CN1813023A - 纳米复合材料和生产方法 - Google Patents
纳米复合材料和生产方法 Download PDFInfo
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- CN1813023A CN1813023A CNA2004800181603A CN200480018160A CN1813023A CN 1813023 A CN1813023 A CN 1813023A CN A2004800181603 A CNA2004800181603 A CN A2004800181603A CN 200480018160 A CN200480018160 A CN 200480018160A CN 1813023 A CN1813023 A CN 1813023A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/005—Reinforced macromolecular compounds with nanosized materials, e.g. nanoparticles, nanofibres, nanotubes, nanowires, nanorods or nanolayered materials
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- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
- C04B35/563—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on boron carbide
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
- C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/583—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on boron nitride
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/10—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aromatic carbon atoms, e.g. polyphenylenes
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C08K3/041—Carbon nanotubes
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- C08K3/045—Fullerenes
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- C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/01—Chemical elements
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- H01—ELECTRIC ELEMENTS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01077—Iridium [Ir]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US47282003P | 2003-05-22 | 2003-05-22 | |
US60/472,820 | 2003-05-22 |
Publications (1)
Publication Number | Publication Date |
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CN1813023A true CN1813023A (zh) | 2006-08-02 |
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Application Number | Title | Priority Date | Filing Date |
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CNA2004800181603A Pending CN1813023A (zh) | 2003-05-22 | 2004-05-21 | 纳米复合材料和生产方法 |
Country Status (6)
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101840746A (zh) * | 2009-03-18 | 2010-09-22 | 伊顿公司 | 含纳米颗粒层的电界面 |
CN102869604A (zh) * | 2010-01-27 | 2013-01-09 | 伦斯勒理工学院 | 具有可调折射率的纳米填充的聚合物纳米复合材料 |
CN101636436B (zh) * | 2007-02-22 | 2014-04-16 | 道康宁公司 | 制备导电薄膜的方法和由该方法制得的制品 |
CN101573404B (zh) * | 2006-10-11 | 2014-07-09 | 佛罗里达大学研究基金公司 | 含有π-相互作用/结合侧取代基的电活性聚合物,它们的碳纳米管复合材料,及它们的形成方法 |
CN104520946A (zh) * | 2012-01-27 | 2015-04-15 | 威廉马歇莱思大学 | 磁性碳纳米带和磁性功能化碳纳米带的合成 |
CN105623264A (zh) * | 2016-04-06 | 2016-06-01 | 汤卓群 | 一种纳米改性有机聚合薄膜及其制备方法 |
CN105949571A (zh) * | 2016-06-17 | 2016-09-21 | 无锡英普林纳米科技有限公司 | 一种纳米压印抗蚀剂 |
CN107418295A (zh) * | 2010-06-29 | 2017-12-01 | 纳克公司 | 硅/锗纳米粒子墨水、用于合成纳米粒子的激光热解反应器和相关方法 |
CN109608623A (zh) * | 2018-12-24 | 2019-04-12 | 山东省科学院新材料研究所 | 一种用于碳纳米管分散的间苯乙炔基高分子聚合物及其制备方法 |
CN109694647A (zh) * | 2018-12-26 | 2019-04-30 | 中国科学院兰州化学物理研究所 | 一种具有优异耐空间环境性能的长效固体润滑防护涂料 |
CN109970047A (zh) * | 2019-03-27 | 2019-07-05 | 昆明理工大学 | 一种由碳纳米角制备石墨烯量子点的方法 |
CN111534094A (zh) * | 2020-05-20 | 2020-08-14 | 吉林大学 | 一种聚酰亚胺薄膜及其制备方法和应用 |
CN112771190A (zh) * | 2018-09-19 | 2021-05-07 | 住友电气工业株式会社 | 立方氮化硼烧结体的制造方法、立方氮化硼烧结体和包括该立方氮化硼烧结体的切削工具 |
Families Citing this family (197)
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US6861481B2 (en) * | 2000-09-29 | 2005-03-01 | Solvay Engineered Polymers, Inc. | Ionomeric nanocomposites and articles therefrom |
US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
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US8067073B2 (en) | 2004-03-25 | 2011-11-29 | Boston Scientific Scimed, Inc. | Thermoplastic medical device |
KR20070045192A (ko) * | 2004-06-14 | 2007-05-02 | 카단트 웹 시스템즈, 인코포레이티드 | 제지 기계에 사용하기 위한 편평 소자 |
JP2006108649A (ja) * | 2004-09-09 | 2006-04-20 | Masaru Hori | ナノインプリント用金型、ナノパターンの形成方法及び樹脂成型物 |
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JP5241242B2 (ja) | 2005-02-16 | 2013-07-17 | ダウ・コーニング・コーポレイション | 強化シリコーン樹脂フィルムおよびその製造方法 |
US8092910B2 (en) | 2005-02-16 | 2012-01-10 | Dow Corning Toray Co., Ltd. | Reinforced silicone resin film and method of preparing same |
ATE452928T1 (de) * | 2005-06-14 | 2010-01-15 | Dow Corning | Angereicherte silikonharzfolie und verfahren für ihre zubereitung |
EP1904568A4 (en) | 2005-07-20 | 2010-12-29 | Agency Science Tech & Res | ELECTRICALLY CONDUCTIVE HARDENABLE RESINS |
KR101253068B1 (ko) | 2005-08-04 | 2013-04-11 | 다우 코닝 코포레이션 | 강화 실리콘 수지 필름 및 이의 제조방법 |
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US8133465B2 (en) * | 2005-09-12 | 2012-03-13 | University Of Dayton | Polymer-carbon nanotube composite for use as a sensor |
JP4911447B2 (ja) * | 2005-11-29 | 2012-04-04 | 帝人株式会社 | 樹脂組成物およびその製造方法 |
JP2007146039A (ja) * | 2005-11-29 | 2007-06-14 | Teijin Ltd | 樹脂組成物およびその成形体 |
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US7465605B2 (en) * | 2005-12-14 | 2008-12-16 | Intel Corporation | In-situ functionalization of carbon nanotubes |
US7604049B2 (en) * | 2005-12-16 | 2009-10-20 | Schlumberger Technology Corporation | Polymeric composites, oilfield elements comprising same, and methods of using same in oilfield applications |
JP5362363B2 (ja) | 2005-12-21 | 2013-12-11 | ダウ・コーニング・コーポレイション | シリコーン樹脂フィルム、その調製方法、及びナノ材料充填シリコーン組成物 |
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JP5134205B2 (ja) * | 2006-01-27 | 2013-01-30 | 帝人株式会社 | 耐熱性、寸法安定性に優れた樹脂組成物およびその製造方法 |
JP5015469B2 (ja) * | 2006-02-14 | 2012-08-29 | 帝人株式会社 | 耐熱樹脂組成物およびその製造法 |
WO2007097835A2 (en) | 2006-02-20 | 2007-08-30 | Dow Corning Corporation | Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition |
JP4947458B2 (ja) * | 2006-02-27 | 2012-06-06 | 独立行政法人物質・材料研究機構 | 複合フィルムとその製造方法 |
JP5048955B2 (ja) * | 2006-03-01 | 2012-10-17 | 帝人株式会社 | 耐熱樹脂組成物およびその製造法 |
JP5154760B2 (ja) * | 2006-03-01 | 2013-02-27 | 帝人株式会社 | ポリエーテルエステルアミド系エラストマー樹脂組成物およびその製造法 |
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- 2004-05-21 CN CNA2004800181603A patent/CN1813023A/zh active Pending
- 2004-05-21 GB GB0523751A patent/GB2421506B/en not_active Expired - Fee Related
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WO2004106420A2 (en) | 2004-12-09 |
GB0523751D0 (en) | 2005-12-28 |
KR100827861B1 (ko) | 2008-05-07 |
JP2007516314A (ja) | 2007-06-21 |
GB2421506A (en) | 2006-06-28 |
US20070265379A1 (en) | 2007-11-15 |
US7479516B2 (en) | 2009-01-20 |
GB2421506B (en) | 2008-07-09 |
WO2004106420A3 (en) | 2005-04-21 |
KR20060028679A (ko) | 2006-03-31 |
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