JP2010519881A - カメラモジュール - Google Patents
カメラモジュール Download PDFInfo
- Publication number
- JP2010519881A JP2010519881A JP2009551960A JP2009551960A JP2010519881A JP 2010519881 A JP2010519881 A JP 2010519881A JP 2009551960 A JP2009551960 A JP 2009551960A JP 2009551960 A JP2009551960 A JP 2009551960A JP 2010519881 A JP2010519881 A JP 2010519881A
- Authority
- JP
- Japan
- Prior art keywords
- lens
- camera module
- wafer
- cover plate
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005516 engineering process Methods 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000003779 heat-resistant material Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 20
- 230000000694 effects Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 35
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010295 mobile communication Methods 0.000 description 2
- 229920001690 polydopamine Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
【選択図】図1
Description
110 第1レンズ
120 第2レンズ
130 カバープレート
200 センサアセンブリー
210 センサダイ(sensor die)
220 PCB
Claims (13)
- ウエハレベルオプティクスレンズを含むレンズアセンブリーと、表面実装技術を利用して前記レンズアセンブリーが実装されるセンサアセンブリーを含むカメラモジュール。
- 前記レンズアセンブリーは、少なくとも一つ以上のレンズを含む請求項1に記載のカメラモジュール。
- 前記ウエハレベルオプティクスレンズは、耐熱性材料を含むことを含む請求項1に記載のカメラモジュール。
- 前記レンズアセンブリーは、カバープレートを含む請求項1に記載のカメラモジュール。
- 前記カバープレートの厚さは、前記レンズアセンブリーを成すレンズの焦点を調節するために調節されたものであることを含む請求項4に記載のカメラモジュール。
- 前記カバープレートは、前記センサアセンブリーと接することを含む請求項4に記載のカメラモジュール。
- 前記カバープレートは、前記レンズアセンブリーを成すレンズと前記センサアセンブリーの間に位置することを含む請求項4に記載のカメラモジュール。
- 前記レンズアセンブリーは、少なくとも一つ以上のレンズウェハとカバープレートウェハを積層した後、前記レンズウェハとカバープレートウェハに切断工程を行って製造される請求項1に記載のカメラモジュール。
- 前記レンズアセンブリーは、切断工程により形成されたレンズウェハとカバープレートをボンディングして形成されたことを含む請求項1に記載のカメラモジュール。
- 前記レンズアセンブリーは、下端にカバープレート、前記カバープレート上に第2レンズ、前記第2レンズ上に第1レンズが位置することを含む請求項1に記載のカメラモジュール。
- 前記センサアセンブリーは、プリント基板と、前記プリント基板上に実装されて前記レンズアセンブリーが積層されるセンサダイを含む請求項1に記載のカメラモジュール。
- 前記プリント基板は、前記レンズアセンブリーを含む表面実装部品を電気的に接続させるためのパッドが形成されたことを含む請求項11に記載のカメラモジュール。
- 前記センサダイは、センサダイウェハを切断して製造される請求項11に記載のカメラモジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070097232 | 2007-09-27 | ||
KR1020080094440A KR20090033070A (ko) | 2007-09-27 | 2008-09-26 | 카메라 모듈 |
PCT/KR2008/005740 WO2009041794A2 (en) | 2007-09-27 | 2008-09-29 | Camera module |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010519881A true JP2010519881A (ja) | 2010-06-03 |
Family
ID=40759647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009551960A Pending JP2010519881A (ja) | 2007-09-27 | 2008-09-29 | カメラモジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US8648957B2 (ja) |
JP (1) | JP2010519881A (ja) |
KR (1) | KR20090033070A (ja) |
CN (1) | CN101675658B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017195302A1 (ja) * | 2016-05-11 | 2017-11-16 | オリンパス株式会社 | レンズユニットの製造方法、及び撮像装置の製造方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120242814A1 (en) | 2011-03-25 | 2012-09-27 | Kenneth Kubala | Miniature Wafer-Level Camera Modules |
TW201339630A (zh) * | 2011-11-30 | 2013-10-01 | Anteryon Internat B V | 設備與方法 |
CN205453874U (zh) * | 2013-03-07 | 2016-08-10 | 株式会社村田制作所 | 相机模块及电子设备 |
CN106331470A (zh) * | 2015-07-03 | 2017-01-11 | 中兴通讯股份有限公司 | 一种拍摄终端和拍摄方法 |
US10586535B2 (en) | 2016-06-10 | 2020-03-10 | Apple Inc. | Intelligent digital assistant in a multi-tasking environment |
CN106454032A (zh) * | 2016-10-17 | 2017-02-22 | 芜湖赋兴光电有限公司 | 一种摄像头镜头安装工艺 |
TWI643499B (zh) * | 2017-02-06 | 2018-12-01 | 佐臻股份有限公司 | Method for manufacturing depth image capturing module capable of improving positioning accuracy and heat insulation effect |
US10355735B2 (en) | 2017-09-11 | 2019-07-16 | Otter Products, Llc | Camera and flash lens for protective case |
US10362847B1 (en) | 2018-03-09 | 2019-07-30 | Otter Products, Llc | Lens for protective case |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0330581A (ja) * | 1989-06-28 | 1991-02-08 | Hitachi Ltd | 半導体装置及びそれを用いたビデオ・カメラ・ユニット並びにその製造方法 |
JP2001238103A (ja) * | 2000-02-23 | 2001-08-31 | Mitsubishi Electric Corp | 撮像装置 |
JP2003014908A (ja) * | 2001-06-29 | 2003-01-15 | Ricoh Co Ltd | 対物レンズ、対物レンズの製造方法及び装置 |
JP2004233482A (ja) * | 2003-01-29 | 2004-08-19 | Sanyo Electric Co Ltd | カメラモジュールの製造方法 |
JP2005026379A (ja) * | 2003-06-30 | 2005-01-27 | Miyota Kk | 固体撮像装置の製造方法 |
WO2005020328A1 (ja) * | 2003-08-22 | 2005-03-03 | Konica Minolta Opto, Inc. | 固体撮像装置及び該固体撮像装置を備えた撮像装置並びに固体撮像装置のマイクロレンズアレイ製造方法 |
JP2005234038A (ja) * | 2004-02-17 | 2005-09-02 | Seiko Epson Corp | 誘電体多層膜フィルタ及びその製造方法並びに固体撮像デバイス |
JP2005539276A (ja) * | 2002-09-17 | 2005-12-22 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法 |
JP2006005211A (ja) * | 2004-06-18 | 2006-01-05 | Iwate Toshiba Electronics Co Ltd | 固体撮像装置及びその製造方法 |
Family Cites Families (16)
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JPS5872127A (ja) * | 1981-10-24 | 1983-04-30 | Canon Inc | 光学的焦点位置調整方法 |
JPH0980590A (ja) | 1995-09-11 | 1997-03-28 | Canon Inc | 撮像光学系のピント調整装置 |
US6096155A (en) * | 1996-09-27 | 2000-08-01 | Digital Optics Corporation | Method of dicing wafer level integrated multiple optical elements |
US8153957B2 (en) * | 1996-09-27 | 2012-04-10 | Digitaloptics Corporation East | Integrated optical imaging systems including an interior space between opposing substrates and associated methods |
US7224856B2 (en) * | 2001-10-23 | 2007-05-29 | Digital Optics Corporation | Wafer based optical chassis and associated methods |
US7961989B2 (en) * | 2001-10-23 | 2011-06-14 | Tessera North America, Inc. | Optical chassis, camera having an optical chassis, and associated methods |
US6744109B2 (en) * | 2002-06-26 | 2004-06-01 | Agilent Technologies, Inc. | Glass attachment over micro-lens arrays |
KR100954947B1 (ko) | 2003-02-27 | 2010-04-27 | 엘지전자 주식회사 | 휴대단말기용 카메라모듈 |
US20050020328A1 (en) | 2003-07-21 | 2005-01-27 | Linder Charles D | Spin formed transition section |
US7796187B2 (en) * | 2004-02-20 | 2010-09-14 | Flextronics Ap Llc | Wafer based camera module and method of manufacture |
TWI282873B (en) | 2004-03-12 | 2007-06-21 | Premier Image Technology Corp | Lens module and assembling method thereof |
US7645635B2 (en) * | 2004-08-16 | 2010-01-12 | Micron Technology, Inc. | Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages |
CN101010807A (zh) * | 2004-09-02 | 2007-08-01 | 阿帕托佩克股份有限公司 | 制造晶片级摄像头模块的方法 |
CN2725916Y (zh) * | 2004-09-15 | 2005-09-14 | 华泰电子股份有限公司 | 镜头模块改良结构 |
TW200632506A (en) * | 2005-03-02 | 2006-09-16 | Premier Image Technology Corp | Camera module and its manufacturing process |
US20090008729A1 (en) * | 2007-07-03 | 2009-01-08 | Advanced Chip Engineering Technology Inc. | Image sensor package utilizing a removable protection film and method of making the same |
-
2008
- 2008-09-26 KR KR1020080094440A patent/KR20090033070A/ko not_active Application Discontinuation
- 2008-09-29 US US12/528,957 patent/US8648957B2/en active Active
- 2008-09-29 JP JP2009551960A patent/JP2010519881A/ja active Pending
- 2008-09-29 CN CN200880015043XA patent/CN101675658B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0330581A (ja) * | 1989-06-28 | 1991-02-08 | Hitachi Ltd | 半導体装置及びそれを用いたビデオ・カメラ・ユニット並びにその製造方法 |
JP2001238103A (ja) * | 2000-02-23 | 2001-08-31 | Mitsubishi Electric Corp | 撮像装置 |
JP2003014908A (ja) * | 2001-06-29 | 2003-01-15 | Ricoh Co Ltd | 対物レンズ、対物レンズの製造方法及び装置 |
JP2005539276A (ja) * | 2002-09-17 | 2005-12-22 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | カメラ・デバイス、ならびに、カメラ・デバイスおよびウェハスケールパッケージの製造方法 |
JP2004233482A (ja) * | 2003-01-29 | 2004-08-19 | Sanyo Electric Co Ltd | カメラモジュールの製造方法 |
JP2005026379A (ja) * | 2003-06-30 | 2005-01-27 | Miyota Kk | 固体撮像装置の製造方法 |
WO2005020328A1 (ja) * | 2003-08-22 | 2005-03-03 | Konica Minolta Opto, Inc. | 固体撮像装置及び該固体撮像装置を備えた撮像装置並びに固体撮像装置のマイクロレンズアレイ製造方法 |
JP2005234038A (ja) * | 2004-02-17 | 2005-09-02 | Seiko Epson Corp | 誘電体多層膜フィルタ及びその製造方法並びに固体撮像デバイス |
JP2006005211A (ja) * | 2004-06-18 | 2006-01-05 | Iwate Toshiba Electronics Co Ltd | 固体撮像装置及びその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017195302A1 (ja) * | 2016-05-11 | 2017-11-16 | オリンパス株式会社 | レンズユニットの製造方法、及び撮像装置の製造方法 |
JPWO2017195302A1 (ja) * | 2016-05-11 | 2019-03-07 | オリンパス株式会社 | レンズユニットの製造方法、及び撮像装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100177237A1 (en) | 2010-07-15 |
CN101675658B (zh) | 2011-07-27 |
KR20090033070A (ko) | 2009-04-01 |
US8648957B2 (en) | 2014-02-11 |
CN101675658A (zh) | 2010-03-17 |
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