CN111246797A - 预连接分析物传感器 - Google Patents
预连接分析物传感器 Download PDFInfo
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Abstract
提供了预连接分析物传感器。一种预连接分析物传感器包含附接到分析物传感器的传感器载体。所述传感器载体包含衬底，所述衬底被配置用于将所述传感器机械耦接到测试、校准或可穿戴设备。所述传感器载体还包含用于将传感器电极电耦接到所述测试、校准或可穿戴设备的导电触点。
Description
通过引用相关申请并入
申请数据表中标识的任何和所有权利要求或其任何更正特此根据37CFR 1.57通过引用并入本文。本申请要求于2017年10月24日提交的美国临时申请第62/576,560号的权益。前述申请通过引用整体并入本文，并且特此明确地成为本说明书的一部分。
技术领域
本公开总体上涉及传感器，并且更明确地涉及如连续分析物传感器等分析物传感器。
背景技术
糖尿病是一种病症，其中胰腺无法产生足够的胰岛素(I型或胰岛素依赖型)和/或胰岛素无效(2型或非胰岛素依赖型)。在糖尿病状态下，患者受高血糖困扰，所述高血糖可能引起与小血管恶化相关的一系列生理紊乱，例如，肾衰竭、皮肤溃疡或眼睛玻璃体出血。由于无意中过量使用胰岛素，或在使用正常剂量的胰岛素或降糖剂时伴有大量运动或食物摄入不足，可能诱发低血糖反应(低血糖)。
常规地，糖尿病患者带有自监测血糖(SMBG)监测器，所述SMBG监测器通常需要不舒服的手指刺破方法。由于缺乏舒适性和便利性，糖尿病患者通常每天仅测量其葡萄糖水平两次到四次。不利的是，这类时间间隔相隔太久以致于糖尿病患者发现高血糖或低血糖病状时可能为时已晚，有时招致危险的副作用。可替代地，可以通过包含皮肤上传感器组合件的传感器系统持续监测葡萄糖水平。传感器系统可以具有无线发射器，所述无线发射器将测量数据发送到接收器，所述接收器可以基于测量而处理和显示信息。
提供这一背景技术以介绍下文发明内容和具体实施方式的简要背景。这一背景技术不意图帮助确定所要求的主题的范围，也不视为将所要求的主题限制于解决上述任何或所有缺点或问题的实施方案。
发明内容
如连续分析物传感器等分析物传感器的制造过程涉及各种步骤，为此使用传感器与如测试和/或校准设备等制造设备之间的临时机械连接和电连接。将传感器准确地放置并对齐到测试和/或校准设备的机械接口和电接口促进实现这些连接。如下文所述，如“互连”、“中介件”或“传感器载体”等装置可以附接到传感器的细长主体，以辅助处置以及临时和永久的电连接和机械连接。传感器载体(也称为“传感器中介件”)还可以包含用于跟踪、数据存储和使传感器电极彼此之间以及与环境间密封的特征。在不限制如由随附权利要求所表达的本发明的实施例的范围的情况下，现将简要地论述其较显著的特征。在考虑这一论述之后，并且明确地说在阅读名为“具体实施方式”的部分之后，将理解本发明的实施例的特征如何提供本文所述的优点。
根据第一方面，提供了一种制造传感器的方法。所述方法包含提供分析物传感器，所述分析物传感器具有：细长主体；第一电极；第二电极，所述第二电极同轴地定位于所述第一电极内；以及至少两个电触点，所述至少两个电触点沿着所述传感器的纵轴纵向对齐并间隔开。所述方法包含将传感器载体附接到所述分析物传感器，所述传感器载体包含：中间体；第一导电部分，所述第一导电部分安置在所述中间体上，所述第一导电部分与所述第一电极电连通；第二导电部分，所述第二导电部分安置在所述中间体上，所述第二导电部分与所述第二电极电连通。所述第一导电部分和所述第二导电部分形成连接部分，所述连接部分被配置成在所述传感器与单独的装置之间建立电连接。
在第一方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述方法进一步包含将外层耦接到所述中间体。所述外层包含标识符。所述外层、所述传感器和所述中间体可以形成层压配置。所述标识符可以是QR码表。所述标识符可以包含光学标识符、射频标识符或存储器编码的标识符中的任一个。所述标识符可以标识所述分析物传感器、所述分析物传感器的校准数据或所述分析物传感器的历史。
在第一方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述方法进一步包含在将所述传感器附接到所述传感器载体之后用膜涂覆所述传感器。
在第一方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一导电部分和所述第二导电部分是迹线。所述迹线可以从所述传感器载体的远端位置延伸，并在所述传感器载体的近端终止。所述迹线可以在所述连接部分中形成暴露的接触表面。所述第一导电部分和所述第二导电部分可以嵌入到所述中间体中。
在第一方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一导电部分和所述第二导电部分是焊接点。所述焊接点可以将所述传感器附接到所述传感器载体。
在第一方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一导电部分和所述第二导电部分是导电胶带。所述导电胶带可以将所述传感器附接到所述传感器载体。
在第一方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述连接部分被配置成与所述单独的装置机械配合。
在第一方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述单独的装置是被配置成测量分析物数据的电子装置单元。
在第一方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述单独的装置是制造站的组件。所述方法可以进一步包含在所述传感器与所述制造站之间建立所述电连接时，执行恒电位仪测量、浸渍过程、固化过程、校准过程或灵敏度测量中的至少一个。所述方法可以进一步包含解除所述传感器与所述校准站之间的电连接。所述方法可以进一步包含通过所述传感器载体的所述连接部分在所述传感器与至少一个测试站之间建立电连接。
在第一方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述中间体进一步包含基准结构，所述基准结构控制所述分析物传感器相对于所述中间体的衬底的位置和空间定向。所述基准结构可以包含所述衬底的柔性部分，所述柔性部分折叠在所述分析物传感器的至少一部分上。
在第一方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一导电部分和/或所述第二导电部分包括螺旋弹簧、片弹簧或导电弹性体中的至少一个。
根据第二方面，提供了一种设备，所述设备包含分析物传感器，所述分析物传感器具有：细长主体、与第一导电触点电连通的第一电极、与第二导电触点电连通的第二电极。所述传感器载体可以附接到所述分析物传感器。所述传感器载体可以包含：中间体；第一导电部分，所述第一导电部分安置在所述中间体上，所述第一导电部分与所述第一导电触点电连通；以及第二导电部分，所述第二导电部分安置在所述中间体上，所述第二导电部分与所述第二导电触点电连通。所述第一导电部分和所述第二导电部分可以形成连接部分，所述连接部分被配置成在所述第一导电触点和所述第二导电触点与单独的装置之间建立电连通。
在第二方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述设备进一步包含耦接到所述中间体的标识符。所述标识符、所述传感器和所述中间体可以形成层压配置。所述标识符可以是QR码表。所述标识符可以是光学标识符、射频标识符或存储器编码的标识符中的任一个。所述标识符可以被配置成标识所述分析物传感器、所述分析物传感器的校准数据和所述分析物传感器的历史中的任一个。
在第二方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一导电部分和所述第二导电部分是迹线。所述迹线可以在所述连接部分中形成暴露的接触表面。所述第一导电部分和所述第二导电部分可以至少部分地嵌入到所述中间体中。
在第二方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一导电部分和所述第二导电部分包含焊接点、导电胶带、螺旋弹簧、片弹簧或导电弹性体中的至少一个。
在第二方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述连接部分被配置成与所述单独的装置机械配合。
在第二方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述单独的装置是被配置成测量分析物数据的电子装置单元。
在第二方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述单独的装置是制造站的组件。恒电位仪测量、浸渍过程、固化过程、校准过程或灵敏度测量中的至少一个可以被配置成在所述传感器与所述制造站之间建立所述电连接时执行。所述制造站可以包括校准站，所述校准站被配置成解除所述传感器与所述校准站之间的电连接并且通过所述传感器载体的所述连接部分在所述传感器与至少一个测试站之间建立电连接。
在第二方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述中间体进一步包括基准结构，所述基准结构被配置成控制所述分析物传感器相对于所述中间体的衬底的位置和空间定向。
在第二方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一电极可以同轴地定位在所述第二电极内，并且所述第一电触点和所述第二电触点可以沿着所述传感器的纵轴纵向对齐并间隔开。
在第二方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一电极和所述第二电极可以附连到柔性平面衬底。另外，所述第一电触点和所述第二电触点可以附连到所述柔性平面衬底。
在第二方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一导电触点和所述第二导电触点通过导电粘合剂附连到所述中间体。
在第二方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一导电触点和所述第二导电触点通过各向异性导电膜附连到所述中间体。
根据第三方面，提供了一种预连接分析物传感器阵列。所述阵列包括：衬底；第一多个电触点，所述第一多个电触点安置在所述衬底上；第二多个电触点，所述第二多个电触点安置在所述衬底上；以及多个分析物传感器，所述多个分析物传感器安置在所述衬底上。所述多个分析物传感器中的每个分析物传感器包含耦接到所述衬底上的所述第一多个电触点中的对应一个第一电触点的第一传感器电触点以及耦接到所述衬底上的所述第二多个电触点中的对应一个第二电触点的第二传感器电触点。所述阵列可以包括一个或多个条带。
在第三方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一多个电触点沿着所述衬底对齐。所述第一多个电触点可以由暴露的接触表面形成。
在第三方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第二多个电触点沿着所述衬底对齐。所述第二多个电触点可以由暴露的接触表面形成。
在第三方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述第一多个电触点和所述第二多个电触点被配置成与单独的装置连接。所述单独的装置可以是制造站的组件。
在第三方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述衬底包含至少一个单切特征，所述至少一个单切特征被配置成促进将所述衬底单切成多个传感器载体，其中所述多个传感器载体中的每个传感器载体附接到所述分析物传感器中的对应一个分析物传感器。
在第三方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述条带进一步包含安置在所述衬底上的多个标识符。
在第三方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述衬底包含细长尺寸，其中所述多个分析物传感器在正交于所述细长尺寸的方向上延伸超过所述衬底的边缘。所述条带可以进一步包含进给导引条带，所述进给导引条带在所述细长尺寸上沿着所述衬底的相对边缘行进。所述衬底可以进一步包含柔性衬底，所述柔性衬底被配置成卷到卷盘上。所述进给导引条带可从所述衬底移除。
在第三方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述衬底包括具有多个基准特征的模制热塑性塑料，所述多个基准特征控制所述多个分析物传感器的位置和定向，并且其中所述第一多个电触点和所述第二多个电触点各自包括所述模制热塑性塑料中的嵌入式导电迹线。
在第三方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述条带进一步包含耦接到所述条带的第一基准结构，所述第一基准结构被配置成定位所述多个分析物传感器。所述第一基准结构包含至少一个单切特征，所述至少一个单切特征被配置成促进将所述第一基准结构单切成多个第二基准结构，其中所述多个第二基准结构中的每个第二基准结构耦接到通过所述衬底形成的多个传感器载体中的对应一个传感器载体。
在第三方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述条带进一步包含具有处理电路系统的载体，所述处理电路系统被配置成对所述多个分析物传感器执行至少恒电位仪测量。所述条带可以进一步包含通信电路系统，所述通信电路系统能够由所述处理电路系统操作以发送和接收与所述分析物传感器中的每个分析物传感器相关联的数据以及所述分析物传感器的标识符。
根据第四方面，提供了一种方法。所述方法包含提供预连接分析物传感器，所述预连接分析物传感器包括：中间体；分析物传感器，所述分析物传感器永久地附接到所述中间体；以及标识符，所述标识符耦接到所述中间体。所述方法包含通过将所述中间体耦接到制造站的对应特征而将所述分析物传感器通信耦接到所述制造站的处理电路系统。所述方法包含操作所述制造站的所述处理电路系统以与所述预连接分析物传感器通信。
在第四方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，操作所述处理电路系统包含通过连接部分从所述分析物传感器获得信号。操作所述处理电路系统可以包含操作所述制造站的光学、红外或射频读取器以获得所述标识符。
在第四方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述方法进一步包含用所述制造站的所述处理电路系统并结合所述标识符存储对应于所述信号的传感器数据。所述标识符可以标识所述分析物传感器、所述分析物传感器的校准数据和所述分析物传感器的历史中的任一个。
在第四方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述信号包含葡萄糖灵敏度信号。
在第四方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述方法进一步包含从所述制造站移除所述预连接分析物传感器并通过将所述中间体的锚定特征机械耦接到可穿戴装置的对应特征而将所述分析物传感器通信耦接到所述可穿戴装置的处理电路系统。所述方法可以进一步包含通过所述可穿戴装置的所述处理电路系统从所述分析物传感器获得体内测量数据。
在第四方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述分析物传感器通过导电粘合剂永久附接到所述中间体。
在第四方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述分析物传感器通过各向异性导电膜永久附接到所述中间体。
根据第五方面，提供了一种可穿戴装置。所述可穿戴装置包括壳体以及被配置成处理分析物传感器信号的电子电路系统。所述电子电路系统封闭在所述壳体内。分析物传感器具有定位在所述壳体外部的远端部分。中间体具有到所述分析物传感器的近端部分和电子装置两者的电连接，其中所述中间体与所述分析物传感器的所述近端部分之间的所述电连接位于所述壳体外部。
在第五方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述中间体可以被定位成邻近于所述壳体的外表面。所述装置可以包含耦接到所述电子装置与所述中间体两者的电触点。所述中间体可以通过导电环氧树脂电连接到所述电触点。所述中间体通过各向异性导电膜电连接到所述电触点。所述中间体可以被密封。所述电触点可以延伸穿过所述壳体。所述中间体可以定位在所述壳体的所述外表面上的凹部中。所述电触点可以在所述凹部中延伸穿过所述壳体以将所述中间体电耦接到封闭在所述壳体内的所述电子电路系统。所述中间体可以被所述凹部中的聚合物覆盖。
在第五方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述分析物传感器形成为具有远端部分和近端部分的细长主体，所述远端部分被配置用于经皮植入在对象中，所述近端部分被配置用于电连接到所述中间体。所述分析物传感器的所述远端部分可以延伸远离穿过所述壳体的开口。所述电子电路系统可以包括恒电位仪和/或无线发射器。
根据第六方面，提供了一种制造预连接分析物传感器的方法。所述方法包括将细长导体的近端部分机械且电连接到中间体的导电部分，并且在所述连接之后，用聚合物膜涂覆所述细长导体的远端部分以形成具有工作电极区域的分析物传感器，所述工作电极区域被配置成支持用于所述细长导体的所述远端部分中的分析物检测的电化学反应。
在第六方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述方法另外包括测试所述分析物传感器，其中所述测试包括将所述中间体电耦接到测试站。所述方法可以另外包括校准所述分析物传感器，其中所述校准包括将所述中间体电耦接到测试站。所述涂覆可以包括浸涂。
在第六方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述中间体可以是由多个耦接的中间体形成的阵列的一部分，其中所述方法进一步包括将多个细长电极中的每个细长电极的近端部分机械且电连接到所述阵列的每个中间体的导电部分。所述涂覆可以对连接到所述阵列的所述中间体的所述多个细长电极中的每个细长电极的每个远端部分并行地执行。所述方法可以包括在所述涂覆之后单切所述阵列的所述中间体中的一个或多个中间体。
在第六方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，机械且电连接包括将导电膏施涂到所述细长导体和所述中间体的所述导电部分。在一些实施例中，机械且电连接包括压缩所述细长导体的所述近端部分与所述中间体的所述导电部分之间的各向异性导电膜。所述连接可以是在远离所述涂覆的位置处执行的。在一些实施例中，所述涂覆、所述测试和所述校准全都是在远离所述连接的位置处执行的。
根据第七方面，一种制造皮肤上可穿戴经皮分析物传感器的方法包括：将电子电路系统组装到壳体的内部体积中，其中所述电子电路系统被配置用于(1)检测由对象的位于分析物传感器的工作电极处的皮肤下的电化学反应生成的信号；并且(2)将从检测到的信号得出的数据无线发射到所述壳体外部以供单独的装置处理和/或显示。在将所述电子电路系统组装到所述壳体的所述内部体积中之后，将所述分析物传感器的近端部分附接到耦接到所述电子电路系统的外部电接口，使得所述电子电路系统变得连接到所述分析物传感器以从所述分析物传感器接收信号而无需打开所述壳体。
在第七方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述方法包括在附接所述分析物传感器的所述近端部分之后密封所述接口。所述方法可以包括在所述附接之前测试所述电子电路系统的功能性。所述方法可以包括在所述附接之前测试所述分析物传感器的功能性。所述组装可以是在远离所述附接的位置处执行的。
在第七方面的普遍适用的实施例(即，可独立地与本文所述的任何方面或实施例组合)中，所述方法可以包括将中间体耦接到所述分析物传感器的所述近端部分，并且所述附接可以包括将所述中间体附接到所述外部电接口。所述方法可以接着包括在所述附接之前使用所述中间体对所述工作电极执行至少一个制造或测试程序。所述执行可以包括涂覆所述分析物传感器的所述工作电极。所述耦接可以是在第一位置处执行的，所述组装可以是在第二位置处执行的，并且所述执行可以是在第三位置执行的，其中所述第一位置、所述第二位置和所述第三位置彼此远离。所述附接和/或耦接可以是通过各向异性导电膜来执行。所述方法可以进一步包括将插入器附接到所述壳体以将所述工作电极植入到对象中。
应理解，本领域技术人员将容易根据本公开明白本发明技术的各种配置，其中通过图示的方式示出并描述本发明技术的各种配置。如将认识到的，本发明技术能够具有其它不同配置，并且其若干细节能够在各种其它方面进行修改，所有这些都不脱离本发明技术的范围。因此，发明内容、附图和具体实施方式本质上应被认为是说明性的而不是限制性的。
附图说明
现将详细论述本发明的实施例，其中着重强调突出有利特征。这些实施例仅出于说明目的，而并未按比例绘制，而是强调本公开的原理。这些附图包含以下附图，其中类似附图标记表示类似部分：
图1是根据一些实施例的附接到宿主并与多个示例装置通信的分析物传感器系统的示意图。
图2是展示了根据一些实施例与图1的传感器系统相关联的电子装置的框图。
图3A-3C展示了根据一些实施例的具有分析物传感器的可穿戴装置。
图3D展示了连接到恒电位仪的细长传感器的一种实施方案。
图4A展示了根据一些实施例的预连接分析物传感器的示意图。
图4B展示了根据一些实施例的预连接分析物传感器的另一示意图。
图4C展示了根据一些实施例的预连接分析物传感器的分层视图。
图4D展示了根据一些实施例的预连接分析物传感器阵列的示意图。
图5A-5E展示了根据一些实施例的具有用于分析物传感器的制造系统和可穿戴装置的系统的框图。
图6展示了根据一些实施例的具有预连接分析物传感器的可穿戴装置的横截面示意图。
图7展示了根据一些实施例的具有预连接分析物传感器的可穿戴装置的横截面示意图。
图8展示了根据一些实施例的具有预连接分析物传感器的可穿戴装置的横截面示意图。
图9展示了根据一些实施例的皮肤上传感器组合件的透视图。
图10和11展示了根据一些实施例的具有弹簧的传感器载体的透视图。
图12展示了根据一些实施例的传感器载体的一部分的横截面透视图。
图13A-13B展示了根据一些实施例的可穿戴传感器组合件的透视图。
图13C展示了根据一些实施例的可穿戴传感器组合件的组件的分解图。
图14A-14B展示了根据一些实施例的另一可穿戴传感器组合件的透视图。
图14C展示了根据一些实施例的包含外部电接口实施例的另一可穿戴传感器组合件的组件的分解图。
图14D展示了安装有预连接传感器组合件的图14C的外部电接口的俯视平面图。
图14E是沿图14D中的线E-E的横截面。
图15A展示了用于传感器载体的印刷电路板衬底的另一实施例。
图15B和15C展示了用于将传感器和传感器载体耦接到可穿戴传感器组合件的电接口的替代性实施例。
图16展示了根据一些实施例的传感器载体的俯视图，所述传感器载体通过导电粘合剂附接到分析物传感器。
图17展示了根据一些实施例的传感器载体的端视图，所述传感器载体通过导电粘合剂附接到分析物传感器。
图18展示了根据一些实施例的传感器载体的端视图，所述传感器载体通过传感器载体衬底的凹部中的导电粘合剂附接到分析物传感器。
图19展示了根据一些实施例的传感器载体的端视图，所述传感器载体通过传感器载体衬底的拐角中的导电粘合剂附接到分析物传感器。
图20展示了根据一些实施例的传感器载体的端视图，所述传感器载体通过传感器载体衬底的圆形凹部中的导电粘合剂附接到分析物传感器。
图21A和21B分别展示了在导引结构中附接到传感器载体的分析物传感器的透视图和端视图。
图22展示了根据一些实施例的传感器载体的俯视图，所述传感器载体通过导电胶带而附接到分析物传感器。
图23展示了根据一些实施例的传感器载体的俯视图，所述传感器载体具有附接到分析物传感器并缠绕在分析物传感器周围的衬底。
图24展示了根据一些实施例的传感器载体的俯视图，所述传感器载体通过焊接的导电塑料而附接到分析物传感器。
图25和26展示了根据一些实施例的用于通过导电塑料而将传感器载体附接到分析物传感器的制造设备。
图27是展示了根据一些实施例的具有扁平电连接器部分的分析物传感器的近端部分的立体示意图。
图28展示了根据一些实施例的附接到传感器载体的图24的分析物传感器的侧视图。
图29展示了根据一些实施例的传感器载体的俯视图，所述传感器载体具有被配置成缠绕在分析物传感器周围的柔性衬底。
图30展示了根据一些实施例的传感器载体的透视图，所述传感器载体具有衬底，所述衬底具有被配置成缠绕在分析物传感器周围的柔性部分。
图31A和31B展示了附接到分析物传感器的传感器载体的另一实施例。
图32展示了根据一些实施例的传感器载体的俯视图，所述传感器载体具有用于附接分析物传感器的可移动紧固件。
图33展示了根据一些实施例的图29的可移动紧固件的透视图。
图34展示了根据一些实施例的实施为桶状紧固件的传感器载体的透视图。
图35A展示了根据一些实施例的传感器载体的正面视图，所述传感器载体具有缠绕在分析物传感器周围的柔性衬底。
图35B展示了根据一些实施例的传感器载体的透视图，所述传感器载体具有缠绕在多个分析物传感器周围的柔性衬底。
图36展示了根据一些实施例的具有压接连接器的传感器载体的端视图。
图37展示了根据一些实施例的传感器载体的端视图，所述传感器载体通过压接连接器而附接到分析物传感器。
图38展示了根据一些实施例的具有若干压接连接器的传感器载体的侧视图。
图39展示了根据一些实施例的传感器载体的透视图。
图40展示了根据一些实施例的传感器载体的透视图，所述传感器载体由模制互连装置形成。
图41展示了根据一些实施例的传感器载体的俯视图，所述传感器载体由模制互连装置形成。
图42展示了根据一些实施例的传感器载体的侧视图，所述传感器载体通过导电耦接器而附接到分析物传感器。
图43展示了根据一些实施例的传感器载体的侧视图，所述传感器载体具有用于附接到多个分析物传感器的细长尺寸。
图44展示了根据一些实施例的传感器载体的俯视图，所述传感器载体具有用于缠绕在分析物传感器周围的柔性衬底。
图45展示了根据一些实施例的另一传感器载体的俯视图，所述另一传感器载体具有用于缠绕在分析物传感器周围的柔性衬底。
图46展示了根据一些实施例的另一传感器载体的俯视图，所述另一传感器载体具有用于缠绕在分析物传感器周围的柔性衬底。
图47A展示了根据一些实施例的传感器载体的侧视图，所述传感器载体在细长尺寸上具有用于附接到多个分析物传感器的进给导引条带。
图47B展示了根据一些实施例的缠绕在卷盘上的图47A的传感器载体的透视图。
图48展示了根据一些实施例的图47A的传感器载体的俯视图，其中传感器载体从所述传感器载体单切。
图49展示了根据一些实施例的传感器载体的透视图，所述传感器载体具有用于附接多个分析物传感器的弹簧加载的插座。
图50展示了根据一些实施例的传感器载体的透视图，所述传感器载体具有用于多个分析物传感器的定位和定向的磁性基准特征。
图51A展示了根据一些实施例的传感器载体的俯视图，所述传感器载体具有用于附接到多个分析物传感器的刚性弯曲面板。
图51B展示了根据一些实施例的传感器载体的俯视图，所述传感器载体具有用于附接到多个分析物传感器的刚柔性面板，所述多个分析物传感器具有用于电连接的边缘卡连接器垫。
图52A展示了根据一些实施例的传感器载体的俯视图，所述传感器载体从图48的传感器载体单切，并且附接到分析物传感器以形成预连接传感器。
图52B展示了根据一些实施例的传感器载体，所述传感器载体具有用于无需V形刻痕部分而附接到图48B的多个分析物传感器的刚柔性面板。
图53A展示了根据一些实施例的预连接传感器，所述预连接传感器将安装在可穿戴装置中。
图53B展示了根据一些实施例的处于折叠位置的预连接传感器，所述预连接传感器将安装在可穿戴装置中。
图54展示了根据一些实施例的传感器载体，所述传感器载体实施为用于连接到分析物传感器的子板。
图55展示了根据一些实施例的通过压紧夹而实施的传感器载体。
图56展示了根据一些实施例的传感器载体，所述传感器载体具有用于连接到分析物传感器的夹。
图57是根据一些实施例的可以针对制造和使用预连接传感器而执行的说明性操作的流程图。
图58展示了根据一些实施例的具有带凹槽的柔性管的传感器保持设备的透视图。
图59展示了根据一些实施例的图58的设备的分解透视图。
图60展示了根据一些实施例的包含安装在图55的设备中的传感器的装置。
图61展示了根据一些实施例的用于预连接传感器的载体的简图。
贯穿始终，类似附图标记指代类似元件。除非另有注明，否则元件未按比例绘制。
具体实施方式
以下描述和实例详细说明了所公开的发明的一些示例性实施方案、实施例和布置。本领域技术人员将认识到，本发明的范围涵盖本发明的许多变化和修改。因此，不应将某些示例实施例的描述视为限制本发明的范围。
定义
为了促进对本文所述的各种实施例的理解，下文定义许多术语。
如本文所使用，术语“分析物”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于生物体液(例如，血液、间质液、脑脊液、淋巴液或尿液)中可分析的物质或化学成分。分析物可以包含天然存在的物质、人造物质、代谢物和/或反应产物。在一些实施例中，通过传感器头、装置和方法测量的分析物是分析物。然而，还预期其它分析物，包含但不限于未羧化凝血酶原；酰基肉碱；腺嘌呤磷酸核糖转移酶；腺苷脱氨酶；白蛋白；α甲胎蛋白；氨基酸谱(精氨酸(克雷布斯循环(Krebs cycle))、组氨酸/尿酸、同型半胱氨酸、苯丙氨酸/酪氨酸、色氨酸)；雄甾烯二酮；安替比林；阿拉伯糖醇对映异构体；精氨酸酶；苯甲酰芽子碱(可卡因)；生物素酶；生物蝶呤；c-反应蛋白；肉碱；肌肽酶；CD4；血浆铜蓝蛋白；鹅脱氧胆酸；氯喹；胆固醇；胆碱酯酶；偶联的1-β羟基-胆酸；皮质醇；肌酸激酶；肌酸激酶MM同工酶；环孢菌素A；D-青霉胺；脱乙基氯喹；硫酸脱氢表雄酮；DNA(乙酰化基因多态性、醇脱氢酶、α1-抗胰蛋白酶、囊性纤维化、杜兴氏/贝克尔型肌营养不良(Duchenne/Becker muscular dystrophy)、分析物-6-磷酸脱氢酶、血红蛋白A、血红蛋白S、血红蛋白C、血红蛋白D、血红蛋白E、血红蛋白F、D-Punjab、β-地中海贫血、乙型肝炎病毒、HCMV、HIV-1、HTLV-1、雷伯氏遗传性视神经病变、MCAD、RNA、PKU、间日疟原虫、性分化、21-脱氧皮质醇)；脱丁基卤泛曲林；二氢化蝶啶还原酶；白喉/破伤风抗毒素；红细胞精氨酸酶；红细胞原卟啉；酯酶D；脂肪酸/酰基甘氨酸；游离β-人绒毛膜促性腺激素；游离红细胞卟啉；游离甲状腺素(FT4)；游离三碘甲状腺原氨酸(FT3)；富马酰乙酰乙酸酶；半乳糖/gal-1-磷酸；半乳糖-1-磷酸尿苷转移酶；庆大霉素；分析物-6-磷酸脱氢酶；谷胱甘肽；谷胱甘肽过氧化物酶；甘氨胆酸；糖基化血红蛋白；卤泛曲林；血红蛋白变体；氨基己糖苷酶A；人红细胞碳酸酐酶I；17-α-羟基孕酮；次黄嘌呤磷酸核糖转移酶；免疫反应性胰蛋白酶；乳酸；铅；脂蛋白((a)、B/A-1、β)；溶菌酶；甲氟喹；奈替米星；苯巴比妥；苯妥英；植烷酸/降植烷酸；孕酮；催乳素；脯氨酸二肽酶；嘌呤核苷磷酸化酶；奎宁；反三碘甲状腺原氨酸(rT3)；硒；血清胰脂肪酶；西索霉素；生长调节素C；特异性抗体(腺病毒、抗核抗体、抗ζ抗体、虫媒病毒、奥叶基氏病病毒、登革热病毒、麦地那龙线虫、细粒棘球绦虫、溶组织内阿米巴、肠道病毒、十二指肠贾第鞭毛虫、幽门螺杆菌、乙型肝炎病毒、疱疹病毒、HIV-1、IgE(特应性疾病)、流感病毒、杜氏利什曼原虫、钩端螺旋体、麻疹/腮腺炎/风疹、麻风分枝杆菌、肺炎支原体、肌红蛋白、盘尾丝虫、副流感病毒、恶性疟原虫、脊髓灰质炎病毒、绿脓杆菌、呼吸道合胞体病毒、立克次氏体(恙虫病)、曼氏血吸虫、刚地弓形虫、梅毒螺旋体、克氏/让氏锥虫、水痘带状疱疹病毒、班氏吴策线虫、黄热病病毒；特异性抗原(乙肝病毒、HIV-1)；琥珀酰丙酮；磺胺多辛；茶碱；促甲状腺素(TSH)；甲状腺素(T4)；甲状腺素结合球蛋白；微量元素；转铁蛋白；UDP-半乳糖-4-差向异构酶；尿素；尿卟啉原I合成酶；维生素A；白血细胞；以及锌原卟啉。在某些实施例中，血液或间质液中天然存在的盐、糖、蛋白质、脂肪、维生素和激素也可以构成分析物。分析物可以天然存在于生物体液中，例如，代谢产物、激素、抗原、抗体等。可替代地，分析物可以被引入到体内，例如，用于成像的造影剂、放射性同位素、化学制剂、基于荧光碳的合成血液，或者药物或药物组合物，包含但不限于胰岛素；乙醇；大麻属(大麻(marijuana)、四氢大麻酚、哈希什)；吸入剂(一氧化二氮、亚硝酸戊酯、亚硝酸丁酯、氯代烃、烃)；可卡因(快克可卡因)；兴奋剂(安非他命、甲基安非他命、利他林、赛乐特、Preludin、Didrex、PreState、Voranil、Sandrex、Plegine；镇静剂(巴比妥酸盐、甲喹酮、安定药，如安定(Valium)、利眠宁(Librium)、眠尔通(Miltown)、舒宁(Serax)、甲丁双脲(Equanil)、Tranxene)；致幻剂(苯环己哌啶、麦角酸(lysergic acid)、墨斯卡灵(mescaline)、佩奥特碱(peyote)、裸头草碱(psilocybin))；麻醉剂(海洛因、可待因、吗啡、鸦片、杜冷丁、Percocet、复方羟可酮(Percodan)、Tussionex、芬太尼(Fentanyl)、达尔丰(Darvon)、镇痛新(Talwin)、止泻灵(Lomotil))；人造毒品(芬太尼、杜冷丁、安非他命、甲基安非他命和苯环己哌啶的类似物，例如摇头丸)；合成代谢类固醇；以及尼古丁。药物和药物组合物的代谢产物也是预期分析物。还可以分析如神经化学物质和体内生成的其它化学物质的分析物，例如，抗坏酸、尿酸、多巴胺、去甲肾上腺素、3-甲氧酪胺(3MT)、3,4-二羟基苯乙酸(DOPAC)、高香草酸(HVA)、5-羟色胺(5HT)和5-羟基吲哚乙酸(FHIAA)。
如本文所使用，术语“微处理器”和“处理器”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于计算机系统、状态机等，所述计算机系统、状态机等使用对驱动计算机的基本指令作出响应并进行处理的逻辑电路来执行算术和逻辑操作。
如本文所使用，术语“校准”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于确定传感器数据与对应参考数据之间的关系的过程，所述关系可以在实时地利用或并不利用参考数据的情况下将传感器数据转换成基本上等同于参考数据的有意义的值。在一些实施例中，即，在分析物传感器中，随着传感器数据与参考数据之间的关系发生改变(例如，由于灵敏度、基线、转运、代谢等的改变)，校准可以随着时间而更新或重新校准(在工厂中，实时地和/或回顾性地进行)。
如本文所使用，术语“经校准数据”和“经校准数据流”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于使用函数(例如，转换函数(包含通过使用灵敏度))而从原始状态变换为另一状态以向用户提供有意义的值的数据。
如本文所使用，术语“算法”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于例如通过使用计算机处理而将信息从一种状态变换为另一状态时所涉及的计算过程(例如，程序)。
如本文所使用，术语“传感器”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于可以借以将分析物量化的装置的组件或区域。一“批”传感器通常是指在同一天或同一天前后并使用相同的工艺和工具/材料制造的一组传感器。此外，测量温度、压力等的传感器可以称为“传感器”。
如本文所使用，术语“葡萄糖传感器”和“用于确定生物样本中的葡萄糖量的构件”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于可以借以将葡萄糖量化的任何机构(例如，酶促的或非酶促的)。例如，一些实施例利用含有葡萄糖氧化酶的膜，所述葡萄糖氧化酶会催化氧气和葡萄糖转化为过氧化氢和葡萄糖酸盐，如以下化学反应所示：
葡萄糖+O2→葡萄糖酸盐+H2O2
因为对于每个葡萄糖分子的代谢，共反应物O2和产物H2O2成比例地改变，所以可以使用电极以监测共反应物或产物的当前改变，以确定葡萄糖浓度。
如本文所使用，术语“可操作地连接”和“可操作地链接”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于以允许在组件之间发射信号的方式将一个或多个组件链接到另一个或多个组件。例如，一个或多个电极可以用于检测样品中的葡萄糖量，并将此信息转换为信号，例如，电信号或电磁信号；接着，所述信号可以发射到电子电路系统。在这种情况下，电极“可操作地链接”到电子电路系统。这些术语足够广泛而包含无线连接性。
术语“确定”涵盖各种各样的动作。例如，“确定”可以包含计算、运算、处理、得出、调查、查找(例如，在表格、数据库或另一数据结构中查找)、确认等。并且，“确定”可以包含接收(例如，接收信息)、访问(例如，访问存储器中的数据)等。并且，“确定”可以包含解析、选择、挑选、计算、得出、建立等。确定还可以包含确认参数匹配预定准则，包含已满足、通过、超过阈值等。
如本文所使用，术语“基本上”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于在很大程度上但未必是所规定的全部。
如本文所使用，术语“宿主”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于哺乳动物，明确地说，人类。
如本文所使用，术语“连续分析物(或葡萄糖)传感器”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于例如以从几分之一秒到例如1分钟、2分钟或5分钟或更长的时间间隔连续或不断测量分析物浓度的装置。在一个示例性实施例中，连续分析物传感器是如美国专利第6,001,067号所述的葡萄糖传感器，所述美国专利通过引用整体并入本文中。
如本文所使用，术语“感测膜”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于可以由两个或更多个域构成并且通常由厚度为几微米或更大的材料构成的可渗透或半渗透的膜，所述材料可渗透氧气并且可渗透或不可渗透葡萄糖。在一个实例中，感测膜包括固定的葡萄糖氧化酶，所述固定的葡萄糖氧化酶能够发生电化学反应以测量葡萄糖浓度。
如本文所使用，术语“传感器数据”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且此外表示但不限于与传感器(如连续分析物传感器)相关联的任何数据。传感器数据包含来自分析物传感器的与所测量的分析物直接相关的模拟或数字信号(或从另一传感器接收的其它信号)的原始数据流(或简称为数据流)以及经校准和/或经筛选的原始数据。在一个实例中，传感器数据包括由A/D转换器从模拟信号(例如，电压或电流)转换的呈“计数”的形式的数字数据，并且包含代表葡萄糖浓度的一个或多个数据点。因此，术语“传感器数据点”和“数据点”通常表示传感器数据在特定时间的数字表示。这些术语广泛地涵盖来自传感器(如基本上连续的葡萄糖传感器)的多个时间间隔的数据点，所述传感器包括例如以从几分之一秒到例如1分钟、2分钟或5分钟或更长的时间间隔进行的个别测量。在另一实例中，传感器数据包括代表在一个时间段内平均化的一个或多个数据点的积分数字值。传感器数据可以包含经校准数据、经平滑数据、经筛选数据、经变换数据和/或与传感器相关联的任何其它数据。
如本文所使用，术语“传感器电子装置”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示但不限于被配置成处理数据的装置的组件(例如，硬件和/或软件)。如下文进一步详细地描述(参见例如图2)，“传感器电子装置”可以被布置且配置成测量、转换、存储、发射、传达和/或检索与分析物传感器相关联的传感器数据。
如本文所使用，术语“灵敏度”或“传感器灵敏度”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示由某一浓度的所测量的分析物或与所测量的分析物(例如，葡萄糖)相关联的所测量的物质(例如，H2O2)产生的信号量。例如，在一个实施例中，对于每1mg/dL的葡萄糖分析物，传感器具有约1皮安到约300皮安的电流的灵敏度。
如本文所使用，术语“样品”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示但不限于宿主身体的样品，例如体液，包含血液、血清、血浆、间质液、脑脊液、淋巴液、眼液、唾液、口腔液、尿液、排泄物或分泌物等。
如本文所使用，术语“远端”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示但不限于各种元件之间相比于特定参考点的空间关系。通常，所述术语表示一个元件相比于另一元件位于离参考点相对较远处。
如本文所使用，术语“近端”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示但不限于各种元件之间相比于特定参考点的空间关系。通常，所述术语表示一个元件相比于另一元件位于离参考点相对较近处。
如本文所使用，术语“电连接”和“电接触”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示本领域技术人员已知的两个电导体之间的任何连接。在一个实施例中，电极与装置的电子电路系统电连接(例如，电连接到装置的电子电路系统)。在另一实施例中，两种材料(如但不限于两种金属)可以相互电接触，使得电流可以从两种材料中的一种传递到另一材料和/或电位可得以施加。
如本文所使用，术语“细长导电主体”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示但不限于至少部分由导电材料形成的细长主体，并且包含可在其上形成的任何数量的涂层。举例来说，“细长导电主体”可以指裸露的细长导电芯(例如，金属导线)；涂覆有一层、二层、三层、四层、五层或者更多层的材料的细长导电芯，每层材料可以是导电的或者不导电的；或上面带有导电涂层、迹线或电极并涂覆有一层、二层、三层、四层、五层或者更多层的材料的细长非导电芯，每层材料可以是导电的或不导电的。
如本文所使用，术语“体外部分”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示但不限于适于保持和/或存在于宿主的活体之外的装置(例如，传感器)的一部分。
如本文所使用，术语“体内部分”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示但不限于适于插入到宿主的活体中和/或存在于宿主的活体内的装置(例如，传感器)的一部分。
如本文所使用，术语“恒电位仪”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示但不限于将工作电极与参考电极之间的电位控制在一个或多个预设值的电子仪器。
如本文所使用，术语“处理器模块”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示但不限于被设计成使用对驱动计算机的基本指令作出响应并进行处理的逻辑电路来执行算术和逻辑操作的计算机系统、状态机、处理器及其组件等。
如本文所使用，术语“传感器会话”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示但不限于传感器处于使用中的时间段，如但不限于从植入传感器(例如，由宿主)时开始到移除传感器(例如，从宿主的身体移除传感器和/或移除系统电子装置(例如，断开连接))的一段时间。
如本文所使用，术语“基本上”和“基本上地”是广义术语，并且对于本领域普通技术人员来说具有其普通和惯常含义(并且不限于特殊或定制的含义)，并且表示但不限于足以提供所需功能的量。
“基于同轴双导线的传感器”：由导电中心芯、绝缘中间层和导电外层组成的圆形导线传感器，导电层在一端暴露以便电接触。
“预连接传感器”：附接有“传感器互连/中介件/传感器载体”的传感器。因此，此“预连接传感器”由接合的两个部分组成：传感器自身以及互连/中介件/传感器载体。术语“预连接传感器”单元表示由这两个不同部分的永久联合形成的单元。
其它定义将在下文的描述中提供，并且在一些情况下，根据所述术语的使用情况提供。
如本文所使用，采用以下缩写：Eq和Eqs(当量)；mEq(毫当量)；M(摩尔)；mM(毫摩尔)；μM(微摩尔)；N(正常)；mol(摩尔)；mmol(毫摩尔)；μmol(微摩尔)；nmol(纳摩尔)；g(克)；mg(毫克)；μg(微克)；kg(千克)；L(升)；mL(毫升)；dL(分升)；μL(微升)；cm(厘米)；mm(毫米)；μm(微米)；nm(纳米)；h和hr(小时)；min.(分钟)；s和sec.(秒)；℃(摄氏度)；℉(华氏度)，Pa(帕斯卡)，kPa(千帕斯卡)，MPa(兆帕斯卡)，GPa(千兆帕斯卡)，Psi(磅/平方英寸)，kPsi(千磅/平方英寸)。
系统的概述/一般描述
体内分析物感测技术可以依赖于体内传感器。体内传感器可以包含细长导电主体，所述细长导电主体具有一个或多个电极，如工作电极和参考电极。
例如，铂金属包层钽丝有时用作具有用于分析物传感器的一个或多个参考电极或反电极的芯部裸露感测元件。此感测元件以膜的形式涂覆以产生最终传感器。
本文描述了预连接传感器，所述预连接传感器包含附接到传感器载体(本文中也称为“传感器中介件”)的分析物传感器。分析物传感器可以包含工作电极和处于细长导电主体的远端处的参考电极。传感器载体可以包含：衬底；耦接到传感器的一个或多个电触点的一个或多个电触点；以及电路，如一个或多个额外的或外部的电触点，用于将耦接到一个或多个传感器触点的一个或多个电触点耦接到外部设备，例如，膜浸涂站、测试站、校准站或可穿戴装置的传感器电子装置。在一些实施例中，衬底可以称为中间体。
下文描述和实例参照附图而描述本发明的实施例。在附图中，附图标记对本发明的本实施例的元件进行标记。在下文中，这些附图标记结合对应附图特征的论述而再现。
传感器系统
图1描绘了根据一些示例实施方案的示例系统100。系统100包含分析物传感器系统101，所述分析物传感器系统包含传感器电子装置112和分析物传感器138。系统100可以包含其它装置和/或传感器，如药物输送泵102和血糖仪104。分析物传感器138可以物理连接到传感器电子装置112，并且可以与传感器电子装置集成(例如，不可释放地附接)或可释放地附接到传感器电子装置。例如，连续分析物传感器138可以通过传感器载体而附接到传感器电子装置112，所述传感器载体将分析物传感器138与传感器电子装置机械且电介接。传感器电子装置112、药物输送泵102和/或血糖仪104可以与一个或多个装置(如显示装置114、116、118和/或120)耦接。
在一些示例实施方案中，系统100可以包含基于云的分析物处理器490，所述分析物处理器被配置成分析通过网络409(例如，通过有线网络、无线网络或其组合)从传感器系统101以及与宿主(也称为患者)相关联的其它装置(如显示装置114、116、118和/或120等)提供的分析物数据(和/或其它患者相关数据)，并生成报告，所述报告提供关于一定时间范围内的所测量的分析物的高级信息(如统计数据)。关于使用基于云的分析物处理系统的充分论述可以在作为美国专利申请公开第2013/0325352号公开的题为“分析物数据的基于云的处理”并且于2013年3月7日提交的美国专利申请第13/788,375号中找到，所述美国专利申请通过引用整体并入本文中。在一些实施方案中，工厂校准算法的一个或多个步骤可以是在云中执行。
在一些示例实施方案中，传感器电子装置112可以包含与测量和处理由分析物传感器138生成的数据相关联的电子电路系统。此所生成的分析物传感器数据还可以包含可以用于处理和校准分析物传感器数据的算法，但是这些算法也可以按其它方式提供。传感器电子装置112可以包含硬件、固件、软件或其组合，以通过分析物传感器(如葡萄糖传感器)而提供分析物的水平的测量。下文参照图2来进一步描述传感器电子装置112的示例实施方案。
在一个实施方案中，本文所述的工厂校准算法可以由传感器电子装置执行。
如上所述，传感器电子装置112可以与一个或多个装置(如显示装置114、116、118和/或120)耦接(例如，无线地，等等)。显示装置114、116、118和/或120可以被配置用于呈现信息(和/或警报)，如由传感器电子装置112发射的传感器信息，以在显示装置114、116、118和/或120处显示。
在一个实施方案中，本文所述的工厂校准算法可以至少部分由显示装置执行。
在一些示例实施方案中，相对小的密钥卡类显示装置114可以包括腕表、腰带、项链、吊坠、珠宝、粘合片、传呼机、密钥卡、塑料卡(例如，信用卡)、标识(ID)卡等。此小型显示装置114可以包含相对小的显示器(例如，比大型显示装置116小)，并且可以被配置成显示某些类型的可显示传感器信息，如，数值、箭头或颜色代码。
在一些示例实施方案中，相对大的手持式显示装置116可以包括手持式接收器装置、掌上电脑等。此大型显示装置可以包含相对较大的显示器(例如，比小型显示装置114大)，并且可以被配置成显示信息，如传感器数据(包含由传感器系统100输出的当前和历史传感器数据)的图形表示。
在一些示例实施方案中，分析物传感器138可以包括葡萄糖传感器，所述葡萄糖传感器被配置成使用一种或多种测量技术(如酶促技术、化学技术、物理技术、电化学技术、分光光度技术、偏振技术、量热技术、离子电渗技术、辐射测量技术、免疫化学技术等)来测量血液或间质液中的葡萄糖。在分析物传感器138包含葡萄糖传感器的实施方案中，葡萄糖传感器可以包括能够测量葡萄糖浓度的任何装置，并且可以使用测量葡萄糖的各种技术(包含有创、微创和无创感测技术(例如，荧光监测))，以提供指示宿主体内的葡萄糖浓度的数据，例如，数据流。数据流可以是传感器数据(原始数据和/或经筛选数据)，所述传感器数据可以转换为用于向宿主(如用户、患者)或看护者(例如，父母、亲戚、监护人、教师、医生、护士或关心宿主健康的任何其他个人)提供葡萄糖值的经校准数据流。此外，分析物传感器138可以作为以下类型的分析物传感器中的至少一种而植入：可植入葡萄糖传感器、经皮葡萄糖传感器(植入在宿主血管中或体外)、皮下传感器、可重新填充的皮下传感器、血管内传感器。
虽然本公开在本文中表示包含包括葡萄糖传感器的分析物传感器138的一些实施方案，但分析物传感器138也可以包括其它类型的分析物传感器。此外，虽然一些实施方案将葡萄糖传感器称为可植入葡萄糖传感器，但是也可以使用能够检测葡萄糖浓度并提供代表葡萄糖浓度的输出信号的其它类型的装置。此外，虽然本说明书在本文中将葡萄糖称为正测量、处理等的分析物，但也可以使用其它分析物，例如包含酮体(例如，丙酮、乙酰乙酸和β-羟基丁酸、乳酸等)、胰高血糖素、乙酰辅酶A、甘油三酯、脂肪酸、柠檬酸循环中的中间体、胆碱、胰岛素、皮质醇、睾酮等。
在一些制造系统中，传感器138被手动分类、放置并保持在固定装置中。这些固定装置针对各种处理步骤(包含介接用于测试和校准操作的电测量设备)在生产过程期间在站间被手动移动。然而，手动处置传感器可能效率低下，可能因不理想的机械连接和电连接而导致延误，并可能对传感器和/或测试和校准设备造成损害，并可能导致传感器的可变性，所述可变性导致在制造过程中收集到不准确的验证数据。此外，将传感器138与传感器电子装置112一起封装到可穿戴装置中的过程涉及对传感器的进一步手动操纵，这可能损坏传感器138。
本文所述的各种系统、装置和方法帮助减少或消除与传感器的手动互动。例如，可提供预连接传感器，所述预连接传感器包含传感器互连或传感器载体，所述传感器互连或传感器载体电耦接到传感器电极并具有被配置成与可穿戴电子装置、自动化设备精确介接和/或鲁棒地连接到测量设备的机械特征和电特征。
与每个传感器相关联的标识和其它数据可以存储在传感器载体上，以用于在制造、测试、校准和体内操作期间对每个传感器进行记录和跟踪。在进行测试和校准操作之后，传感器载体可以用于按被密封且在电气上鲁棒的布置将传感器连接到可穿戴装置的传感器电子装置，如，皮肤上传感器组合件。
图2描绘了根据一些示例实施方案的电子装置112的实例，所述电子装置可以用于传感器电子装置112中或者可以实施在制造站(如测试站、校准站、智能载体或在装置101的制造期间使用的其它设备)中。传感器电子装置112可以包含电子组件，所述电子组件被配置成处理传感器信息(如传感器数据)，并例如通过处理器模块而生成经变换传感器数据和可显示传感器信息。例如，处理器模块可以将传感器数据变换为以下中的一种或几种：经筛选传感器数据(例如，一个或多个经筛选分析物浓度值)、原始传感器数据、经校准传感器数据(例如，一个或多个经校准分析物浓度值)、改变速率信息、趋势信息、加速/减速速率信息、传感器诊断信息、位置信息、警报/警告信息、如可由如本文所公开的工厂校准算法、传感器数据的平滑和/或筛选算法确定的校准信息等。
在一些实施例中，处理器模块214被配置成实现数据处理(包含与工厂校准相关的数据处理)的可观部分(如果不是全部)。处理器模块214可以与传感器电子装置112成整体和/或可以远程定位，例如，位于装置114、116、118和/或120和/或云490中的一个或多个中。例如，在一些实施例中，处理器模块214可以至少部分位于网络409中的基于云的分析物处理器490或别处内。
在一些示例实施方案中，处理器模块214可以被配置成校准传感器数据，并且数据存储存储器220可以将经校准传感器数据点作为经变换传感器数据存储。此外，在一些示例实施方案中，处理器模块214可以被配置成从显示装置(如装置114、116、118和/或120)无线接收校准信息，以实现来自传感器138的传感器数据的校准。此外，处理器模块214可以被配置成对传感器数据(例如，经校准和/或经筛选的数据和/或其它传感器信息)执行额外算法处理，并且数据存储存储器220可以被配置成存储与算法相关联的经变换传感器数据和/或传感器诊断信息。处理器模块214可以被进一步配置成存储和使用从工厂校准确定的校准信息，如下所述。
在一些示例实施方案中，传感器电子装置112可以包括耦接到用户接口222的专用集成电路(ASIC)205。ASIC 205可以进一步包含恒电位仪210、用于将数据从传感器电子装置112发射到一个或多个装置(如装置114、116、118和/或120)的遥测模块232和/或用于信号处理和数据存储的其它组件(例如，处理器模块214和数据存储存储器220)。虽然图2描绘了ASIC 205，但也可使用其它类型的电路，包含现场可编程门阵列(FPGA)、被配置成提供由传感器电子装置12执行的处理中的一些(如果不是全部)的一个或多个微处理器、模拟电路、数字电路或其组合。
在图2所描绘的实例中，通过传感器数据的第一输入端口211，恒电位仪210耦接到分析物传感器138(如葡萄糖传感器)，以从分析物生成传感器数据。恒电位仪210可以耦接到形成传感器138的一部分的工作电极211和参考电极212。恒电位仪可以向分析物传感器138的电极211、212之一提供电压，以将用于测量指示宿主体内的分析物浓度的值(例如，电流)的传感器(也称为传感器的模拟部分)偏压。恒电位仪210可以取决于并入到分析物传感器138中的电极(如作为第三电极的反电极)的数量而具有到传感器138的一个或多个连接。
在一些示例实施方案中，恒电位仪210可以包含将来自传感器138的电流值转化为电压值的电阻器，而在一些实施示例实施方案中，电流/频率转换器(未示出)还可以被配置成使用例如电荷计数装置而将来自传感器138的所测量的电流值连续积分。在一些示例实施方案中，模/数转换器(未示出)可以将来自传感器138的模拟信号数字化成所谓的“计数”，以允许由处理器模块214处理。所得的计数可以与恒电位仪210所测量的电流直接相关，所述恒电位仪可以与宿主体内的分析物水平(如葡萄糖水平)直接相关。
遥测模块232可以可操作地连接到处理器模块214，并且可以提供在传感器电子装置112与一个或多个其它装置(如显示装置、处理器、网络访问装置等)之间实现无线通信的硬件、固件和/或软件。可以在遥测模块232中实施的各种无线电技术包含蓝牙、低能耗蓝牙、ANT、ANT+、ZigBee、IEEE 802.11、IEEE 802.16、蜂窝无线电接入技术、射频(RF)、红外(IR)、寻呼网络通信、磁感应、卫星数据通信、扩频通信、跳频通信、近场通信等。在一些示例实施方案中，遥测模块232包括蓝牙芯片，但是蓝牙技术也可以实施在遥测模块232和处理器模块214的组合中。
处理器模块214可以控制由传感器电子装置112执行的处理。例如，处理器模块214可以被配置成处理来自传感器的数据(例如，计数)，筛选数据，校准数据，执行故障-安全检查等。
恒电位仪210可以例如使用电流/电压或电流/频率转换器而按离散时间间隔或连续地测量分析物(例如，葡萄糖等)。
处理器模块214可以进一步包含数据发生器(未示出)，所述数据发生器被配置成生成用于发射到装置(如显示装置114、116、118和/或120)的数据包。此外，处理器模块214可以生成用于通过遥测模块232发射到这些外部源的数据包。在一些示例实施方案中，数据包可以包含传感器和/或传感器电子装置112的标识码、原始数据、经筛选数据、经校准数据、改变速率信息、趋势信息、错误检测或校正等。
处理器模块214还可以包含程序存储器216和其它存储器218。处理器模块214可以耦接到通信接口(如通信端口238)和电源(如电池234)。此外，电池234可以进一步耦接到电池充电器和/或调节器236，以向传感器电子装置112供电和/或对电池234充电。
程序存储器216可以实施为用于存储数据(如所耦接的传感器138的标识符(例如，传感器标识符(ID)))并用于存储配置ASIC 205以执行本文所述的一个或多个操作/功能的代码(也称为程序代码)的半静态存储器。例如，程序代码可以配置处理器模块214以处理数据流或计数，筛选，执行下文所述的校准方法，执行故障-安全检查等等。
存储器218也可以用于存储信息。例如，包含存储器218的处理器模块214可以用作系统的高速缓存存储器，其中为最近从传感器接收的传感器数据提供了临时存储器。在一些示例实施方案中，存储器可以包括存储器存储组件，如，只读存储器(ROM)、随机存取存储器(RAM)、动态RAM、静态RAM、非静态RAM、电可擦除可编程只读存储器(EEPROM)、可重写ROM、闪存等。
数据存储存储器220可以耦接到处理器模块214，并且可以被配置成存储各种传感器信息。在一些示例实施方案中，数据存储存储器220存储一天或多天的分析物传感器数据。所存储的传感器信息可以包含以下中的一个或多个：时间戳、原始传感器数据(一个或多个原始分析物浓度值)、经校准数据、经筛选数据、经变换传感器数据和/或任何其它可显示传感器信息、校准信息(例如，如来自工厂校准的参考BG值和/或先前校准信息)、传感器诊断信息等。
用户接口222可以包含各种接口，如一个或多个按钮224、液晶显示器(LCD)226、振动器228、音频换能器(例如，扬声器)230、背光(未示出)等。包括用户接口222的组件可以提供与用户(例如，宿主)互动的控件。
电池234可以操作性地连接到处理器模块214(以及可能传感器电子装置12的其它组件)，并提供传感器电子装置112的必要电力。在其它实施方案中，接收器可以例如通过感应耦合来经皮供电。
电池充电器和/或调节器236可以被配置成从内部和/或外部充电器接收能量。在一些示例实施方案中，电池234(或电池组)被配置成通过感应和/或无线充电板来充电，但是也可以使用任何其它充电和/或电力机制。
可以设置一个或多个通信端口238(也称为一个或多个外部连接器)以实现与其它装置的通信，例如，可以设置PC通信(com)端口以实现与和传感器电子装置112分离或成整体的系统的通信。例如，通信端口可以包括串行(例如，通用串行总线或“USB”)通信端口，并允许与另一计算机系统(例如，PC、个人数字助理或“PDA”、服务器等)通信。在某些示例实施方案中，工厂信息可以从传感器或云数据源发送到算法。
一个或多个通信端口238可以进一步包含：输入端口237，其中可接收校准数据；以及输出端口239，所述输出端口可以用于将经校准数据或将校准数据发射到接收器或移动装置。图2示意性地展示了这些方面。应理解，端口可以在物理上分离，但在替代实施方案中，单个通信端口可以提供第二个输入端口与输出端口两者的功能。
在一些分析物传感器系统中，传感器电子装置的皮肤上部分可以简化，以将皮肤上电子装置的复杂性和/或大小最小化，例如，仅向被配置成运行校准和显示传感器数据所需的其它算法的显示装置提供原始的、经校准的和/或经筛选的数据。然而，传感器电子装置112(例如，通过处理器模块214)可以被实施成执行用于生成经变换传感器数据和/或可显示传感器信息的预期算法，例如包含进行以下的算法：评估参考和/或传感器数据的临床可接受性，基于入选准则而评估校准数据以进行最佳校准，评估校准的质量，比较所估计的分析物值与时间对应所测量分析物值，分析所估计的分析物值的变化，评估传感器和/或传感器数据的稳定性，检测信号伪像(噪声)，替换信号伪像，确定传感器数据的改变速率和/或趋势，执行动态且智能的分析物值估计，对传感器和/或传感器数据执行诊断，设置操作模式，评估数据的异常等。
图3A、3B和3C展示了实施为可穿戴装置的分析物传感器系统101的示例性实施方案，如皮肤上传感器组合件600。如图3所示，皮肤上传感器组合件包括壳体128。粘合片126可以将壳体128耦接到宿主的皮肤。粘合剂126可以是接合到载体衬底(例如，水刺聚酯、聚氨酯膜或其它适当类型)以进行皮肤附接的压敏粘合剂(例如，丙烯酸系类型、基于橡胶的类型或其它适当类型)。壳体128可以包含贯穿孔180，所述贯穿孔与用于将传感器138植入在对象的皮肤之下的传感器插入装置(未示出)合作。
可穿戴传感器组合件600可以包含可操作以测量和/或分析由葡萄糖传感器138感测的葡萄糖指示符的传感器电子装置112。传感器组合件600内的传感器电子装置112可以将信息(例如，测量数据、分析数据和葡萄糖数据)发射到远程设备(例如，图1所示的114、116、118、120)。如图3C所示，在此实施方案中，传感器138从其远端延伸到贯穿孔180，并被引导到壳体128内的电子模块135。工作电极211和参考电极212连接到包含恒电位仪的电子模块135中的电路。
图3D展示了分析物传感器138的一个示例性实施例，所述分析物传感器包含细长主体部分。细长主体部分可以又长又细，但柔软而坚固。例如，在一些实施例中，细长导电主体的最小尺寸小于约0.1英寸、0.075英寸、0.05英寸、0.025英寸、0.01英寸、0.004英寸或0.002英寸。虽然本文中将细长导电主体说明为具有圆形横截面，但在其它实施例中，细长导电主体的横截面可以是卵形、矩形、三角形或多面体、星形、C形、T形、X形、Y形、不规则形状等。
在图3D的实施方案中，分析物传感器138包括导线芯139。在传感器138的远端体内部分处，导线芯139形成电极211a。在传感器138的近端体外部分处，导线芯139形成触点211b。随着导线芯139沿着传感器138的细长主体部分延伸，电极211a和触点211b在所述导线芯的长度上电连通。导线芯可以由单一材料(如铂或钽)制成，或者可以形成为多层，如，导电材料或具有不同导电材料的外涂层的非导电材料。
层104围绕导线芯139的至少一部分。层104可以由绝缘材料形成，如，聚酰亚胺、聚氨酯、聚对二甲苯或任何其它已知的绝缘材料。例如，在一个实施例中，层104安置在导线芯139上，并被配置成使得电极211a通过窗口106暴露。
在一些实施例中，传感器138进一步包括如包括导电材料的套筒而围绕绝缘层104的层141。在传感器138的远端体内部分处，套筒层141形成电极212a。在传感器138的近端体外部分处，套筒层141形成触点212b。随着套筒层141沿着传感器138的细长主体部分延伸，电极212a和触点212b在所述套筒层的长度上电连通。此套筒层141可由涂覆到绝缘层104上的含银材料形成。含银材料可以包含各种材料中的任一种，并呈各种形式，如，Ag/AgCl聚合物膏、涂料、基于聚合物的导电混合物和/或市场上可购得的墨水。此层141可以使用粘贴/浸渍/涂覆步骤(例如，使用模具计量的浸涂过程)来处理。在一个示例性实施例中，Ag/AgCl聚合物膏通过以下方式而涂覆到细长主体：对主体浸涂(例如，使用弯月面涂覆技术)，并且接着牵拉主体穿过模具，以将涂层计量到精确厚度。在一些实施例中，多个涂覆步骤用于将涂层累积到预定厚度。
图3D所示的传感器138还包含覆盖传感器138的远端体内部分的至少一部分的膜108。此膜通常由多个层形成，所述多个层可以包含干涉域、酶域、扩散阻力域和生物保护域中的一个或多个。此膜对于支持实现分析物检测的电化学过程重要，并且通常通过浸涂、喷涂或其它制造步骤来精心制造。优选地，从形成膜108之时到将传感器138的远端体内部分植入到对象中之时，传感器138的远端体内部分所经受的处置要尽可能少。在一些实施例中，电极211a形成电化学测量系统的工作电极，电极212a形成此系统的参考电极。在使用中，两个电极可以植入到宿主中，以便进行分析物监测。
虽然上文描述特别适用于同轴导线型结构，但本文中的实施例也适用于电极的其它物理配置。例如，两个电极211a和212a可以附连到平面衬底(如较薄的平坦聚合物柔性电路)的细长柔性条带的远端体内部分上。两个触点211b和212b可以附连到此柔性平面衬底的近端体外部分。电极211a、212a可以电连接到其在平面衬底上的相应触点211b、212b(电路迹线)。在这种情况下，电极211a、212a和触点211b、212b可以在平坦表面上彼此邻近，而不是如图3D所示那样是同轴的。
图3D还示出了触点211b和触点212b电耦接到简单的基于电流/电压转换器的恒电位仪210。恒电位仪包含电池320，所述电池的输出耦接到运算放大器322的输入。运算放大器322的输出耦接到触点324，所述触点通过电阻器328而电耦接到工作电极触点211b。放大器322将触点324偏压到电池电压Vb，并将驱动维持此偏压所需的电流im。此电流将从工作电极211a流经围绕传感器138的间质液并流向参考电极212a。参考电极触点212b电耦接到连接到电池320的另一侧的另一触点334。对于此电路来说，电流im等于(Vb-Vm)/R，其中Vm是放大器322的输出处测量的电压。针对工作电极211a上的给定偏压的此电流的大小是窗口106附近的分析物浓度的测度。
触点324和334通常是电路板上的导电垫/迹线。在测试期间，此板的表面上，始终有某一电平的寄生泄漏电流ip。如果可能，则由于分析物，泄漏电流不应形成电流的测量的一部分。为了减小此泄漏电流对所测量的电流的影响，可以在偏压触点324与直接连接到电池输出的返回触点334之间提供任选的额外垫/迹线336。此任选的额外导电垫/迹线可以称为“保护迹线”。因为它们保持在相同电位，所以偏压触点324和保护迹线336将基本上不会有泄漏电流。此外，保护迹线336到返回触点334的泄漏电流不会穿过放大器输出电阻器328，并且因此不会包含在测量中。保护迹线的其它方面和实施方案可以在美国专利公开2017/0281092的第[0128]和[0129]段中找到，这些段落通过引用并入本文中。
在制造过程期间，对传感器138执行各种涂覆、测试、校准和组装操作。然而，可能难以运输个别传感器并将传感器与多个测试和校准设备设施电介接。这些过程还会使传感器因处置而受到损坏。为了帮助解决这些问题，传感器138可以作为预连接传感器的一部分提供，所述预连接传感器包含下文更详细描述的传感器载体。
图4A示出了预连接传感器400的示意图。如图4A所示，预连接传感器400包含永久附接到传感器138的传感器载体402。在图4A的实例中，传感器载体402包含中间体，如衬底404，并且还包含一个或多个触点，如第一内部触点406和第二内部触点408。第一内部触点406电耦接到传感器138的近端上的第一触点，并且接触内部触点408电耦接到传感器138的近端上的第二触点。传感器138的远端是被配置用于插入到宿主的皮肤中的自由端。在一些实施方案中，例如，触点406和408可以对应于图3D的触点324和334。
如图4A所示，第一内部触点406可以电耦接到第一外部触点410，并且第二内部触点408可以电耦接到第二外部触点412。如下文进一步详细地描述，外部触点410和412可以被配置成与可穿戴装置600中的传感器电子装置112电介接。此外，外部触点410和412可以被配置成与制造设备(如一个或多个测试站和/或一个或多个校准站)的处理电路系统电介接。虽然本文中描述传感器载体上的两个外部触点410和412耦接到传感器138上的两个对应触点的各种实例，但这只是说明性的。在其它实施方案中，传感器载体402和传感器138可以各自具备单个触点，或者可以各自具备两个以上触点，例如，传感器载体的任何N个外部触点(例如，两个以上外部触点410和412)以及传感器138的任何M个触点(例如，两个以上触点406和408)，这些触点可以被耦接。在一些实施方案中，传感器载体402和传感器138可以具有相同数量的触点(即，N＝M)。在一些实施方案中，传感器载体402和传感器138可以具有不同数量的触点(即，N≠M)。例如，在一些实施方案中，传感器载体402可以具有用于耦接到制造站的各种组件或在它们之间耦接的额外触点。
如下文进一步详细地描述，衬底404可以被配置成与可穿戴装置600中的传感器电子装置112耦接。在一些实施例中，衬底404可以被设定大小和形状以与壳体128机械介接，并与壳体128内的传感器电子装置112电介接。此外，衬底404可以被设定大小和形状以与制造设备、组装设备、测试站和/或一个或多个校准站机械介接。如下文进一步详细地描述，传感器载体402可以附接和/或电耦接到传感器138。传感器138可以通过例如使用以下方式永久耦接到传感器载体402的组件(例如，衬底404)：粘合剂(例如，UV固化、湿气固化、多部分活化、热固化、热熔胶等)，包含导电粘合剂(例如，碳填充、碳纳米管填充、银填充、导电添加剂等)、导电墨水、弹簧触点、夹、经缠绕柔性电路、导电聚合物(例如，导电弹性体、导电塑料、碳填充的PLA、导电石墨烯PLA)、导电泡沫、导电织物、桶状连接器、模制互连装置结构、缝纫、绕线、导线接合、导线穿线、点焊、型锻、压接、装订、裁剪、锡焊或钎焊、塑料焊接或包覆模制。在一些实施例中，在组装、制造、测试和/或校准操作之前或期间，传感器138可以通过铆钉、磁体、各向异性导电膜、金属箔或其它适当结构或材料永久地耦接到衬底404，以将传感器载体402机械且电附接到传感器138。在一些实施例中，传感器载体402可以在传感器138周围3-D打印，以形成预连接传感器400。此外，传感器载体402可以包含基准特征430(有时称为基准结构)，如，凹部、开口、表面或凸出部，以用于将传感器138相对于传感器载体402对齐、定位和定向。传感器载体402还可以包含或可以自身形成一个或多个锚定特征，以用于在制造期间(例如，相对于制造站)固定并对齐分析物传感器。此外，传感器载体402可以包含被配置成标识传感器的标识符450。在一些实施例中，标识符450形成在衬底404上。下文将进一步解释标识符450。
图4B展示了预连接分析物传感器400的另一示意图。图4B所示的预连接分析物传感器400可以包含图4A所示的预连接分析物传感器400的类似组件。为了清楚起见，图4B被示出为没有任选盖460。图4C展示了图4B所示的预连接分析物传感器400的分解图。
在图4B的实例中，传感器载体402包含中间体，如衬底404，并且还包含一个或多个迹线，如第一迹线414和第二迹线416。第一迹线414可以包含第一内部触点406和第一外部触点410。第二迹线416可以包含第二内部触点408和第二外部触点412。在一些实施例中，第一内部触点406电耦接到传感器138的近端上的第一触点，并且第二内部触点408电耦接到传感器138的近端上的第二触点。传感器138的远端是被配置用于插入到宿主的皮肤中的自由端。结合本文中的各种实施例而描述电耦接器，如，夹、导电粘合剂、导电聚合物、导电墨水、金属箔、导电泡沫、导电织物、绕线、导线穿线或任何其它适当方法。在一些实施例中，非导电粘合剂426(例如，环氧树脂、氰基丙烯酸酯、丙烯酸系材料、橡胶、氨酯、热熔胶等)可以用于将传感器138附接到衬底404。非导电粘合剂426可以被配置成对传感器138进行附连、密封、绝缘或将应变消除提供给所述传感器。传感器138可以通过其它方法(如上文图4A所述的方法)而附接到衬底404。
如图4C所示，压敏粘合剂428可以被配置成隔离迹线414和416的暴露端。例如，压敏粘合剂428可以将传感器138层压在衬底404与盖460之间。在这类情况下，传感器138、衬底404、压敏粘合剂428和盖460可以形成层压配置。在层压配置中，传感器138和其到一个或多个触点(例如，第一内部触点406和第二内部触点408)的连接与一个或多个暴露触点(例如，第一外部触点410和第二外部触点412)隔离。此外，层压配置可以产生围绕传感器138的湿气密封区域。湿气密封可以如由压敏粘合剂428和非导电粘合剂426的组合所体现而产生。在其它实施例中，层压结构可以通过以下材料和方法中的一种或组合产生：非导电粘合剂、压敏粘合带、弹性体、热接合、热板焊接、激光焊接、超声焊接、RF焊接或任何适当类型的层压方法。盖460可以由至少部分覆盖衬底404的聚合物片、结构或膜组成。盖460可以任选地含有可以标识传感器138的标识符450。在一些实施例中，标识符450可以并有各种标识协议或技术，如但不限于NFC、RFID、QR码、条码、Wi-Fi、可调电阻器、电容值、阻抗值、ROM、存储器、IC、闪存等。
作为任选组件的导引固定装置420是与工作站(如测试站、校准站、组装站、涂覆站、制造站)的接口的示例性实施例，或作为可穿戴组合件的一部分。导引固定装置420包含基准特征(或基准结构)430，如凹部、开口、表面或凸出部，以用于将传感器138相对于传感器载体402对齐、定位和定向。基准特征430可以用于制造过程中，并用于组装到可穿戴电子组件中。在一些实施例中，基准特征430是被配置成与衬底404的对应基准特征432对齐的升高凸出部。衬底404的对应基准特征432可以将切口、狭槽、孔或凹部作为特征。传感器载体中的对应基准特征432可以是与工作站(如测试站、校准站、组装站、涂覆站或其它制造站)中的基准特征430介接的放置特征。导引固定装置420可以被配置成确保传感器载体402的适当放置，以使暴露的外部触点410和412对齐，以用于连接到工作站(如测试站、校准站、组装站、涂覆站或其它制造站)。在其它实施例中，基准特征430可以由阴型特征组成以与对应阳型基准特征432接合。
图4D展示了预连接分析物传感器400的阵列480的示意图，所述阵列具有带有任选标识符450的多个预连接传感器400。在图4D中，示出了作为预连接分析物传感器400的一维条带形成的阵列，但也可以植入二维阵列。在一些实施例中，预连接分析物传感器阵列480可以安置在盒中。所述多个预连接传感器400中的每个预连接传感器都可以被单切。在一些实施例中，可以设置刻痕4020以促进单切为个别预连接传感器400。在一些实施例中，阵列480可以用于促进按顺序或随机方式个别地制造、测试和/或校准多个传感器138。在一些实施例中，阵列480可以用于促进同时制造、测试和/或校准多个传感器138。
图5A-5E示出了预连接分析物传感器400可以在植入前寿命期间与之相关联的各种机器和组合件的框图。这类机器和组合件可以包含制造设备，例如，一个或多个制造站5091、一个或多个测试站5002和/或一个或多个校准站5004以及皮肤上可穿戴组合件600。这些中的至少一些被配置成收纳传感器载体402，并通过传感器载体402而将机器和组合件通信耦接到传感器138。
一些实施例的一个方面是在附图上述膜108之前，传感器138耦接到传感器载体402。在传感器138附接到传感器载体的情况下，并可能多个载体安装的传感器如图4D所示附接在一起的情况下，随后的装置生产步骤(如膜涂覆、测试、校准和组装成可穿戴单元)可以在以下情况下得以执行：较容易安装到制造和测试设备和从其拆卸，较少的传感器处置，较低的损坏膜的机会，从而产生总体上明显的生产效率的提高。
预连接传感器构造的另一益处是，较容易在不同的设施之间分离不同种类的制造和测试设备，这些设施被较好地装备以处置这些设备。例如，制造电极可能需要各种种类的金属成形/挤压机，而膜涂覆、测试和校准则需要潮湿的化学实验室和灵敏的电子测试设备。因此，传感器电极可以在一个位置的设施中形成并安装在载体上，并且接着运送到不同远程设施，所述远程设施被配置用于膜涂覆、测试和校准。在此上下文中，远程不意味着位于同一建筑中的同一生产设施中。对于不同的商业实体来说，执行专门从事适当的制造和测试技术的不同任务可能甚至是有利的。
制造站5091可以包括如本文所述的测试站、如本文所述的校准站或另一制造站。制造站5091可以包含处理电路系统5092和/或机械组件5094，所述处理电路系统和/或机械组件可操作以执行测试操作、校准操作和/或其它制造操作，例如，传感器校直操作、膜涂覆操作、固化操作、校准检查操作、葡萄糖灵敏度操作(例如，灵敏度斜率、基线和/或噪声校准操作)和/或视觉检验操作。
预连接分析物传感器400可以连接到一个或多个测试站5002，所述测试站具有被配置成通过传感器138来执行测试操作以验证传感器138的操作完整性的处理电路系统5012。测试操作可以包含验证传感器138的电气性能，验证工作电极与触点408之间的通信，验证参考电极或额外电极与触点406之间的通信和/或传感器138的其它电子验证操作。处理电路系统5012可以通过以下方式与传感器138通信耦接来进行测试操作：将衬底404插入到插座5006(例如，测试站5002的壳体中的凹部)中，直到触点410耦接到测试站5002的触点5010并且触点412耦接到测试站5002的触点5008为止。
系统5000可以包含一个或多个校准站5004，所述校准站具有被配置成通过传感器138来执行校准操作以获得传感器138的体内操作的校准数据的处理电路系统5020。由校准设备5004获得的校准数据可以提供给皮肤上传感器组合件600，以在传感器138的体内操作期间使用。处理电路系统5020可以通过以下方式与传感器138通信耦接来进行校准操作：将衬底404插入到插座5014(例如，校准站5004的壳体中的凹部)中，直到触点410耦接到测试站5002的触点5018并且触点412耦接到测试站5002的触点5016为止。
在图5A-5E的实例中，测试站5002和校准站5004包含插座5006和5014。然而，这仅是说明性的，并且传感器载体402可以使用其它安装特征(如抓握、剪裁或夹紧特征)而安装到测试站5002、校准站5004和/或制造站5091。例如，制造站5091包含抓握结构5093和5095，其中至少一个抓握结构可移动以抓握传感器载体402(或具有多个传感器载体和传感器的载体)。结构5093可以是具有一个或多个电触点(如触点5008)的固定结构。结构5095可以是可移动的特征，所述可移动的特征移动(例如，在方向5097上滑动)以在制造站5091的电耦接位置中抓住并固定传感器载体402。在其它实施方案中，特征5093与5095两者是可移动的。
传感器载体402还可以包含标识符450(参见例如图4A-4D)。标识符450可以形成在衬底404上或嵌入在其中。标识符450可以实施为视觉或光学标识符(例如，在衬底404上预先打印或实时打印或蚀刻到衬底404中的条码或QR码)、射频(RF)标识符或电标识符(例如，可在测试和校准之前、期间或之后用标识符和/或其它数据编程的激光可调电阻器、电容标识符、电感标识符或微存储电路(例如，标识符被编码在标识符的存储器中的集成电路或其它电路))。标识符450可以用于在每个传感器的整个制造过程中跟踪此传感器(例如，通过存储每个传感器的测试和/或校准数据的历史)。换句话说，标识符450标识分析物传感器、分析物传感器的校准数据和分析物传感器的历史中的任一个。例如，标识符450可以用于测试和校准性能数据的分箱。标识符450可以是离散的原始值，或者可以除标识号之外对信息进行编码。标识符450可以用于将数据以数字方式存储在衬底404上的非易失性存储器中或作为用于在传感器载体402外部存储数据的参考数字来存储。
测试站5002可以包含读取标识符450以获得传感器138的唯一标识符的阅读器5011(例如，光学传感器、RF传感器或电接口，如集成电路接口)。由测试站5002获得的测试数据可以与传感器138的标识符一起存储和/或发射。
校准站5004可以包含读取标识符450以获得传感器138的唯一标识符的读取器5011(例如，光学传感器、RF传感器或电接口)。由校准站5004获得的校准数据可以与传感器138的标识符一起存储和/或发射。在一些实施方案中，由校准站5004获得的校准数据可以由校准站5004(例如，通过将校准数据编程到标识符中)添加到标识符450。在一些实施方案中，由校准站5004获得的校准数据可以由校准站连同标识符450一起发射到远程系统或装置。
如图5A-5E所示并且如果下文进一步详细地描述，皮肤上传感器组合件600可以包含一个或多个触点，如触点5022，所述触点被配置成将内部电子电路系统耦接到传感器载体402的触头410和412并因此耦接到传感器138。传感器载体402可以被设定大小和形状以固定在壳体128中或上的空腔5024内，使得传感器138通过传感器载体402耦接到壳体128中的电子装置，并且传感器138可以在位置上固定以从壳体128延伸以用于针对体内操作而插入。
虽然图5A-5E示出了一个校准站和一个测试站，但应了解，一个以上测试站和/或一个以上校准站可以用于生产的制造和测试阶段中。虽然校准站5004和测试站5002在图5A-5E中被示出为不同站，但应了解，在一些实施方案中，校准站和测试站可以组合为一个或多个校准/测试站(例如，用于执行测试和校准操作的处理电路系统设置在共同壳体内并耦接到单个接口5006的站)。
可穿戴组合件600还可以包含读取标识符450以获得传感器138的唯一标识符的读取器(例如，光学传感器、RF传感器或电接口)，所述读取器被定位成接近触点5022。传感器电子装置可以基于所读取的标识符450而获得传感器138的体内操作的校准数据。校准数据可以存储在标识符450自身中并从其获得，或者标识符450可以用于从远程系统(如基于云的系统)获得所安装的传感器138的校准数据。
图6-8是可穿戴组合件600内的预连接传感器400的固定的各种实施方案的示意图。在图6的实例中，传感器载体402与基壁605和壳体128直接接触，并且触点5022包含壳体128上的多个触点，所述触点用于接触传感器载体402的两个触点410与412(例如，两者位于传感器载体402的顶表面上)两者。在图7的实例中，机械收纳器700设置在基壁605上以用于机械固定传感器载体402。在图8的实例中，机械收纳器800设置在基壁605上以用于与接收器702合作而机械固定传感器载体402。在图8的实例中，接收器702包含用于接触位于传感器载体402的后表面上的传感器载体的触点410的额外触点704。
图9示出了传感器模块300的详细实例，所述传感器模块包含预连接传感器400和密封结构192。如图所示，密封结构192可以安置在衬底404上，其中密封结构192可以被配置成防止湿气朝向触点410和412侵入。此外，触点410和412可以实施为用于耦接到传感器电子装置的片弹簧触点。在一些实施例中，预连接传感器400包含至少一个触点。在一些实施例中，预连接传感器400包含至少两个触点。在一些实施例中，预连接传感器400包含至少三个触点。在一些实施例中，预连接传感器400包含至少四个触点。粘合剂126可以将壳体128耦接到宿主的皮肤130。粘合剂126可以是接合到载体衬底(例如，水刺聚酯、聚氨酯膜或其它适当类型)以进行皮肤附接的压敏粘合剂(例如，丙烯酸系类型、基于橡胶的类型或其它适当类型)。如图9所示，衬底404可以包含至少一个臂202或其它机械特征，所述至少一个臂或其它机械特征用于与基座128上的对应配合特征(例如，机械互锁，如卡扣配合、夹和/或干涉特征)介接，以将衬底404机械固定到壳体128。耦接特征(如臂902和/或衬底404的其它特征)可以被设定大小和形状，以用于将衬底404可释放地机械附接到与制造设备相关的连接器(如图5A-5E的连接器5006、5014和/或5093/5095中的一个或多个连接器)，以用于在制造期间以及附接到壳体128的特征900之前进行测试和/或校准操作。
图10展示了使用螺旋弹簧306而实施触点406和408的实施方案中的传感器模块400的透视图。在图10的实例中，衬底404上的凸出部308可以对齐传感器138并将弹簧306固定到衬底404。(为了提高图10的清晰度，并不是所有的凸出部308都被标记。)凸出部308可以向远端凸出部。
至少三个、至少四个和/或少于十个凸出部308可以被配置成接触弹簧306的周边。凸出部308可以由间隙分离。随着弹簧306插入在凸出部308之间，间隙使凸出部308能够向外挠曲。用于将电子装置单元500耦接到基座128的向下的力可以推动弹簧306而靠到传感器138上，以使弹簧306电耦接到传感器138。传感器138可以在凸出部308中的至少两个之间行进。测试站5002和/或校准站5004也可具有配合连接器结构，当衬底404插入到凹部5006或5014中时，所述配合连接器结构压缩弹簧306以将弹簧306电耦接在传感器138和处理电路系统5012或5020之间。
传感器138可以包含被配置用于皮下感测的远端部分138a和机械耦接到传感器载体402的近端部分138b，具有机械耦接到衬底404并电耦接到近端部分138b的电互连(例如，弹簧306)。弹簧306可以是圆锥弹簧、螺旋弹簧或本文所述或适用于电连接的任何其它类型的弹簧。
衬底404可以具有基座部分312，所述基座部分包含位于弹簧306周围的至少两个近端凸出部308。近端突出308被配置成帮助将弹簧306定向。葡萄糖传感器138的区段位于近端凸出部308(在弹簧306远端)之间。
基座部分312可以被配置成机械耦接到壳体128、制造设备5091、测试设备5002和/或校准设备5004。例如，基座部分312包含锚定特征，如臂202。锚定特征可以包含臂202和/或可以包含如基座312、臂202和/或衬底404中的一个或多个凹口、凹部、凸出部或其它特征的特征，这些特征与例如插座(如图5A-5E的5014的插座5006之一)或由夹持连接器特征(如图5A-5E的特征5093和5095)形成的夹持连接器的对应特征机械介接以固定并对齐传感器138。在一个适当实例中，可滑动的(或者以其它方式可操作的或可旋转的)特征(如图5A-5E的特征5095)可以被布置成一起在臂202、基座312和/或传感器载体402中的一个或多个上方、周围滑动或以其它方式与其接合，以将传感器载体402固定到制造设备。例如，在未提供臂202的传感器载体402的其它实施方案中，插座连接器(如图5A-5E的5014的插座5006之一)或由夹持连接器特征(如图5A-5E的特征5093和5095)形成的夹持连接器可以包含翻盖组件、滑动组件或其它可移动组件，这些组件支承在传感器载体402上或覆盖所述传感器载体，以将传感器载体402闩锁到制造、测试和/或校准设备。
现参照图11和12，示出了传感器模块400的另一实施方案，所述传感器模块包含：基座部分312d；葡萄糖传感器138，所述葡萄糖传感器具有被配置用于皮下感测的远端部分138a以及机械耦接到基座部分312d的近端部分138b；以及机械耦接到衬底404并电耦接到近端部分138b的电互连(例如，片弹簧306d)。片弹簧306d可以被配置成在预连接传感器400安置在与基座128耦接的电子装置单元500之间时，响应于来自测试站触点、校准站触点和/或与基座128耦接的电子装置单元500的压力而弯曲。
如本文所使用，悬臂弹簧是一种类型的片弹簧。如本文所使用，片弹簧可以由许多弯曲金属条带制成，这些条带相互叠加地被保持在一起。如本文所使用，在许多实施例中，片弹簧仅包含一个弯曲金属条带(例如，一层)(而不是多层弯曲金属)。例如，图11中的片弹簧306d可以由一层金属或多层金属制成。在一些实施例中，片弹簧包含在一端固定的一层扁平金属(使得片弹簧是悬臂弹簧)。
如图11和12所示，基座部分312d包含近端凸出部320d，所述近端凸出部具有近端部分138b的至少一部分位于其中的通道322d。通道322d定位近端部分138b的第一区域，使得所述区域电耦接到片弹簧306d。
如图12的横截面透视图所示，片弹簧306d远离第一区域弯曲，并且向近端凸出部，以与测试站5002、校准站5004和/或可穿戴组合件600电耦接。片弹簧306d的至少一部分形成“W”形。片弹簧306d的至少一部分形成“C”形。片弹簧306d在近端凸出部320d周围弯曲。片弹簧306d向近端凸出部以电耦接测试站5002、校准站5004和/或电子装置单元500。密封件192被配置成阻止流体侵入片弹簧306d。
片弹簧306d被定向成使得将传感器载体402耦接到测试站5002、校准站5004和/或电子装置单元500按压片弹簧306d而靠在测试站5002、校准站5004和/或电子装置单元500的第一电触点以及葡萄糖传感器138的第二电触点上，以将葡萄糖传感器138电耦接到测试站5002、校准站5004和/或电子装置单元500。密封件192的近端高度可以大于片弹簧306d的近端高度，使得测试站5002、校准站5004和/或电子装置单元500在接触片弹簧306d之前接触密封件192。如图所示，弹簧306和/或片弹簧306d可以与衬底404上的基础特征(例如，特征308)和/或通道322d合作，以形成基准特征，所述基准特征将传感器138相对于传感器载体402固定和对齐(例如，针对制造、校准、测试和/或体内操作)。
图13A和13B示出了包含预连接传感器400的可穿戴组合件600的实施例的透视图。可穿戴组合件600可以包含传感器电子装置和粘合片(未示出)。预连接传感器400可以包含传感器载体，如，图4A-4D所示的传感器载体402。传感器载体402可以放置在壳体128中或上。壳体128可以由两个壳体组件构成，即，顶部壳体520和底部壳体522。顶部壳体520和底部壳体522可以组装在一起以形成壳体128。顶部壳体520和底部壳体522可以被密封以防止湿气侵入壳体128的内部空腔。密封壳体可以包含密封材料(例如，环氧树脂、硅胶、氨酯或其它适当材料)。在其它实施例中，壳体128形成为单个组件包封料(例如，环氧树脂)，所述组件包封料被配置成容纳传感器载体402和传感器电子装置。图13A展示了顶部壳体520内的孔隙524，所述孔隙被配置成允许插入组件(例如，皮下注射针、C形针、V形针、侧开口针等)穿过可穿戴组合件600以进行插入和/或缩回。孔隙524可以与底部壳体522中的对应孔隙对齐。在其它实施例中，孔隙524可以延伸穿过壳体128的偏心位置。在其它实施例中，孔隙524可以延伸穿过壳体128的边缘，从而形成C形通道。在一些实施例中，孔隙524包含密封材料，如，凝胶、粘合剂、弹性体或位于孔隙524内的其它适当材料。
图13B示出了可穿戴组合件600的底部的透视图。如图所示，预连接传感器400可以安置在壳体128内。预连接传感器400可以安装在底部壳体522的孔隙526内。如图所示，传感器138可以从孔隙526延伸出。孔隙526可以被设定大小和形状以保持预连接传感器400。此外，孔隙526可以被设定大小和形状以保持预连接传感器400，其中传感器138大致上平行于皮肤表面延伸，并形成90度的弯头以用于插入到皮肤中。应理解，底部壳体522的底表面可以含有用于将可穿戴组合件粘合到用户的皮肤表面的附接构件(例如，粘合片)。
图13C示出了可穿戴组合件600的分解图。各种电子组件(如图2所示的恒电位仪210和其它组件)可以安装在电子组合件衬底530(通常是某种形式的印刷电路板)上或安装到所述电子组合件衬底。预期传感器载体402具有与电子组合件衬底530的电耦接。各种方法可以用于在预连接传感器400的一个或多个触点(如外部触点410和412)与电子组合件衬底530之间建立电连接(例如，销、焊料、导电弹性体、导电粘合剂等)。传感器载体402可以被配置成通过底部壳体522而与电子组合件衬底530介接。在其它实施方案中，传感器载体402可以被配置成通过顶部壳体520而与电子组合件衬底530介接。在一些其它实施方案中，传感器载体402被配置成通过可穿戴组合件600的侧面而与电子组合件衬底530介接。如图所示，任选的密封构件528可以被配置成使传感器载体402的至少一部分绝缘而免受潜在的湿气侵入。在一些情况下，密封构件528可以是所分配的液体(例如，粘合剂、凝胶)或固体材料(例如，弹性体、聚合物)。密封构件528可以是焊接(例如，激光或超声波、热板)或以其它方式永久附接(例如，各向异性膜、压敏粘合剂、氰基丙烯酸酯、环氧树脂或其它适当粘合剂)以产生密封区域的所组装的组件。密封构件528可以用于将传感器载体402物理耦接到可穿戴组合件600，和/或提供所述传感器载体与所述可穿戴组合件的密封区域。
图14A-14E展示了可穿戴组合件600的另一实施方案。图14A-14E的实施方案类似于图13A-13C所示的实施方案。如图14A所示，可穿戴组合件600包含作为顶部壳体520和底部壳体522形成的壳体。可穿戴组合件还包含用于在将传感器138间隙插入到对象体内期间使用的贯穿孔524。特别参照图14B、C和D，底部壳体522包含具有底板704的凹部726。底板704可以包含从底板704向上延伸的定位销784和786以及两个孔隙722和724。定位销可以在例如壳体的模制期间形成为底板704的整体部分，或者它们可以是利用摩擦配合、粘合剂或者任何其它手段耦接到底板的单独的部分。在一些实施例中，存在至少一个定位销。在一些实施例中，存在至少两个定位销。在一些实施例中，存在至少三个定位销。在底板704的相对侧上的是印刷电路板530(在图14E中可见)，其上安装有传感器电子电路系统(例如，恒电位仪210或连接到恒电位仪的至少迹线)中的一些或全部。印刷电路板530上还可以安装有导电销712和714，所述导电销延伸穿过底板704中的孔隙722和724，从而形成可在无需打开壳体的情况下接近的外部电接口。预连接传感器400落入此凹部726中。孔794和孔796落在定位销784和786上，并且导电销712和714延伸穿过传感器载体衬底404中的孔706和708。类似于图4A到4C中的不同实施例所示，这些孔706和708延伸穿过衬底404上的电镀金属(例如，铜)触点406和触点408。一般来说，衬底404中的孔706、708的数量对应于传感器138中存在的电极的数量，而所述电极的数量反过来对应于销712、714的数量。例如，具有工作电极、参考电极和反电极的三电极系统可以在衬底中具有对应于向上延伸穿过底板704的三个销的三个孔。销712和714可以按各种方式(如焊料、型锻或导电凝胶、膏、粘合剂或膜)电连接到触点408和406。在作出此连接之后，用于检测和/或处理被放置在壳体内的分析物传感器信号的电子电路系统变得连接到分析物传感器，以从其接收信号。在图14D和14E中，将传感器138接合到传感器载体402的连接材料被表示为762和764。这些连接可以通过上文参照图4A所述的方法中的任一种来建立。
一旦衬底404被置于销712、714上，传感器138的近端部分便可以通过压敏粘合剂772而固定到底板704，以在插入器开口524处向下延伸之前将传感器的近端部分保持在壳体上或壳体附近。这实现准确传感器插入位置，并控制到插入针中的偏置力。各种方法和/或结构特征可以用于执行此保持功能，如底板704中的凸出部或搁板、包覆模制部分、在传感器上方安装的卡扣配合额外塑料件，或者在预连接传感器被置于凹部726中之前或之后放置的任何类型的凝胶或粘合剂。如图13C所示，任选的密封构件528a和528b可以被配置成使传感器载体402的至少一部分密封和绝缘而免受潜在的湿气侵入。在一些情况下，密封构件528可以是所分配的液体(例如，粘合剂、凝胶)或固体材料(例如，弹性体、聚合物)。密封构件528可以是焊接(例如，激光或超声波、热板)或以其它方式永久附接(例如，压敏粘合剂、氰基丙烯酸酯、环氧树脂或其它适当粘合剂)以产生密封区域的所组装的组件。密封构件528可以用于将传感器载体402物理耦接到可穿戴组合件600，和/或提供所述传感器载体与所述可穿戴组合件的密封区域。两个密封构件528a和528b由壁766和768部分分离。这些壁允许将两种不同密封方法用于由壁分离的凹部726的两个不同部分中。例如，528b可以是通过壁的一侧上的开口524而按压配合到凹部部分中的固体聚合物。凹部726的其余部分则可以用液体UV固化环氧树脂填充，所述液体UV固化环氧树脂硬化以形成密封构件528a。壁的每侧上的两个凹部部分的深度可以相同或不同。
图15A示出了传感器载体402的另一替代实施方案，所述传感器载体也可能采取印刷电路板的形式。在此实施方案中，如参照图3D中的项目336所述的保护迹线407设置在传感器载体402的衬底404上。如上文所解释，此保护迹线407定位在触点406与408之间，并由传感器电子装置连接到偏压电压。保护迹线407可以通过类似于销712和714而延伸穿过衬底704的一个或多个导电销713(图14A到14E中未示出)而耦接到传感器电子装置。在图15A中，销被示出为连接到衬底404的侧面上的塔状触点。绝缘层780(如焊料罩)可以定位在保护迹线407上方，以消除分析物传感器电极短路到保护迹线的风险。
图15B和15C展示了将安装有分析物传感器138的传感器载体402连接到可穿戴传感器内的电子电路系统的其它实施方案。在图15B中，传感器138如以上参照图14C和14D所示通过导电粘合剂762和764而耦接到传感器载体402。在传感器载体衬底的另一侧上的是导电接触垫812和814。电路板530还具有接合到所述电路板的接触垫826和828，所述接触垫可通过凹部726的底板704而接近。各向异性膜820用于将传感器载体触点812电接合并机械接合到电路板触点826，并且还将传感器载体触点814电接合并机械接合到电路板触点828。各向异性膜820通过热而被压缩在触点之间，这使膜820中的导电颗粒垂直地桥接触点对812/826与814/828之间的间隙。膜820中的导电颗粒水平间隔开，因此触点对之间不会出现短路。电接合和机械接合技术已广泛用于小型电子装置(如智能电话)的显示应用中，并且使之在生产环境中实现简单和一致的连接。
在图15C中，传感器138的近端区域通过各向异性膜820而耦接到传感器载体402的触点812和814。同一各向异性膜820的不同区域可以用于将传感器载体触点812和814分别连接到电路板触点826和828。在此实施方案中，将传感器138连接到触点812和814的膜820的区域可以水平邻近于将电路板触点826和828连接到传感器载体触点812和814的膜820的区域或者以其它方式与其分开。
在图10-15的实例中，预连接传感器400可以作为独立接口安装在传感器138与传感器电子装置之间。然而，应理解，在本文所述的一些实施方案中，预连接传感器400可以包含传感器载体，其连接到可穿戴组合件600内的传感器138与传感器电子装置之间的额外接口。例如，通道322d和片弹簧306d可以形成在单独的衬底上，所述单独的衬底在校准和测试操作之后在密封件192内机械附接到基座部分312d以安装到可穿戴组合件600中。
上述分析物传感器连接技术的一个益处是，预连接传感器400的制造可以与封闭在壳体内的电子装置的制造分开。如上文参考预连接传感器结构和随后的涂覆、测试和校准过程所述，内部含有电子装置的壳体可以在将预连接传感器400附接到传感器电接口的设施分开的设施中制造。这是通过提供可从壳体外部接近的分析物传感器电子接口而成为可能。不需要打开壳体来附接传感器。
在一些有利方法中，预连接传感器的电极在第一位置被制造和安装在衬底上，并且然后运送到第二位置以进行涂覆测试和校准。具有内部电子装置的壳体是在第三位置中制造的。具有电子装置的壳体从第三位置运送到第二位置，在所述第二位置处，完整的分析物传感器附接到外部电接口。这三个位置可以全部彼此相隔很远。这可以将灵敏的膜涂覆的传感器的处置最小化，但仍然允许单独制造整个装置的其它组件。
图16示出了传感器载体402的实施方案的俯视图，其中衬底404是基本上平面的衬底，并且传感器138通过导电粘合剂1500而附接到衬底404。如图16所示，导电粘合剂1500可以涂覆到传感器138的触点1000和1002，以将传感器138机械附接到衬底404。一旦被涂覆，触点1000和1002上的导电粘合剂1500可以自身形成触点408和406，以用于耦接到测试站5002、校准站5004和/或电子装置单元500。图17示出了图16的传感器载体402的侧视图，其中可见导电粘合剂1500覆盖传感器138在近端部分处的一部分。在其它实施例中，传感器138可以通过导电粘合剂1500或通过任何其它适当方法通过使用例如夹、导电聚合物、金属箔、导电泡沫、导电织物、绕线、导线穿线或通过任何其它适当方法而附接到衬底404。
图18、19和20示出了图16的衬底404的实例，所述衬底具有用于控制传感器138在衬底404上的位置和空间定向的额外基准特征。在图18的实例中，衬底404包含v形凹部1700。传感器138部分安置在凹部1700内，以使传感器138在沿着凹部的方向上定向，并且导电粘合剂1500基本上覆盖传感器138，并填充未由传感器138填充的凹部1700的部分，以将传感器138固定在凹部内。在图19的实例中，衬底404包含第一平面部分1800和相对于第一个平面部分以非平行(例如，垂直)角度延伸的第二平面部分1802，并且传感器138通过导电粘合剂1500附接在第一平面部分和第二平面部分的界面处。在图20的实例中，衬底404包含圆形凹部1900，其中传感器138由基本上覆盖传感器138并填充未由传感器138填充的凹部1700的部分以将传感器138固定在凹部内的导电粘合剂1500附接。
图21A和21B示出了示例传感器载体402，其中至少一对导引结构2106和2108形成在衬底404上，如在一个或两个触点406和408上。当施涂导电粘合剂以将传感器主体138等接合在一起时，这些导引结构可以帮助将所述传感器主体放置在适当位置上。这可以在制造期间在将传感器组装到传感器载体时消除对外部导引固定装置的需求。结构2106、2108可以由焊料或其它导电粘合剂制成。虽然图21A和21B中未示出，但可以在导引结构之间提供额外粘合接合材料，以便在制造期间将传感器固定到导引结构。
导电粘合剂1500可以是例如导电液体分配凝胶。导电液体分配凝胶可以是固化(例如，在室温下或高固化温度下)的单组分或双组分粘合剂。导电液体分配凝胶可以是快速固化粘合剂。双组分导电液体分配凝胶可以包含基础粘合剂(例如，环氧树脂、聚氨酯等)和导电填料(例如，银、碳、镍等)。导电粘合剂1500可以包含例如具有一种或多种嵌入导电材料(如银、铜或石墨)的粘合树脂。导电粘合剂1500可以是热固化导电粘合剂。
图22示出了传感器载体402的实施方案的俯视图，其中衬底404是基本上平面的衬底，并且传感器138通过导电胶带2000而附接到衬底404。如图22所示，导电胶带2000可以涂覆到传感器138的一个或多个触点(例如，连接区域1000和1002)，以将传感器138机械附接到衬底404。一旦被涂覆，触点1000和1002上的导电胶带2000可以自身形成触点408和406，以用于耦接到测试站5002、校准站5004和/或电子装置单元500。如图22所示，胶带200可以涂覆在传感器138上方，或者可以介入在衬底404与传感器138之间。在胶带2000被安置在衬底404与传感器138之间的实施方案中，衬底404可以是可以如图23的端视图所示在传感器138周围卷曲或折叠的柔性衬底。图23的卷曲衬底包含可以形成一个或多个触点(例如，406或408)的延伸部分2100。
导电胶带2000可以被配置成用作具有一个或多个导电胶带2000和非导电胶带区域的多区胶带。导电区域和非导电区域的组合可以用于电隔离连接区域。使用多区胶带可以在单个组装步骤中简化多个连接区域的组装。胶带上的导电区域的间距可以与传感器导线138的目标连接区域匹配。在其它实施例中，胶带的导电区域的间距明显小于传感器导线138的目标连接区域的间隔。较短间距可以实现胶带放置的较大可变性，同时确保传感器138与衬底404之间的隔离连接。导电胶带2000可以由聚合物衬底与导电粘合剂(如碳浸渍粘合剂、金属浸渍粘合剂)形成。作为另一实例，导电胶带2000可以是具有导电和非导电粘合剂的金属衬底。非导电衬底的一些实例是聚酰亚胺、复合物、聚合物等。导电衬底的一些实例是金属(例如，箔片、电镀、包层等)、导电聚合物和导电弹性体。非导电粘合剂的实例是环氧树脂、氰基丙烯酸酯、丙烯酸系材料、橡胶、氨酯、热熔胶等。导电粘合剂的实例是碳填充粘合剂、纳米颗粒填充粘合剂、金属填充粘合剂(例如，银)、导电墨水等。
图24示出了传感器载体402的实施方案的俯视图，其中衬底404是基本上平面的衬底，并且传感器138通过焊接或接合到非导电(例如，塑料)衬底404的导电塑料2200而附接到衬底404。如图24所示，导电塑料2200可以涂覆到传感器138的触点1000和1002，以将传感器138机械附接到衬底404。一旦被涂覆，触点1000和1002上的导电塑料2200可以自身形成触点408和406，以用于耦接到测试站5002、校准站5004和/或电子装置单元500。
图25和26示出了用于将导电塑料2200焊接到衬底404的示例性超声波焊接系统。如图25所示，衬底404可以具备凹部，导电塑料构件2200上的凸出部可以被收纳在所述凹部中。传感器138可以安置在导电塑料构件2200上的凸出部中的凹部内，并且导电塑料构件2200可以在方向2302上被按压并且通过超声波焊头2300振动以形成熔化区域2400，当移除焊头2300时，所述熔化区域凝固以将传感器138固定在衬底404与导电塑料2200之间，以形成到传感器138的导电触点。
在一些实施方案中，为了向传感器138提供用于将触点夹到或锡焊到衬底404的额外表面区域，传感器138的近端可以被卷曲或以其它方式平坦化，如图27所示。如图27所示，触点1000F和1002F可以是会聚到圆柱形导线传感器138中的扁平触点。如图28中的传感器载体402的侧视图所示，扁平触点1000F和1002F可以通过导电附接构件2600和2602(如夹、焊料、各向异性导电膜、导电胶带、具有嵌入的导体的塑料构件、导电弹簧或弹性导电构件(作为实例))而附接到衬底404。
在一个实例中，如触点1000F和1002F(和/或本文所述的其它形式的触点1000和1002)的连接器可以被激光焊接到衬底404上的对应触点。在传感器138被激光焊接到衬底404的实施方案中，衬底404的迹线表面可以通过锡焊位置处的激光照射来预热。表面散热可以使预先沉积的焊料材料回流到传感器139的每侧。如硼硅酸盐玻璃“角”的导引件可以放置在传感器和预沉积的焊料上方以保持焊料，从而朝向传感器驱动熔融焊料。所得到的“托架”接合可以接着将传感器牢固地锚定到衬底404上的迹线，这可以帮助增大或最大化迹线-焊料-传感器触点导线接合区域。在锡焊过程的热部分期间，如硼硅酸盐玻璃角的导引件的使用还可以保护可以包含在衬底上和/或衬底中的印刷电路板组合件电子装置免受焊料碎屑的影响。
在另一实例中，如触点1000F和1002F(和/或本文所述的其它形式的触点1000和1002)的连接器可以在没有激光的情况下焊接到衬底404上的对应触点。在这些实例中，焊丝可以预先进给到烙铁的尖端上，以在尖端上形成熔融焊料液滴。接着，烙铁可以向下移动，因此液滴触碰衬底上的传感器和导电迹线。例如本文所述的Ag/AgCl涂层的传感器上的涂层可以具备低热质量，使得传感器涂层快速加热而不会冻结焊料。一旦涂层被加热，焊料便会润湿涂层。迹线也将具有极小的热质量，因此它可以快速加热而不会冻结焊料。焊接掩模可以在迹线周围提供，所述焊接掩模防止焊料从迹线的边缘流出。
在一些实施方案中，衬底404可以至少部分由柔性电路(例如，具有导电迹线或其它适当柔性电路的聚酰亚胺衬底)形成，所述柔性电路在传感器138的至少一部分上方和/或周围折叠到柔性电路的导电迹线。图29示出了衬底404的柔性电路实施方案的俯视图，其中衬底404是具有中心的非导电的细长部分2702的柔性电路，传感器138沿着所述细长部分定向，并且具有在垂直于中心部分2702的细长尺寸的方向上从中心部分延伸的上延伸部2700和下延伸部2704。延伸部2700和2704分别包含形成触点408和406的导电触点2706和2708。导电触点2706和2708可以通过衬底404上或内的迹线和/或导电通孔而耦接到形成触点412和410的外部触点。在一些情况下，延伸部2700和2704可以允许测试、校准、传感器电子装置或其它设备在未被传感器占据的区域中连接到传感器载体/传感器组合件。这可以允许额外连接类型和/或改进连接的电耦接。
图30示出了传感器载体402的实施方案，其中衬底404包含楔形基座部分2800和可折叠柔性部分2802。导电触点2804可以从基座部分2800延伸到可折叠部分2802，使得当传感器138放置在基座部分2800上并且任选地可折叠部分2802在传感器138上方(例如，在方向2820上)折叠以缠绕在传感器138上方和周围时，触点410和412电耦接到传感器138。基座部分2800可以是刚性的并且可以在远离传感器138的方向上渐缩。基座部分2800可以在窄端处包含导电触点410和412。基座部分2800可以例如可移除地插入到测试站5002和校准站5004的凹部5006和5014中，以用于测试和校准操作。在图27和28的实例中，柔性衬底可以在传感器上方折叠并固定，例如，固定到传感器和/或其自身，以通过焊接锡焊、机械压接、弹簧接触、铆钉、如环氧树脂的粘合剂等来固定传感器。
图31A和31B展示了传感器载体402的另一实施例。在此实施例中，传感器载体402包括由非导电材料(例如，聚合物或陶瓷)制成的块状物404。块状物404包含沿着y轴延伸穿过其中的贯穿孔1420，分析物传感器138的近端体外部分延伸穿过所述贯穿孔。狭槽或盲孔1410和1412在与贯穿孔y轴线正交的z轴上与贯穿孔1420相交。导电触点材料406和408电镀在顶表面上并延伸到狭槽1410和1412中。沿着x轴延伸的额外孔1430和1432与贯穿孔1420和狭槽1410和1412两者相交。每个孔1430和1432跨越其相应狭槽延伸并在每个狭槽的另一侧上部分延伸到块状物种，从而在另一侧上形成盲孔或凹陷1442、1444。可以导电或非导电的插塞1451和1453被插入到孔1430和1432中并将导线分析物传感器的触点212b和211b推动到凹陷1442、1444中，从而导致触点212b和211b与传感器载体触点406和408电接触。
图32示出了传感器载体的俯视图，所述传感器载体具有衬底404、基准特征2900以及用于触点406和408中的每个触点的可移动连接器2902。传感器138可以与基准特征2900对齐，并且可移动连接器2902可以移动以将触点1000和1002中的每个触点固定在对应基准特征与可移动连接器之间。可移动连接器2902和/或基准特征2900导电耦接到触点1000和1002。可移动连接器2902和/或基准特征2900可以导电耦接到衬底404上形成触点410和412的其它触点(未示出)。图33是基准特征2900以及可在方向2904上朝向基准特征2900移动以固定传感器138的相关联的可移动触点2902之一的透视图。触点1000和1002可以是扁平的，以增强与基准特征2900和触点2902的接触。如果需要，额外导电材料2906可以在基准特征2900与触点2902之间形成在衬底404上，以增强与传感器138的电接触。附加导电材料可以是衬底404内的嵌入导电层(例如，铜或其它导电金属层)的一部分的暴露表面，或者可以是焊料或导电粘合剂(作为实例)。
图34示出了由传感器载体形成的预连接传感器的透视图，所述传感器载体被实施为基本上围绕传感器138的桶状连接器。在图34的实例中，衬底404可以是通过导电带在传感器138周围形成的绝缘层，所述导电带从具有触点1000和1002的内部触点延伸到形成触点410和412的外表面。如图34所示，环形触点410和412可以通过按压配合而可移除地收纳到装置3100(例如，测试站5002、校准站5004和/或电子装置单元500)的导电支架3102和3104中。导电支架3102和3104可以在传感器138与装置3100(例如，测试站5002、校准站5004和/或电子装置单元500)之间建立电连通。
图35A示出了传感器载体402的实施方案，其中柔性电路缠绕在传感器138的端部上方，使得柔性衬底的顶部部分3200和底部部分3202形成在传感器138的相对侧上。如图35B所示，顶部部分3200和底部部分3202可以缠绕在多个传感器138的端部上方，使得柔性电路条带3404形成多个传感器的共同传感器载体。柔性电路条带3204可以包含用于耦接到每个传感器138的触点1000和1002的成对的内部触点，以及成对的外部触点，每对外部触点耦接到对应的一对内部触点并形成用于耦接到测试站5002和/或校准站5004的触点。以此方式，多个传感器可以作为群组而运输并耦接到测试和校准设备。条带传感器载体3204可以包含每个传感器138的标识符，使得每个传感器的测试和/或校准数据可以被记录和存储。个别预连接传感器可以通过将条带传感器载体3204单切为可以安装在电子装置单元(如图13和14的可穿戴传感器单元)中的每个传感器的个别传感器载体来形成。条带3204可以包含单切特征3220(例如，促进单切为单个预连接传感器的标记和/或刻痕)。
虽然图35A和35B示出了缠绕在传感器138的端部周围的柔性电路条带，但这仅是说明性的。应理解，其它一个或多个传感器138的柔性条带载体可以按其它方式附接到一个或多个传感器。例如，传感器138的端部或其它部分可以延伸到柔性电路条带3204的衬底中以耦接到条带中的内部导电触点，或者传感器138的端部或其它部分可以附接到柔性电路条带3204的表面(例如，使用各向异性导电膜(ACF)或其它导电粘合剂、激光焊料或其它焊料、夹或其它附接机构和/或定位和对齐传感器的基准特征)。
图36示出了传感器载体302的实施方案，其中压接连接器3301延伸穿过衬底404的一部分。如图36所示，压接连接器3301可以具有从衬底404的第一侧延伸的基座部分3300(例如，以形成触点410和412之一)。压接连接器3301还包含从衬底404的相对第二侧延伸的臂3302。如图37所示，臂3302可被按压在一起或压接以机械固定并导电耦接到传感器138，从而形成例如触点406。图38示出了图36和37的传感器载体的侧视图，并且示出了如何提供延伸穿过衬底404并在第一侧上形成触点406和408以及在第二侧上形成触点410和412的两个压接连接器。虽然触点410和412在图38中形成在衬底404的第二侧上，但应了解，触点410和412可以形成在第一侧上，或者形成在衬底404的侧壁或边缘上(例如，通过在衬底404内包含一个或多个弯头或其它导电耦接件)。
图39示出了预连接传感器的实施方案，其中传感器载体402包含向远端定向的通道358，所述通道向远端引导传感器138，使得传感器138包含至少45度和/或小于135度的弯头。通道盖362将葡萄糖传感器138固定在向远端定向的通道358中。在图39的实例中，一个或多个触点(例如，408和406)是使用导电弹性构件1400来实施的。在其它实施例中，触点可以是任何适当类型(例如，螺旋弹簧306、片弹簧306d)。触点(例如，导电弹性构件1400)在传感器138与外部设备(例如，测试站5002、校准站5004和/或皮肤上传感器组合件600)之间形成导电耦接。如图所示，触点可以与衬底404上的基础特征(例如，凸出部308)和/或通道322d合作，以形成基准特征，所述基准特征将传感器138相对于传感器载体402固定和对齐(例如，针对制造、校准、测试和/或体内操作)。在一些实施方案中，传感器138可以弯曲、胶合或接合，以便附连在传感器载体402内。
图40示出了传感器载体402的实施方案，其中衬底404是模制互连装置。在图40的实例中，衬底404由包含导电迹线3702的模制热塑性塑料或热固性塑料(例如，丙烯腈-丁二烯-苯乙烯、液晶聚合物、聚酰亚胺/聚邻苯二甲酰胺塑料或其它热塑性或热固性聚合物材料)形成。导电迹线3702可以形成在衬底404的表面上，和/或可以进入和/或穿过衬底404的部分以形成适当连接。导电迹线可以使用各种技术(例如，通过激光蚀刻进行的选择性电镀、组合可电镀和不可电镀的衬底聚合物或其它适当方法)而形成在模制衬底上。在其它实施例中，导电材料(例如，导电聚合物、金属冲压件、电镀聚合物、金属结构)可以用非导电材料包覆模制。
为了产生如图40所示的适当电连接，导电迹线3702电耦接在触点(例如，传感器138上的接触区域1000和1002)与外部触点(例如，触点410和412)之间。虽然触点(例如，410和412)形成在传感器138在图37的实例中所附接到的衬底404的同一表面上，但这仅是说明性的。应了解，触点(例如，触点410和412)可以形成在衬底404的相对表面上或边缘或侧壁上，并且通过衬底404内或上的导电材料(例如，导电层、结构、粘合剂、夹、焊料或互连等)而耦接到触点(例如，触点408和406)。例如，触点(例如，触点410和412)可以形成指定区域，以介接传感器138所附接到的衬底404的不同表面或区域上的电耦接件。指定区域可以形成用于将传感器定向通道、沟槽、凹部、狭槽或类似对齐特征。
模制热塑性衬底404可以是注射模制衬底，所述注射模制衬底具有促进用于传感器138的测试、校准和可穿戴装置安装的各个方面的特征。例如，模制热塑性衬底404可以包含基准特征或其它位置特征或定位特征，例如，形状与传感器138的近端的形状互补的凹部3700。例如，凹部3700可以包含三个或更多个阶梯区域，所述阶梯区域对应于如图3D所示的同轴分析物传感器的不同层之间的阶梯。在其它配置中，模制热塑性衬底404可以包括如图18的实例中的平壁凹部，如图19的实例中的形成拐角的壁，或者如图20的实例中的圆形凹部。在其它配置中，模制热塑性衬底404可以在表面上包含定位和对齐传感器138的升高特征或凸出部。例如，形状与传感器138的形状对应的升高通道可以设置在模制热塑性衬底404的表面上。作为另一实例，一个或多个柱可以从模制热塑性衬底404的表面延伸。例如，一条或多条凸出部线可以形成在模制热塑性衬底404的表面上，传感器138可以被定位和对齐而靠在凸出部线上，和/或被定位和对齐在凸出部线之间。以此方式，可以为模制热塑性衬底404提供各种配置，包含将传感器138定向在优选位置和优选方向上的基准特征。
模制热塑性衬底404还可以包含其它形状的特征，例如在衬底的相对侧上便于抓握、保持和运输传感器138的手指保持件3720。模制热塑性衬底404还可以包含其它形状的特征，例如对应于用于制造设备5091、测试设备5004和校准设备5004的连接器的形状的锚定特征，例如，制造设备5091的抓握连接器特征5093/5095和/或测试设备5002和校准设备5004的凹部连接器5006和5014。形成在模制热塑性衬底404上和/或通过模制热塑性衬底404自身形成的锚定特征可以包含一个或多个凸出部，例如，柱、卡扣配合特征、如臂202的臂(参见例如图11-14)、凹部、凹口、钩和/或类似于图28所示的锥形部分的锥形部分(作为实例)。在一些实例中，模制热塑性衬底404的一部分或整个模制热塑性衬底404的形状可以对应于制造设备5091、测试设备5002、校准设备5004、载体和/或可穿戴装置中的一个或多个上或其内的安装插座的形状。
尽管衬底404在图40中被示出为基本上直线的，但是模制热塑性衬底404可以具备特征3720和/或如手柄形状等整体形状，以用于在制造和组装操作期间插入、拉动或以其它方式操纵传感器138。例如，模制热塑性衬底404可以包含主要部分以及从主要部分延伸的握持部分，所述主要部分被配置成与制造设备5091、测试设备5002、校准设备5004和/或可穿戴装置机械介接和电介接。握持部分可以在制造操作期间从制造设备5091、测试设备5002或校准设备5004延伸，以便于在制造操作之后或之间从设备移除传感器载体402和传感器138。握持部分可以与主要部分一体地形成，或者可以是从模制热塑性衬底404的表面或从其内部延伸的单独的组件。握持组件可以是被设定形状成用于(例如，由技术人员)用握持工具或用手握持的柱、杆、轴或拱形手柄。
如图40所示，传感器138可以放置在凹部3700中并使用粘合剂3704(例如，如本文所述的导电粘合剂)固定到衬底404。粘合剂3704可被涂覆以将传感器138的触点1000耦接到衬底404上的第一导电迹线3702，以在传感器138与传感器载体402之间形成触点408。粘合剂3704还可以被涂覆以将传感器138的触点1002耦接到衬底404上的第二导电迹线3702，以在传感器138与传感器载体402之间形成触点406。以此方式，模制热塑性衬底404可以提供用于移动和/或以其它方式处置传感器138的手柄和/或应变消除构件。
图41示出了图40的传感器载体402的俯视图。如图40和41所示，第一导电迹线3702可以从与凹部3700内的触点1000的接触部分延伸，以在衬底404的表面上形成一个或多个暴露部分，所述暴露部分形成用于耦接到测试站5002、校准站5004和/或电子装置单元500的外部触点412。第二导电迹线3702可以从与凹部3700内的触点1002的接触部分延伸，以在衬底404的表面上形成一个或多个暴露部分，所述暴露部分形成用于耦接到测试站5002、校准站5004和/或电子装置单元500的外部触点410。
图42示出了如图40和41所示的传感器载体402的具体实施方案。在传感器载体402的此实施方案中，传感器138通过导电耦接器3900(如夹、导电粘合剂、导电聚合物、金属箔、导电泡沫、导电织物、绕线、导线穿线或通过任何适当方法)而附接到衬底404。如图43所示，衬底4000可以具有细长尺寸，平行的导电条带4001和4002沿着所述细长尺寸形成。多个传感器138可以附接到衬底4000并且在垂直于衬底的细长尺寸的方向上延伸超出衬底的边缘。可以提供如刻痕4020的单体特征，所述单切特征促进将衬底4000单切为每个传感器的个别传感器载体衬底404，和/或将每个传感器的导电条带4001和4002的部分电隔离。每个传感器可以使用例如夹3900或任何其它方法(包含通过使用导电粘合剂、导电聚合物、金属箔、导电泡沫、导电织物、绕线、导线穿线或任何其它适当方法)而附接到衬底4000。每个传感器的标识符450可以提供在衬底4000的对应部分上。
传感器138可以各自具有一对传感器电触点(例如，触点1000和1002)，所述传感器电触点耦接到由衬底上的条带4001和4002形成的对应的一对电触点。衬底4000中的开口和/或延伸穿过衬底4000的通孔可以提供条带4001和4002的暴露部分，所述暴露部分形成用于将每个传感器138耦接到测试站5002、校准站5004和/或电子装置单元500(例如，可穿戴装置的电子装置单元)的多对电触点。多对电触点中的每一对通过衬底而耦接到条带4001和4002的相关联的一对部分。
图44-46示出了可以从图43所示类型的传感器载体条带单切的传感器载体上的各种触点配置。在图44的实例中，衬底4000上的z形触点配置已被单切，以在衬底的较小部分(称为衬底404)上形成预连接传感器。在这种情况下，z形触点配置可以在测试、制造或校准设备上的连接器(例如，较大间距连接)之间实现较大距离，但是不需要z形衬底来产生较大距离，并且可以使用其它衬底形状。在图45的实例中，衬底4000的正方形部分已被单切，以在衬底404上形成预连接传感器。在图46的实例中，衬底4000的正方形部分已被单切，以形成预连接传感器，并且开口4300(例如，气隙)提供在单切的衬底404中以改进单切的接触条带部分4001和4002之间的电隔离。
如图47A所示，在一些实施方案中，形成多个传感器138的传感器载体的细长衬底4000可以具备沿着细长衬底的细长边缘行进的进给导引条带4402。进给导引条带4402可以包含定位特征4404，所述定位特征可以被接近和操纵以将预连接传感器的条带移动穿过一个或多个制造站并进行对齐。
在图47A的实施方案中，传感器138可以在制造或测试操作之后大批地附接到衬底4000并且在衬底404上单切。如图47B所示，图47A中所示的预连接传感器的条带可以提供在卷盘4410上，以用于大批存储和/或运输，并且任选地使用进给导引条带4402自动地从卷盘拉出，以移动穿过一个或多个测试站和/或一个或多个校准站。图48示出了具有传感器载体的预连接传感器，所述传感器载体已从衬底4000单切并且与进给导引条带4402的单切的部分4402分离。可替代地，进给导引条带4402可以在个别预连接传感器的单切之前作为条带来分离。在其它实施例中，进给导引件被集成到最终产品配置中，并且在单切期间或之后不从传感器载体移除。
图49示出了传感器载体402的实施方案，其中多组触点406和408由具有用于收纳对应的多个传感器138的狭槽的插座4600形成。在一些实施方案中，插座4600可以是包括弹性或柔性材料的细长构件。插座4600可以具有狭槽，所述狭槽任选地刺穿绝缘层或使外层的一部分变形，以便与传感器138接触。
图50示出了多个传感器138的传感器载体的实施方案，所述传感器载体具有形成基准特征以使每个传感器保持精确的对齐和位置的凹部4700。互补的磁性特征可以提供在传感器138和衬底404上，以使每个传感器保持精确的对齐和位置，并且促进精确的传感器处理。
图51A示出了使用印刷电路板技术由刚性、柔性或组合刚性/柔性的衬底形成的细长衬底4800的实施方案，多个传感器载体402可以从所述衬底单切。衬底的柔性部分可以由如聚酰亚胺、PEEK、聚酯或任何适当类型的材料制成。衬底的刚性部分可以由如FR4、FR5、FR6、绝缘金属衬底(IMS)、PTFE或任何适当类型的材料制成。如图51A所示，每个传感器载体可以包含传感器连接部分4804和接口或处理部分4802。在一些实施方案中，每个传感器载体可以包含从刚性或柔性部分延伸的传感器连接部分4804以及从刚性或柔性部分延伸的接口或处理部分4802。在这些实施方案中，如触点406和408的一个或多个触点可以形成在每个传感器载体402的传感器连接部分4804上。衬底4800的传感器连接部分4804可以含有传感器载体402的锚定或基准特征。
图51B示出了如图51A所示的细长衬底4800的另一实施方案，所述细长衬底具有用于连接到工作站(如测试站、校准站、组装站、涂覆站或其它制造站)的任选的电连接接口4850。任选的电连接接口4850可以通过配置在电路板的一个或多个层上的电迹线而耦接到一个或多个传感器载体402。如图51B所示，多个传感器载体402组装在面板中，并且传感器载体402中的每个传感器载体可以包含从刚性或柔性部分延伸的传感器连接部分4804以及从刚性或柔性部分延伸的接口或处理部分4802。在这些实施方案中，如触点406和408的一个或多个触点可以形成在每个传感器载体402的传感器连接部分4804上。衬底4800的传感器连接部分4804可以含有传感器载体402的锚定或基准特征。在一些实施方案中，图51B所示的细长衬底4800可以被配置成允许传感器138延伸超出衬底的边缘。这可以通过移除细长衬底4860的一部分以进行进一步处理来实现。在一些实施例中，穿孔(例如，V形刻痕、鼠齿或其它适当类型)包含在细长衬底4800中，以能够移除面板4860的底部部分以进行浸渍或校准。在此实施方案中，细长衬底4800可以被配置用于浸渍或校准，如图52B所述。
现参照图52A，传感器载体402的实施方案被示出为具有传感器连接部分4804上的一个或多个传感器触点(例如，触点406和408)以及接口或处理部分4802上的一个或多个接口触点(例如，触点410和412)。一个或多个接口触点(例如，410和412)可以形成在传感器载体402上以用于连接到测试站5002、校准站5004和/或电子装置单元500。在此配置中，测试和/或校准操作可以通过将部分4802耦接到测试和/或校准设备来执行。
图52B示出了多个传感器载体402的示例面板实施方案，所述传感器载体具有用于与工作站(例如，测试站、校准站、组装站、涂覆站或其它制造站)的电子装置介接的电连接接口4850。图52B的图示示出了在移除底部面板部分4860(从图51B的图示)之后并且在传感器138通过一个或多个传感器触点(例如，触点406和408)而附接的情况下的图48B的细长衬底4800。在一些实施方案中，传感器可以永久连接(例如，导电粘合剂、导电聚合物、导电墨水、焊料、焊接、钎焊或其它适当方法)到传感器载体402，并且两个组件可以一起或单独校准。在其它实施方案中，传感器可以可释放地附接(例如，通过夹、金属箔、导电泡沫、导电织物、绕线、导线穿线或任何其它适当方法)。
在测试和/或校准操作之后，柔性部分4802可以围绕式折叠、覆盖式折叠、围绕式缠绕、覆盖式缠绕或者操纵以包封部分4804，以安装到皮肤上传感器组合件600上。在图53A的实例中，部分4802可以形成用于传感器138的独立处理电路(例如，传感器电子装置112的实施方案)。在其它实施方案中，部分4802可以直接耦接到用于组合件600的信号处理电路、传感器电子装置的系统封装(SIP)实施方案或者用于传感器电子装置的主印刷电路板。在图53B的实例中，柔性部分4804被折叠以包封部分4802，以安装到皮肤上传感器组合件600中，以便使传感器138在位置上固定以延伸(例如，穿过开口4808)以用于针对体内操作而插入。
图54示出了传感器载体402使用印刷电路板技术而作为用于传感器电子装置的主印刷电路板5100的子板来制造的实施方案。如图54所示，一个或多个触点(例如，触点5104(例如，焊接触点))可以在传感器载体402与主PCB 5100之间形成，以形成用于皮肤上传感器组合件600中的传感器138的传感器电子装置单元。导电迹线5102可以通过导电附接机构5103(例如，如本文所论述的焊料、导电粘合剂、导电胶带或其它导电附件)而将触点5104耦接到传感器138。
图55示出了传感器载体402的实施方案，其中压紧夹5200被设置成闭合压接连接器5202的臂5204，以将传感器138固定到衬底404。连接器5204可以由形成触点410和412之一的导电材料形成。如图55所示，压紧夹5200包含具有倾斜表面的夹紧臂5208，随着压紧夹5200在方向5206上朝向衬底404移动并且弹回以将压紧夹5200固定到衬底404，倾斜表面向外推动臂。在其它实施方案中，压紧夹5200可以被设置成不具有夹紧臂5208，使得压紧夹5200在臂5204被压紧闭合之后可移除，而使得压紧夹5200不形成传感器载体的一部分。如图55所示，可以设置一个或多个电极突出部5220以形成例如衬底404上的触点410和412中的一个或多个触点。虽然突出部5220形成在与传感器138在图55的实例中所附接到的表面相对的衬底404的表面上，但这仅是说明性的。应了解，触点(如触点410和412)的突出部可以形成在相对表面上，与传感器138相同的表面上，或者形成在衬底404的边缘或侧壁上，并且通过导电通孔或者衬底404内或上的其它导电层、结构或互连而耦接到触点408和406。在一些实施方案中，压紧夹5200可以用于与压接连接器5202一起对传感器138施加偏置力，或者可以在没有压接连接器5202的情况下直接对衬底施加偏置力。压紧夹5202可以径向地、轴向地或在适当方向上施加力，以在传感器138和导电通路上提供偏置力。
图56示出了传感器载体402的实施方案，其中触点406和408由可折叠导电夹5300形成。传感器138可以穿过每个夹5300中的开口5302插入，并且通过将每个夹5300的部分5304折叠到传感器138上方而机械固定到衬底404并导电耦接到夹5300。
夹5300的部分5304还可以形成用于耦接到如制造站(例如，测试站、校准站、组装站、涂覆站或其它制造站)的外部设备的触点410和412。然而，这仅是说明性的。在其它实施方案中，可以设置导电耦接到夹5300的一个或多个电极突出部以形成例如衬底404上的触点410和412中的一个或多个触点。此类突出部可形成在与传感器138所附接到的表面相对的衬底404的表面上，在与传感器138相同的表面上，或在衬底404的边缘或侧壁上，并通过导电通孔或衬底404内或上的其它导电层、结构或互连而耦接到夹5300。
夹5300还形成用于将传感器138相对于衬底404定位和对齐的基准特征。衬底404可以被设定大小和形状(或可以包含结构特征)，所述结构特征相对于制造站和/或可穿戴装置的壳体形成衬底404的锚定特征。以此方式，传感器载体402可以用于容易针对制造和组装操作而定位和对齐传感器138(例如，使用基准特征以将传感器相对于衬底404对齐并且使用锚定特征以将衬底相对于制造或可穿戴设备对齐)。
当安装在皮肤上传感器组合件600中时，本文所述的各种实施例中的传感器载体402的导电组件彼此电隔离并且与环境电隔离。例如，触点406、408、410和412可以通过以下方式彼此电隔离并且与环境电隔离：使用非导电粘合剂(例如，单组分或双组分环氧树脂)，使用聚氨酯，使用低压包覆模制(如可模制聚酰胺或可模制聚烯烃)，使用注射包覆模制热塑性塑料或热固性塑料，使用非弹性体(如焊接翻盖塑料、粘合接合翻盖、装有密封剂(例如，环氧树脂、氨基甲酸乙酯、硅树脂等)的单面或双面空腔)，或使用工厂预压缩弹性体(如用于将弹性体保持在压缩状态中的约束双体空腔)。双体空腔可以通过以下方式而将弹性体保持在压缩状态中：卡扣配合、如超声波焊接、激光焊接、溶剂接合或热熔的接合或如螺钉、铆钉、夹或其它紧固件的机械紧固件。
图57示出了可以被执行以用于制造和使用预连接分析物传感器的说明性操作。
在框5400中，可以提供分析物传感器，如分析物传感器138。如本文所述，分析物传感器可以具有细长主体(例如，具有细长导电芯的细长导电主体)，以及处于细长主体上(例如，在细长主体的远端处)的工作电极。分析物传感器还可以在沿着细长主体的近端或别处包含一个或多个电触点，并且分别耦接到工作电极和/或参考电极。
在框5402中，可以将如本文所述的传感器载体402的实施方案之一的传感器载体附接到例如细长主体的近端。附接传感器载体包含将传感器载体的一个或多个触点(例如，在衬底上)耦接到细长主体上的一个或多个对应电触点。
在框5403中，提供如制造站的工作站。如本文所述，制造站可以被配置成执行一个或多个浸涂过程，以在工作电极上形成上述膜108。
在框5404中，通过将传感器载体耦接到至少一个测试站的电路，可以将分析物传感器耦接到至少一个测试站(例如，测试站5002)。将传感器载体耦接到至少一个测试站的电路可以包含将一个或多个锚定特征(如传感器载体的衬底)机械耦接到测试站的配合接口，使得衬底上的一个或多个外部触点耦接到测试站处的一个或多个对应触点。传感器载体上的传感器的标识符可以由测试站读取。由测试站获得的与标识符相关联的测试数据可以由测试站存储和/或发射。
在框5406中，通过将传感器载体耦接到至少一个校准站的电路，可以将分析物传感器耦接到至少一个校准站(例如，校准站5004)。将传感器载体耦接到至少一个校准站的电路可以包含将一个或多个锚定特征(如传感器载体的衬底)机械耦接到校准站的配合接口，使得衬底上的一个或多个外部触点耦接到校准站处的一个或多个对应触点。传感器载体上的传感器的标识符可以由校准站读取。由校准站获得的与标识符相关联的校准数据可以由校准站存储和/或发射。校准数据可以存储在传感器载体上或者被发送，以在传感器138的体内使用期间供皮肤上传感器组合件600后续使用。
传感器载体402可以根据需要耦接到一个或多个额外制造站。额外制造站可以包含恒电位仪测量站、传感器校直站、膜浸渍站、固化站、分析物灵敏度测量站和/或检验站。
在框5408中，可以将传感器载体耦接到可穿戴装置(例如，皮肤上传感器组合件600)的传感器电子装置(例如，电子装置单元500的传感器电子装置112)。将传感器载体耦接到传感器电子装置可以包含将传感器载体上的一个或多个外部触点耦接到传感器电子装置的对应触点。在一些实施例中，将传感器载体耦接到传感器电子装置可以包含如本文所述将传感器载体固定在基座(如基座128)与电子装置单元500之间。皮肤上传感器组合件600中的读取器可以从传感器载体获得传感器的标识符。传感器的校准数据可以基于标识符来获得。
在框5410中，可以通过传感器电子装置来获得和处理来自工作电极(例如，和参考电极)的体内信号。来自工作电极(例如，和参考电极)的体内信号可以由传感器电子装置通过传感器载体的电路从传感器接收。
本文所公开的方法包括用于实现所描述的方法的一个或多个步骤或动作。方法步骤和/或动作可以彼此互换，而不脱离权利要求的范围。换句话说，除非指定了步骤或动作的具体次序，否则可以修改具体步骤和/或动作的次序和/或使用，而不脱离权利要求的范围。例如，上文结合框5404和5406描述的操作可以颠倒和/或可以并行执行。
在一些情形下，可能需要将传感器138以优选的位置和定向耦接到衬底上的一个或多个触点。图58示出了示例性设备5531，其中传感器138使用弹性管定向到衬底5530。如图58所示，设备5531可以包含具有一个或多个导电触点(如触点5532和5534(例如，印刷电路衬底上的暴露铜垫))的衬底5530以及弹性管5500。弹性管5500可以由非导电弹性体形成。
如图所示，弹性管5500可以形成有“D”、“O”、椭圆形、金字塔形或半球形的横截面，所述横截面在弹性管5500的底部部分中具有细长切口5503，传感器138安置在其中。以此方式，弹性管5500的细长切口的侧壁可以将传感器138相对于衬底5530对齐。
切口5503的每侧上的底部部分5502可以附接到衬底5530。底部部分5502可以使用粘合剂5504(如压敏粘合剂)而附接到衬底。弹性管5500中的细长开口5501和切口5503提供足够空间，其中为了组装设备，管5500可以放置在传感器138上方，而传感器138在衬底5530上处于适当位置中。
图59示出了图55的设备的分解透视图，其中可以在衬底5530上看到触点5532和5534。传感器138可以定位在一个或多个触点(如触点5532和5534)上方。
在将管初始放置在传感器上方期间，传感器138可以松散地保持在管5500的开口5501内，并且接着当管被压缩时(例如，通过可穿戴装置的上壳体)由管固定到衬底5530。以此方式，传感器138可以通信耦接并机械固定到衬底，而无需锡焊或其它结合操作。
在制造操作期间和/或在传感器138的体内使用期间，传感器138可以通过管5500的外部压缩在衬底404上保持在适当位置中。图60示出了通过壳体结构压缩管5500而将传感器138保持在适当位置中的实例。例如，壳体5700(例如，可穿戴装置的壳体或用于制造站的盖或夹)可以包含在组装配置中压缩管5500以固定传感器138的凸出部构件5702。
如上文结合例如图35B、43、47A、47B、50和51所述，在制造操作期间，多个传感器138可以由公共传感器载体承载。然而，在一些情形下，可以提供如智能载体的公共载体，以用于多个预连接传感器的制造操作。图61示出了用于多个预连接传感器的载体的示例。如图58所示，载体5800可以包含用于多个预连接传感器的接口5804的壳体5802。壳体5802可以是基本上实心的衬底，或者可以是形成内腔的壳体，其它组件安装和/或连接在所述内腔内。
每个接口5804可以被配置成在本文描述的实施方案中的任一者中收纳传感器载体402。例如，每个接口5804可以包含与如本文根据各种实施方案所述的传感器载体的一个或多个对应锚定特征介接的一个或多个特征。载体5800可以包含被配置成与传感器138和/或外部计算设备通信的电路5806(例如，一个或多个处理器和/或存储器)。电路5806可以包含用于发射和/或接收来自外部设备的数据的通信电路系统，如一个或多个天线。壳体5802可以包含用于将载体5800机械耦接到制造设备的一个或多个结构5810(例如，夹、扣、凸出部、凹部、凹口、柱等)。一个或多个导电触点5808可以提供在壳体5802上，通过载体而将制造设备通信耦接到传感器138。
如图所示，每个接口5804可以与特定标识号相关联(作为实例，在图58中表示为I1、I2、...、IN-1和IN)。电路5806可以通过与接口相关联的标识号来电子标识安装在载体5800的接口5804中的传感器。然而，这仅是说明性的。在其它实施方案中，传感器138可以使用接口5804中的每个接口中的读取器由电路5806唯一地标识，盖读取器读取如传感器载体上的标识符450的标识符。测试和/或校准数据可以由处理电路系统5806收集，并与每个传感器的标识符一起存储和/或发射。
在制造期间，一个或多个预连接传感器可以经装载载体5800。载体5800可以将预连接传感器紧固在其中并且为每个传感器执行恒电位仪测量(例如，使用电路5806)。传感器138可以通过个别安装特征而固定到接口5804，或者载体5800可以具备锁定机构，如可滑动杆5812。可滑动杆5812可以在如图所示的打开位置与闭合位置之间滑动(例如，通过手柄5814)，在打开位置中，传感器载体可以插入到接口5804中以及从其移除，在关闭位置中，杆5812阻止传感器载体从接口移除。
在一些情形下，初始测量测试可以由载体5800执行，以通过传感器互连电极和传感器表面而测试恒电位仪连接。可以对耦接到载体5800的传感器138执行的制造操作可以包含传感器的物理操纵，如传感器的校直。通过允许多个传感器使用自动校直设备在单个操作中校直，载体5800可以促进较有效的制造。
载体5800可以在传感器138的各个制造阶段促进恒电位仪测量和/或其它测量。恒电位仪测量可以在校直操作之前、期间和/或之后执行，并且关于传感器损坏或可以通过校直而引入的可能的任何其它机械应力的信息可以与相关联的传感器ID一起被保存和/或发射。
可以对耦接到载体5800的传感器138执行的制造操作还可以包含膜过程，其中执行浸渍操作以形成膜，如每个传感器的膜508。安装在载体5800中的经校直的传感器138可以同时被浸渍。恒电位仪测量可以在膜操作之前、期间和/或之后执行，并且传感器的电化学和浸渍过程相关联的信息可以由载体5800收集、处理、存储和/或发射。
可以对耦接到载体5800的传感器138执行的制造操作还可以包含固化过程。对安装在载体5800中的传感器138的群组执行固化可以允许固化过程占用较少的空间，这可以减少由固化设备使用的制造区域的占地面积。恒电位仪测量可以在固化操作之前、期间和/或之后执行，并且与传感器的电化学和浸渍过程相关联的信息可以由载体5800收集、处理、存储和/或发射。
可以对耦接到载体5800的传感器138执行的制造操作还可以包含校准操作。因为载体5800可以在制造过程中早期执行连接测试，所以改进的分析物/电化学校准可以由载体5800自身和/或与外部制造设备协作来执行。校准数据可以由载体5800收集、处理、存储和/或发射。
通过载体5800收集校准和/或测试数据可以节省连接和断开额外外部设备的时间。通过载体5800收集校准和/或测试数据，特别是当数据与传感器ID一起自动被收集并存储时，也可以减少校准/测试的错误，这是因为贯穿各种过程，数据是由同一设备收集的。
可以对连接到载体5800的传感器138执行的制造操作还可以包含分析物浓度测量。例如，载体5800可以由制造设备(例如，机械臂)移动，以将安装在载体中的传感器138暴露于各种分析物浴(例如，葡萄糖浴)。载体5800可以在各种浴暴露期间收集电势测量值。在各种浴暴露期间与电位测量相关联的信息可以由载体5800收集、处理、存储和/或发射。
可以对连接到载体5800的传感器138执行的制造操作还可以包含分析物灵敏度测量。可以由载体5800执行的灵敏度测量可以包含基线测量、斜率测量和/或噪声测量，基线测量指示没有分析物暴露于的情况下的来自每个传感器的信号，斜率测量指示分析物的给定量的信号改变。这些灵敏度测量可以由载体5800存储和/或发射。
可以对耦接到载体5800的传感器138执行的制造操作还可以包含视觉检验操作(例如，由技术人员)。提供已经历上述所有测试/校准/制造操作的安装在载体5800中的一组预连接传感器可以允许较有效和/或较自动化的视觉检验和剔除(例如，因为载体5800内的每个传感器的确切物理位置是已知的)。已在制造操作期间表现出异常电化学或机械应力的传感器138可以由载体5800标记(例如，使用显示器、视觉指示器或将标志信息发射到外部设备)以用于重新测试或剔除。
一些附图所示的元件之间的连接展示了示例性通信路径。可以包含额外通信路径(直接的或通过中介而进行的)，以进一步促进元件之间的信息交换。通信路径可以是允许元件交换信息的双向通信路径。
上述方法的各种操作可以由能够执行操作的任何适当装置执行，如各种硬件和/或软件组件、电路和/或模块。通常，附图所示的任何操作可以由能够执行操作的相应功能装置来执行。
结合本公开所描述的各种说明性逻辑块、模块和电路(如图2的框)可以用下述实施或执行：被设计成执行本文所述的功能的数字信号处理器(DSP)、专用集成电路(ASIC)、现场可编程门阵列信号(FPGA)或其它可编程逻辑装置(PLD)、离散门或晶体管逻辑、离散硬件组件或其任何组合。处理器可以是微处理器，但是可替代地，处理器可以是任何市售的处理器、控制器、微控制器或状态机。处理器还可以实施为计算装置的组合，例如，DSP和微处理器的组合、多个微处理器、与DSP内核结合的一个或多个微处理器或任何其它这类配置。
在一个或多个方面中，所描述的各种功能可以实施为硬件、软件、固件或其任何组合。如果实施为软件，则这些功能可以作为计算机可读介质上的一个或多个指令或代码存储或发射。计算机可读介质包含计算机存储介质和通信介质两者，通信介质包含促进将计算机程序从一处传送到另一处的任何介质。存储介质可以是可以由计算机访问的任何可用介质。作为实例而非限制，这类计算机可读介质可以包括各种类型的RAM、ROM、CD-ROM或其它光盘存储器、磁盘存储器或其它磁性存储装置，或可以用于携带或存储呈可由计算机访问的指令或数据结构的形式的期望程序代码的任何其它介质。并且，任何连接都适当地称为计算机可读介质。例如，如果使用同轴电缆、光纤缆线、双绞线、数字用户线(DSL)或无线技术(如红外、无线电和微波)从网站、服务器或其它远程源传输软件，则介质的定义中包含同轴电缆、光纤缆线、双绞线、DSL或无线技术(如红外、无线电、WiFi、
RFID、NFC和微波)。如本文所使用，磁盘和光盘包含压缩光盘(CD)、激光光盘、光盘、数字通用光盘(DVD)、软盘和Blu-
光盘，其中磁盘通常磁性地再现数据，而光盘通过激光光学地再现数据。因此，在一些方面中，计算机可读介质可以包括非暂时性计算机可读介质(例如，有形介质)。此外，在一些方面中，计算机可读介质可以包括暂时性计算机可读介质(例如，信号)。上述各项的组合也应包含在计算机可读介质的范围内。
某些方面可以包括用于执行本文所呈现的操作的计算机程序产品。例如，这类计算机程序产品可以包括具有存储(和/或编码)有指令的计算机可读介质，所述指令可由一个或多个处理器执行，以执行本文描述的操作。对于某些方面，计算机程序产品可以包含包装材料。
软件或指令还可以在传输介质上传输。例如，如果使用同轴电缆、光纤缆线、双绞线、数字用户线(DSL)或无线技术(如红外、无线电和微波)从网站、服务器或其它远程源传输软件，则传输介质的定义中包含同轴电缆、光纤缆线、双绞线、DSL或无线技术(如红外、无线电和微波)。
此外，应了解，用于执行本文所述的方法和技术的模块和/或其它适当装置可以在适用时由用户终端和/或基站下载和/或以其它方式获得。例如，这类设备可以耦接到服务器以促进传送用于执行本文所述的方法的装置。可替代地，可以通过存储装置(例如，RAM、ROM、如压缩光盘(CD)或软盘等物理存储介质)提供本文所述的各种方法，使得用户终端和/或基站可以在将存储装置耦接或提供到所述装置时获得各种方法。此外，可以利用用于将本文所述的方法和技术提供给装置的任何其它适当技术。
应理解，权利要求不限于上文说明的精确配置和组件。可以对上述方法和设备的布置、操作和细节进行各种修改、改变和变化，而不脱离权利要求的范围。
除非另外定义，否则所有术语(包含技术和科学术语)应具有对于本领域普通技术人员来说普通和惯用的含义，并且除非本文中明确地定义，否则不限于特殊或定制的含义。应注意，当描述本公开的某些特征或方面时，特定术语的使用不应被视为暗示所述术语在本文中重新定义以限于包含本公开的与此术语相关联的特征或方面的任何具体特性。除非另有明确陈述，否则本申请所使用的术语和短语及其变型，尤其是所附权利要求中的术语和短语及其变型，应被解释为开放式的而非限制性的。作为上述内容的实例，术语“包含”应理解为意指“包含但不限于”等；如本文所使用，术语“包括”与“包含”“含有”或“其特征在于”同义并且是包含性或开放式的并且不排除额外未列出的元件或方法步骤；术语“具有”应解释为“至少具有”；术语“包含”应解释为“包含但不限于”；术语“实例”用于提供所论述的项目的示例性实例，而非其穷尽性或限制性清单；如“已知”、“普通”、“标准”和类似含义的术语的形容词不应理解为将所描述的项目限制在指定时间段或指定时间可获得的项目，而相反应理解为涵盖现在或在将来任何时间可获得或已知的已知、普通或标准技术；并且如“优选地”、“优选的”、“所需”或“所需的”以及具有类似含义的词的术语的使用不应理解为暗示某些特征对本发明的结构或功能是关键、必需或甚至至关重要的，而实际上应理解为仅打算突出本发明的特定实施例中可以利用或可以不利用的替代或额外特征。类似地，除非另有明确陈述，否则用连词“和”连在一起的项目群组不应理解为需要那些项目中的每个项目存在于所述群组中，而相反应理解为“和/或”。类似地，除非另外明确陈述，否则用连词“或”连在一起的项目群组不应理解为所述群组中需要互斥性，而相反应理解为“和/或”。
当提供值的范围时，应理解所述范围的上限和下限以及上限与下限之间的每个中间值都涵盖在实施例内。
关于本文中基本上任何复数和/或单数术语的使用，本领域技术人员可以在适于上下文和/或应用的情况下将复数转换成单数和/或将单数转换成复数。为了清楚起见，本文中可明确地阐述各种单数/复数排列。不定冠词“一个/一种(a/an)”不排除多个。单个处理器或另一单元可以满足权利要求所述的若干项目的功能。在彼此不同的附属权利要求中叙述某些措施这一单纯事实并不指示这些措施的组合不能用于获得优势。权利要求中的任何参考符号都不应理解为限制范围。
本领域技术人员还应理解，如果希望特定数量的所引入权利要求叙述，那么将在所述权利要求中明确陈述这一意图，且在不存在这类叙述的情况下，不存在这种意图。举例来说，作为理解的辅助，以下所附权利要求可含有引入性短语“至少一个”和“一个或多个”的使用来引入权利要求叙述。然而，此类短语的使用不应被解释为暗示通过不定冠词“一个、一种(a、an)”引入的权利要求陈述将含有此类所引入权利要求陈述的任何特定权利要求限制于仅含有一个此类陈述的实施例，甚至当同一权利要求包含引入性短语“一或多个”或“至少一个”以及如“一个、一种”等不定冠词(例如，“一个”和/或“一种”通常应被解释为意为“至少一个”或“一或多个”)时，亦是如此；对于用于引入权利要求陈述的定冠词的使用也是如此。此外，即使明确叙述所引入的权利要求叙述的特定数字，本领域技术人员将认识到这类叙述应典型地解译为至少意味所述数字(例如无其它修饰语的简单叙述“两条叙述”典型地意指至少两条叙述，或两条或两条以上叙述)。另外，在使用类似于“A、B和C中的至少一个”等惯例的那些情况下，一般来说，打算这类句法结构是在本领域技术人员应了解的惯例的意义上，例如，包含所列出的项目的任何组合、包含单个成员(例如，“具有A、B和C中的至少一者的系统”将包含但不限于具有仅A、仅B、仅C、A和B一起、A和C一起、B和C一起和/或A、B和C一起的系统等等)。在使用类似于“A、B或C中的至少一者”等惯例的那些情况下，一般来说，打算这类句法结构是在本领域技术人员应了解的惯例的意义上(例如，“具有A、B或C中的至少一者的系统”将包含但不限于具有仅A、仅B、仅C、A和B一起、A和C一起、B和C一起和/或A、B和C一起的系统等等)。本领域技术人员将进一步了解，几乎任何表示两个或两个以上替代性术语的转折性词语和/或短语，无论是在描述内容、权利要求还是图式中，都应理解为考虑包含所述术语之一、所述术语中的任一术语或两个术语的可能性。例如，短语“A或B”应被理解为包含“A”或“B”或“A和B”的可能性。
本说明书中所使用的表示成分的量、反应条件等的所有数字应被理解为在所有情况下均被术语“约”修饰。因此，除非有相反的指示，否则本文所阐述的数字参数是近似值，所述近似值可以根据期望寻求获得的特性而变化。至少，而且不是试图限制将等同物的教义应用至在要求本申请优先权的任何申请中的任何权利要求的范围，应当根据有效数字的数目和普通舍入方法来解释每个数值参数。
本文中所引用的所有参考文献都以全文引用的方式并入本文中。在通过引用的方式并入的公开和专利或专利申请与本说明书中所包含的公开内容相抵触的情况下，本说明书意欲替代和/或优先于任何这类矛盾材料。
本文包括标题以供参考并辅助定位各个部分。这些标题无意于限制相对于此描述的概念的范围。这类概念在整个说明书中可能具有适用性。
此外，虽然出于清晰和理解的目的已借助于说明和实例相当详细地描述了上述内容，但本领域技术人员清楚可以进行某些改变和修改。因此，说明书和实例不应被理解为将本发明的范围限制在本文中所描述的特定实施例和实例，而是实际上还涵盖属于本发明的真正范围和精神内的所有修改和替代方案。
可以在任何数量的计算装置中完全实现和/或控制所描述的各种系统和方法。通常，指令布置在通常非暂时性的计算机可读介质上，并且这些指令足以允许计算装置中的处理器实施本发明的方法。计算机可读介质可以是具有指令的硬盘驱动器或固态存储器，所述指令在运行时被加载到随机存取存储器中。例如来自多个用户或来自任何一个用户的对应用程序的输入可以通过任意数量的适当的计算机输入装置进行。例如，用户可以使用键盘、鼠标、触摸屏、操纵杆、触控板、其它指标装置或任何其它这类计算机输入装置来输入与计算有关的数据。数据也可以通过插入的存储芯片、硬盘驱动器、闪存驱动器、闪存、光学介质、磁性介质或任何其它类型的文件存储介质来输入。输出可以通过视频图形卡或耦接到用户可以看到的显示器的集成图形芯片组而传递给用户。可替代地，打印机可以用于输出结果的硬拷贝。给定此教导，任何数量的其它有形输出也将被理解为本发明所预期。例如，输出可以存储在存储芯片、硬盘驱动器、闪存驱动器、闪存、光学介质、磁性介质或任何其它类型的输出上。还应注意，本发明可以实施在许多不同类型的计算装置上实现，例如，个人计算机、膝上型计算机、笔记本计算机、上网本计算机、手持计算机、个人数字助理、移动电话、智能电话、平板电脑，并且还实施在专门为这些目的设计的装置上。在一个实施方案中，智能电话或wi-fi连接装置的用户可以使用无线因特网连接从服务器将应用程序的拷贝下载到其装置。适当的认证程序和安全交易过程可以规定要向卖方付款。应用程序可以通过移动连接或WiFi或其它无线网络连接下载。接着，所述应用程序可以由用户运行。这类联网系统可以为多个用户向系统和方法提供单独的输入的实施方案提供适当计算环境。在预期工厂校准方案的以下系统中，多个输入可以允许多个用户同时输入相关数据。
Claims (88)
1.一种设备，其包括：
分析物传感器，所述分析物传感器包括：
细长主体；
第一电极，所述第一电极与第一导电触点电连通；以及
第二电极，所述第二电极与第二导电触点电连通；以及
传感器载体，所述传感器载体附接到所述分析物传感器，所述传感器载体包含：
中间体；
第一导电部分，所述第一导电部分安置在所述中间体上，所述第一导电部分与所述第一导电触点电连通；
第二导电部分，所述第二导电部分安置在所述中间体上，所述第二导电部分与所述第二导电触点电连通，
其中所述第一导电部分和所述第二导电部分形成连接部分，所述连接部分被配置成在所述第一导电触点和所述第二导电触点与单独的装置之间建立电连通。
2.根据权利要求1所述的设备，其进一步包括：
耦接到所述中间体的标识符。
3.根据权利要求2所述的设备，其中所述标识符、所述传感器和所述中间体形成层压配置。
4.根据权利要求2或3所述的设备，其中所述标识符是QR码表。
5.根据权利要求2或3所述的设备，其中所述标识符是光学标识符、射频标识符或存储器编码的标识符中的任一个。
6.根据权利要求2或3所述的设备，其中所述标识符被配置成标识所述分析物传感器、所述分析物传感器的校准数据和所述分析物传感器的历史中的任一个。
7.根据前述权利要求中任一项所述的设备，其中所述第一导电部分和所述第二导电部分是迹线。
8.根据权利要求7所述的设备，其中所述迹线在所述连接部分中形成暴露的接触表面。
9.根据前述权利要求中任一项所述的设备，其中所述第一导电部分和所述第二导电部分至少部分地嵌入在所述中间体中。
10.根据前述权利要求中任一项所述的设备，其中所述第一导电部分和所述第二导电部分包含焊接点、导电胶带、螺旋弹簧、片弹簧或导电弹性体中的至少一个。
11.根据前述权利要求中任一项所述的设备，其中所述连接部分被配置成与所述单独的装置机械配合。
12.根据前述权利要求中任一项所述的设备，其中所述单独的装置是被配置成测量分析物数据的电子装置单元。
13.根据前述权利要求中任一项所述的设备，其中所述单独的装置是制造站的组件。
14.根据权利要求13所述的设备，其中所述制造站被配置成执行恒电位仪测量、浸渍过程、固化过程、校准过程或灵敏度测量中的至少一个。
15.根据权利要求13所述的设备，其中所述制造站包括校准站，所述校准站被配置成解除所述传感器与所述校准站之间的电连接并且通过所述传感器载体的所述连接部分在所述传感器与至少一个测试站之间建立电连接。
16.根据前述权利要求中任一项所述的设备，其中所述中间体进一步包括基准结构，所述基准结构被配置成控制所述分析物传感器相对于所述中间体的衬底的位置和空间定向。
17.根据前述权利要求中任一项所述的设备，其中所述第一电极同轴地定位在所述第二电极内。
18.根据权利要求17所述的设备，其中所述第一电触点和所述第二电触点沿着所述传感器的纵轴纵向对齐并间隔开。
19.根据权利要求1到16中任一项所述的设备，其中所述第一电极和所述第二电极附连到柔性平面衬底。
20.根据权利要求19所述的设备，其中所述第一导电触点和所述第二导电触点附连到所述柔性平面衬底。
21.根据前述权利要求中任一项所述的设备，其中所述第一导电触点和所述第二导电触点通过导电粘合剂附连到所述中间体。
22.根据前述权利要求中任一项所述的设备，其中所述第一导电触点和所述第二导电触点通过各向异性导电膜附连到所述中间体。
23.一种预连接分析物传感器阵列，所述阵列包括：
衬底；
第一多个电触点，所述第一多个电触点安置在所述衬底上；
第二多个电触点，所述第二多个电触点安置在所述衬底上；以及
多个分析物传感器，所述多个分析物传感器安置在所述衬底上，所述多个分析物传感器中的每个分析物传感器包括：
第一传感器电触点，所述第一传感器电触点耦接到所述衬底上的所述第一多个电触点中的对应一个第一电触点，以及
第二传感器电触点，所述第二传感器电触点耦接到所述衬底上的所述第二多个电触点中的对应一个第二电触点。
24.根据权利要求23所述的阵列，其中所述第一多个电触点沿着所述衬底对齐。
25.根据权利要求23或24中任一项所述的阵列，其中所述第一多个电触点由暴露的接触表面形成。
26.根据权利要求23、24或25中任一项所述的阵列，其中所述第二多个电触点沿着所述衬底对齐。
27.根据权利要求23到26中任一项所述的阵列，其中所述第二多个电触点由暴露的接触表面形成。
28.根据权利要求23到27中任一项所述的阵列，其中所述第一多个电触点和所述第二多个电触点被配置成与单独的装置连接。
29.根据权利要求28所述的阵列，其中所述单独的装置是制造站的组件。
30.根据权利要求23到29中任一项所述的阵列，其中所述衬底包括至少一个单切特征，所述至少一个单切特征被配置成促进将所述衬底单切成多个传感器载体，其中所述多个传感器载体中的每个传感器载体附接到所述分析物传感器中的单独的一个分析物传感器。
31.根据权利要求23到30中任一项所述的阵列，其进一步包括安置在所述衬底上的多个标识符。
32.根据权利要求23到31中任一项所述的阵列，其中所述衬底包括细长尺寸，其中所述多个分析物传感器在正交于所述细长尺寸的方向上延伸超过所述衬底的边缘。
33.根据权利要求32所述的阵列，其进一步包括进给导引条带，所述进给导引条带在所述细长尺寸上沿着所述衬底的相对边缘行进。
34.根据权利要求23到33中任一项所述的阵列，其中所述衬底包括被配置成卷到卷盘上的柔性衬底。
35.根据权利要求33所述的阵列，其中所述进给导引条带能够从所述衬底移除。
36.根据权利要求23到35中任一项所述的阵列，其中所述衬底包括具有多个基准特征的模制热塑性塑料，所述多个基准特征控制所述多个分析物传感器的位置和定向，并且其中所述第一多个电触点和所述第二多个电触点各自包括所述模制热塑性塑料中的嵌入式导电迹线。
37.根据权利要求23到36中任一项所述的阵列，其进一步包括耦接到所述阵列的第一基准结构，所述第一基准结构被配置成定位至少一个分析物传感器。
38.根据权利要求37所述的阵列，其中所述第一基准结构包含至少一个单切特征，所述至少一个单切特征被配置成促进将所述第一基准结构单切成多个第二基准结构，其中所述多个第二基准结构中的每个第二基准结构耦接到通过所述衬底形成的多个传感器载体中的对应一个传感器载体。
39.根据权利要求23到38中任一项所述的阵列，其中所述衬底包含处理电路系统，所述处理电路系统被配置成对所述多个分析物传感器执行至少恒电位仪测量。
40.根据权利要求39所述的阵列，其进一步包括通信电路系统，所述通信电路系统能够由所述处理电路系统操作以发送和接收与所述分析物传感器中的每个分析物传感器相关联的数据以及所述分析物传感器的标识符。
41.根据权利要求23所述的阵列，其中所述阵列包括一个或多个条带。
42.一种方法，其包括：
提供预连接分析物传感器，所述预连接分析物传感器包括：
中间体；
分析物传感器，所述分析物传感器永久地附接到所述中间体；以及
标识符，所述标识符耦接到所述中间体；以及
通过将所述中间体耦接到制造站的对应特征而将所述分析物传感器通信耦接到所述制造站的处理电路系统；以及
操作所述制造站的所述处理电路系统以与所述预连接分析物传感器通信。
43.根据权利要求42所述的方法，其中操作所述处理电路系统包含从所述分析物传感器获得信号。
44.根据权利要求42或43中任一项所述的方法，其中操作所述处理电路系统包含操作所述制造站的光学、红外或射频读取器以获得所述标识符。
45.根据权利要求43所述的方法，其进一步包括用所述制造站的所述处理电路系统并结合所述标识符存储对应于所述信号的传感器数据。
46.根据权利要求42到45中任一项所述的方法，其中所述标识符标识所述分析物传感器、所述分析物传感器的校准数据和所述分析物传感器的历史中的任何一个或多个。
47.根据权利要求43到46中任一项所述的方法，其中所述信号包括葡萄糖灵敏度信号。
48.根据权利要求42到47中任一项所述的方法，其进一步包括从所述制造站移除所述中间体并通过将所述中间体耦接到可穿戴装置的对应特征而将所述分析物传感器通信耦接到所述可穿戴装置的处理电路系统。
49.根据权利要求42到48中任一项所述的方法，其中所述分析物传感器通过导电粘合剂永久附接到所述中间体。
50.根据权利要求42到48中任一项所述的方法，其中所述分析物传感器通过各向异性导电膜永久附接到所述中间体。
51.根据权利要求48所述的方法，其进一步包括通过所述可穿戴装置的所述处理电路系统从所述分析物传感器获得体内测量数据。
52.一种可穿戴装置，其包括：
壳体；
电子电路系统，所述电子电路系统被配置成处理分析物传感器信号，其中所述电子电路系统封闭在所述壳体内；
分析物传感器，所述分析物传感器具有定位在所述壳体外部的远端部分；
中间体，所述中间体具有到所述分析物传感器的近端部分和电子装置两者的电连接，其中所述中间体与所述分析物传感器的所述近端部分之间的所述电连接位于所述壳体外部。
53.根据权利要求52所述的装置，其中所述中间体被定位成邻近于所述壳体的外表面。
54.根据权利要求52或53中任一项所述的装置，其包括耦接到所述电子装置与所述中间体两者的电触点。
55.根据权利要求54所述的装置，其中所述中间体通过导电环氧树脂电连接到所述电触点。
56.根据权利要求54所述的装置，其中所述中间体通过各向异性导电膜电连接到所述电触点。
57.根据权利要求52到56中任一项所述的装置，其中所述中间体被密封。
58.根据权利要求54到57中任一项所述的装置，其中所述电触点延伸穿过所述壳体。
59.根据权利要求52到58中任一项所述的装置，其中所述分析物传感器形成为具有远端部分和近端部分的细长主体，所述远端部分被配置用于经皮植入在对象中，所述近端部分被配置用于电连接到所述中间体。
60.根据权利要求52到59中任一项所述的装置，其中所述中间体定位在所述壳体的所述外表面上的凹部中。
61.根据权利要求60所述的装置，其中电触点在所述凹部中延伸穿过所述壳体以将所述中间体电耦接到封闭在所述壳体内的所述电子电路系统。
62.根据权利要求60或61中任一项所述的装置，其中所述中间体被所述凹部中的聚合物覆盖。
63.根据权利要求52到62中任一项所述的装置，其中所述分析物传感器的所述远端部分延伸远离穿过所述壳体的开口。
64.根据权利要求52到63中任一项所述的装置，其中所述电子电路系统包括恒电位仪。
65.根据权利要求52到64中任一项所述的装置，其中所述电子电路系统包括无线发射器。
66.一种制造预连接分析物传感器的方法，所述方法包括：
将细长导体的近端部分机械且电连接到中间体的导电部分；
在所述连接之后，用聚合物膜涂覆所述细长导体的远端部分以形成具有工作电极区域的分析物传感器，所述工作电极区域被配置成支持用于所述细长导体的所述远端部分中的分析物检测的电化学反应。
67.根据权利要求66所述的方法，其另外包括测试所述分析物传感器，其中所述测试包括将所述中间体电耦接到测试站。
68.根据权利要求67所述的方法，其另外包括校准所述分析物传感器，其中所述校准包括将所述中间体电耦接到测试站。
69.根据权利要求66到68中任一项所述的方法，其中所述涂覆包括浸涂。
70.根据权利要求66到69中任一项所述的方法，其中所述中间体是由多个耦接的中间体形成的阵列的一部分，其中所述方法进一步包括将多个细长电极中的每个细长电极的近端部分机械且电连接到所述阵列的每个中间体的导电部分。
71.根据权利要求70所述的方法，其包括对连接到所述阵列的所述中间体的所述多个细长电极中的每个细长电极的每个远端部分并行地执行所述涂覆。
72.根据权利要求71所述的方法，其包括在所述涂覆之后单切所述阵列的所述中间体中的一个或多个中间体。
73.根据权利要求66到72中任一项所述的方法，其中机械且电连接包括将导电膏施涂到所述细长导体和所述中间体的所述导电部分。
74.根据权利要求66到73中任一项所述的方法，其中机械且电连接包括压缩所述细长导体的所述近端部分与所述中间体的所述导电部分之间的各向异性导电膜。
75.根据权利要求66到74中任一项所述的方法，其中所述连接是在远离所述涂覆的位置处执行的。
76.根据权利要求75所述的方法，其中所述涂覆、所述测试和所述校准全都是在远离所述连接的位置处执行的。
77.一种制造皮肤上可穿戴装置的方法，所述方法包括：
将电子电路系统组装到壳体的内部体积中，其中所述电子电路系统被配置用于(1)检测由对象的位于分析物传感器的工作电极处的皮肤下的电化学反应生成的信号；并且(2)将从检测到的信号得出的数据无线发射到所述壳体外部以供单独的装置处理和/或显示；以及
在将所述电子电路系统组装到所述壳体的所述内部体积中之后，将所述分析物传感器的近端部分附接到耦接到所述电子电路系统的外部电接口，使得所述电子电路系统变得连接到所述分析物传感器以从所述分析物传感器接收信号而无需打开所述壳体。
78.根据权利要求77所述的方法，其包括在附接所述分析物传感器的所述近端部分之后密封所述接口。
79.根据权利要求77或78中任一项所述的方法，其包括在所述附接之前测试所述电子电路系统的功能性。
80.根据权利要求77到79中任一项所述的方法，其包括在所述附接之前测试所述分析物传感器的功能性。
81.根据权利要求77到80中任一项所述的方法，其中所述组装是在远离所述附接的位置处执行的。
82.根据权利要求77到81中任一项所述的方法，其包括将中间体耦接到所述分析物传感器的所述近端部分，并且其中所述附接包括将所述中间体附接到所述外部电接口。
83.根据权利要求82所述的方法，其包括在所述附接之前使用所述中间体对所述工作电极执行至少一个制造或测试程序。
84.根据权利要求82所述的方法，其中所述执行包括涂覆所述分析物传感器的所述工作电极。
85.根据权利要求83或84所述的方法，其中所述耦接是在第一位置处执行的，所述组装是在第二位置处执行的，并且所述执行是在第三位置执行的，并且其中所述第一位置、所述第二位置和所述第三位置彼此远离。
86.根据权利要求77到85中任一项所述的方法，其中所述附接是通过各向异性导电膜来执行的。
87.根据权利要求77到86中任一项所述的方法，其中所述耦接是通过各向异性导电膜来执行的。
88.根据权利要求77到87中任一项所述的方法，其包括将插入器附接到所述壳体以将所述工作电极植入到对象中。
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| WO2022016639A1 (zh) * | 2020-07-24 | 2022-01-27 | 湖州美奇医疗器械有限公司 | 一种三电极皮下植入式葡萄糖传感器及其制作方法 |
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| CN114711765A (zh) * | 2022-06-07 | 2022-07-08 | 苏州百孝医疗科技有限公司 | 连续分析物浓度监测系统 |
| CN114711765B (zh) * | 2022-06-07 | 2022-10-14 | 苏州百孝医疗科技有限公司 | 连续分析物浓度监测系统 |
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