CN101730863B - 相机模块及其制造方法 - Google Patents
相机模块及其制造方法 Download PDFInfo
- Publication number
- CN101730863B CN101730863B CN2008800213373A CN200880021337A CN101730863B CN 101730863 B CN101730863 B CN 101730863B CN 2008800213373 A CN2008800213373 A CN 2008800213373A CN 200880021337 A CN200880021337 A CN 200880021337A CN 101730863 B CN101730863 B CN 101730863B
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- CN
- China
- Prior art keywords
- image capture
- capture device
- substrate
- optical element
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 238000000034 method Methods 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 35
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- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 34
- 230000000295 complement effect Effects 0.000 claims description 9
- 230000009286 beneficial effect Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 24
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 238000012536 packaging technology Methods 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B19/00—Cameras
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US92594607P | 2007-04-24 | 2007-04-24 | |
US60/925,946 | 2007-04-24 | ||
PCT/US2008/005289 WO2008133943A1 (en) | 2007-04-24 | 2008-04-24 | Small form factor modules using wafer level optics with bottom cavity and flip chip assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101730863A CN101730863A (zh) | 2010-06-09 |
CN101730863B true CN101730863B (zh) | 2011-12-28 |
Family
ID=39925980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008800213373A Expired - Fee Related CN101730863B (zh) | 2007-04-24 | 2008-04-24 | 相机模块及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8605208B2 (zh) |
JP (2) | JP2010525412A (zh) |
CN (1) | CN101730863B (zh) |
CA (1) | CA2685080A1 (zh) |
WO (1) | WO2008133943A1 (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8456560B2 (en) * | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
KR100843300B1 (ko) * | 2007-04-12 | 2008-07-03 | 삼성전기주식회사 | 카메라 모듈 및 그 제조방법 |
CN101681085B (zh) * | 2007-04-24 | 2014-11-19 | 数字光学公司 | 采用晶片级光学系统的自动聚焦/变焦模块 |
US7825985B2 (en) * | 2007-07-19 | 2010-11-02 | Flextronics Ap, Llc | Camera module back-focal length adjustment method and ultra compact components packaging |
US9118825B2 (en) | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
CN101968563A (zh) * | 2009-07-27 | 2011-02-09 | 昆山钜亮光电科技有限公司 | 回流焊级堆叠镜头组件 |
US9419032B2 (en) * | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
JP5445030B2 (ja) * | 2009-10-27 | 2014-03-19 | 凸版印刷株式会社 | カメラモジュール及びその製造方法 |
JP2011209699A (ja) * | 2010-03-10 | 2011-10-20 | Fujifilm Corp | ウェハレンズアレイ及びその製造方法 |
US10782187B2 (en) * | 2010-07-08 | 2020-09-22 | Cvg Management Corporation | Infrared temperature measurement and stabilization thereof |
US10009528B2 (en) | 2011-02-24 | 2018-06-26 | Nan Chang O-Film Optoelectronics Technology Ltd | Autofocus camera module packaging with circuitry-integrated actuator system |
US8545114B2 (en) | 2011-03-11 | 2013-10-01 | Digitaloptics Corporation | Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane |
US8618795B1 (en) | 2012-06-29 | 2013-12-31 | General Electric Company | Sensor assembly for use in medical position and orientation tracking |
KR102089445B1 (ko) * | 2012-08-08 | 2020-03-17 | 엘지이노텍 주식회사 | 카메라 모듈 |
CN103679107B (zh) | 2012-09-25 | 2017-12-01 | 霍尼韦尔国际公司 | 基于层叠封装的集成电路芯片成像器 |
CN103780803A (zh) * | 2012-10-23 | 2014-05-07 | 鸿富锦精密工业(深圳)有限公司 | 取像模组 |
US9204025B1 (en) | 2013-08-30 | 2015-12-01 | Amazon Technologies, Inc. | Camera module with a molded enclosure contained in a flexible substrate |
US9241097B1 (en) | 2013-09-27 | 2016-01-19 | Amazon Technologies, Inc. | Camera module including image sensor die in molded cavity substrate |
KR102334469B1 (ko) | 2013-12-10 | 2021-12-02 | 에이엠에스 센서스 싱가포르 피티이. 리미티드. | 웨이퍼-레벨 광학 모듈 및 그 제조 방법 |
US9276140B1 (en) * | 2014-09-16 | 2016-03-01 | Amazon Technologies, Inc. | Imager module with interposer chip |
TWI558200B (zh) * | 2015-02-26 | 2016-11-11 | 晶睿通訊股份有限公司 | 攝像模組及攝影裝置 |
US10447900B2 (en) * | 2015-08-06 | 2019-10-15 | Apple Inc. | Camera module design with lead frame and plastic moulding |
US9933601B2 (en) * | 2015-12-16 | 2018-04-03 | Intel Corporation | Stacked wafer lens and camera |
US10925160B1 (en) | 2016-06-28 | 2021-02-16 | Amazon Technologies, Inc. | Electronic device with a display assembly and silicon circuit board substrate |
US11356582B2 (en) * | 2018-07-11 | 2022-06-07 | Samsung Electro-Mechanics Co., Ltd. | Camera module with gap maintaining member |
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WO2008133943A1 (en) | 2008-11-06 |
US8605208B2 (en) | 2013-12-10 |
CA2685080A1 (en) | 2008-11-06 |
WO2008133943A8 (en) | 2010-04-08 |
US20100053423A1 (en) | 2010-03-04 |
CN101730863A (zh) | 2010-06-09 |
US20140098288A1 (en) | 2014-04-10 |
JP5814962B2 (ja) | 2015-11-17 |
JP2010525412A (ja) | 2010-07-22 |
JP2013214962A (ja) | 2013-10-17 |
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