JP2013051336A - 部品内蔵配線基板及びその製造方法 - Google Patents
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
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- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
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- Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】本発明の部品内蔵配線基板10は、コア基板11に内蔵された板状の部品70と、絶縁層と導体層とが交互に積層されたビルドアップ層12(13)を備えている。部品70は、その両端部に側面部及び主面部を有する端子電極が形成され、主面部の側の絶縁層20(21)には、端子電極の側面部及び主面部と接続されるビア導体60(61)が形成されている。ビア導体60は、下方の端子電極に近接するほどビア径が小さくなるテーパ状に形成され、端子電極の表面部との接続箇所におけるビア径が端子電極の主面部の長さよりも大きい。これにより、ビア導体60と部品70の端子電極との接続面積を拡大し、かつ位置ずれに対する許容度を高めることで、接続信頼性が向上する。
【選択図】図1
Description
11…コア基板
11a…収容穴部
12、13…ビルドアップ層
14…スルーホール導体
15…閉塞体
16…樹脂充填材
20、21、22、23…樹脂絶縁層
24、25…ソルダーレジスト層
30、31…導体層
32…端子パッド
33…BGA用パッド
40、41、42、43、60、61、65、66…ビア導体
50…半田バンプ
51…半田ボール
64…半田
70…コンデンサ
71…部品
100…半導体チップ
T…端子電極
Claims (10)
- 板状の部品が内蔵されてなる部品内蔵配線基板において、
前記部品には、平面視で側面部及び少なくとも一方の主面部を有する端子電極が第1の方向の端部に形成され、
前記部品の前記主面部の側には絶縁層と導体層とが交互に積層され、
前記部品の前記主面部の側の前記絶縁層には、前記端子電極の前記側面部及び前記主面部と接続される第1のビア導体が形成され、
前記第1のビア導体は、積層方向において前記端子電極に近接するほどビア径が小さくなるテーパ状に形成されるとともに、前記第1の方向において前記主面部との接続箇所における前記ビア径が前記主面部の長さよりも大きいことを特徴とする部品内蔵配線基板。 - 前記第1のビア導体の中心軸は、平面視で前記端子電極の前記側面部の直上領域に位置することを特徴とする請求項1に記載の部品内蔵配線基板。
- 前記部品には、前記第1の方向の両側の端部に1対の前記端子電極が形成され、
前記絶縁層には、前記1対の前記端子電極のそれぞれの前記側面部及び前記主面部と接続される1対の前記第1のビア導体が形成されることを特徴とする請求項1又は2に記載の部品内蔵配線基板。 - 前記部品は、コンデンサであることを特徴とする請求項3に記載の部品内蔵配線基板。
- 前記端子電極の前記主面部は、第1の主面部と、前記第1の主面部と積層方向に対向する第2の主面部とを含み、
前記部品の前記第1の主面部の側及び前記第2の主面部の側に、前記絶縁層と前記導体層とが交互に積層され、
前記部品の前記第1の主面部の側の前記絶縁層に形成された一方の前記第1のビア導体と、前記部品の前記第2の主面部の側の前記絶縁層に形成された他方の前記第1のビア導体とが、互いに積層方向で対称的な配置で形成されていることを特徴とする請求項1から4のいずれか一項に記載の部品内蔵配線基板。 - 前記端子電極に対し、前記第1の方向と異なる第2の方向に並ぶ複数の前記第1のビア導体が形成されていることを特徴とする請求項1から5のいずれか一項に記載の部品内蔵配線基板。
- 前記絶縁層には、前記部品の前記端子電極と接続されない一又は複数の第2のビア導体が形成され、前記第1のビア導体の前記ビア径は前記第2のビア導体のビア径よりも大きいことを特徴とする請求項1から6のいずれか一項に記載の部品内蔵配線基板。
- 前記部品は、コア基板に開口された収容穴部に収容されていることを特徴とする請求項1から7のいずれか一項に記載の部品内蔵配線基板。
- 板状の部品が内蔵されてなる部品内蔵配線基板の製造方法であって、
端部に側面部及び主面部を有する端子電極が形成された部品を用意し、基板内に前記部品を配置する部品配置工程と、
前記部品の前記主面部の側に絶縁層を形成し、当該絶縁層の所定位置に前記端子電極の前記側面部及び前記主面部と接続される第1のビア導体を、積層方向において前記端子電極に近接するほどビア径が小さくなるテーパ状の断面形状で形成するビア導体形成工程と、
を含み、前記第1のビア導体は、平面視で第1の方向において、前記主面部との接続箇所における前記ビア径が前記主面部の長さよりも大きいことを特徴とする部品内蔵配線基板の製造方法。 - 前記部品配置工程では、コア基板を用意し、前記コア基板に収容穴部を形成し、前記部品を前記収容穴部に収容することを特徴とする請求項9に記載の部品内蔵配線基板の製造方法。
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JP2011189169A JP5715009B2 (ja) | 2011-08-31 | 2011-08-31 | 部品内蔵配線基板及びその製造方法 |
US13/599,326 US8952262B2 (en) | 2011-08-31 | 2012-08-30 | Component-incorporated wiring substrate and method of manufacturing the same |
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JP2011189169A JP5715009B2 (ja) | 2011-08-31 | 2011-08-31 | 部品内蔵配線基板及びその製造方法 |
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Cited By (8)
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JP2014120771A (ja) * | 2012-12-14 | 2014-06-30 | Samsung Electro-Mechanics Co Ltd | 電子部品組込み基板及びその製造方法 |
JP2014192321A (ja) * | 2013-03-27 | 2014-10-06 | Ibiden Co Ltd | 電子部品内蔵配線板およびその製造方法 |
JP2016152310A (ja) * | 2015-02-17 | 2016-08-22 | 京セラ株式会社 | 電子部品内蔵型配線基板およびその製造方法 |
JP2016219730A (ja) * | 2015-05-26 | 2016-12-22 | 新光電気工業株式会社 | 電子部品内蔵基板及びその製造方法と電子装置 |
JP2017005232A (ja) * | 2015-06-16 | 2017-01-05 | 京セラ株式会社 | 電子部品内蔵型配線基板 |
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JP2017028024A (ja) * | 2015-07-17 | 2017-02-02 | 富士通株式会社 | 部品搭載基板、部品内蔵基板、部品搭載基板の製造方法および部品内蔵基板の製造方法 |
JP2018006450A (ja) * | 2016-06-29 | 2018-01-11 | 新光電気工業株式会社 | 電子部品内蔵基板及びその製造方法と電子部品装置 |
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US10504865B2 (en) * | 2017-09-28 | 2019-12-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package structure and method of manufacturing the same |
CN214123862U (zh) * | 2018-03-23 | 2021-09-03 | 株式会社村田制作所 | 高频模块和通信装置 |
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JP7103835B2 (ja) * | 2018-04-24 | 2022-07-20 | 太陽誘電株式会社 | 積層セラミック電子部品及びその製造方法、並びに回路基板 |
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US20130048361A1 (en) | 2013-02-28 |
US8952262B2 (en) | 2015-02-10 |
JP5715009B2 (ja) | 2015-05-07 |
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