JP2018006450A - 電子部品内蔵基板及びその製造方法と電子部品装置 - Google Patents
電子部品内蔵基板及びその製造方法と電子部品装置 Download PDFInfo
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Abstract
【解決手段】コア基板10と、コア基板10の上面側に形成されたキャビティ30と、コア基板10と一体的に形成されたキャビティ30の底板と、底板に形成された複数の貫通穴30a,30bと、複数の貫通穴30a,30bの間に配置された底板の一部からなる部品搭載部20と、部品搭載部20の上に搭載され、キャビティ30内に配置された電子部品40と、コア基板10の上面に形成され、電子部品40の上面を覆う第1絶縁層50と、コア基板10の下面に形成され、貫通穴30a,30bを埋めると共に、電子部品40の下面を覆う第2絶縁層52とを含み、キャビティ30内は第1絶縁層50と第2絶縁層52とで充填され、第1絶縁層50と第2絶縁層52とは同じ絶縁樹脂から形成される。
【選択図】図15
Description
図2〜図14は実施形態の電子部品内蔵基板の製造方法を説明するための図、図15は実施形態の電子部品内蔵基板を示す図である。以下、電子部品内蔵基板の製造方法を説明しながら、電子部品内蔵基板及び電子部品装置の構造を説明する。
キャパシタ40の両端側の接続端子42は、キャパシタ本体の上面端部から下面端部まで被覆するように形成され、接続端子42上面及び下面に配線層を接続することができる。
1467172182723_0 Process)と呼ばれる工法によって形成される。
下面側の第2絶縁層52の上に第2配線層62が形成されている。下面側の第2配線層62は、第2ビアホールVH2内のビア導体を介してキャパシタ40の接続端子42の下面に接続されている。
Claims (12)
- コア基板と、
前記コア基板の上面側に形成されたキャビティと、
前記コア基板と一体的に形成された前記キャビティの底板と、
前記底板に形成された複数の貫通穴と、
前記複数の貫通穴の間に配置された前記底板の一部からなる部品搭載部と、
前記部品搭載部の上に搭載され、前記キャビティ内に配置された電子部品と、
前記コア基板の上面に形成され、前記電子部品の上面を覆う第1絶縁層と、
前記コア基板の下面に形成され、前記貫通穴を埋めると共に、前記電子部品の下面を覆う第2絶縁層とを有し、
前記キャビティ内は前記第1絶縁層と前記第2絶縁層とで充填され、
前記第1絶縁層と前記第2絶縁層とは同じ絶縁樹脂から形成されることを特徴とする電子部品内蔵基板。 - 前記コア基板のキャビティは、平面視で四角状に形成され、前記キャビティの底板の両端側に2つの前記貫通穴が配置され、前記キャビティの中央部に前記部品搭載部が配置されていることを特徴とする請求項1に記載の電子部品内蔵基板。
- 前記電子部品は、両端側に接続端子を備えたキャパシタであり、
前記キャパシタの中央部が前記部品搭載部に固定され、
前記キャパシタは、前記キャパシタの両端側の接続端子がそれぞれ前記複数の貫通穴と平面視で重なるように配置されていることを特徴とする請求項1又は2に記載の電子部品内蔵基板。 - 前記第2絶縁層に形成され、前記貫通穴を通して前記電子部品の接続端子の下面に到達するビアホールと、
前記第2絶縁層の下面に形成され、前記ビアホールを介して前記電子部品の接続端子の下面に接続される配線層と
を有することを特徴とすることを特徴とする請求項1乃至3のいずれか一項に記載の電子部品内蔵基板。 - 前記部品搭載部は、帯状に形成されていることを特徴とする請求項1乃至4のいずれか一項に記載の電子部品内蔵基板。
- 前記電子部品は、前記部品搭載部に接着剤で固定されていることを特徴とする請求項1乃至5のいずれか一項に記載の電子部品内蔵基板。
- 前記コア基板は、メタルコア基板であることを特徴とする請求項1乃至6のいずれか一項に記載の電子部品内蔵基板。
- コア基板と、
前記コア基板の上面側に形成されたキャビティと、
前記コア基板と一体的に形成された前記キャビティの底板と
前記キャビティの底板に形成された複数の貫通穴と、
前記複数の貫通穴の間に配置された前記底板の一部からなる部品搭載部と、
前記部品搭載部の上に搭載され、前記キャビティ内に配置された第1電子部品と、
前記コア基板の上面に形成され、前記第1電子部品の上面を覆う第1絶縁層と、
前記コア基板の下面に形成され、前記貫通穴を埋めると共に、前記第1電子部品の下面を覆う第2絶縁層と
を備え、
前記キャビティ内は前記第1絶縁層と前記第2絶縁層とで充填され、
前記第1絶縁層と前記第2絶縁層とは同じ絶縁樹脂から形成される電子部品内蔵基板と、
前記電子部品内蔵基板の上に搭載され、前記第1電子部品と電気的に接続された第2電子部品とを有する電子部品装置。 - コア基板を用意する工程と、
前記コア基板を加工することにより、前記コア基板の上面に、底板に複数の貫通穴を有し、前記複数の貫通穴の間の前記底板の一部からなる部品搭載部を備えたキャビティを形成する工程と、
前記部品搭載部の上に電子部品を搭載して、前記電子部品をキャビティ内に配置する工程と、
前記コア基板の上面に、前記電子部品の上面を覆う第1絶縁層を形成すると共に、前記コア基板の下面に、前記貫通穴を埋めて前記電子部品の下面を覆う第2絶縁層を形成し、前記キャビティ内を前記第1絶縁層と前記第2絶縁層とで充填する工程とを有し、
前記第1絶縁層と前記第2絶縁層とは同じ絶縁樹脂から形成されることを特徴とする電子部品内蔵基板の製造方法。 - 前記コア基板にキャビティを形成する工程において、
前記キャビティは、平面視で四角状に形成され、前記キャビティの底板の両端側に2つの前記貫通穴が配置され、前記キャビティの中央部に前記部品搭載部が配置され、
前記電子部品を搭載する工程において、
前記電子部品は、両端側に接続端子を備えたキャパシタであり、
前記キャパシタの中央部が前記部品搭載部に固定され、前記キャパシタの両端側の接続端子が前記2つの貫通穴の上に配置されることを特徴とする請求項9に記載の電子部品内蔵基板の製造方法。 - 前記第1絶縁層及び前記第2絶縁層を形成する工程の後に、
前記第2絶縁層に、前記貫通穴を通して前記電子部品の接続端子の下面に到達するビアホールを形成する工程と、
前記第2絶縁層の下面に、前記ビアホールを介して前記電子部品の接続端子の下面に接続される配線層を形成する工程とを有することを特徴とする請求項9又は10に記載の電子部品内蔵基板の製造方法。 - 前記コア基板にキャビティを形成する工程において、
前記コア基板はメタルコア基板であり、
前記メタルコア基板の上面に前記キャビティに対応する開口部を備えた第1レジスト層を形成する工程と、
前記メタルコア基板の下面に前記複数の貫通穴に対応する開口部を備えた第2レジスト層を形成する工程と、
前記メタルコア基板を両面側からそれぞれ第1レジスト層及び第2レジスト層をマスクにしてウェットエッチングする工程と
を含み、
前記ウェットエッチングは、前記コア基板の上面側のエッチングレートが前記コア基板の下面側のエッチングレートよりも高くなるように設定されることを特徴とする請求項9乃至11のいずれか一項に記載の電子部品内蔵基板の製造方法。
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JP2011142286A (ja) * | 2010-01-06 | 2011-07-21 | Samsung Electro-Mechanics Co Ltd | 電子部品内蔵型プリント基板およびその製造方法 |
JP2013175495A (ja) * | 2012-02-23 | 2013-09-05 | Nec Toppan Circuit Solutions Inc | 部品内蔵印刷配線板及びその製造方法 |
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