CN101681085B - 采用晶片级光学系统的自动聚焦/变焦模块 - Google Patents
采用晶片级光学系统的自动聚焦/变焦模块 Download PDFInfo
- Publication number
- CN101681085B CN101681085B CN200880021357.0A CN200880021357A CN101681085B CN 101681085 B CN101681085 B CN 101681085B CN 200880021357 A CN200880021357 A CN 200880021357A CN 101681085 B CN101681085 B CN 101681085B
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- lens unit
- lens
- image capture
- capture device
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US92594707P | 2007-04-24 | 2007-04-24 | |
US60/925,947 | 2007-04-24 | ||
PCT/US2008/005298 WO2008133946A1 (en) | 2007-04-24 | 2008-04-24 | Auto focus/ zoom modules using wafer level optics |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101681085A CN101681085A (zh) | 2010-03-24 |
CN101681085B true CN101681085B (zh) | 2014-11-19 |
Family
ID=39925982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200880021357.0A Active CN101681085B (zh) | 2007-04-24 | 2008-04-24 | 采用晶片级光学系统的自动聚焦/变焦模块 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090015706A1 (zh) |
JP (3) | JP2010525413A (zh) |
CN (1) | CN101681085B (zh) |
CA (1) | CA2685083A1 (zh) |
WO (1) | WO2008133946A1 (zh) |
Families Citing this family (46)
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US8456560B2 (en) * | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
KR100843300B1 (ko) * | 2007-04-12 | 2008-07-03 | 삼성전기주식회사 | 카메라 모듈 및 그 제조방법 |
CA2685080A1 (en) * | 2007-04-24 | 2008-11-06 | Flextronics Ap Llc | Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly |
US7825985B2 (en) | 2007-07-19 | 2010-11-02 | Flextronics Ap, Llc | Camera module back-focal length adjustment method and ultra compact components packaging |
US9118825B2 (en) | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
KR101634353B1 (ko) | 2008-12-04 | 2016-06-28 | 삼성전자주식회사 | 마이크로 렌즈, 상기 마이크로 렌즈 제조방법, 상기 마이크로 렌즈 제조 장치, 및 상기 마이크로 렌즈를 구비한카메라 모듈 |
JP5422986B2 (ja) * | 2008-12-10 | 2014-02-19 | コニカミノルタ株式会社 | 駆動装置および撮像装置 |
CN102422627A (zh) * | 2009-03-18 | 2012-04-18 | 拜耳材料科技公司 | 晶片级光学系统 |
KR20100130423A (ko) * | 2009-06-03 | 2010-12-13 | 삼성전자주식회사 | 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 모듈 |
KR101648540B1 (ko) | 2009-08-13 | 2016-08-16 | 삼성전자주식회사 | 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 장치 |
US9419032B2 (en) * | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
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CN102055886A (zh) * | 2009-11-10 | 2011-05-11 | 台湾东电化股份有限公司 | 整合影像传感器、对焦驱动装置及驱动电路的整合模块 |
CN102262331B (zh) * | 2010-05-25 | 2014-10-15 | 鸿富锦精密工业(深圳)有限公司 | 取像模块及其取像方法 |
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JP5719598B2 (ja) * | 2011-01-06 | 2015-05-20 | 日本電産サンキョー株式会社 | レンズ駆動装置の製造方法 |
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WO2013136053A1 (en) * | 2012-03-10 | 2013-09-19 | Digitaloptics Corporation | Miniature camera module with mems-actuated autofocus |
JP5539430B2 (ja) * | 2012-03-22 | 2014-07-02 | 富士フイルム株式会社 | 電子機器の製造方法 |
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KR102064596B1 (ko) * | 2013-03-11 | 2020-02-11 | 삼성전자 주식회사 | 카메라 모듈을 포함하는 전자장치 |
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CN107209342B (zh) * | 2015-01-23 | 2020-03-27 | 夏普株式会社 | 相机模块的制造方法、像面侧组透镜、像面侧组透镜的制造方法和摄像元件 |
WO2016163953A1 (en) * | 2015-04-06 | 2016-10-13 | Heptagon Micro Optics Pte. Ltd. | Small footprint auto focus camera module |
JP6583611B2 (ja) * | 2015-04-27 | 2019-10-02 | ミツミ電機株式会社 | カメラ装置の組立て方法およびレンズユニットの組立て方法 |
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CN109445235B (zh) | 2015-12-02 | 2022-02-22 | 宁波舜宇光电信息有限公司 | 采用分体式镜头的摄像模组及其组装方法 |
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Also Published As
Publication number | Publication date |
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JP2014194585A (ja) | 2014-10-09 |
JP2013020267A (ja) | 2013-01-31 |
WO2008133946A1 (en) | 2008-11-06 |
JP2010525413A (ja) | 2010-07-22 |
CA2685083A1 (en) | 2008-11-06 |
CN101681085A (zh) | 2010-03-24 |
US20090015706A1 (en) | 2009-01-15 |
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