISCHER, PATENTANWALTSGESELLSCH, DE

Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE