DE602004001054D1 - Präzisionsbeschichtungsmaske und Verfahren zur Herstellung der Maske, Elektrolumineszenzanzeige und Verfahren zur Herstellung der Anzeige und Elektronisches Gerät - Google Patents

Präzisionsbeschichtungsmaske und Verfahren zur Herstellung der Maske, Elektrolumineszenzanzeige und Verfahren zur Herstellung der Anzeige und Elektronisches Gerät

Info

Publication number
DE602004001054D1
DE602004001054D1 DE602004001054T DE602004001054T DE602004001054D1 DE 602004001054 D1 DE602004001054 D1 DE 602004001054D1 DE 602004001054 T DE602004001054 T DE 602004001054T DE 602004001054 T DE602004001054 T DE 602004001054T DE 602004001054 D1 DE602004001054 D1 DE 602004001054D1
Authority
DE
Germany
Prior art keywords
making
mask
display
electronic device
precision coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004001054T
Other languages
English (en)
Other versions
DE602004001054T2 (de
Inventor
Shinichi Yotsuya
Takayuki Kuwahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE602004001054D1 publication Critical patent/DE602004001054D1/de
Application granted granted Critical
Publication of DE602004001054T2 publication Critical patent/DE602004001054T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
DE602004001054T 2003-01-20 2004-01-08 Präzisionsbeschichtungsmaske und Verfahren zur Herstellung der Maske, Elektrolumineszenzanzeige und Verfahren zur Herstellung der Anzeige und Elektronisches Gerät Expired - Lifetime DE602004001054T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003011451 2003-01-20
JP2003011451A JP4222035B2 (ja) 2003-01-20 2003-01-20 成膜用精密マスク及びその製造方法、エレクトロルミネッセンス表示装置及びその製造方法、電子機器

Publications (2)

Publication Number Publication Date
DE602004001054D1 true DE602004001054D1 (de) 2006-07-20
DE602004001054T2 DE602004001054T2 (de) 2007-01-11

Family

ID=32588599

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004001054T Expired - Lifetime DE602004001054T2 (de) 2003-01-20 2004-01-08 Präzisionsbeschichtungsmaske und Verfahren zur Herstellung der Maske, Elektrolumineszenzanzeige und Verfahren zur Herstellung der Anzeige und Elektronisches Gerät

Country Status (7)

Country Link
US (1) US7033665B2 (de)
EP (1) EP1441572B1 (de)
JP (1) JP4222035B2 (de)
KR (1) KR100645606B1 (de)
CN (1) CN100364140C (de)
DE (1) DE602004001054T2 (de)
TW (1) TWI267561B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3775493B2 (ja) * 2001-09-20 2006-05-17 セイコーエプソン株式会社 マスクの製造方法
JP3915734B2 (ja) 2003-05-12 2007-05-16 ソニー株式会社 蒸着マスクおよびこれを用いた表示装置の製造方法、ならびに表示装置
US8088435B2 (en) 2005-03-30 2012-01-03 Brother Kogyo Kabushiki Kaisha Mask, method for producing mask, and method for producing wired board
JP4887861B2 (ja) * 2005-03-30 2012-02-29 ブラザー工業株式会社 マスク、マスク製造方法及び配線基板の製造方法
KR100712215B1 (ko) 2005-08-25 2007-04-27 삼성에스디아이 주식회사 레이저 열전사용 마스크 및 그를 이용한 레이저 열전사방법
JP4692290B2 (ja) 2006-01-11 2011-06-01 セイコーエプソン株式会社 マスクおよび成膜方法
US20080108224A1 (en) * 2006-10-12 2008-05-08 Zhaoning Yu Patterning methods
KR101446226B1 (ko) * 2006-11-27 2014-10-01 엘지디스플레이 주식회사 플렉서블 표시장치 및 그 제조 방법
JP5167763B2 (ja) * 2007-10-29 2013-03-21 大日本印刷株式会社 蒸着マスク及び蒸着マスクの製造方法
EP2351871B1 (de) 2008-10-21 2016-06-15 Ulvac, Inc. Maske und verfahren zur herstellung eines films mit der maske
KR101058117B1 (ko) 2010-03-22 2011-08-24 삼성모바일디스플레이주식회사 박막 증착용 마스크 어셈블리와, 이를 이용한 유기 발광 장치와, 이의 제조 방법
JP5710843B2 (ja) * 2012-07-09 2015-04-30 シャープ株式会社 マスクユニットおよび蒸着装置
CN104445044B (zh) * 2014-12-03 2016-08-17 中国科学院上海微系统与信息技术研究所 偏离（111）硅片解理晶向的高强度悬臂梁结构及制作方法
US9804310B2 (en) * 2015-02-17 2017-10-31 Materion Corporation Method of fabricating anisotropic optical interference filter
CN106435473A (zh) * 2016-11-11 2017-02-22 京东方科技集团股份有限公司 掩模板及其制作方法、有机发光二极管显示器的制作方法
KR20200030712A (ko) 2018-09-12 2020-03-23 삼성디스플레이 주식회사 하이브리드형 마스크 스틱과, 이를 적용한 마스크 프레임 어셈블리
KR20200081990A (ko) * 2018-12-28 2020-07-08 엘지디스플레이 주식회사 표시장치용 마스크
CN112048707B (zh) * 2020-04-22 2022-08-12 北京航天控制仪器研究所 一种薄膜图形化夹具工装及其应用方法
JP2022071292A (ja) * 2020-10-28 2022-05-16 キヤノン株式会社 蒸着マスク、蒸着マスクを用いたデバイスの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4511599A (en) * 1983-03-01 1985-04-16 Sigmatron Associates Mask for vacuum depositing back metal electrodes on EL panel
US4715940A (en) * 1985-10-23 1987-12-29 Gte Products Corporation Mask for patterning electrode structures in thin film EL devices
JPH04236758A (ja) 1991-01-16 1992-08-25 Oki Electric Ind Co Ltd 蒸着用マスク
JP3265718B2 (ja) * 1993-06-23 2002-03-18 株式会社日立製作所 Ｓｉ転写マスク、及び、Ｓｉ転写マスクの製造方法
JPH09162096A (ja) 1995-12-05 1997-06-20 Toshiba Corp 荷電ビーム成形用アパーチャおよび荷電ビーム露光装置
US5976444A (en) * 1996-09-24 1999-11-02 The United States Of America As Represented By The Secretary Of The Navy Nanochannel glass replica membranes
JPH10330910A (ja) * 1997-06-04 1998-12-15 Toray Ind Inc シャドーマスクおよびその製造方法
JP4364957B2 (ja) * 1998-10-22 2009-11-18 北陸電気工業株式会社 蒸着マスク
JP2001023773A (ja) * 1999-07-08 2001-01-26 Hokuriku Electric Ind Co Ltd 有機ｅｌ素子の製造方法と装置
JP2001185350A (ja) * 1999-12-24 2001-07-06 Sanyo Electric Co Ltd 被着用マスク、その製造方法、エレクトロルミネッセンス表示装置及びその製造方法
JP4092914B2 (ja) * 2001-01-26 2008-05-28 セイコーエプソン株式会社 マスクの製造方法、有機エレクトロルミネッセンス装置の製造方法

Also Published As

Publication number Publication date
KR100645606B1 (ko) 2006-11-13
CN1518399A (zh) 2004-08-04
DE602004001054T2 (de) 2007-01-11
JP4222035B2 (ja) 2009-02-12
US20040214449A1 (en) 2004-10-28
CN100364140C (zh) 2008-01-23
TWI267561B (en) 2006-12-01
JP2004225071A (ja) 2004-08-12
EP1441572A1 (de) 2004-07-28
EP1441572B1 (de) 2006-06-07
US7033665B2 (en) 2006-04-25
KR20040067929A (ko) 2004-07-30
TW200415245A (en) 2004-08-16

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