CN103545303B - 集成电路封装体组件、用于组装印刷电路板的方法 和集成电路封装体 - Google Patents
集成电路封装体组件、用于组装印刷电路板的方法 和集成电路封装体 Download PDFInfo
- Publication number
- CN103545303B CN103545303B CN201310308756.8A CN201310308756A CN103545303B CN 103545303 B CN103545303 B CN 103545303B CN 201310308756 A CN201310308756 A CN 201310308756A CN 103545303 B CN103545303 B CN 103545303B
- Authority
- CN
- China
- Prior art keywords
- pcb
- package body
- insert
- substrate
- opening portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261672422P | 2012-07-17 | 2012-07-17 | |
US61/672,422 | 2012-07-17 | ||
US201261710430P | 2012-10-05 | 2012-10-05 | |
US61/710,430 | 2012-10-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103545303A CN103545303A (zh) | 2014-01-29 |
CN103545303B true CN103545303B (zh) | 2018-02-09 |
Family
ID=49784236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310308756.8A Expired - Fee Related CN103545303B (zh) | 2012-07-17 | 2013-07-17 | 集成电路封装体组件、用于组装印刷电路板的方法 和集成电路封装体 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9101058B2 (zh) |
CN (1) | CN103545303B (zh) |
IL (1) | IL227518A (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102440487B1 (ko) * | 2015-04-30 | 2022-09-07 | 삼성전자주식회사 | 디스플레이 유닛 및 이를 가지는 디스플레이 장치 |
CN108493121B (zh) * | 2018-03-22 | 2019-09-20 | 上海飞骧电子科技有限公司 | 一种解决双面电路晶元焊料短路的载板制作及封装方法 |
US11011389B2 (en) * | 2019-04-22 | 2021-05-18 | The Boeing Company | Additively manufactured flexible interposer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6175158B1 (en) * | 1998-09-08 | 2001-01-16 | Lucent Technologies Inc. | Interposer for recessed flip-chip package |
CN102405524A (zh) * | 2009-02-20 | 2012-04-04 | 国家半导体公司 | 集成电路微模块 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6898846B2 (en) * | 2002-08-21 | 2005-05-31 | Potomac Photonics, Inc. | Method and components for manufacturing multi-layer modular electrical circuits |
TWM250504U (en) * | 2003-11-27 | 2004-11-11 | Optimum Care Int Tech Inc | Assembly structure for hiding electronic component |
TW200404706A (en) * | 2003-12-05 | 2004-04-01 | Chung Shan Inst Of Science | Composite material structure for rotary-wings and its producing method |
TWI443789B (zh) * | 2008-07-04 | 2014-07-01 | Unimicron Technology Corp | 嵌埋有半導體晶片之電路板及其製法 |
US20120314390A1 (en) * | 2010-03-03 | 2012-12-13 | Mutual-Tek Industries Co., Ltd. | Multilayer circuit board |
DE102010022204B4 (de) * | 2010-05-20 | 2016-03-31 | Epcos Ag | Elektrisches Bauelement mit flacher Bauform und Herstellungsverfahren |
DK2750491T3 (da) * | 2011-08-23 | 2019-11-11 | Fujikura Ltd | Substrat med indbygget komponent og fremgangsmåde til fremstilling af dette |
-
2013
- 2013-07-17 US US13/944,546 patent/US9101058B2/en active Active
- 2013-07-17 CN CN201310308756.8A patent/CN103545303B/zh not_active Expired - Fee Related
- 2013-07-17 IL IL227518A patent/IL227518A/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6175158B1 (en) * | 1998-09-08 | 2001-01-16 | Lucent Technologies Inc. | Interposer for recessed flip-chip package |
CN102405524A (zh) * | 2009-02-20 | 2012-04-04 | 国家半导体公司 | 集成电路微模块 |
Also Published As
Publication number | Publication date |
---|---|
CN103545303A (zh) | 2014-01-29 |
US9101058B2 (en) | 2015-08-04 |
IL227518A (en) | 2016-11-30 |
IL227518A0 (en) | 2013-12-31 |
US20140022736A1 (en) | 2014-01-23 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200427 Address after: Singapore City Patentee after: Marvell Asia Pte. Ltd. Address before: Ford street, Grand Cayman, Cayman Islands Patentee before: Kaiwei international Co. Effective date of registration: 20200427 Address after: Ford street, Grand Cayman, Cayman Islands Patentee after: Kaiwei international Co. Address before: Hamilton, Bermuda Patentee before: Marvell International Ltd. Effective date of registration: 20200427 Address after: Hamilton, Bermuda Patentee after: Marvell International Ltd. Address before: Babado J San Mega Le Patentee before: MARVELL WORLD TRADE Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180209 Termination date: 20210717 |
|
CF01 | Termination of patent right due to non-payment of annual fee |